CN107081879A - The method of the resin formation part of resin seal mould and manufacture electronic unit - Google Patents
The method of the resin formation part of resin seal mould and manufacture electronic unit Download PDFInfo
- Publication number
- CN107081879A CN107081879A CN201710073572.6A CN201710073572A CN107081879A CN 107081879 A CN107081879 A CN 107081879A CN 201710073572 A CN201710073572 A CN 201710073572A CN 107081879 A CN107081879 A CN 107081879A
- Authority
- CN
- China
- Prior art keywords
- mould
- resin
- lead frame
- inner chamber
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 153
- 229920005989 resin Polymers 0.000 title claims abstract description 153
- 238000000034 method Methods 0.000 title claims description 49
- 230000015572 biosynthetic process Effects 0.000 title description 28
- 238000004519 manufacturing process Methods 0.000 title description 19
- 238000002347 injection Methods 0.000 claims abstract description 9
- 239000007924 injection Substances 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims description 27
- 238000009434 installation Methods 0.000 claims description 17
- 239000013067 intermediate product Substances 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 2
- 230000002706 hydrostatic effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0077—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping removing burrs or flashes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of following resin seal mould：It effectively can discharge air from the inner chamber of injection molten resin to outside, while flash trimmer can be used to remove the burrs of intermediate products well.In resin seal mould, by the downside inner chamber (25) being arranged in downside in cavity block and the upside inner chamber (35) being arranged in the interior cavity block (33) in upside, formed inner chamber (60).The upper surface (23a) of cavity block (23) in downside, along the opening edge portion of downside inner chamber (35), dam block (27) is set, the dam block (27) by when clamp when is not abutted with the upper surface of lead frame in the way of configure, in upside cavity block (33) lower surface (33a) setting separated with upside inner chamber (35) and with the exhaust outlet (36) of ft connection.The height dimension of dam block (27) is less than the thickness of lead frame (40).When clamping, exhaust outlet (36) and dam block (27) part superposition.
Description
Technical field
The resin of electronic unit is manufactured the present invention relates to a kind of resin seal mould and using the resin seal mould
The method of forming section.
Background technology
It is known that, conventionally, there is following resin sealing apparatus：Shaped using multistation, make the ministry of electronics industry being arranged on lead frame
Part (for example, discrete semiconductor component of simple function element) carries out resin seal, so as to manufacture the ester moulding of electronic unit
Portion.When manufacturing the resin formation part of electronic unit using resin sealing apparatus, the upper mould by constituting resin seal mould first
Tool and lower mould, clamp lead frame.Then, molten resin is filled to the interior intracavitary being formed between mold and lower mould, so
Pressurize is carried out afterwards and solidifies it, is thus produced in lead frame and is located into having around the electronic unit of intracavitary
The intermediate products of resin formation part.Then, after resin seal process, the table for being formed at intermediate products is removed using flash trimmer
The resin burr in face, product (such as semiconductor device) is obtained by processing of lead frame etc..
Figure 14 shows to make the electronic unit being arranged on lead frame 301 to carry out after the process of resin seal and process
Intermediate products 300 before the process of lead frame 301.In intermediate products 300, the outer leads 303 of many lead frames 301 is from the ministry of electronics industry
It is prominent in the resin formation part 302 of part.Many outer leads 303 to prevent it from deforming, each other by be arranged on framework 304,304 it
Between connecting rod 305 link.Connecting rod 305 is cut in the process of processing lead frame 301.In resin seal process, melt
Melt resin also flows into the region formed by inner chamber (part of resin formation part 302), outer lead 303 and connecting rod 305
306, form resin burr in region 306.
As it was noted above, removing resin burr using flash removed machine.But, if formed in Figure 14 region 306 compared with
Thick resin burr, then be difficult by flash trimmer removal.Therefore, be currently by the mold in resin seal mould or
The surface of lower mould sets prominent dam block in the way of filling up region 306, is flowed into suppress molten resin to region 306.By
This, the resin burr for being formed at region 306 can be thin to the degree that can be removed using flash trimmer.
Therefore, the problem of presently, there are is, when injecting molten resin to the interior intracavitary of resin seal mould, interior intracavitary
Air by compression so as to preventing the injection of molten resin, or in molten resin air be captured so as to the resin of product into
Shape portion produces space.To solve the above problems, setting the groove for being communicated to mold exterior from inner chamber (to be referred to as in resin seal mould
" exhaust outlet " (such as Fig. 9 of patent document 1), so that the air of interior intracavitary is easily to outside discharge during injection molten resin.In addition,
Also described in Fig. 1 of patent document 1 etc. in lead frame middle setting exhaust outlet in itself.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2002-100646 publications
The content of the invention
Problems to be solved by the invention
But, in the case of setting exhaust outlet in resin seal mould, when the interior intracavitary injection to resin seal mould
During molten resin, along with air from the discharge of inner chamber, molten resin flows into exhaust outlet, so that in exhaust outlet formation resin hair
Thorn.When forming thicker resin burr in the exhaust outlet connected with inner chamber, it is difficult to deburring using flash trimmer.To solve
Above mentioned problem, it may be considered that exhaust outlet narrows.But, in this case, air is difficult to discharge from inner chamber during injection molten resin,
And then when Reusability resin seal mould, the resin accumulation of attachment in exhaust outlet can block exhaust outlet.
The resin of attachment accumulates this problem as described in patent document 1 in exhaust outlet, and exhaust outlet is set in itself in lead frame,
It is addressed by the way that the resin adhered in exhaust outlet is removed together with product.But, in this composition, lead frame can be produced
The free degree of shape is restricted the problem of this is new.
The Lesson One of the present invention is entitled can be taken into account from the inner chamber of injection molten resin to outside effectively simultaneously there is provided a kind of
Discharge air and easily remove this two resin seal mould of flash removed from intermediate products using flash trimmer.
The second problem of the present invention is that there is provided a kind of method of following manufacture resin formation part：Using can simultaneously it is simultaneous
Turn round and look at from injection molten resin inner chamber effectively discharge air and using flash trimmer easily from intermediate products go flash removed this two
The resin seal mould of item, so that manufacture is installed on the resin forming portion of electronic unit on lead frame exactly.
The solution used to solve the problem
A kind of resin seal mould is provided in the 1st aspect of the present invention,
Possess the first mould and the second mould,
In the first interarea and the second interarea of second mould opposed with first interarea of first mould
Between clamp lead frame, and carry out resin seal to the part configured in the lead frame of inner chamber, the inner chamber by
The first inner chamber portion for being arranged on first interarea and the second inner chamber portion for being arranged on the second interarea are formed,
In the first interarea of first mould, dam block, the dam are set along the opening edge portion in the first inner chamber portion
Block with when clamp the lead frame when, the mode not abutted with the interarea of second die side of the lead frame is configured,
In the second interarea of second mould, set with the second inner chamber part from and with second mould it is outer
The exhaust outlet of portion's connection,
The height dimension away from first interarea of the dam block is less than the thickness of the lead frame,
When first mould is overlapped with second mould, the exhaust outlet and the dam block part superposition.
A kind of method is provided in the 2nd aspect of the present invention,
The resin formation part of electronic unit is manufactured using resin seal mould as claimed in claim 1,
Methods described includes following process：
Prepare the lead frame of non-mounting with the installation portion for being mounted with the electronic unit and in addition；
The installation portion of the lead frame is configured in the interior intracavitary；
The lead frame is clamped between the first interarea of first mould and the second interarea of second mould
Non-mounting；
To the interior intracavitary resin by injection.
In an embodiment being related in the 2nd aspect of the present invention, methods described also includes：
After the process of resin seal is carried out to the installation portion of the lead frame, described first is removed using flash trimmer
The dam block of mould and the process of the resin burr formed in the gap of second mould.
Invention effect
In the 1st aspect of the present invention, the dam block of first mould, not draw when clamping the lead frame with described
The mode that the interarea of second die side of wire frame is abutted, configured, and the dam block away from first interarea
Height dimension is less than the thickness of the lead frame, so when the first interarea and second mould of first mould
When clamping the lead frame between the second interarea, gap is formed between the dam block of first mould and second mould.
Also, the part superposition of the dam block and the exhaust outlet.Therefore, according to the first embodiment of the invention, by
In there is the gap, the inner chamber is connected with the exhaust outlet in the state of the lead frame is clamped, therefore to described interior
When intracavitary injects molten resin, the air of the interior intracavitary is effectively discharged out to outside mould via the gap from the exhaust outlet
Portion.Moreover, the height dimension away from first interarea of the dam block be less than the lead frame thickness, so with setting
Compared with the situation for the exhaust outlet that the inner chamber is connected, the resin burr for being formed at the part in the gap is thinning, thus
Using flash trimmer flash removed can be accurately removed from intermediate products.
Moreover, according to first method, in the mode opposed with the exhaust outlet for being arranged on second mould, described first
In the composition of the other parts (a part of different part from the lead frame) of mold arrangement lead frame, the exhaust outlet
It is a part of to be overlapped with the dam block, therefore the gap formed between the dam block and second mould connects with exhaust outlet.Its
As a result, the exhaust pathway for being communicated to mold exterior from the inner chamber will not hinder the other parts of the lead frame, via institute
The air of the interior intracavitary can be discharged exactly by stating exhaust outlet.
According to the 2nd aspect of the present invention, identically with first method, the air of the interior intracavitary via the gap from
The exhaust outlet is effectively expelled to mold exterior, and flash removed can be removed from intermediate products using flash trimmer.Accordingly, energy
Enough resin formation parts for correctly producing the electronic unit installed on the installation portion of the lead frame.
Also, an embodiment being related to according to second method, compared to being provided with the row that is connected with the inner chamber body
The situation of gas port, the dam block and second mould for being formed at first mould are easily and securely removed using flash trimmer
Gap relatively thin resin burr.
Brief description of the drawings
Fig. 1 is the figure for showing to possess the resin sealing apparatus for the resin seal mould that embodiments of the present invention are related to.
Fig. 2 is the stereogram for the part for showing the resin seal mould that embodiments of the present invention are related to.
Fig. 3 is the stereogram for showing a part for cavity block in downside.
Fig. 4 is the top view for showing a part for cavity block in downside.
Fig. 5 is the stereogram for showing to be configured with a part for cavity block in the downside of the state of lead frame.
Fig. 6 is the top view for showing to be configured with a part for cavity block in the downside of the state of lead frame.
Fig. 7 is to show the three-dimensional cutaway view along Fig. 6 line A-A.
Fig. 8 is to show the sectional view along Fig. 6 line A-A.
Fig. 9 is the manufacturer for the resin formation part for being shown with the resin seal mould that embodiments of the present invention are related to
The flow chart of method.
Figure 10 is the top view for showing the intermediate products after resin seal process and before burr removing step.
Figure 11 is the top view for showing the intermediate products after burr removing step and before lead frame manufacturing procedure.
Figure 12 is to show the three-dimensional cutaway view along Figure 11 line B-B.
Figure 13 is to show the resin seal mould of comparative example and is sectional view corresponding with Fig. 8.
Figure 14 is to show the top view for illustrating prior art.
Description of reference numerals
1 resin seal mould
2 times moulds
20 downside stocks
22 blocks
Cavity block in 23 downsides
The upper surface of cavity block on the downside of 23a
24
25 downsides inner chamber
26 cross gates
27 dam blocks
The upper surface of 27a dam blocks
28 cast gates
3 molds
30 upside stocks
32 reject block
Cavity block in 33 upsides
The lower surface of cavity block on the upside of 33a
34 rejecting portions
35 upsides inner chamber
36 exhaust outlets
36a overlapping portions
40 lead frames
41st, 42 installation portion
43 non-mounting
50 resin formation parts
60 inner chambers
70 gaps
100 resin sealing apparatus
Embodiment
The resin seal mould being related to reference to the accompanying drawings to embodiments of the present invention is illustrated.The following description
In, the term (such as " on ", " under ") in the specific direction of expression has been used as needed, and these are to be readily appreciated that the present invention
And use, do not limit the purpose of the scope of the present invention.
(resin sealing apparatus 100)
As shown in figure 1, resin sealing apparatus 100 is shaped on lead frame 40 (referring to Fig. 5 to Fig. 8) with multistation
Electronic unit carry out resin seal, thus manufacture electronic unit resin formation part 50 (encapsulation part, with reference to figures 10 to Figure 12).
Electronic unit is, such as the discrete semiconductor component of single function element.
Resin sealing apparatus 100 possesses pedestal 10, the lower stationary platen 11 being fixed on pedestal 10, is fixed on lower fixed station
4 connecting rods 12 in the corner portion of plate 11, be fixed on connecting rod 12 upper end upper stationary platen 13, be arranged on lower fixed station
The removable platen 14 that can be moved up and down between plate 11 and upper stationary platen 13 and by connecting rod 12 and installed in pedestal
The servo motor 15 of 10 side.
Removable platen 14 passes through the elbow-bar mechanism that is arranged between the removable platen 14 and lower stationary platen 11
16 action and move up and down.Elbow-bar mechanism 16 has ball-screw 17 and crank 18.The lower end side of ball-screw 17 with
The mode that can be rotated is supported on lower stationary platen 11, and its bottom is provided with pulley 17a.In the pulley of ball-screw 17
Between 17a and pulley 15a in the rotating shaft of servo motor 15, timing belt 19 is set up.Therefore, it will be watched via timing belt 19
The rotation for taking motor 15 is delivered to ball-screw 17.Nut 17b is set in ball-screw 17, with the rotation of ball-screw 17,
Nut 17b is moved up and down.Therefore, with the nut 17b linkage that moves up and down, and then crank 18 is flexible, thus can realize removable
Platen 14 is moved up and down.
(resin seal mould 1)
Resin seal mould 1 is arranged between stationary platen 13 and removable platen 14.Resin seal mould 1 possesses use
In the lower mould 2 and mold 3 that clamp lead frame 40.Lower mould 2 has the downside mold base being fixed on removable platen 14
4 and be arranged on downside mold base 4 in downside stock (chase) 20.Mold 3, which has, to be fixed under stationary platen 13
Upside mold base 5 and the upside stock 30 being arranged in the mold base 5 of upside.
The downside stock 20 and upside stock 30 of resin seal mould 1 are as shown in Figure 2.Fig. 2 shows downside stock 20 and upper
The general construction of side stock 30.But, eliminate for knock pin (extrusion pin) that product is extruded and taken out from mould
Liftout plate etc..Hereinafter, in this specification, using the X-direction shown in Fig. 2 as longitudinal direction, Y-direction is laterally, Z-direction is short transverse.
Moreover, representing the expression of " on ", " under " in direction in this specification, +Z direction, the -Z direction in figure are referred respectively to.
(downside stock 20)
As shown in Fig. 2 downside stock 20 is with cavity block 23 in basket 21, cylinder block 22 and downside.Cylinder block 22 and downside inner chamber
Block 23 has rectangular shape respectively, is arranged in basket 21.Cavity block 23 is with transverse direction (Y-direction) folder in 2 downsides of setting
Hold a block 22.The upper surface location of cylinder block 22 is more upper than the upper surface of cavity block in downside 23, therefore in cylinder block 22
In upper surface and downside step is formed between the upper surface of cavity block 23.
Cylinder block 22 has the cylinder 24 of the through hole of the hard resin as input flaky resin etc..Cylinder 24 is circle under vertical view
Shape.In in cylinder 24, hard resin is pressurizeed, while the plunger for being provided for injecting in inner chamber 60 described hereinafter (does not have
There is diagram).The rejecting portion 34 that plunger makes hard resin be pressed to upside stock 30 is pressurizeed, while melting it.In addition, cylinder
The heater for heating hard resin and melting it can be provided in block 22.
As shown in figure 3, cavity block 23 has a pair of lower inner chamber 25,25 being set up in parallel in longitudinal direction (X-direction) in downside.Under
Side inner chamber 25 has the shape (reference picture 8 etc.) that the upper surface 23a of cavity block 23 is tapered downwards out of downside.When downside set
When frame 20 and the coincidence of upside stock 30, the upside inner chamber 35 set in downside inner chamber 25 and upside described later in cavity block 33
Cooperation forms (delimitation) inner chamber 60.Cross gate 26 is provided between a pair of lower inner chamber 25, the cross gate 26 is from downside
The groove that interior cavity block 23 extends to cylinder block 22 and horizontal (Y-direction).But, cross gate 26 is not communicated in cylinder 24.
In addition, in Fig. 2, figure is seen for convenience, be only provided with 1 cylinder 24, but multiple cylinders can also be set in cylinder block 22
24.When being provided with multiple cylinders 24, the downside inner chamber of quantity corresponding with the quantity of cylinder 24 is also provided with cavity block 23 in downside
25。
The upper surface 23a of cavity block 23 is in downside, cooperates with clamping lead frame 40 with the lower surface 33a of cavity block in upside 33
Interarea.As shown in Figure 3, Figure 4, set in downside in the upper surface 23a of cavity block 23 along the opening edge portion of downside inner chamber 25
It is equipped with dam block 27.The upper surface 23a upward directions (+Z direction) of the cavity block 23 out of downside of dam block 27 are prominent.
The height dimension of the dam block 27 of upper surface away from cavity block in downside 23, the thickness than lead frame 40 is smaller.In detail
For, as shown in figure 8, the size of dam block 27 is, when clamping lead frame 40 using downside stock 20 and upside stock 30, even if
Lead frame 40 is compressed thinning by clamping force, and the lower surface 33a of cavity block 33 will not connect in dam block 27a upper surface 27c and upside
The size of tactile degree.
The shape of dam block 27 changes according to the shape of lead frame 40.In present embodiment, dam block 27, which has, to be divided mutually
From the first block 27a and the second block 27b.First block 27a is disposed relative to the phase of the cross gate 26 of downside inner chamber 25
Toss about, substantially "U" shape (or substantially " U " shape) under vertical view.A pair of " L " shape laterally separated in (Y-direction)
Second block 27b, 27b are arranged between downside inner chamber 25 and cross gate 26.Thus, dam block 27 is configured as, when clamping lead
During frame 40, not abut the upper surface 40a (interarea of the side of mold 2) of lead frame 40.
Between second block 27b, 27b of a pair of L-shaped, the cast gate of connection downside inner chamber 25 and cross gate 26 is provided with
28.Cast gate 28 is between a pair of L-shaped portions 27b, 27b on the downside of excision formed by inner chamber 25, with 2 opposed side walls,
And inclined bottom surface.
(upside stock 30)
As shown in Fig. 2 upside stock 30 has basket 31, rejects cavity block 33 in block 32 and upside.Reject block 32 and upper
Cavity block 33 has rectangular shape respectively in side, is arranged in basket 31.2 upsides inner chamber is set in transverse direction (Y-direction)
Block 33, block 32 is rejected with the clamping in centre.
Reject and rejecting portion 34 is provided with block 32, the rejecting portion 34 is for temporarily storing by the cylinder 24 of downside stock 20
The recess of the molten resin of supply.Principal part 34a with the principal part 34a under vertical view being circle and is arranged on by rejecting portion 34
Protuberance 34b, 34b middle and extended in transverse direction (Y-direction).When downside stock 20 and upside stock 30 are overlapped, rejecting portion
When 34 principal part 34a is overlapped with cylinder 24, the protuberance 34b in rejecting portion 34 is overlapped with cross gate 26.Thus, from downside stock 20
Cylinder 24 is connected by rejecting portion 34 with cross gate 26, cast gate 28 and inner chamber 60, forms the stream of molten resin.
Cavity block 33 has a pair of upsides inner chamber 35 being set up in parallel in longitudinal direction (X-direction) in upside.Upside inner chamber 35 has
The shape that the lower surface 33a for having the cavity block 33 out of upside is tapered upward (with reference to Fig. 8 etc.).As it was noted above, working as downside
When stock 20 is overlapped with upside stock 30, upside inner chamber 35 is cooperated with the downside inner chamber 25 set in cavity block in downside 23 in formation
Chamber 60.
Fig. 8 is the sectional view along Fig. 6 line A-A.Fig. 8 shows to work as clamps lead using downside stock 20 and upside stock 30
In downside in the state of frame 40 in the section of cavity block 23 and upside cavity block 33 section.The lower surface of cavity block 33 in upside
33a is that the upper surface 23a with cavity block in downside 23 is opposed, is the interarea for being cooperated with the upper surface 23a and clamping lead frame 40.
In upside in the lower surface 33a of cavity block 33, it is provided with as the groove with being contacted outside upside stock 30
Exhaust outlet 36.Exhaust outlet 36 is separated from upside inner chamber 35, is extended along longitudinal direction (X-direction).Moreover, in the end of longitudinal direction (X-direction),
Exhaust outlet 36 has the overlapping portion 36a with the dam block 27a part superpositions of downside stock 20.
Also, in present embodiment, as it was noted above, 27 height of the dam block of the upper surface 23a away from cavity block in downside 23
Degree size is, in the case of lead frame 40 is clamped using downside stock 20 and upside stock 30, even if lead frame 40 is pressed from both sides
Clamp force is compressed thinning, the size for the degree that cavity block 33 will not also be contacted in dam block 27 and upside.Therefore, when clamping lead frame 40
When, gap 70 is formed between the lower surface 33a of cavity block 33 in dam block 27a upper surface 27c and upside.Certainly, even in folder
Make before tight lead frame 40 in the state of lower mould 2 and the matched moulds of mold 3, can also form gap 70.Via gap 70, make each other
The upside inner chamber 35 of separation is connected with exhaust outlet 36.The height dimension in gap 70 is more much smaller than the depth dimensions of exhaust outlet 36.But
It is that as described later, gap 70 is by connecting inner chamber 60 and exhaust outlet 36, it can be ensured that the portion discharge function of exhaust outlet 36.
Therefore, the width (flow path area) for the degree that the width in gap 70 is preferably vented with without prejudice to from inner chamber 60.
In addition, when setting multiple cylinders 24 in downside stock 20, the quantity pair with cylinder 24 is also set in upside stock 30
The rejecting portion 34 and upside inner chamber 35 for the quantity answered.
(lead frame 40)
Resin seal mould 1 of the present embodiment can be corresponding with the lead frame with arbitrary shape, herein to attached
The shape for the example lead frame 40 that seal is carried is illustrated.As shown in Figures 5 to 7, lead frame 40, which has, is mounted with electronic unit
The installation portion 41,42 of (not shown) and non-mounting 34 in addition.Installation portion 41,42 is empty in width (Y-direction)
Go out interval and constitute.Electronic unit is mounted across 2 installation portions 41,42.Non-mounting 43 refer in lead frame 40 except
The part of installation portion 41,42.As shown in Figure 7,8, the upper surface 27c that the upper surface 40a of lead frame 40 is located at than dam block 27a is also high
Position.
(manufacture method of the resin formation part 50 of electronic unit)
Fig. 9 shows to employ the resin formation part of the electronic unit for the resin seal mould 1 that embodiment of the present invention is related to
50 manufacture method.The manufacture method of resin formation part 50 includes：Preparation is mounted with drawing for electronic unit in installation portion 41,42
The process (S1) of wire frame 40；And the lead frame 40 prepared in process S1 is configured to the process (S2) in downside on cavity block 23
(with reference to Fig. 5-Fig. 8).Lead frame 40 is between cavity block 23 in alignment pin (not shown), dam block 27 and cylinder block 22 and downside
Step is positioned.Thus, when clamping lead frame 40 using downside stock 20 and upside stock 30, installation portion 41,42 quilts
Configuration is in inner chamber 60.
The manufacture method of resin formation part 50 also includes：Using downside stock 20 and upside stock 30 to the non-of lead frame 40
The process (S3) (referring to Fig. 8) that installation portion 43 is clamped.By be moved upward removable platen 14 as shown in Figure 1 come
It is clamped process S3.Accordingly, pressed from both sides in downside in the upper surface 23a of cavity block 23 and upside between the lower surface 33a of cavity block 33
Tight lead frame 40.Now, in the clamp state, the cavity block 33 in the dam block 27a of cavity block 23 upper surface 27c and upside in downside
Lower surface 33a between form gap 70, i.e., on the downside of stock 20 and upside stock 30 do not contact.Thus, it is applied to lead frame 40
Clamping force will not be applied directly to resin seal mould 1 itself, prevent damage mould 1.
The manufacture method of resin formation part 50 also includes：Molten resin is injected into inner chamber 60 makes its solidification so as to lead
The installation portion 41,42 of frame 40 carries out the process (S4) (referring to Figure 10) of resin seal.The plunger being arranged in cylinder 24 is set to increase, from
And inject molten resin into inner chamber 60.Molten resin passes through rejecting portion 34 from the cylinder 24 of downside stock 20, flows to cross gate
26th, cast gate 28 and inner chamber 60.
Now, the gap formed between the lower surface 33a of cavity block 33 in dam block 27a upper surface 27c and upside
70, inner chamber 60 and exhaust outlet 36 are attached.Therefore, inner chamber can effectively be discharged from exhaust outlet 36 to mold exterior by gap
Air in 60.Particularly, by setting the overlapping portion 36a with dam block 27a part superpositions in exhaust outlet 36, gap 70 is being drawn
The front face side of the non-mounting 43 of wire frame 40 is connected with exhaust outlet.Its result is that the exhaust of mold exterior is communicated to from inner chamber 60
Path will not be hindered by non-mounting 43, can discharge away the air in inner chamber 60 exactly.
The molten resin being filled in inner chamber 60 solidifies and forms resin formation part 50.Also, molten resin is with from interior
The air that chamber 60 is discharged is flowed into gap 70, the stream of the molten resin and exhaust outlet 36, and progress solidifies so as to respectively
Form resin burr 51,52,53.
The manufacture method of resin formation part 50 also includes：Using such as air pressure type, hydrostatic flash trimmer from centre
Product removes the process (S5) of resin burr (with reference to Figure 11,12).Thereby, it is possible to remove the upper table for being formed at dam block 27a, 27b
The relatively thin resin burr in gap 70 in face 27c and upside between the lower surface 33a of cavity block 33.In addition, because of cross gate 26
Deng the molten resin of formation stream and be formed at exhaust outlet 36 thicker resin burr 52,53 be reserved state.
The manufacture method of resin formation part 50 also includes：Process the process (S6) (referring to Figure 11) of lead frame 40.Using such as
Double dot dash line cutting lead frame 40 shown in the cutting machine along Figure 11 such as blade or punch press.Its result is to be manufactured that possess resin
The electronic unit of forming section 50 and lead frame 41,42.
Figure 13 shows the resin seal mould of comparative example.The resin seal mould of the comparative example only cavity block in upside
Set the construction this point of exhaust outlet different from resin seal mould 1 of the present embodiment in 33, other construction all sames.
Therefore, Tu13Zhong, remaining is identical with Fig. 8 reference in addition to exhaust outlet 236.
For the resin seal mould of comparative example, in upside in the lower surface 33a of cavity block 33, set and upside inner chamber
The exhaust outlet 236 of 35 connections.When implementing the manufacture method of resin formation part 50 using the resin seal mould of the comparative example,
The installation portion 41,42 of lead frame 40 is carried out in the process (S4) of resin seal, goes out to form thicker resin hair in exhaust outlet 236
Thorn.
In such cases, in the process (S5) of resin burr is removed from intermediate products, using such as air pressure type, hydraulic pressure
The flash trimmer of formula is difficult to remove the resin burr being formed in exhaust outlet 236.In deburring operation S5, simply removing can
The relatively thin resin burr removed using flash trimmer, the thicker resin burr for remaining in exhaust outlet 236 can also be
Cut and remove in the process (S6) being processed to the lead frame 40 of back segment.But, in manufacturing procedure S6, to being formed in row
The thicker resin burr of part in gas port 236 and around resin formation part 50, it is difficult to remove exactly to trickle position.
Moreover, in manufacturing procedure S6, if cut to the not only thick but also hard resin burr being formed at around resin formation part 50,
Then it is possible to that the blade of cutting machine can be damaged.
In addition, when using resin seal mould 1 of the present embodiment, forming the resin burr 51 in gap 70
It is relatively thin, the lower surface 33a of the gap 70 cavity block 33 in the dam block 27a of cavity block 23 upper surface 27c and upside in downside it
Between.Therefore, resin burr 51 can accurately be removed using such as air pressure type, hydrostatic flash trimmer.Because of shapes such as cross gates 26
Into, thicker resin burr 52,53 in the stream that is formed at molten resin and in exhaust outlet 36, it is impossible to utilize flash trimmer
Remove, but non-mounting 43 that can be with lead frame 40 in the process (S6) of the processing lead frame 40 of back segment is together removed.
Accordingly, present embodiment is with cavity block 33 in the dam block 27a of the cavity block 23 upper surface 27c in downside and upside
Gap 70 between lower surface 33a is ensured based on the idea of this novelty of the part of functions of exhaust outlet 36.Therefore, will
The air for injecting the inner chamber 60 of molten resin is effectively discharged out to mold exterior from gap 70.Thereby, it is possible to suppress ester moulding
Space occurs in portion 50, while can accurately remove the resin burr on the periphery of resin formation part 50 using flash trimmer.
Moreover, in present embodiment, in flash removed process S5 is removed, removing the resin burr on the periphery of resin formation part 50
(resin burr 51).Therefore, in manufacturing procedure S6, when the line of cut cutting lead frame 40 shown in Figure 11, except being formed
Beyond a part for resin burr 52 in the stream of molten resin, the blade of cutting machine can not cut hard resin.Thus,
The damage of cutting machine blade can be suppressed.
(variation)
The present invention is described above according to embodiment, but the present invention is not limited by the embodiment,
In the main scope for not departing from the present invention, various improvement and the change being related to can be carried out.
For example, in embodiments, exhaust outlet 36 is set in dam block 27, upside stock 30 to be set in downside stock 20
Example be illustrated, but the present invention it is not limited, dam block can also be set in upside stock 30 on the contrary, in downside
Exhaust outlet is set in stock 20.
Also, in embodiments, Fig. 8 is shown below example：In downside the upper surface 27c of the dam block 27 of cavity block 23 with it is upper
The height dimension (Z-direction size) in the lower surface 33a of cavity block 33 gap 70 in side, from the lateral side of exhaust outlet 36 in inner chamber 60 1
It is fixed in longitudinal direction (X-direction).But, the present invention is not limited thereto, for example can with the height dimension in gap 70 from
The mode that the lateral side of exhaust outlet 36 in inner chamber 60 1 gradually expands in longitudinal direction (X-direction) is tilted.
Moreover, in embodiments, connected and extended straight in longitudinal direction (X-direction) with gap 70 with an exhaust outlet 36
Example be illustrated, but the present invention it is not limited, any position can be arranged on when being connected with gap 70.In addition,
Exhaust outlet 36 need not extend straight, can be bent under vertical view according to the easness of shaping, can also carry out branch.And then,
A plurality of exhaust outlet 36 can also be set.
Claims (3)
1. a kind of resin seal mould, it is characterised in that
Possess the first mould and the second mould,
Between the first interarea of first mould and the second interarea of second mould opposed with first interarea
Lead frame is clamped, and resin seal is carried out to the part configured in the lead frame of inner chamber, the inner chamber is by being arranged on
The first inner chamber portion of first interarea is formed with the second inner chamber portion for being arranged on second interarea,
In the first interarea of first mould, the opening edge portion in the first inner chamber portion is provided with dam block, the dam block
So that when clamping the lead frame, the mode not abutted with the interarea of second die side of the lead frame is configured,
In the second interarea of second mould, be provided with the second inner chamber part from and with second mould outside
The exhaust outlet of connection,
The height dimension away from first interarea of the dam block is less than the thickness of the lead frame,
When first mould is overlapped with second mould, the exhaust outlet and the dam block part superposition.
2. a kind of method, it is characterised in that the resin of electronic unit is manufactured using resin seal mould as claimed in claim 1
Forming section,
Methods described includes following process：
Prepare the lead frame of non-mounting with the installation portion for installing the electronic unit and in addition；
The installation portion of the lead frame is configured in the interior intracavitary；
The non-peace of the lead frame is clamped between the first interarea of first mould and the second interarea of second mould
Dress portion；And
To the interior intracavitary resin by injection.
3. method according to claim 2, it is characterised in that also include：
After the process of resin seal is carried out to the installation portion of the lead frame, removed using flash trimmer in first mould
The dam block of tool and the process of the resin burr formed in the gap of second mould.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-025107 | 2016-02-12 | ||
| JP2016025107A JP6288120B2 (en) | 2016-02-12 | 2016-02-12 | Method for manufacturing resin-molded mold and resin molded part of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107081879A true CN107081879A (en) | 2017-08-22 |
| CN107081879B CN107081879B (en) | 2020-05-15 |
Family
ID=59615094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710073572.6A Active CN107081879B (en) | 2016-02-12 | 2017-02-10 | Resin sealing mold and method for manufacturing resin molding part of electronic component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6288120B2 (en) |
| CN (1) | CN107081879B (en) |
| TW (1) | TWI663662B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6986539B2 (en) * | 2019-11-25 | 2021-12-22 | Ｔｏｗａ株式会社 | Resin-molded lead frame manufacturing method, resin-molded product manufacturing method, and lead frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920768A (en) * | 1996-12-19 | 1999-07-06 | Denso Corporation | Manufacturing method for a resin sealed semiconductor device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59208733A (en) * | 1983-05-12 | 1984-11-27 | Matsushita Electronics Corp | Manufacture of resin sealed type semiconductor device |
| JPH04192432A (en) * | 1990-11-26 | 1992-07-10 | Mitsubishi Electric Corp | Hydraulic deburring device for semiconductor device |
| TWI290756B (en) * | 2006-01-02 | 2007-12-01 | Advanced Semiconductor Eng | Leadframe and chip package applying the same |
| TWM326467U (en) * | 2007-08-22 | 2008-02-01 | Single Well Ind Corp | Semiconductor packaging mold |
| TWI382511B (en) * | 2009-01-23 | 2013-01-11 | Advanced Semiconductor Eng | Leadframe strip, molding method and molded structure thereof |
-
2016
- 2016-02-12 JP JP2016025107A patent/JP6288120B2/en active Active
-
2017
- 2017-01-17 TW TW106101541A patent/TWI663662B/en not_active IP Right Cessation
- 2017-02-10 CN CN201710073572.6A patent/CN107081879B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920768A (en) * | 1996-12-19 | 1999-07-06 | Denso Corporation | Manufacturing method for a resin sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6288120B2 (en) | 2018-03-07 |
| JP2017143226A (en) | 2017-08-17 |
| CN107081879B (en) | 2020-05-15 |
| TW201732967A (en) | 2017-09-16 |
| TWI663662B (en) | 2019-06-21 |
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