CN107129776A - 一种低电阻导电胶 - Google Patents

一种低电阻导电胶 Download PDF

Info

Publication number
CN107129776A
CN107129776A CN201710380809.5A CN201710380809A CN107129776A CN 107129776 A CN107129776 A CN 107129776A CN 201710380809 A CN201710380809 A CN 201710380809A CN 107129776 A CN107129776 A CN 107129776A
Authority
CN
China
Prior art keywords
parts
low resistance
conductive glue
resistance conductive
boron nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710380809.5A
Other languages
English (en)
Inventor
钱龙风
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710380809.5A priority Critical patent/CN107129776A/zh
Publication of CN107129776A publication Critical patent/CN107129776A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0806Silver
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

本发明涉及一种低电阻导电胶,包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10‑20份、氮化硼20‑30份、氧化锌20‑30份、导电填料10‑15份、银粉15‑20份、聚二甲基硅氧烷10‑18份。本发明所述的低电阻导电胶,导电性好,粘结能力强,耐磨、耐高温,稳定性好,无毒,环保。

Description

一种低电阻导电胶
技术领域
本发明涉及界面散热材料领域,尤其涉及一种低电阻导电胶。
背景技术
随着微电子器件集成密度越来越高,微电子器件的散热需求也越来越高,因此,开发一种具有高导电性能的界面散热材料具有重要意义。由于导电胶具备环境友好性和低成本特点,已逐渐取代传统锡铅焊料互连材料。然而,传统导电胶发展过程也遇到一些瓶颈,如导电性能不高、密度大,稳定性不高等问题。
发明内容
本发明解决其技术问题所采用的技术方案是:提供一种低电阻导电胶,其特征是:包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
作为优选,所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
作为优选,所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选,所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为20-30nm。
作为优选,所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
本发明所述的低电阻导电胶,导电性好,粘结能力强,耐磨、耐高温,稳定性好,无毒,环保。
具体实施方式
本发明所述的一种低电阻导电胶,提供一种低电阻导电胶,包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
作为优选,所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
作为优选,所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选,所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为20-30nm。
作为优选,所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
以上所述仅是本发明的优选实施方式,并不用于限制本发明,应当指出, 对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变型,这些改进和变型也应视为本发明的保护范围。

Claims (5)

1.一种低电阻导电胶,其特征是:包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
2.如权利要求1所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
3.如权利要求1-2所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
4.如权利要求1-2所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为 20-30nm。
5.如权利要求1-2所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
CN201710380809.5A 2017-05-25 2017-05-25 一种低电阻导电胶 Pending CN107129776A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710380809.5A CN107129776A (zh) 2017-05-25 2017-05-25 一种低电阻导电胶

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710380809.5A CN107129776A (zh) 2017-05-25 2017-05-25 一种低电阻导电胶

Publications (1)

Publication Number Publication Date
CN107129776A true CN107129776A (zh) 2017-09-05

Family

ID=59732847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710380809.5A Pending CN107129776A (zh) 2017-05-25 2017-05-25 一种低电阻导电胶

Country Status (1)

Country Link
CN (1) CN107129776A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073188A (zh) * 2014-06-06 2014-10-01 苏州之诺新材料科技有限公司 一种丙烯酸酯导电胶粘剂及其制备方法
CN104962215A (zh) * 2015-06-30 2015-10-07 苏州洋杰电子有限公司 一种含有改性丙烯酸树脂的导电胶
CN106047229A (zh) * 2016-06-27 2016-10-26 强新正品(苏州)环保材料科技有限公司 导电胶的制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073188A (zh) * 2014-06-06 2014-10-01 苏州之诺新材料科技有限公司 一种丙烯酸酯导电胶粘剂及其制备方法
CN104962215A (zh) * 2015-06-30 2015-10-07 苏州洋杰电子有限公司 一种含有改性丙烯酸树脂的导电胶
CN106047229A (zh) * 2016-06-27 2016-10-26 强新正品(苏州)环保材料科技有限公司 导电胶的制备方法

Similar Documents

Publication Publication Date Title
JP5806760B1 (ja) 熱伝導性導電性接着剤組成物
US9084373B2 (en) Thermally conductive adhesive
CN106118539B (zh) 一种掺杂银纳米颗粒的导电银胶及其制备方法与应用
CN104741821B (zh) 一种用于电子模块高温封装微纳米铜颗粒填充Sn基焊膏的制备方法
CN105441034A (zh) 一种橡胶改性的相变导热界面材料及制备方法
KR20200003887A (ko) 열전도성 도전성 접착제 조성물
WO2021128895A1 (zh) 一种高导热绝缘层材料、金属基板及制备方法
CN105462530B (zh) 导电银胶及其制备方法和微电子功率器件
CN102191001B (zh) 一种环氧导电胶组合物
CN106085276A (zh) 一种掺杂银盐的导电银胶及其制备方法与应用
CN103289175A (zh) 一种聚烯烃基绝缘高导热复合材料及制备方法
CN105348821A (zh) 一种高导热性能的相变石墨导热材料及制备方法
CN105949903B (zh) 一种高效散热涂料及其应用方法
CN108003841A (zh) 一种相变吸波导热材料及其制备方法和用途
CN102002336A (zh) 一种无溶剂型高性能导电胶
CN105255385A (zh) 一种单组份高性能导电银胶及其制备方法
CN105885756A (zh) 一种高效导热胶
CN105925239A (zh) 一种专用导热胶
CN107129776A (zh) 一种低电阻导电胶
JP2019196475A (ja) 低損失絶縁樹脂組成物、及びこれを用いた絶縁フィルム
CN103497717B (zh) 一种led导热固晶胶粘结剂及其制备方法
CN105038076A (zh) 高功率led基板的导热绝缘材料
CN107254262A (zh) 一种导热胶片
CN103911089B (zh) 一种铜纳米线导电胶及其制备方法
CN106190008A (zh) 一种led用高热导率导电胶的制备工艺

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170905