CN107148164A - Two-sided etching steel mesh and its manufacture craft - Google Patents
Two-sided etching steel mesh and its manufacture craft Download PDFInfo
- Publication number
- CN107148164A CN107148164A CN201710456423.8A CN201710456423A CN107148164A CN 107148164 A CN107148164 A CN 107148164A CN 201710456423 A CN201710456423 A CN 201710456423A CN 107148164 A CN107148164 A CN 107148164A
- Authority
- CN
- China
- Prior art keywords
- mesh
- thickness
- half tone
- etching
- manufacture craft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of two-sided etching steel mesh, including half tone, several mesh are etched with half tone, the thickness of each mesh is equal with the thickness of the tin cream to be printed corresponding to it, and mesh includes the perforate of the first mesh, second mesh corresponding with the first mesh etched by the lower surface of half tone, the first mesh of connection and the second mesh etched by the upper surface of half tone.A kind of manufacture craft of above-mentioned two-sided etching steel mesh, comprises the following steps:(1)Performed etching in the upper surface of half tone, form the first mesh;(2)Performed etching on the lower surface of half tone, form the second mesh.The present invention utilizes two-sided etching mode so that the etch thicknesses of steel mesh one side reduce, so as to avoid etching process tolerance excessive, improve the etching precision of steel mesh, and then can improve the printing precision of soft printed circuit board and improve product yield.
Description
Technical field
The invention belongs to FPC(Soft printed circuit board)Print field, and in particular to one kind printing is used
High-accuracy steel mesh and the steel mesh manufacture craft.
Background technology
Influenceed by the trend development of electronics industry to highly-integrated functions, the frivolous miniaturization of part, it is existing soft
Printed circuit board (PCB) is in SMT productions, and can often run into must carry a variety of size specification parts in the situation on same surface, and this is required
FPC is in print solder paste, it is necessary to set different paste solder printing thickness to solder demand according to different parts.
At present, traditional SMT steel meshes are stepped design, it is necessary to make different-thickness in one by one side etch process
Steel mesh, i.e., on a surface of half tone 1 by etch produce needed for thickness c mesh 2, as shown in Figure 1.At this stage,
, can be because chemical concentration when the thickness that steel mesh manufacturer etches to steel mesh is more than 0.1mm, etching period, temperature etc. reason and shadow
Etching precision is rung, so as to influence the printing precision of required steel mesh, one side etched thickness is bigger, and tolerance is bigger(Etching Hou Du≤
During 0.06mm, tolerance can be within 0.01mm, and etched thickness exceeds 0.1mm, and tolerance is within 0.03mm), it is impossible to meet production
Required precision, influences production yield.
The content of the invention
There is degree of precision it is an object of the invention to provide one kind, so as to meet the production essence of soft printed circuit board
Spend desired two-sided etching steel mesh.
To reach above-mentioned purpose, the technical solution adopted by the present invention is:
A kind of two-sided etching steel mesh, is used for print solder paste, it includes half tone, described in the SMT processing procedures of soft printed circuit board
Several mesh are etched with half tone, the thickness of each mesh is equal with the thickness of the tin cream to be printed corresponding to it, institute
State the first mesh that mesh includes being etched by the upper surface of the half tone, by the lower surface of the half tone etch with described first
The second corresponding mesh of mesh, the perforate for connecting first mesh and second mesh, the thickness of first mesh
Thickness sum with second mesh is the thickness of the mesh.
It is preferred that, the thickness of first mesh is equal with the thickness of second mesh.
The present invention, which also provides one kind, can improve etching precision, so as to produce above-mentioned high-precision two-sided etching steel mesh
Manufacture craft.
A kind of manufacture craft of above-mentioned two-sided etching steel mesh, it comprises the following steps:(1)Enter in the upper surface of the half tone
Row etching, forms it into first mesh;(2)Performed etching on the lower surface of the half tone, form it into described second
Mesh, and the thickness of the mesh that is formed of thickness sum of the thickness of first mesh and second mesh with it is described
The thickness of tin cream to be printed corresponding to mesh is equal.
It is preferred that, the manufacture craft also includes(3)Open up the perforate for connecting first mesh and second mesh.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art:The present invention utilizes two-sided
Etching mode so that the etch thicknesses of steel mesh one side reduce, so as to avoid etching process tolerance excessive, improve the etching of steel mesh
Precision, and then the printing precision of soft printed circuit board can be improved and product yield is improved.
Brief description of the drawings
Accompanying drawing 1 is the structure schematic cross-sectional view that existing one side etches steel mesh.
Accompanying drawing 2 is the structure schematic cross-sectional view of the two-sided etching steel mesh of the present invention.
In the figures above:1st, half tone;2nd, mesh;3rd, perforate;4th, the first mesh;5th, the second mesh.
Embodiment
The invention will be further described for shown embodiment below in conjunction with the accompanying drawings.
Embodiment one:It is a kind of to be used for print solder paste in the SMT processing procedures of soft printed circuit board referring to shown in accompanying drawing 2
Several mesh 2 are etched with two-sided etching steel mesh, including half tone 1, half tone 1.For each mesh 2, its thickness c and its institute
The thickness of corresponding tin cream to be printed is equal.When tin cream needed for the two-sided etching steel mesh is used to print the part of different size,
The thickness c of each mesh 2 is different.
For a mesh 2, it is included by the upper surface of half tone 1(Top faces)Etching the first mesh 4, under half tone 1
Surface(Bot faces)Second mesh 5 corresponding with the first mesh 4 of etching, the perforate for connecting the first mesh 4 and the second mesh 5
The thickness b sums of 3, the thickness a of the first mesh 4 and the second mesh 5 are the thickness c of mesh 2.Generally, the thickness a of the first mesh 4
It is equal with the thickness b of the second mesh 5.
The manufacture craft of above-mentioned two-sided etching steel mesh is achieved by the steps of:(1)Carved in the upper surface of half tone 1
Erosion, forms it into the first mesh 4, the thickness of the first mesh 4 is a;(2)Perform etching, form it on the lower surface of half tone 1
Second mesh 5, the thickness of the second mesh 5 is b, and the thickness b sums of the thickness a of the first mesh 4 and the second mesh 5 are formed
The thickness c of mesh 2 is equal with the thickness of the tin cream to be printed corresponding to mesh 2;(3)Open up the first mesh 4 of connection and the second net
The perforate 3 in hole 5, the longitudinal section of perforate 3 is trapezoidal.
For example in accompanying drawing 2, the thickness h of half tone 1 is 200 μm, and a mesh 2 design of two-sided etching steel mesh needs to etch thickness
Degree, the i.e. thickness c of mesh 2 is 120 μm, then in the first mesh 4 that the upper surface etch thicknesses a of half tone 1 is 60 μm, in half tone 1
Lower surface etch thicknesses b be 60 μm of the second mesh 5, then remaining thickness is 80 μm between the first mesh 4 and the second mesh 5
Half tone 1, and perforate 3 is opened up in this place.
The present invention makes different-thickness mesh 2 in the steel mesh of one by two-sided small size etch process, so as to reduce one side
During continuous etching by excessive the brought accuracy tolerance of etch thicknesses it is big the problem of, after the two-sided etching technics, steel mesh
Etching precision can be controlled within ± 10 μm, it is ensured that the printing precision of required steel mesh, it is to avoid traditional one side, which is significantly etched, to be made
It is inaccurate and caused part failure welding after stove into FPC tin cream amounts during printing, improve soft printed circuit board FPC printing
And welding quality, it can save Production Time and required manpower, improve production efficiency, effectively save cost, it is ensured that quality.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (4)
1. a kind of two-sided etching steel mesh, is used for print solder paste, it includes half tone, institute in the SMT processing procedures of soft printed circuit board
State and several mesh be etched with half tone, the thickness of each mesh is equal with the thickness of the tin cream to be printed corresponding to it,
It is characterized in that:The mesh includes carving by the first mesh of the upper surface etching of the half tone, by the lower surface of the half tone
Second mesh corresponding with first mesh of erosion, the perforate for connecting first mesh and second mesh, it is described
The thickness sum of the thickness of first mesh and second mesh is the thickness of the mesh.
2. two-sided etching steel mesh according to claim 1, it is characterised in that:The thickness of first mesh and described second
The thickness of mesh is equal.
3. a kind of manufacture craft of two-sided etching steel mesh as claimed in claim 1 or 2, it is characterised in that:The manufacture craft
Comprise the following steps:(1)Performed etching in the upper surface of the half tone, form it into first mesh;(2)In the half tone
Lower surface on perform etching, form it into second mesh, and the thickness of first mesh and second mesh
The thickness for the mesh that thickness sum is formed is equal with the thickness of the tin cream to be printed corresponding to the mesh.
4. the manufacture craft of two-sided etching steel mesh according to claim 3, it is characterised in that:The manufacture craft also includes
(3)Open up the perforate for connecting first mesh and second mesh.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710456423.8A CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710456423.8A CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107148164A true CN107148164A (en) | 2017-09-08 |
CN107148164B CN107148164B (en) | 2019-05-14 |
Family
ID=59781502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710456423.8A Active CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107148164B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
CN112339409A (en) * | 2020-09-30 | 2021-02-09 | 格力电器(合肥)有限公司 | Steel mesh for increasing local tin paste amount |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595805A (en) * | 2012-02-23 | 2012-07-18 | 昆山元崧电子科技有限公司 | Novel steel plate and manufacturing process of novel steel plate |
CN202475956U (en) * | 2012-02-23 | 2012-10-03 | 昆山元崧电子科技有限公司 | Novel steel plate |
CN203040031U (en) * | 2012-12-04 | 2013-07-03 | 精华电子(苏州)有限公司 | Trepanning structure used for printed circuit board printing processing step steel board |
CN203680992U (en) * | 2014-01-06 | 2014-07-02 | 歌尔声学股份有限公司 | PCB screen printing plate |
CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
-
2017
- 2017-06-16 CN CN201710456423.8A patent/CN107148164B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595805A (en) * | 2012-02-23 | 2012-07-18 | 昆山元崧电子科技有限公司 | Novel steel plate and manufacturing process of novel steel plate |
CN202475956U (en) * | 2012-02-23 | 2012-10-03 | 昆山元崧电子科技有限公司 | Novel steel plate |
CN203040031U (en) * | 2012-12-04 | 2013-07-03 | 精华电子(苏州)有限公司 | Trepanning structure used for printed circuit board printing processing step steel board |
CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
CN203680992U (en) * | 2014-01-06 | 2014-07-02 | 歌尔声学股份有限公司 | PCB screen printing plate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
CN112339409A (en) * | 2020-09-30 | 2021-02-09 | 格力电器(合肥)有限公司 | Steel mesh for increasing local tin paste amount |
Also Published As
Publication number | Publication date |
---|---|
CN107148164B (en) | 2019-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202857137U (en) | Printed circuit board with character identifiers | |
CN102291946A (en) | Method for manufacturing thick copper circuit board | |
CN103582317B (en) | Flexible printed wiring board leakage stannum semicircle orifice manufacture method | |
CN102573309A (en) | Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method | |
CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
CN107148164A (en) | Two-sided etching steel mesh and its manufacture craft | |
CN104661436B (en) | Printed circuit board blind slot processing method | |
TWI609612B (en) | Stencil printing method for manufacturing printed circuit board | |
CN107734877B (en) | Flexible circuit board and laser preparation process thereof | |
CN109714907A (en) | A kind of production method of the multi-layer PCB for 5G communication | |
CN110913586B (en) | Manufacturing method of semi-flexible printed circuit board | |
CN104053300A (en) | Locating hole structure of soft and hard multilayer circuit board and setting method of locating hole | |
CN105813374A (en) | Control method for impedance of outer layer | |
CN105828523A (en) | Rigid-flex combined circuit board and manufacturing method thereof | |
CN108124384A (en) | Small size wiring board method for processing forming without interior positioning | |
CN102244974B (en) | Hollowed-out FPC and manufacturing method thereof | |
CN105072824A (en) | Manufacture method of embedded circuit board | |
CN203691754U (en) | Combined and jointed board based on various kinds of samples | |
CN203708620U (en) | Printed circuit board (PCB) with multiple alignment system | |
CN203912323U (en) | Location hole structure of flexible/hard multilayer circuit board | |
CN103203982B (en) | A kind of printing Three-dimensional mask plate | |
CN110881245A (en) | Circuit board and manufacturing method thereof | |
CN103203984B (en) | A kind of printing Three-dimensional mask plate | |
CN104602457A (en) | Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board | |
CN103203983B (en) | A kind of printing Three-dimensional mask plate with figure opening |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |