CN107129776A - 一种低电阻导电胶 - Google Patents
一种低电阻导电胶 Download PDFInfo
- Publication number
- CN107129776A CN107129776A CN201710380809.5A CN201710380809A CN107129776A CN 107129776 A CN107129776 A CN 107129776A CN 201710380809 A CN201710380809 A CN 201710380809A CN 107129776 A CN107129776 A CN 107129776A
- Authority
- CN
- China
- Prior art keywords
- parts
- low resistance
- conductive glue
- resistance conductive
- boron nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
本发明涉及一种低电阻导电胶,包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10‑20份、氮化硼20‑30份、氧化锌20‑30份、导电填料10‑15份、银粉15‑20份、聚二甲基硅氧烷10‑18份。本发明所述的低电阻导电胶,导电性好,粘结能力强,耐磨、耐高温,稳定性好,无毒,环保。
Description
技术领域
本发明涉及界面散热材料领域,尤其涉及一种低电阻导电胶。
背景技术
随着微电子器件集成密度越来越高,微电子器件的散热需求也越来越高,因此,开发一种具有高导电性能的界面散热材料具有重要意义。由于导电胶具备环境友好性和低成本特点,已逐渐取代传统锡铅焊料互连材料。然而,传统导电胶发展过程也遇到一些瓶颈,如导电性能不高、密度大,稳定性不高等问题。
发明内容
本发明解决其技术问题所采用的技术方案是:提供一种低电阻导电胶,其特征是:包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
作为优选,所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
作为优选,所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选,所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为20-30nm。
作为优选,所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
本发明所述的低电阻导电胶,导电性好,粘结能力强,耐磨、耐高温,稳定性好,无毒,环保。
具体实施方式
本发明所述的一种低电阻导电胶,提供一种低电阻导电胶,包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
作为优选,所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
作为优选,所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选,所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为20-30nm。
作为优选,所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
以上所述仅是本发明的优选实施方式,并不用于限制本发明,应当指出, 对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变型,这些改进和变型也应视为本发明的保护范围。
Claims (5)
1.一种低电阻导电胶,其特征是:包括聚丙烯酸酯、氮化硼、氧化锌、导电填料、银粉和聚二甲基硅氧烷,其原料各组分按重量计,所述聚丙烯酸酯10-20份、氮化硼20-30份、氧化锌20-30份、导电填料10-15份、银粉15-20份、聚二甲基硅氧烷10-18份。
2.如权利要求1所述的低电阻导电胶,其特征是:其原料各组分按重量计,包含聚丙烯酸酯20份、氮化硼30份、氧化锌30份、导电填料15份、银粉20份、聚二甲基硅氧烷18份。
3.如权利要求1-2所述的低电阻导电胶,其特征是:所述氮化硼为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
4.如权利要求1-2所述的低电阻导电胶,其特征是:所述导电填料为氮化铝,粒径大小为 20-30nm。
5.如权利要求1-2所述的低电阻导电胶,其特征是:由下述方法制备:
(1) 将聚丙烯酸酯、氮化硼、氧化锌、银粉和聚二甲基硅氧烷混合,在 40-50℃下,搅拌30-60min,然后在 1000W 的功率下超声 1-2h,得到混合物料 ;
(2) 向步骤 (1) 得到的混合物料中加入导电填料,在 70-80℃下固化1-1.5h,然后在100-110℃下固化 1-2h,最后在 150-160℃下固化 1-3h,得到低电阻导电胶。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710380809.5A CN107129776A (zh) | 2017-05-25 | 2017-05-25 | 一种低电阻导电胶 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710380809.5A CN107129776A (zh) | 2017-05-25 | 2017-05-25 | 一种低电阻导电胶 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107129776A true CN107129776A (zh) | 2017-09-05 |
Family
ID=59732847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710380809.5A Pending CN107129776A (zh) | 2017-05-25 | 2017-05-25 | 一种低电阻导电胶 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107129776A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104073188A (zh) * | 2014-06-06 | 2014-10-01 | 苏州之诺新材料科技有限公司 | 一种丙烯酸酯导电胶粘剂及其制备方法 |
CN104962215A (zh) * | 2015-06-30 | 2015-10-07 | 苏州洋杰电子有限公司 | 一种含有改性丙烯酸树脂的导电胶 |
CN106047229A (zh) * | 2016-06-27 | 2016-10-26 | 强新正品(苏州)环保材料科技有限公司 | 导电胶的制备方法 |
-
2017
- 2017-05-25 CN CN201710380809.5A patent/CN107129776A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104073188A (zh) * | 2014-06-06 | 2014-10-01 | 苏州之诺新材料科技有限公司 | 一种丙烯酸酯导电胶粘剂及其制备方法 |
CN104962215A (zh) * | 2015-06-30 | 2015-10-07 | 苏州洋杰电子有限公司 | 一种含有改性丙烯酸树脂的导电胶 |
CN106047229A (zh) * | 2016-06-27 | 2016-10-26 | 强新正品(苏州)环保材料科技有限公司 | 导电胶的制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5806760B1 (ja) | 熱伝導性導電性接着剤組成物 | |
US9084373B2 (en) | Thermally conductive adhesive | |
CN106118539B (zh) | 一种掺杂银纳米颗粒的导电银胶及其制备方法与应用 | |
CN104741821B (zh) | 一种用于电子模块高温封装微纳米铜颗粒填充Sn基焊膏的制备方法 | |
CN105441034A (zh) | 一种橡胶改性的相变导热界面材料及制备方法 | |
KR20200003887A (ko) | 열전도성 도전성 접착제 조성물 | |
WO2021128895A1 (zh) | 一种高导热绝缘层材料、金属基板及制备方法 | |
CN105462530B (zh) | 导电银胶及其制备方法和微电子功率器件 | |
CN102191001B (zh) | 一种环氧导电胶组合物 | |
CN106085276A (zh) | 一种掺杂银盐的导电银胶及其制备方法与应用 | |
CN103289175A (zh) | 一种聚烯烃基绝缘高导热复合材料及制备方法 | |
CN105348821A (zh) | 一种高导热性能的相变石墨导热材料及制备方法 | |
CN105949903B (zh) | 一种高效散热涂料及其应用方法 | |
CN108003841A (zh) | 一种相变吸波导热材料及其制备方法和用途 | |
CN102002336A (zh) | 一种无溶剂型高性能导电胶 | |
CN105255385A (zh) | 一种单组份高性能导电银胶及其制备方法 | |
CN105885756A (zh) | 一种高效导热胶 | |
CN105925239A (zh) | 一种专用导热胶 | |
CN107129776A (zh) | 一种低电阻导电胶 | |
JP2019196475A (ja) | 低損失絶縁樹脂組成物、及びこれを用いた絶縁フィルム | |
CN103497717B (zh) | 一种led导热固晶胶粘结剂及其制备方法 | |
CN105038076A (zh) | 高功率led基板的导热绝缘材料 | |
CN107254262A (zh) | 一种导热胶片 | |
CN103911089B (zh) | 一种铜纳米线导电胶及其制备方法 | |
CN106190008A (zh) | 一种led用高热导率导电胶的制备工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170905 |