CN107104298B - 电连接器及其制造方法 - Google Patents

电连接器及其制造方法 Download PDF

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CN107104298B
CN107104298B CN201710320835.9A CN201710320835A CN107104298B CN 107104298 B CN107104298 B CN 107104298B CN 201710320835 A CN201710320835 A CN 201710320835A CN 107104298 B CN107104298 B CN 107104298B
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protrusion
electric connector
metal layer
top surface
terminal
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CN107104298A (zh
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朱德祥
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Lotes Guangzhou Co Ltd
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    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01R12/71—Coupling devices for rigid printing circuits or like structures
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
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    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
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Abstract

本发明公开了一种电连接器，用以电性连接一芯片模块，包括：一本体，设有多个收容孔，所述本体具有一上表面；至少一凸部，向上凸出于所述上表面，一绝缘部位于所述凸部上，用于支撑所述芯片模块；一金属层，所述金属层覆盖所述上表面及所述凸部四周；多个端子，收容于所述收容孔，用于导接所述芯片模块；所述金属层覆盖所述上表面及所述凸部四周，所述绝缘部位于所述凸部上，支撑所述芯片模块，既保证了所述金属层较好的屏蔽所述端子之间的串音，满足所述端子高频信号的传输，又避免了所述金属层接触所述芯片模块，防止了所述芯片模块短路。

Description

电连接器及其制造方法
技术领域
本发明涉及一种电连接器及其制造方法，尤其涉及一种具有屏蔽效果的电连接器及其制造方法。
背景技术
随着计算机技术的飞速发展，LGA电连接器的端子数目越来越多，如此造成端子排布非常紧密，使得端子间容易产生信号干扰，为了屏蔽端子间的信号干扰，业界通常使用的一种电连接器，用以电性连接一芯片模块至一电路板，包括一本体，所述本体上一体成型多个凸块用以支撑所述芯片模块，所述本体设有多个信号收容槽和多个接地收容槽，多个信号端子和多个接地端子分别对应收容于所述信号收容槽和所述接地收容槽，所述本体的上表面镀设一金属层，用于屏蔽信号端子间的信号干扰。
然而，在所述本体的上表面镀金属层的过程中，所述凸块的表面也会镀有金属层，故所述芯片模块支撑于所述凸块上时，位于所述凸块顶面的金属层会接触所述芯片模块，造成所述芯片模块短路。
因此有必要设计一种改良的电连接器，以克服上述问题。
发明内容
针对背景技术所面临的问题，本发明的目的在于提供一种具有屏蔽效果又避免芯片模块短路的电连接器。
为实现上述目的，本发明采用以下技术手段：一种电连接器，用以电性连接一芯片模块包括：一本体，设有多个收容孔，所述本体具有一上表面；至少一凸部，向上凸出于所述上表面，一绝缘部位于所述凸部上，用于支撑所述芯片模块；一金属层，所述金属层覆盖所述上表面及所述凸部四周，且位于所述凸部四周的金属层高于位于所述上表面的金属层；多个端子，收容于所述收容孔，用于导接所述芯片模块；
进一步，所述凸部具有相对设置的两个第三侧面和连接两个第三侧面且倾斜的一第一侧面和一第二侧面，所述第三侧面垂直于所述上表面，所述第一侧面与所述上表面形成的锐角小于所述第二侧面与所述上表面形成的锐角；
进一步，每一所述端子具有倾斜的一固定部用于将所述端子固定于所述本体，所述第二侧面相对于所述上表面的倾斜角度与所述固定部相对于所述上表面的倾斜角度相同；
进一步，所述第二侧面与所述收容孔的内壁共面；
进一步，每一所述端子具有倾斜的一弹性部，用于抵接所述芯片模块，所述第一侧面相对于所述上表面的倾斜角度与所述弹性部的顶部相对于所述上表面的倾斜角度相同；
进一步，所述第一侧面与所述收容孔的内壁间隔；
进一步，所述绝缘部自所述凸部一体延伸；
进一步，所述绝缘部安装于所述凸部的顶面，所述金属层覆盖所述凸部的顶面；
进一步，所述端子包括信号端子和接地端子，分别具有一固定部，所述本体具有一第一槽固定所述信号端子的固定部和一第二槽固定所述接地端子的固定部，所述第二槽贯通所述上表面，使得所述金属层覆盖所述第二槽的内壁且所述接地端子的固定部接触所述金属层，而所述第一槽未贯通所述上表面，使得所述金属层未覆盖所述第一槽的内壁；
进一步，所述端子具有有朝同一侧倾斜的一弹性部用于抵接所述芯片模块和一固定部用于固定端子，一横梁连接所述弹性部和所述固定部，所述固定部的倾斜角度与所述弹性部的倾斜角度不同；
进一步，所述收容孔呈多行和多列排列，沿行和列的方向，每一所述凸部均位于相邻两个所述收容孔之间；
所述电连接器的制造方法为：S1：提供一本体，所述本体具有一上表面，至少一凸部向上凸出于所述上表面，用于支撑一芯片模块；S2：提供一金属层，镀设于所述上表面和所述凸部的各个表面；S3：将所述凸部的顶面绝缘；S4：将多数端子组装于所述本体中；
进一步，将所述凸部的顶面绝缘的方法为：将所述本体上下倒置于化学液中，使所述凸部的顶面浸没于化学液中，直至位于所述凸部顶面的所述金属层完全去除；
进一步，将所述凸部的顶面绝缘的方法为：提供一塑胶块，安装于所述凸部的顶面；
进一步，将所述凸部的顶面绝缘的方法为：将一激光5对焦所述凸部的顶面进行烧灼，直至全部烧掉位于所述凸部顶面的所述金属层；
进一步，在激光烧灼之前，所述凸部顶面设有一凸块供激光对焦，所述凸块的面积小于所述凸部顶面的面积，激光5烧灼之后，所述凸块消失；
进一步，在步骤S2中，将金属液从上向下注入所述上表面，使金属液在所述上表面自由扩散，直至覆盖整个所述上表面，从而使得所述上表面被镀上金属层。
与现有技术相比，本发明具有以下有益效果：
所述金属层覆盖所述上表面及所述凸部四周，所述绝缘部位于所述凸部上，支撑所述芯片模块，既保证了所述金属层较好的屏蔽所述端子之间的信号干扰，满足所述端子高频信号的传输，又避免了所述金属层接触所述芯片模块，防止了所述芯片模块短路。
【附图说明】
图1为本发明电连接器第一实施例本体未镀金属层时的立体示意图；
图2为本发明电连接器第一实施例立体局部分解示意图；
图3为本发明电连接器第一实施例立体组装局部示意图；
图4为本发明电连接器第一实施例芯片模块和电路板组装前的剖视图；
图5为本发明电连接器第一实施例芯片模块和电路板组装后的剖视图；
图6为本发明电连接器制造方法的流程图；
图7为本发明电连接器第一实施例本体镀金属层前和镀金属层后的流程示意图；
图8为本发明电连接器第一实施例使凸部顶面绝缘的第一种方法的流程示意图；
图9为本发明电连接器第一实施例使凸部顶面绝缘的第二种方法的流程示意图；
图10为本发明电连接器第二实施例的立体示意图；
图11为发明电连接器第三实施例本体未镀金属层时的立体示意图；
图12为发明电连接器第四实施例本体未镀金属层时的立体示意图。
具体实施方式的附图标号说明：
电连接器100 本体1 上表面11 凸部12
第一侧面121 第二侧面122 第三侧面123 绝缘部124
收容孔13 第一槽131 第二槽132 通槽133
限位槽134 金属层2 端子3 信号端子3A
接地端子3B 弹性部31 固定部32 横梁33
锡球4 激光5 凸块6 化学液7
芯片模块8 电路板9
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1、图3和图5所示，为本发明电连接器100的第一实施例，本发明电连接器100为一种电连接器100，用以电性连接一芯片模块8至一电路板9，其包括一本体1，所述本体1设有呈多行多列排列的多个收容孔13，多个端子3分别自下而上对应***所述收容孔13中，所述端子3一端弹性抵接所述芯片模块8，另一端通过一锡球4焊接至所述电路板9，一金属层2，镀设于所述绝缘本体1上。
如图2和图3所示，所述端子3包括信号端子3A和接地端子3B，且所述信号端子3A和所述接地端子3B的结构相同。每一所述端子3具有一横梁33，所述横梁33一侧向上倾斜延伸形成一弹性部31，所述弹性部31的顶端弹性抵接所述芯片模块8，所述横梁33相对的另一侧向上倾斜延伸形成一固定部32，所述固定部32固定于所述收容孔13，且所述固定的倾斜角度和所述弹性部31的倾斜角度不同。
如图1、图2和图5所示，所述本体1具有一上表面11，自所述上表面11向上凸伸形成多个凸部12，沿行和列的方向，每一所述凸部12均位于两个所述收容孔13之间，所述金属层2覆盖所述上表面11以及所述凸部12的四周，且位于所述凸部12四周的金属层2高于位于所述上表面11的金属层2。所述凸部12的顶面形成一绝缘部124，用于支撑所述芯片模块8，如此既保证了所述金属层2能够屏蔽所述信号端子3A之间的信号干扰，满足所述信号端子3A高频信号的传输，又避免了所述金属层2接触所述芯片模块8，防止所述芯片模块8短路。进一步，每一所述凸部12具有相对设置的两个第三侧面123和连接两个第三侧面123且倾斜的一第一侧面121和一第二侧面122，所述第三侧面123垂直于所述上表面11，所述第一侧面121与所述上表面11形成的锐角小于所述第二侧面122与所述上表面11形成的锐角；且所述第一侧面121相对于所述上表面11的倾斜角度与所述弹性部31的顶部相对于所述上表面11的倾斜角度相同，所述第二侧面122相对于所述上表面11的倾斜角度与所述固定部32相对于所述上表面11的倾斜角度相同，如此设置，保证了所述凸部12倾斜与所述弹性部31倾斜和所述固定部32倾斜的一致性，避免所述凸部12和所述端子3干涉。另外，所述第一侧面121与所述收容孔13的内壁间隔，增大了所述第一侧面121到所述弹性部31距离，避免安装所述芯片模块8时，所述弹性部31向下变形触碰所述第一侧面121；所述第二侧面122与所述收容孔13的内壁共面，使所述上表面11能够容纳更大的所述凸部12。所述收容孔13包括一通槽133***述端子3的弹性部31，所述通槽133的内壁也镀有金属层2，所述弹性部31与所述金属层2之间具有间隙，使得所述弹性部31不接触所述金属层2。一限位槽134连通所述通槽133，所述横梁33收容于所述限位槽134，且所述限位槽134的顶壁限制所述横梁33向上移动。
如图2和图3所示，所述本体1具有一第一槽131固定所述信号端子3A的所述固定部32和一第二槽132固定所述接地端子3B的所述固定部32，所述第二槽132贯通所述上表面11，使所述金属层2覆盖所述第二槽132的内壁，便于所述接地端子3B与所述金属层2导通，加强所述接地端子3B的屏蔽功能；所述第一槽131未贯通所述上表面11，使所述金属层2未覆盖所述第一槽131的内壁，避免所述信号端子3A与所述金属层2短路。
如图6所示，本发明电连接器100的制造方法为，S1：提供一本体1，所述本体1具有一上表面11，至少一凸部12向上凸出于所述上表面11，用于支撑一芯片模块8；S2：提供一金属层2，镀设于所述上表面11和所述凸部12的各个表面，优选的，如图7所示，通过将金属液从上向下注入，使金属液在所述上表面11自由扩散，直至覆盖整个所述上表面11和所述凸部12，从而使得所述上表面11和所述凸部12的表面被镀上金属层2，同时金属液也流入所述收容孔13，使所述金属层2镀设于所述收容孔13的内壁；S3：将所述凸部12的顶面绝缘；S4：将多数端子3从下至上组装于所述本体1中。需要特别说明的实施，步骤S3中，将所述凸部12的顶面绝缘的方法可以为很多，在本说明书列举如下三种：第一种为，如图8所示，将所述本体1上下倒置于化学液7中，使所述凸部12的顶面浸没于化学液7中，直至位于所述凸部12顶面的所述金属层2完全去除，本实施例中，所述化学液7为酸性溶液，尤其为氧化性酸液，比如硫酸、硝酸，在其它实施例中，所述化学液7的种类可以为其它任意成分，只其要能蚀刻掉所述凸部12顶面的所述金属层2即可，在此并不为限；第二种为，如图10所示，提供一绝缘部124，安装于所述凸部12的顶面，隔开所述金属层2和所述芯片模块8；第三种为，如图9所示，将一激光5对焦所述凸部12的顶面进行烧灼，直至全部烧掉位于所述凸部12顶面的所述金属层2，优选的，在激光5烧灼之前，所述凸部12顶面设有一凸块6供激光5对焦，所述凸块6的面积小于所述凸部12顶面的面积，激光5烧灼之后，所述凸块6消失，方便所述激光5能够准确对焦所述凸块6的顶面。
如图10所示，为本发明电连接器100的第二实施例，其与第一实施例的不同在于，金属层2镀完后，所述金属层2覆盖所述凸部12的顶面，再提供一绝缘部124’安装于所述凸部12的顶面，从而不需要将位于所述凸部12顶面的所述金属层2完全去除，就可避免所述金属层2接触所述芯片模块8。本实施例的其它结构与第一实施例完全相同，在此并不赘述。
如图11所示，为本发明电连接器100的第三实施例，其与第一实施例的不同在于，所述凸部12呈上小下大的台阶状，从而使所述绝缘部124的顶面变小，当镀所述金属层2时，可减少所述绝缘部124的顶面上覆盖的所述金属层2，降低去除所述绝缘部124顶面上的所述金属层2的难度。本实施例的其它结构与第一实施例完全相同，在此并不赘述。
如图12所示，为本发明电连接器100的第四实施例，其与第三实施例的不同在于，所述绝缘部124的顶面为弧形面。本实施例的其它结构与第三实施例完全相同，在此并不赘述。
综上所述，本发明电连接器100有下列有益效果：
（1）所述金属层2覆盖所述上表面11及所述凸部12四周，所述绝缘部124位于所述凸部12上，支撑所述芯片模块8，既保证了所述金属层2较好的屏蔽所述端子3之间的信号干扰，满足所述端子3高频信号的传输，又避免了所述金属层2接触所述芯片模块8，防止了所述芯片模块8短路。
（2）所述第二槽132贯通所述上表面11，使所述金属层2覆盖所述第二槽132的内壁，便于所述接地端子3B与所述金属层2导通，加强所述接地端子3B的屏蔽功能；所述第一槽131未贯通所述上表面11，使所述金属层2未覆盖所述第一槽131的内壁，避免所述信号端子3A与所述金属层2短路。
（3）所述第一侧面121相对于所述上表面11的倾斜角度与所述弹性部31的顶部相对于所述上表面11的倾斜角度相同，所述第二侧面122相对于所述上表面11的倾斜角度与所述固定部32相对于所述上表面11的倾斜角度相同，如此设置，保证了所述凸部12倾斜与所述弹性部31倾斜和所述固定部32倾斜的一致性，避免所述凸部12和所述端子3干涉。
（4）所述第一侧面121与所述收容孔13的内壁间隔，增大了所述第一侧面121到所述弹性部31的距离，避免安装所述芯片模块8，所述弹性部31向下变形触碰所述第一侧面121。
上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明的专利范围，所以凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。

Claims (19)

1.一种电连接器，用以电性连接一芯片模块，其特征在于，包括：
一本体，设有多个收容孔，所述本体具有一上表面；
至少一凸部，自所述上表面向上凸伸形成，一绝缘部位于所述凸部上，用于支撑所述芯片模块；
一金属层，所述金属层覆盖所述上表面及所述凸部的各个侧面，且位于所述凸部的各个侧面的金属层高于位于所述上表面的金属层；
多个端子，收容于所述收容孔，用于导接所述芯片模块。
2.如权利要求1所述的电连接器，其特征在于：所述凸部具有相对设置的两个第三侧面和连接两个第三侧面且倾斜的一第一侧面和一第二侧面，所述第三侧面垂直于所述上表面，所述第一侧面与所述上表面形成的锐角小于所述第二侧面与所述上表面形成的锐角。
3.如权利要求2所述的电连接器，其特征在于：每一所述端子具有倾斜的一固定部用于将所述端子固定于所述本体，所述第二侧面相对于所述上表面的倾斜角度与所述固定部相对于所述上表面的倾斜角度相同。
4.如权利要求2所述的电连接器，其特征在于：所述第二侧面与所述收容孔的内壁共面。
5.如权利要求2所述的电连接器，其特征在于：每一所述端子具有倾斜的一弹性部，用于抵接所述芯片模块，所述第一侧面相对于所述上表面的倾斜角度与所述弹性部的顶部相对于所述上表面的倾斜角度相同。
6.如权利要求2所述的电连接器，其特征在于：所述第一侧面与所述收容孔的内壁间隔。
7.如权利要求1所述的电连接器，其特征在于：所述绝缘部自所述凸部一体延伸。
8.如权利要求7所述的电连接器，其特征在于：所述凸部呈上小下大的台阶状，所述绝缘部的顶面为平面。
9.如权利要求7所述的电连接器，其特征在于：所述绝缘部的顶面为弧形面。
10.如权利要求1所述的电连接器，其特征在于：所述绝缘部安装于所述凸部的顶面，所述金属层覆盖所述凸部的顶面。
11.如权利要求1所述的电连接器，其特征在于：所述端子包括信号端子和接地端子，分别具有一固定部，所述本体具有一第一槽固定所述信号端子的固定部和一第二槽固定所述接地端子的固定部，所述第二槽贯通所述上表面，使得所述金属层覆盖所述第二槽的内壁且所述接地端子的固定部接触所述金属层，而所述第一槽未贯通所述上表面，使得所述金属层未覆盖所述第一槽的内壁。
12.如权利要求1所述的电连接器，其特征在于：所述端子具有朝同一侧倾斜的一弹性部用于抵接所述芯片模块和一固定部用于固定端子，一横梁连接所述弹性部和所述固定部，所述固定部的倾斜角度与所述弹性部的倾斜角度不同。
13.如权利要求1所述的电连接器，其特征在于：所述收容孔呈多行和多列排列，沿行和列的方向，每一所述凸部均位于两个所述收容孔之间。
14.一种电连接器的制造方法，其特征在于，包括：
S1：提供一本体，所述本体具有一上表面，至少一凸部自所述上表面向上凸伸形成，用于支撑一芯片模块；
S2：提供一金属层，镀设于所述上表面、所述凸部的各个侧面和所述凸部的顶面；
S3：将所述凸部的顶面绝缘；
S4：将多数端子组装于所述本体中。
15.如权利要求14所述的电连接器的制造方法，其特征在于：将所述凸部的顶面绝缘的方法为：将所述本体上下倒置于化学液中，使所述凸部的顶面浸没于化学液中，直至位于所述凸部顶面的所述金属层完全去除。
16.如权利要求14所述的电连接器的制造方法，其特征在于：将所述凸部的顶面绝缘的方法为：提供一绝缘部，安装于所述凸部的顶面。
17.如权利要求14所述的电连接器的制造方法，其特征在于：将所述凸部的顶面绝缘的方法为：将一激光对焦所述凸部的顶面进行烧灼，直至全部烧掉位于所述凸部顶面的所述金属层。
18.如权利要求17所述的电连接器的制造方法，其特征在于：在激光烧灼之前，所述凸部顶面设有一凸块供激光对焦，所述凸块的面积小于所述凸部顶面的面积，激光烧灼之后，所述凸块消失。
19.如权利要求14所述的电连接器的制造方法，其特征在于：在步骤S2中，将金属液从上向下注入所述上表面，使金属液在所述上表面自由扩散，直至覆盖整个所述上表面，从而使得所述上表面被镀上金属层。
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CN203707383U (zh) * 2013-12-17 2014-07-09 番禺得意精密电子工业有限公司 电连接器
CN203826736U (zh) * 2013-12-17 2014-09-10 番禺得意精密电子工业有限公司 电连接器

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