CN107104178B - Led模组制作方法以及其结构 - Google Patents
Led模组制作方法以及其结构 Download PDFInfo
- Publication number
- CN107104178B CN107104178B CN201710182057.1A CN201710182057A CN107104178B CN 107104178 B CN107104178 B CN 107104178B CN 201710182057 A CN201710182057 A CN 201710182057A CN 107104178 B CN107104178 B CN 107104178B
- Authority
- CN
- China
- Prior art keywords
- conductive component
- conductive
- substrate
- component
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000007639 printing Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 239000011521 glass Chemical group 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 125000005487 naphthalate group Chemical group 0.000 claims description 4
- 230000002459 sustained effect Effects 0.000 claims 2
- 150000003949 imides Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 29
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 18
- 239000002245 particle Substances 0.000 description 13
- 229910052763 palladium Inorganic materials 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- CKQGJVKHBSPKST-UHFFFAOYSA-N [Ni].P#[Mo] Chemical group [Ni].P#[Mo] CKQGJVKHBSPKST-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- 150000002344 gold compounds Chemical class 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/365,963 US10211188B2 (en) | 2016-12-01 | 2016-12-01 | Method for making an LED module and module made thereof |
US15/365,963 | 2016-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107104178A CN107104178A (zh) | 2017-08-29 |
CN107104178B true CN107104178B (zh) | 2019-06-04 |
Family
ID=59675696
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710182057.1A Active CN107104178B (zh) | 2016-12-01 | 2017-03-22 | Led模组制作方法以及其结构 |
CN201720287300.1U Active CN206711917U (zh) | 2016-12-01 | 2017-03-22 | Led模组 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720287300.1U Active CN206711917U (zh) | 2016-12-01 | 2017-03-22 | Led模组 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10211188B2 (zh) |
CN (2) | CN107104178B (zh) |
TW (2) | TWM548359U (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211188B2 (en) * | 2016-12-01 | 2019-02-19 | Cheng Chang TransFlexDisplay Corp. | Method for making an LED module and module made thereof |
US10476004B2 (en) * | 2017-08-25 | 2019-11-12 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing flexible display panel |
CN111128048B (zh) * | 2020-02-14 | 2022-03-08 | 广州新视界光电科技有限公司 | 显示面板以及显示装置 |
CN115379646A (zh) * | 2021-05-21 | 2022-11-22 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板的制作方法、电路板以及镜头模组 |
CN113936557A (zh) * | 2021-10-15 | 2022-01-14 | 业成科技(成都)有限公司 | 显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1416300A (zh) * | 2002-11-12 | 2003-05-07 | 清华大学 | 一种有机电致发光器件及其制备方法 |
CN101154651A (zh) * | 2006-09-29 | 2008-04-02 | 宝创科技股份有限公司 | 发光二极管发光装置的平面结构 |
CN101582225A (zh) * | 2008-05-13 | 2009-11-18 | 蓝星光电科技股份有限公司 | 可挠式发光二极管显示屏 |
CN102290506A (zh) * | 2011-09-20 | 2011-12-21 | 苏州晶能科技有限公司 | 具有图形化透明薄膜电极的led模块制造工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6891200B2 (en) * | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
US7201497B2 (en) * | 2004-07-15 | 2007-04-10 | Lumination, Llc | Led lighting system with reflective board |
DE102006015117A1 (de) * | 2006-03-31 | 2007-10-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip |
DE102014109718B4 (de) * | 2013-07-12 | 2018-03-08 | Panasonic Intellectual Property Management Co., Ltd. | Licht emittierende Vorrichtung und Beleuchtungseinrichtung unter Verwendung derselben |
TWM520726U (zh) * | 2015-12-25 | 2016-04-21 | 曹惠蘭 | 一種可撓的發光二極體顯示器 |
EP3261417A1 (en) * | 2016-06-22 | 2017-12-27 | OSRAM GmbH | A support structure for lighting devices, corresponding lighting device and method |
US10211188B2 (en) * | 2016-12-01 | 2019-02-19 | Cheng Chang TransFlexDisplay Corp. | Method for making an LED module and module made thereof |
-
2016
- 2016-12-01 US US15/365,963 patent/US10211188B2/en active Active
-
2017
- 2017-03-22 TW TW106204041U patent/TWM548359U/zh unknown
- 2017-03-22 TW TW106109587A patent/TWI657604B/zh active
- 2017-03-22 CN CN201710182057.1A patent/CN107104178B/zh active Active
- 2017-03-22 CN CN201720287300.1U patent/CN206711917U/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1416300A (zh) * | 2002-11-12 | 2003-05-07 | 清华大学 | 一种有机电致发光器件及其制备方法 |
CN101154651A (zh) * | 2006-09-29 | 2008-04-02 | 宝创科技股份有限公司 | 发光二极管发光装置的平面结构 |
CN101582225A (zh) * | 2008-05-13 | 2009-11-18 | 蓝星光电科技股份有限公司 | 可挠式发光二极管显示屏 |
CN102290506A (zh) * | 2011-09-20 | 2011-12-21 | 苏州晶能科技有限公司 | 具有图形化透明薄膜电极的led模块制造工艺 |
Also Published As
Publication number | Publication date |
---|---|
US20180158805A1 (en) | 2018-06-07 |
CN206711917U (zh) | 2017-12-05 |
TWI657604B (zh) | 2019-04-21 |
TWM548359U (zh) | 2017-09-01 |
US10211188B2 (en) | 2019-02-19 |
CN107104178A (zh) | 2017-08-29 |
TW201822385A (zh) | 2018-06-16 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191030 Address after: 11 / F, No.71, Dazhong South Street, West District, Taichung, Taiwan, China Patentee after: Xinchen Technology Co., Ltd Address before: 1, floor 5, No. 229, Fuxing Second Road, Zhubei City, Xinzhu County Patentee before: Zhengchang New Horizon Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220308 Address after: No. 19 Lane 17 lane, Guangming Road, Hsinchu, Taiwan, China 19 Patentee after: Fan Wenchang Address before: 11 / F, No.71, Dazhong South Street, West District, Taichung, Taiwan, China Patentee before: Xinchen Technology Co.,Ltd. |