CN105161470A - IGBT module heat-radiation apparatus - Google Patents
IGBT module heat-radiation apparatus Download PDFInfo
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- CN105161470A CN105161470A CN201510415555.7A CN201510415555A CN105161470A CN 105161470 A CN105161470 A CN 105161470A CN 201510415555 A CN201510415555 A CN 201510415555A CN 105161470 A CN105161470 A CN 105161470A
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- igbt module
- heat abstractor
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- type radiator
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an IGBT module heat-radiation apparatus. The air temperature in an air inlet position is low while the air temperature in an air outlet position is high. The IGBT module heat-radiation apparatus comprises a plate-fin type radiator. The radiator comprises a plurality of fins. A plurality of projections are arranged inside a fin channel of the plate-fin type radiator. The projections are sequentially increasing from the air inlet position of the plate-fin type radiator to the air outlet position of the plate-fin type radiator. By arranging projections of different densities in the plate-fin type radiator channel to adjust the thermal resistance along the air flow direction, the heat-radiation apparatus has the thermal resistance decreased with the air flow direction. The temperature uniformity of the IGBT module heat-radiation apparatus is thus guaranteed. The IGBT module reliability is further improved.
Description
Technical field
The present invention relates to Electronic Packaging field, particularly relate to a kind of IGBT module heat abstractor.
Background technology
IGBT module (InsulatedGateBipolarTransistor; Chinese is translated into insulated gate bipolar transistor); igbt chip, drive circuit, control circuit and protective circuit are encapsulated into an inside modules; form the electronic power integrated module that function is complete, have certain versatility; have and control the advantages such as convenient, switching speed is fast, operating frequency is high, safety operation area is large; be widely used in the fields such as consumer electronics, Medical Devices, intelligent grid and track traffic, energy-conservation, improve in efficiency etc. and play a significant role.
Along with the raising that increase and the application of IGBT module range of application require, its will less towards volume, integrated level is higher, performance and the stronger future development of reliability, if single angle from power electronic technology, integrated level also has very large room for promotion.But improving constantly of integrated level must make caloric value improve, temperature probably causes Module Fail even to damage, causes serious financial consequences after exceeding the scope of its work permission.Therefore, the heat dissipation problem of IGBT module becomes the obstacle of restriction IGBT module towards more high integration development.In numerous power electronic equipment radiating mode, structure is simple, cost is low and high reliability owing to having for air blast cooling radiating mode, is the main heat sink mode of current IGBT module.
Current IGBT module air-cooled radiator adopts plate fin type radiator and pin column radiator usually.Plate fin type radiator, its fin arranged in parallel make by the air-flow of radiator become very even, even if incoming flow is turbulent flow, also may becoming laminar flow by during radiator.But from the angle of enhanced heat exchange, the heat exchange of structure to enhance fluid and solid wall surface of this rule is disadvantageous; Pin column radiator enhances the disturbance of fluid, and increase local detachment loss and whirlpool loss in flow process, but the flow resistance of radiator is much larger than plate fin type radiator, processing method is comparatively difficult simultaneously.Also has a kind of air-cooled radiator at present, as Chinese patent literature CN2583935, as shown in Figure 1, a kind of compound heat abstractor is proposed, multiple pin post is arranged in its passage between each fin of gilled radiator, the flow resistance of gas in radiator is about than high by 10% in rectangular-wing gilled radiator, but the flow resistance of ratio in the pin post radiator of corresponding size is much lower, reduces the thermal resistance of radiator thus.But, the shortcoming that this patent exists is, flow through radiator when uniform stream, intake air temperature is lower, and air outlet temperature is higher, whole radiator in the course of the work temperature distributing disproportionation is even, IGBT module base plate each position thermal stress is different, and reliable long-term working is had a strong impact on, and Fig. 2 ~ Fig. 3 adopts finite element analysis software ANSYS to distribute the analogous diagram of carrying out to the baseplate temp of this plate wing radiator and chip temperature, its maximum temperature Tmax=65.05371 DEG C, poor temperature uniformity.And in the prior art, not for the structural design of temperature homogeneity.
Therefore, we need badly and work out a kind of heat abstractor that can improve IGBT module temperature homogeneity, to improve the reliability of IGBT module.
Summary of the invention
In view of this, the present invention proposes the projection arranging different densities in plate fin type radiator gas channel, protruding quantity increases to plate fin type radiator air outlet position successively from plate fin type radiator air inlet position, strengthen the gas disturbance of gas outflow part thus, improve radiator temperature uniformity, ensure IGBT module safe and stable operation.
A kind of IGBT module heat abstractor that object according to the present invention proposes, comprise a plate fin type radiator, described plate fin type radiator comprises several fins, in the fin channels of plate fin type radiator, be provided with some projections, the quantity of described projection increases to plate fin type radiator air outlet position successively from plate fin type radiator air inlet position.
Preferably, described projection is positioned at two fin wall places of described fin channels, in equidistant cross arrangement between adjacent protrusion.
Preferably, described projection cylindrical, semicircle column type, square column type or polygonal cylindricality.
Preferably, described projection adopts the mode embedded to assign in described fin channels.
Preferably, described projection and fin channels one-body molded.
Preferably, operationally, the length of described projection is identical with the height of described fin for described IGBT module heat abstractor.
Preferably, the longitudinal section of described fin is designed to undaform, zigzag or ripple type.
Preferably, described IGBT module heat abstractor is aluminium material.
Preferably, copper coin is embedded at the base plate bottom of described IGBT module heat abstractor.
Preferably, different graphic high thermal conductivity material is embedded at the base plate bottom of described IGBT module heat abstractor.
Compared with prior art, the present invention has following technical advantage:
The projection of different densities is set in plate fin type radiator fin channels, the gas disturbance of gas outflow part can be strengthened, improve the wind speed of air outlet position, solve the problem that air-cooled radiator intake air temperature is low, air outlet temperature is high, improve radiator temperature uniformity, ensure that IGBT module can work with security and stability.
Good heat dissipation effect, not only remains the advantage that plate fin type radiator area is large, and the effect of fin channels internal projection is flow-disturbing, and its arrangement is loose, and flow resistance is much little compared with pin column radiator.In the passage of flow restriction between fin, inside modules heat can effectively be shed, and IGBT module reliability is high.
In equidistant cross arrangement between adjacent protrusion, protruding arrangement can not be too intensive, makes to flow in the bending channel of air-flow between fin, increase heat exchange area.
Projection is positioned at two fin wall places of fin channels, and can be one-body molded with fin, and making technology is simple, and heat exchange area is large, and turbulent flow is strengthened.
The longitudinal section of fin is designed to undaform, zigzag or ripple type, increases heat exchange area and enhances turbulent flow.
Embed copper coin at the base plate bottom of IGBT module heat abstractor, thereby enhance the capacity of heat transmission of fin substrate, and different graphic high thermal conductivity materials can be embedded at substrate, in order to adjust the thermal resistance of base plate diverse location, ensure the uniformity of temperature.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of IGBT module composite radiator in prior art
Fig. 2 ~ Fig. 3 is baseplate temp and the chip temperature analogous diagram of conventional panels wing radiator
Fig. 4 is the structural representation of IGBT module heat abstractor in the preferred embodiment of the present invention
Fig. 5 ~ Fig. 6 is baseplate temp and the chip temperature analogous diagram of IGBT module heat abstractor in the preferred embodiment of the present invention
The Reference numeral related in accompanying drawing and part illustrate: 1.IGBT module radiating device; 2. fin channels; 3. protruding.
Embodiment
As described in the background art, existing IGBT module heat abstractor, heat abstractor is flow through when uniform stream, intake air temperature is lower, air outlet temperature is higher, and therefore temperature distributing disproportionation is even in the course of the work for whole radiator, and IGBT module base plate each position thermal stress is different, long-term work, reliability is had a strong impact on.
Below, will be described in detail concrete technical scheme of the present invention.
A kind of IGBT module heat abstractor 1, described heat abstractor 1 need force cooling, fan is provided with in the side of heat abstractor 1, the thermal resistance of air-cooled radiator and flow resistance weigh the major parameter of radiator performance, when heat abstractor volume is identical with radiating condition, the heat abstractor that thermal resistance is little, flow resistance is low is first-selected.
Refer to Fig. 4, IGBT module heat abstractor 1 in the present invention comprises a traditional plate fin type radiator, plate fin type radiator comprises several fins, some protruding 3 are provided with in fin channels 2, arrange protruding 3, the gas disturbance of heat abstractor can be strengthened, strengthen turbulent depth and the heat exchange between fluid and wall, its thermal resistance is less than without protruding conventional panels fin radiator.The existence of protruding 3 makes the situation that not only there is friction loss in heat abstractor 1 passage equally, also there is the situation of local resistance loss, and local resistance loss is much larger than friction loss, therefore, the flow resistance of the IGBT module heat abstractor 1 in the present invention is greater than the plate fin type radiator only having friction loss to exist.Under identical wind speed, compared to conventional panels fin radiator, IGBT module heat abstractor 1 thermal resistance in the present invention reduces obviously, but flow resistance increases to some extent, find after Integrated comparative, same radiating effect to be reached under identical operating mode, the fan power needed for IGBT module heat abstractor in the present invention is little, illustrate fan and heat abstractor volume identical time, IGBT module heat abstractor 1 can obtain better radiating effect, therefore, IGBT module heat abstractor 1 not only remains the large advantage of conventional panels fin radiator area, and thermal resistance reduces, radiating effect increases.
In whole heat abstractor region, the air inlet position air temperature of heat abstractor 1 is low, air outlet position air temperature is high, thus the quantity arranging projection 3 in heat abstractor 1 air inlet position is few, density is low, the quantity of air outlet position projection 3 is many, density is high, the air inlet position of the quantity self-heat irradiation device 1 of protruding 3 is increased successively to the air outlet position of heat abstractor 1, by optimizing the distribution of protruding 3, the projection 3 of different densities is set, to regulate the thermal resistance in wind flow direction, improve the wind speed of air outlet position, flow disturbance in heat abstractor 1 fin is strengthened, radiating effect increases, the thermal resistance of whole heat abstractor 1 is along with the reduction of wind flow direction, the temperature of whole heat abstractor 1 also can reach unanimity.Under identical radiating condition, IGBT module heat abstractor 1 is while radiating efficiency increases, and its temperature homogeneity also significantly improves, and thus the reliability of IGBT module increases.
Protruding 3 cylindrical, semicircle column type, square column type or polygonal cylindricality, the mode embedded is adopted to assign in fin channels 2, be inserted in the hole that heat abstractor substrate sets in advance by protruding 3, and it is fixing by viscose glue bonding, when heat abstractor works, the length of protruding 3 is identical with the height of fin.For making gas-flow resistance little as much as possible, the arrangement of protruding 3 is unsuitable overstocked, simultaneously, protruding 3 are distributed in fin channels 2 two fin wall places, can be one-body molded with fin, making technology is simple, and in equidistant cross arrangement between adjacent two projections 3, air-flow is flowed in bending channel, increases heat exchange area.The quantity self-heat irradiation device 1 air inlet position of protruding 3 is increased successively to heat abstractor 1 air outlet position, such as, two, position projection 3 in first fin channels near heat abstractor 1 air inlet, four projections 3 are set in second fin channels, in the 3rd fin channels, six projections 3 are set, eight projections 3 are set in the 4th fin channels, increase progressively successively.To the projection specifically arranging how much quantity, according to each region thermal resistance of heat abstractor 1, temperature and determining, do not limit.By arranging the projection 3 of different densities, to regulate the thermal resistance in wind flow direction, make the thermal resistance of whole heat abstractor 1 along with the reduction of wind flow direction, the temperature of whole heat abstractor 1 can reach unanimity, and temperature homogeneity significantly improves, and the reliability of IGBT module increases.
Further, in order to the gas flow disturbance increasing fin area and strengthen in the fin channels 2 of heat abstractor 1, the longitudinal section of fin can be designed to undaform, zigzag or ripple type.Meanwhile, heat abstractor 1, its fin, substrate and protruding 3 are aluminium material, in order to strengthen the capacity of heat transmission of fin substrate, can embed copper coin bottom the aluminium base of heat abstractor 1.
Further, also can use the fin of different materials in heat abstractor 1, or embed different graphic high thermal conductivity material at base plate bottom, to adjust the thermal resistance of different fin region, base plate diverse location, ensure the uniformity of heat abstractor 1 temperature.
Refer to Fig. 5 ~ Fig. 6, for the present invention, make use of finite element analysis software ANSYS to distribute to the baseplate temp of the air-cooled radiating device in the present invention and chip temperature under the operating mode identical with traditional heat-dissipating device and emulate, the maximum temperature of the IGBT module heat abstractor in the present invention, Tmax=58.7164 DEG C, well below the temperature of heat abstractor of the prior art, visible, the projection of different densities effectively reduces thermal resistance, and radiating efficiency increases, and temperature homogeneity is improved.
Because the air inlet position air temperature of heat abstractor 1 is low, air outlet position air temperature is high, therefore the present invention by arranging the projection of different densities in plate fin type radiator passage, and the quantity of projection increases to plate fin type radiator air outlet position successively from plate fin type radiator air inlet position, regulate the thermal resistance in wind flow direction, make the thermal resistance flow direction reduction with the wind of heat abstractor, ensure the uniformity of IGBT module heat sink temperature, improve the reliability of IGBT module.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (10)
1. an IGBT module heat abstractor, comprise a plate fin type radiator, described plate fin type radiator comprises several fins, in the fin channels of plate fin type radiator, be provided with some projections, it is characterized in that: the quantity of described projection increases to plate fin type radiator air outlet position successively from plate fin type radiator air inlet position.
2. a kind of IGBT module heat abstractor as claimed in claim 1, is characterized in that: described projection is positioned at two fin wall places of described fin channels, in equidistant cross arrangement between adjacent protrusion.
3. a kind of IGBT module heat abstractor as claimed in claim 1, is characterized in that: described projection is cylindrical, semicircle column type, square column type or polygonal cylindricality.
4. a kind of IGBT module heat abstractor as claimed in claim 1, is characterized in that: described projection adopts the mode embedded to assign in described fin channels.
5. a kind of IGBT module heat abstractor as claimed in claim 1, is characterized in that: described projection and described fin one-body molded.
6. a kind of IGBT module heat abstractor as claimed in claim 1, is characterized in that: operationally, the length of described projection is identical with the height of described fin for described IGBT module heat abstractor.
7. as claimed in claim 1 a kind of for IGBT module heat abstractor, it is characterized in that: the longitudinal section of described fin is designed to undaform, zigzag or ripple type.
8. as claimed in claim 1 a kind of for IGBT module heat abstractor, it is characterized in that: described IGBT module heat abstractor is aluminium material.
9. as claimed in claim 8 a kind of for IGBT module heat abstractor, it is characterized in that: embed copper coin at the base plate bottom of described IGBT module heat abstractor.
10. as claimed in claim 1 a kind of for IGBT module heat abstractor, it is characterized in that: embed different graphic high thermal conductivity material at the base plate bottom of described IGBT module heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510415555.7A CN105161470A (en) | 2015-07-15 | 2015-07-15 | IGBT module heat-radiation apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510415555.7A CN105161470A (en) | 2015-07-15 | 2015-07-15 | IGBT module heat-radiation apparatus |
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| CN105161470A true CN105161470A (en) | 2015-12-16 |
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| CN201510415555.7A Pending CN105161470A (en) | 2015-07-15 | 2015-07-15 | IGBT module heat-radiation apparatus |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392347A (en) * | 2015-12-19 | 2016-03-09 | 郑州大学 | Segmented fin radiator |
| JP2016162527A (en) * | 2015-02-27 | 2016-09-05 | ダイキョーニシカワ株式会社 | Cooling structure of heating element |
| CN106993398A (en) * | 2017-05-19 | 2017-07-28 | 海信（山东）空调有限公司 | A kind of combined radiator |
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
| CN111611739A (en) * | 2020-05-27 | 2020-09-01 | 中车株洲电力机车研究所有限公司 | Design method and device of fin radiator |
| CN111916410A (en) * | 2019-05-10 | 2020-11-10 | 株洲中车时代电气股份有限公司 | Heat radiator |
| TWI756989B (en) * | 2020-12-16 | 2022-03-01 | 宏致電子股份有限公司 | Elongate heat sink |
| CN114530646A (en) * | 2022-01-21 | 2022-05-24 | 厦门钧科电子科技有限公司 | Power module with consistent temperature and design method of radiator of power module |
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| CN1553502A (en) * | 2003-05-27 | 2004-12-08 | 建亨精密股份有限公司 | Radiating fin structure |
| CN2715345Y (en) * | 2004-07-04 | 2005-08-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN101808488A (en) * | 2009-02-13 | 2010-08-18 | 纬创资通股份有限公司 | Heat dissipating device |
| CN202523698U (en) * | 2012-03-27 | 2012-11-07 | 许继集团有限公司 | Air-cooling radiator for IGBT |
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2015
- 2015-07-15 CN CN201510415555.7A patent/CN105161470A/en active Pending
Patent Citations (4)
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| CN1553502A (en) * | 2003-05-27 | 2004-12-08 | 建亨精密股份有限公司 | Radiating fin structure |
| CN2715345Y (en) * | 2004-07-04 | 2005-08-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN101808488A (en) * | 2009-02-13 | 2010-08-18 | 纬创资通股份有限公司 | Heat dissipating device |
| CN202523698U (en) * | 2012-03-27 | 2012-11-07 | 许继集团有限公司 | Air-cooling radiator for IGBT |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016162527A (en) * | 2015-02-27 | 2016-09-05 | ダイキョーニシカワ株式会社 | Cooling structure of heating element |
| CN105392347A (en) * | 2015-12-19 | 2016-03-09 | 郑州大学 | Segmented fin radiator |
| CN106993398A (en) * | 2017-05-19 | 2017-07-28 | 海信（山东）空调有限公司 | A kind of combined radiator |
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
| CN111916410A (en) * | 2019-05-10 | 2020-11-10 | 株洲中车时代电气股份有限公司 | Heat radiator |
| CN111611739A (en) * | 2020-05-27 | 2020-09-01 | 中车株洲电力机车研究所有限公司 | Design method and device of fin radiator |
| CN111611739B (en) * | 2020-05-27 | 2023-09-08 | 中车株洲电力机车研究所有限公司 | Design method and device for fin radiator |
| TWI756989B (en) * | 2020-12-16 | 2022-03-01 | 宏致電子股份有限公司 | Elongate heat sink |
| CN114530646A (en) * | 2022-01-21 | 2022-05-24 | 厦门钧科电子科技有限公司 | Power module with consistent temperature and design method of radiator of power module |
| CN114530646B (en) * | 2022-01-21 | 2023-09-22 | 合肥钧联汽车电子有限公司 | Temperature-consistent power module and radiator design method thereof |
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