CN107155285A - Temprature control method of the electronic equipment internal based on microchannel heat-transfer character - Google Patents
Temprature control method of the electronic equipment internal based on microchannel heat-transfer character Download PDFInfo
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- CN107155285A CN107155285A CN201710524344.6A CN201710524344A CN107155285A CN 107155285 A CN107155285 A CN 107155285A CN 201710524344 A CN201710524344 A CN 201710524344A CN 107155285 A CN107155285 A CN 107155285A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
Temprature control method of the electronic equipment internal based on microchannel heat compensator conducting property, it is related to a kind of temprature control method, and in particular to the temprature control method based on microchannel heat compensator conducting property inside a kind of electronic equipment.In order to solve, fluid type of drive in existing microchannel is complicated to be difficult to integrated the present invention, and power consumption and volume are larger, the problem of cost and process technology require higher.The present invention's concretely comprises the following steps：Step 1: the positive pole and negative pole of power supply are separately positioned on the both sides of microchannel, one magnetic field of each setting of upper and lower surface difference in microchannel；Step 2: regulation microchannel both sides apply the potential of electrode；Step 3: regulating and controlling to the size that microchannel upper and lower surface applies magnetic field；Step 4: regulating and controlling to inside microchannels magnetic direction angle size；Step 5: realizing the regulation and control to microchannel internal electrolyte solution fluid interchange by the regulation and control of step 2 to step 3.The invention belongs to electronic device field.
Description
Technical field
The present invention relates to a kind of temprature control method, and in particular to microchannel heat compensator conducting property is based on inside a kind of electronic equipment
Temprature control method, belong to electronic device field.
Background technology
In recent years, developing rapidly with microelectronics and micro electro mechanical system (MEMS) technology, electronic component volume constantly diminishes, property
Energy, speed are constantly improved, and electronic equipment is tended to high-power, miniaturization.However, the miniaturization of electronic equipment and integrated
Change, effective radiating of electron equipment brings huge challenge.The energy consumption and heating power of electronic component are increasing, and unit is held
The caloric value and heat flow density of product electronic device are increased considerably.Electronic component is operationally very sensitive to temperature, temperature mistake
Height can cause its performance to be remarkably decreased, and directly affect the stability and reliability of system work.The hair of studies have shown that cpu chip
Thermal power increases to current more than 200W by 100W several years ago, and its heat flow density conducted through radiator base plate is up to
105W/m2, and have increased trend year by year.The temperature of one semiconductor element often raises 10 DEG C, and system reliability will be reduced
50%.The electronic equipment failure or damage for wherein having more than 55% are due to that temperature is too high caused, when electronic component work
When, while power is consumed the temperature of element can be made to raise rapidly, if heat timely can not be transmitted and spread out, just
The temperature inside electronic component can be made constantly to increase, when temperature rises the peace that electronic component can be caused to work to a certain extent
Full property and reliability are significantly reduced, and finally result in disabler.If can not be timely by produced heat dissipation outside
In boundary's environment electronic equipment can be caused normally to work.Therefore heat analysis and heat must be carried out to integrated electronic equipment
Control, rationally finds effective radiating mode, by the heat transfer in equipment into free surrounding space, so that control electronics exist
Temperature during work is no more than maximum temperature is allowed, to improve the stability of electronic device works and the purpose of security.
Current fan coolling technology is the most common mode used for Electronic cooling, i.e., will be cooled down using fan
Air force feed is to radiating element surface so that heat at this to be scattered away.With the miniaturization and integrated, this cooling of electronic equipment
Mode determines also more and more obvious.First, also increasing with the energy consumption and heating power of electronic equipment, traditional fan is cold
But heat dissipation capacity is limited, it is impossible to meet the cooling requirements of the high heat flux of electronic equipment.Second, fan coolling efficiency and fan
Speed is directly proportional, thus very big noise can be caused during high-power operation.3rd, the conventional side for improving fan radiator cooling
Method is improved the rotating speed of fan and the size of increase fin etc., but both approaches all can not ad infinitum increase fan radiator
Heat-sinking capability, air-cooled technology can not meet the growing cooling requirements of chip.
Currently for the problems of above conventional electronic devices radiating, a kind of new solution is proposed.Wherein
Liquid is big because of its unit heat capacity ratio gas, can be reached than air-cooled higher cooling effect using it as the type of cooling of cycle fluid
Really.In liquid cooling electronic equipment, MCA is also a kind of enhanced heat exchange structure, and size can be from a few micrometers to number in the least
Rice, the material of making has silicon, copper, aluminium and its alloy etc., and cooling medium selects electrolyte solution, can have microchannel very high
Heat transfer coefficient.Thus apply upper in Electronic cooling, micro-processing technology is easy to operate and realize, and it is used as efficiency compact high
Heat exchanger or cooling device very advantageous.In order to ensure that the stable circulation of the fluid in microchannel flows and conducted heat, fluid driving
Mode is generally divided into following two：One is Mechanical Driven mode, including Pneumatic Micropump, piezoelectric micropump, centrifugal force Micropump etc., mainly
It is the motion driving fluid using the moving mechanical member of itself.This type of drive must be used cooperatively with check valve, micro-valve
The complexity and difficulty of processing of micro-pump structure can be increased.Need to drive fluid by the dither of mechanical part, therefore to note
The service life of meaning pumping diaphragm.Complicated, integrated difficulty is big, requires high to micro-processing technology, cost is high.Two be that on-mechanical drives
Flowing mode, including the dynamic electric drive such as pressure-driven, driven by electroosmosis, are characterized in Machinery Ministry of the micropump system without activity in itself
Part.But this mode also has some limitations, the velocity magnitude of EOF is unrelated with the lateral dimension of microchannel, easily control
System.The flowing velocity of pressure driven flow is not only relevant with microchannel lateral dimension, also related to along the barometric gradient of journey, controls
Must take into consideration both sides factor.Because driven by electroosmosis must just have on the basis of electric double layer is produced, so pipe wall material
Itself must can take electric charge or some ions of strong adsorption can just meet the requirements.EOF is driven to need very high voltage,
This will bring safety problem, and power consumption is big, volume big, be difficult miniaturization.
The content of the invention
The present invention for solve fluid type of drive in existing microchannel it is complicated be difficult to it is integrated, and power consumption and volume compared with
Greatly, the problem of cost and process technology require higher, and then propose temperature of the electronic equipment internal based on microchannel heat compensator conducting property
Control method.
The present invention adopts the technical scheme that to solve the above problems：The method of the invention is comprised the following steps that：
Step 1: the positive pole and negative pole of power supply are separately positioned on into the both sides of microchannel, microchannel upper surface and under
Surface one magnetic field of each setting of difference；
Step 2: regulation microchannel both sides apply the potential of electrode；
Step 3: regulating and controlling to the size that microchannel upper and lower surface applies magnetic field；
Step 4: regulating and controlling to inside microchannels magnetic direction angle size；
Step 5: realizing the tune to microchannel internal electrolyte solution fluid interchange by the regulation and control of step 2 to step 3
Control.
The beneficial effects of the invention are as follows：1st, the high efficiency and heat radiation of miniaturized electronic equipment is realized：Electronic component small volume, property
Can and speed constantly improve, energy consumption and the factor such as heating power is big, causing electronic equipment, operationally temperature is too high, direct shadow
The stability and reliability of acoustic system work.By the use of MCA as heat exchange structure in this patent, heat exchange specific surface area is very
Greatly, structural volume is small and compact, it is possible to achieve high efficient heat exchanging.Using electrolyte solution as heat-exchange working medium, heat endurance is good, changes
Hot coefficient is big, can adjust the physicochemical characteristics of heat-exchange working medium according to actual needs, meets demand of the electronic equipment to radiating,
Regulate and control simpler convenience, it is workable；
2nd, realize that electronic equipment internal active heat removal regulates and controls：Current Electronic cooling mode mainly by fan coolling, this
Kind mode heat dissipation capacity is limited, and the noise produced during work is big, and structure is big, it is impossible to meet miniaturized electronic equipment to high heat flux
The requirement of radiating.Apply electric field and magnetic field to drive electrolyte solution to flow outside microchannel in the present invention, realize and wall
Heat exchange.Just easily regulate and control Thermal Performance of Micro Channels by changing the size of electrode two ends potential, the size and Orientation angle in magnetic field
Size is measured, changes the exchange capability of heat of microchannel, it is easy to operate, it is easily controlled the temperature field of electronic equipment internal.
3rd, electronic equipment internal space is saved：The present invention, which is installed inside small electronic equipment, the space taken is saved is
Realize the key of effectively reduction equipment operating temperature.The size of MCA is micron order yardstick, and structure is gently small, it is possible to achieve
Integrated MCA, makes compact conformation, takes up space small, may be mounted in the electronic component of required heat exchange without
It is influenceed normally to work, process technology is ripe, easy for installation.And heat exchange area is improved, is set for powerful electronics
Standby effect is more prominent.
4th, energy expenditure is saved：If only electric field driven liquid flowing is wanted to reach electrical potential difference required for identical effect
Very big, corresponding energy expenditure is very big, and when the equipment for needing to radiate is larger, the consumption of energy is bigger.Utilized in the present invention
Under the interaction in electric field and magnetic field drive electrolyte solution realize heat exchange, it is necessary to electrode potential can reach only potential drive
Dynamic 1/10th, substantially reduce the consumption of energy, and service life also increases accordingly.
Brief description of the drawings
Fig. 1 is microchannel threedimensional model schematic diagram；
Fig. 2 is the front view of microchannel；
Fig. 3 is the side view of microchannel；
Fig. 4 is change schematic diagram of the electrolyte solution flow velocity with magnetic field intensity；
Fig. 5 is change schematic diagram of the Nu numbers with flow velocity；
Fig. 6 is change schematic diagram of the heat flow density with magnetic field intensity；
Fig. 7 is the microchannel two-dimensional section schematic diagram for changing magnetic field angle, and wherein constan represents that wall surface temperature is constant
Value, Hotwall represents that microchannel is hot wall face, and the temperature of fluid carries out heat to realize less than wall surface temperature with microchannel wall
Exchange；
Fig. 8 is change schematic diagram of the electrolyte solution flow velocity with magnetic direction angle；
Fig. 9 is change schematic diagram of the Nu numbers with flow velocity；
Figure 10 is change schematic diagram of the heat flow density with magnetic direction angle；
Figure 11 is electrolyte solution flow velocity with the change schematic diagram for applying potential size；
Figure 12 is change schematic diagram of the Nu numbers with flow velocity；
Figure 13 is heat flow density with application potential size variation schematic diagram.
Embodiment
Embodiment one：Illustrate present embodiment, electronic equipment internal described in present embodiment with reference to Fig. 1 to Fig. 3
Temprature control method based on microchannel heat compensator conducting property through the following steps that realize：
Step 1: the positive pole and negative pole of power supply 1 are separately positioned on into the both sides of microchannel 3, microchannel 3 upper surface and
One magnetic field 2 of each setting of lower surface difference；
Step 2: the regulation both sides of microchannel 3 apply the potential of electrode；
Step 3: regulating and controlling to the size that the upper and lower surface of microchannel 3 applies magnetic field；
Step 4: regulating and controlling to the internal magnetic field deflection size of microchannel 3；
Step 5: realizing the tune to the internal electrolyte solution fluid interchange of microchannel 3 by the regulation and control of step 2 to step 3
Control.
Present embodiment is simple and convenient to the magnetic field inside microchannel 2 and the size control of electric field, easily implements, Ke Yishi
Fluid interchange in existing microchannel；Magnetic field size, the size of direction and potential are changed by this regulation and control method, charged ion by
Lorentz force change, change flow velocity of the solution in microchannel, reached when the flowing in the microchannel in high-temperature wall surface
The purpose that heat exchange is realized with wall is arrived, so as to regulate and control the heat transfer characteristic of microchannel 2.
The governing equation being related in present embodiment has：
Poisson equation solution electric fields are utilized in electromagnetic system
In formula (1) and formula (2), u represents the flowing velocity of fluid；V represents potential；B represents magnetic induction intensity；
Continuity equation and Navier-Stokes equation solution velocity fields are utilized in the eastern streaming system of fluid, speed u, which is met, to be connected
Continuous property equation：
Vector is represented using bold symbols, flow equation is expressed as：
ρ and μ represents the density and viscosity of fluid respectively in formula (3) and formula (4)；T represents the time；J represents that electric current is close
Degree；P represents pressure；B represents magnetic induction intensity；Assuming that the magnetic conductivity of liquid is sufficiently small, therefore the magnetic field of internal fluid can be near
Seemingly represented with B；Ohm's law (Ohm ' slaw) is expressed as in electromagnetism：
Relation between current density and potential V is proposed by above formula；Wherein, σ is the electrical conductivity of solution；In formula (5)
Section 2 represents that conductive ion moves produced induced-current in the electric field；
Nernst-Plank equations describe ion diffusion, Nernst-Plank (NP) equation can accurately more describe it is every kind of from
The current flux of sub- species；I ion flux densities can be expressed as：
C in formula (6)iRepresent the molar concentration of i ions, DiShow the diffusion coefficient of i ions, ziShow the ioni valence of i ions；F
Faraday constant is represented, R represents universal gas constant, and T represents the absolute temperature of electrolyte solution, and N is represented in electrolyte solution
Contained ionic species, u × B represents induction field；
Have under conditions of stable state：
Current density is expressed as：
Because the size of microchannel is larger, when concentration of electrolyte solutions is 100mM, the thickness of electric double layer is 0.97nm,
It is very small,；Electric double layer can be ignored；Electroneutral is kept inside electrolyte solution in microchannel, therefore is had：
Formula (7) and (9) represent that every kind of ion is gamma free flux on insulation wall, and the ion for giving entrance in microchannel is molten
The concentration of liquid；Describe electrochemistry transport phenomena, fluid motion equation coupled with mass of ion transport equation, due to from
The presence influence flow field mass transport of sub- flux；Formula (6) intermediate ion mass transport influences current density, J；In turn, Lip river is passed through
Lun Zili influences flow field J × B；Accordingly, it would be desirable to be solved using continuity and the electroneutral of N-S equations, N-P equations and solution whole
The flow field of electrolyte solution, ionic species concentration and Potential Distributing in individual model；
Energy equation describes temperature field：
ρ represents the density of fluid in formula (10), and J represents current density, and T represents temperature, and t represents time, CpShow specific heat
Hold, λ represents thermal conductivity.
Illustrate influence of the size for applying potential to the internal electrolyte solution heat-transfer character of microchannel 3 with reference to Figure 11 to Figure 13：
In actual application, the position of usual microchannel and geometry are fixed, it is desirable to which Thermal Performance of Micro Channels performance reaches
Size is needed, in addition to the size, deflection except change magnetic field, the size of regulation electrode two ends electrical potential difference is one extraordinary
Solution.This method is simple to operate, easily implements, safe and reliable, significant to regulation and control Thermal Performance of Micro Channels.Work as magnetic
When field is mutually perpendicular to electric field, size is value 0.63246T, and during wall surface temperature 323.15K, the heat-transfer character of microchannel is with potential
Result of variations figure；
As shown in Figure 11 to 13, electrolyte solution flows through flow velocity, Nu numbers and heat flow density in microchannel with application
Potential change trend.With the potential V of application increase, flow velocity, Nu numbers and the heat flow density increase of microchannel.Charged ion exists
Suffered electric field force becomes big in the presence of electric field, and the Lorentz force under the collective effect in magnetic field suffered by charged ion just becomes
Greatly, therefore, electrolyte solution flows through Nu numbers in microchannel and becomes big with the increase of potential.It is big due to electrolyte solution speed
The voltage that small and electrode two ends apply is directly proportional, and flow velocity is bigger, and heat exchange amount is higher, therefore big by the voltage for changing electrode two ends
The small flow velocity that can change liquid is so as to realize the control of the heat exchange property size of microchannel.
Embodiment two：Illustrate present embodiment, electronic equipment internal described in present embodiment with reference to Fig. 1 to Fig. 3
Changing microchannel left and right ends in the step of temprature control method based on microchannel heat compensator conducting property two and applying the potential of electrode is
Realized by following two methods：
The first, the slide rheostat of connecting in circuit, changed by changing the size of resistance of slide rheostat
Become the potential for applying the both sides of microchannel 3；
Secondth, the potential for changing the application of microchannel both sides by increasing or reducing the quantity of battery in power supply is big
It is small.
Embodiment three：Illustrate present embodiment, electronic equipment internal described in present embodiment with reference to Fig. 1 to Fig. 3
The big of magnetic field is applied to the upper and lower surface of microchannel 3 in the step of temprature control method based on microchannel heat compensator conducting property three
It is small to carry out regulating and controlling to realize by the following method：
Electromagnet is installed additional in original upper and lower surface of microchannel 3, can be by changing the size and coil of electric current
The number of turn adjust the size in magnetic field, the slide rheostat that can also connect in circuit is by changing the size of resistance value in circuit
To change regulation and control of the size realization of electric current to magnetic field size.
Illustrate influence of the magnetic field size to the heat-transfer character of microchannel 2 with reference to Fig. 4 to Fig. 6：
The ratio of the cross section height and width of microchannel 3 is 1:1, the potential of both sides is 0.1V, and wall surface temperature is 323.15K, magnetic field
The speed of the internal electrolyte solution of microchannel 3, Nu, heat flow density change with magnetic field B under perpendicular condition；
The Nu numbers of microchannel all increase with the increase of magnetic field intensity, because magnetic field B increase, charged ion institute
The Lorentz force being subject to also can become big therewith, so that flow velocity of the electrolyte solution in microchannel becomes big.In cross-sectional area not
In the case of change, there are more electrolyte solutions to carry out heat exchange with wall, enhance the heat exchange of electrolyte solution and wall
Ability.Therefore, the flow velocity of microchannel, Nu numbers and heat flow density increase all as the change in magnetic field is big.
Embodiment four：Illustrate present embodiment, electronic equipment internal described in present embodiment with reference to Fig. 1 to Fig. 3
Realized in the step of temprature control method based on microchannel heat compensator conducting property four by changing the position in magnetic field inside to microchannel 3
The regulation and control at magnetic direction angle.
Illustrate influence of the magnetic direction angle to the heat-transfer character of microchannel 3 with reference to Fig. 7 to Figure 10：
Charged ion produces Lorentz force under orthogonal magnetic field and electric field action, it is flowed along in microchannel
The dynamic purpose for realizing heat exchange；Size and the side of Lorentz force can be changed by the size and angle in appropriate adjustment magnetic field
To so as to influence the size of electrolyte solution and the heat transfer intensity of microchannel, i.e. Nu numbers；Position and geometry when microchannel
Fixed, in the case that the size in magnetic field is constant, it is desirable to reach the Nu numbers required for us, the deflection for changing magnetic field is one non-
Often good solution；This method is simple to operate, easily implements, safe and reliable, has important meaning to regulation and control Thermal Performance of Micro Channels
Justice；
As shown in fig. 7, the direction in magnetic field to be made to following change, the direction in magnetic field is perpendicular in above-mentioned research
Lower surface, next the axial rotation by magnetic direction along microchannel the Lorentz force suffered by charged ion will occurs
Change；Therefore, the deflection in magnetic field how is adjusted non-to flowing of the electrolyte solution in microchannel and the research of heat transfer property
It is often important；
As shown in fig. 7, giving constant wall surface temperature in figure, appoint in two sides of microchannel and so apply certain potential
The angle of difference, magnetic field and upper lower wall surface is the deflection that α is referred to as magnetic field；What charged ion was produced in the presence of electric field and magnetic field
Lorentz force changes with the change of magnetic field angle.Therefore the equation of momentum is modified to：
(12)
In formula (11) and formula (12), u=juy+k·uz, FyAnd FzIt is the magnetic field body force that magnetic field is induced.Momentum side
Five orders of journey from left to right are transient terms, convective term, source item, diffusion term and Lorentz force respectively；Work as magnetic direction
During with y-axis angular separation for α, FyAnd FzIt is expressed as：
Fy=σ uy|Bsinα|2 (13)
Fz=σ uz|Bcosα|2 (14)
It is 323.15K the following is given wall steady temperature, magnetic field size 0.94868, two ends apply micro- under the conditions of potential 0.1V
Speed, Nu, the heat flow density of passage electrolyte solution are respectively 50 °, 60 °, 70 °, 80 ° and 90 ° with magnetic direction angle α and change knot
Really；
As shown in Figure 7 to 10, under conditions of magnetic field size and application potential are certain, with the increase of magnetic field angle,
Flow velocity, Nu numbers and the heat flow density of electrolyte solution also can become big therewith.Because due to the increase of magnetic field angle, equivalent to
Increase the size in magnetic field so that the action effect in magnetic field is stronger, the Lorentz force suffered by charged ion becomes big, and electrolyte is molten
The speed of the flowing of liquid is bigger, and the intensity washed away with microchannel wall is bigger.Increasing the angle in magnetic field can also make along speed
The thermal conductivity factor in direction becomes big, so that heat transfer efficiency becomes big.Therefore, the angle in magnetic field is bigger, electrolyte solution and microchannel
Exchange capability of heat it is stronger, Nu numbers become big therewith；In summary, by changing the intensity and placement location of magnet, it can adjust and apply
Plus the size and Orientation angle in magnetic field, the Lorentz force suffered by charged ion is changed, also Effective Regulation electrolyte is molten
The size of liquid heat exchange property in microchannel.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, as long as be without departing from technical solution of the present invention content, according to the technical spirit of the present invention,
Within the spirit and principles in the present invention, any simple modification, equivalent substitution and improvement for being made to above example etc., still
Belong within the protection domain of technical solution of the present invention.
Claims (4)
1. temprature control method of the electronic equipment internal based on microchannel heat compensator conducting property, it is characterised in that：In the electronic equipment
Temprature control method of the portion based on microchannel heat compensator conducting property through the following steps that realize：
Step 1: the positive pole and negative pole of power supply (1) are separately positioned on into the both sides of microchannel (3), the upper surface in microchannel (3)
With lower surface difference one magnetic field (2) of each setting；
Step 2: regulation microchannel (3) both sides apply the potential of electrode；
Step 3: regulating and controlling to the size that microchannel (3) upper and lower surface applies magnetic field；
Step 4: regulating and controlling to microchannel (3) internal magnetic field deflection size；
Step 5: realizing the regulation and control to microchannel (3) internal electrolyte solution fluid interchange by the regulation and control of step 2 to step 3.
2. temprature control method of the electronic equipment internal based on microchannel heat compensator conducting property according to claim 1, its feature exists
In：The potential for changing application electrode in microchannel left and right ends in step 2 is realized by following two methods：
The first, in circuit connect a slide rheostat, applied by changing the size of resistance of slide rheostat to change
Plus the potential of microchannel (3) both sides；
Secondth, the potential size that microchannel both sides apply is changed by increasing or reducing the quantity of battery in power supply.
3. temprature control method of the electronic equipment internal based on microchannel heat compensator conducting property according to claim 1, its feature exists
In：The size progress regulation and control for applying magnetic field in step 3 to microchannel (3) upper and lower surface are to realize by the following method
's：
In original microchannel (3), upper and lower surface installs electromagnet additional, can be by changing the size and coil of electric current
The number of turn adjusts the size in magnetic field, can also connect in circuit slide rheostat by change the size of resistance value in circuit come
Change regulation and control of the size realization of electric current to magnetic field size.
4. temprature control method of the electronic equipment internal based on microchannel heat compensator conducting property according to claim 1, its feature exists
In：By changing regulation and control of the position realization in magnetic field to microchannel (3) internal magnetic field deflection in step 4.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110274508A (en) * | 2019-06-13 | 2019-09-24 | 华南师范大学 | A kind of active strengthening and heat transferring device and active intensified heat transfer method |
| CN110505793A (en) * | 2019-08-23 | 2019-11-26 | 昆明理工大学 | A kind of micro-channel device and method of the reinforcing heat convection based on magnetic force |
| CN110274508B (en) * | 2019-06-13 | 2024-05-17 | 华南师范大学 | Active enhanced heat transfer device and active enhanced heat transfer method |
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| 冯建朝: "在轨变工况环境下卫星热分析及单机热控优化研究", 《中国优秀硕士学位论文全文数据库 工程科技II辑》 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110274508A (en) * | 2019-06-13 | 2019-09-24 | 华南师范大学 | A kind of active strengthening and heat transferring device and active intensified heat transfer method |
| CN110274508B (en) * | 2019-06-13 | 2024-05-17 | 华南师范大学 | Active enhanced heat transfer device and active enhanced heat transfer method |
| CN110505793A (en) * | 2019-08-23 | 2019-11-26 | 昆明理工大学 | A kind of micro-channel device and method of the reinforcing heat convection based on magnetic force |
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