CN107058747A - The method of oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board - Google Patents
The method of oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
- C22B7/004—Dry processes separating two or more metals by melting out (liquation), i.e. heating above the temperature of the lower melting metal component(s); by fractional crystallisation (controlled freezing)
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0026—Pyrometallurgy
- C22B15/0028—Smelting or converting
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Abstract
The method of oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board, comprises the following steps：（1）Heat detin processing；（2）Break process；（3）Mixed smelting；（4）Melt treatment；（5）Inner flue gas of the stove processing；（6）Come out of the stove fume treatment.The present invention is using copper concentrate as primary raw material, and useless circuit board processing is combined, in the effective decomposing organic matter in high temperature molten bath, realizes autogenous smelting using organic matter and sulphide ore oxidation heat liberation, use high concentration SO by part waste printed circuit board of arranging in pairs or groups with oxygen-enriched top blowing copper weld pool2Flue gas suppresses bioxin generation, and injection auxiliary air decomposes the compound of residual, and flue gas gathers dust through waste heat recovery, electricity, enter acid making system after water-spraying control.Energy consumption of the present invention is low, and valuable metal comprehensive recovery is high, resourcebility processing useless circuit board, can solve existing useless circuit board handling process pollution weight, produce hypertoxic bioxin, the low problem of metal recovery rate.
Description
Technical field
Handled the invention belongs to waste printed circuit board pyrogenic attack field, more particularly to a kind of oxygen-enriched top blowing copper weld pool collocation
The method of waste printed circuit board.
Background technology
Waste printed circuit board is mainly made up of electronic component, organic fortified resin, glass fibre, copper foil etc., wherein gold
Category content is generally more than 40%, mainly includes common metal Cu, Fe, Ni, Zn and noble metal Au, Ag, Pt, Pd etc. are a large amount of recyclable
The material utilized, economic value is higher.On the other hand, generally containing lead, cadmium, mercury etc. to human body and environment in waste printed circuit board
Brominated flame retardant, phenolic resin, epoxy resin in harmful material, organic constituent element etc. fail to produce during effective processing largely
Strong toxicity carcinogen.It follows that the existing resource of waste printed circuit board has harmfulness again, therefore it is rational to need proposition badly
The method of recycling recycling.
Waste printed circuit board conventional treatment method includes mechanical treatment, hydrometallurgic recovery, pyrogenic process recovery etc..Mechanical treatment includes
The process such as disassemble, crush, sorting, being used in combination frequently as pretreatment process with pyrogenic process, wet recycling process, cost is relatively low, it is dirty
Dye is small, but its treatment effect is high to the dependence of material monomer dissociation degree, and waste printed circuit board base material hardness is high, toughness
By force, the comminution energy conssumption of Mechanical Method is high, and equipment attrition degree is high, be also easy to produce noise and containing glass fibre, organic resin it is harmful
Dust, the organic matter such as resin, plastics produces toxic gas because localized hyperthermia will react.
Wet-treating handles useless circuit board particle by modes such as extraction, precipitation, displacement, ion exchange, filtering and distillations
Acid/base leachate, valuable metal is extracted, the rate of recovery of metal is high, purity is high, the problems such as no dioxin emission, but technique stream
Journey is complicated, is also easy to produce largely containing heavy metal ion, the waste water of cyanide, spent acid, needs strict sewage disposal process, such shortcoming
Limit the innoxious recovery and processing of waste printed circuit board.
The organic matter in useless circuit board is decomposed in pyrogenic attack by modes such as burning, sintering, melting, melting, pyrolysis, is reclaimed
Valuable metal, while needing the braking measure that bioxin reaction of formation is set up in processing procedure Ji the decomposition measure of bioxin.
The formation mechanism of pyrogenic attack Guo journey Zhong bioxin is divided into two kinds：（1）Because reaction temperature and time are not enough, having in useless circuit board
Machine thing is not decomposed completely, generates carbon containing macromolecular Deng bioxin predecessors, and combined chloride is generated in the presence of metallic catalyst
Bioxin；（2）CO/CO in flue gas2In the low-temperature space of burner hearth and smoke processing system, through the metal for being attached to flue dust surface
Catalyst, from the beginning reacts He Cheng bioxin.Therefore, it is effective generation for suppressing bioxin, need to be from the suitable reaction of offer
Temperature, effective decomposing organic matter, the catalytic action for suppressing metallic catalyst, reduction flue gas bioxin are generated in temperature range
The handling process of comprehensive Design useless circuit board in terms of residence time.
CN102191383A proposition wet methods sealing-off-disassemble the useless circuit board that classification-pyrogenic process burns organic matter and Tail Gas
Processing method, by the different elements of progressively wet-leaching, the different component for crushing, sorting in useless circuit board reclaims metal component,
Burn organic component and reclaim heat energy, high temperature incineration Tail Gas.The technique is using high temperature incineration method processing organic component and is harmful to
Tail gas, need to configure incinerator and extra exhaust gas combustion chamber, and equipment, flow are complex.Meanwhile, wet-treating is only capable of reclaiming useless
Lead, tin and small part rare precious metal in circuit board, and it is difficult to the directly complicated useless circuit board of processing, the leaching agent of part metals
Efficiency is low, and active force is weak, can only act on exposed metal surface, when coating metal lid or during covered with scolding tin the rate of recovery compared with
It is low.Therefore this method is extremely difficult to Disposal of Electronic Wastes processing and the purpose utilized.
CN104566398A handles useless circuit board using fluidized incineration furnace melting, first with tear crusher machine useless circuit board,
Fluidized incineration furnace is added into, maintains to produce using inorganic matter combustion heat release on useless circuit board substrate, incineration flue gas is passed through successively
Water cooler, cyclone dust collectors, sack cleaner, activated carbon adsorber, alkali liquor absorption tower are crossed, to reduce flue-gas temperature, collection
Flue dust, cleaning of off-gas, effectively prevent the generation of bioxin.The method adaptability to raw material is strong, but long flow path, and equipment is complicated.And it is single
Only melting useless circuit board, is blister copper by the copper melting in useless circuit board, and glass fibre etc. forms dilute expensive in clinker, useless circuit board
Loss amount of the metal in clinker is larger, causes the waste of valuable metal resource.
CN101274329A is using flash smelting and electric dilution PROCESS FOR TREATMENT useless circuit board, it is necessary to which useless circuit board is crushed
To below 3mm, then it is smelting obtain water quenching after liquid metal and clinker, liquid metal ingot casting, slag depletion and store up, waste gas is anxious
Emptied after cold, depickling, dedirt.The technological process is simple, and treating capacity is big, but tight to raw material granularity, composition, process conditions requirement
Lattice, preprocessing process is complicated, high energy consumption.
The content of the invention
The technical problems to be solved by the invention are that there is provided a kind of oxygen-enriched top blowing copper for defect present in prior art
The method of melting collocation processing waste printed circuit board.
Present invention collocation processing waste printed circuit board during copper concentrate oxygen-enriched top blowing bath smelting, utilizes bath smelting
Treating capacity is big, adaptability to raw material is strong, reaction temperature is high, speed is fast, the advantage such as energy pyrolytic bioxin, the useless print of recycling treatment
Printed circuit board.It is rapid in high temperature molten bath to decompose the organic constituent element of waste printed circuit board；The copper matte regulus enrichment generated using matte smelting
The valuable metal in waste printed circuit board is reclaimed, glass fibre in waste printed circuit board etc. is melted into slag making, valuable gold is realized
Category is simply and effectively separated with glass fibre；Auxiliary air is blasted in the oxygen-enriched top blowing stove ascent stage, air capacity, stove is accurately controlled
Thorax internal diameter is larger, increases bioxin predecessors in gas residence time, fully oxidized combustion product gases, prevents the life of bioxin
Into；With reference to the braking measure of flue low-temperature region bioxin reaction of formation, generation and the emission problem of bioxin are solved, gold is improved
Belong to the rate of recovery, realize effective recovery of waste printed circuit board.
The technical solution adopted for the present invention to solve the technical problems is：The useless printing electricity of oxygen-enriched top blowing copper weld pool collocation processing
The method of road plate, specifically includes following steps：
（1）Heat detin processing：By waste printed circuit board heating removing scolding tin, scolding tin, detin substrate and electronic component are obtained,
Scolding tin is melted into ingot casting, screening separates electronic component, detin substrate feeding step（2）；
（2）Break process：By step（1）The detin substrate disintegrating machine coarse crushing of gained；
（3）Mixed smelting：By copper concentrate and auxiliary material in mixing granulation after materials ratio dispensing, oxygen-enriched top is added by top filling mouthful
Blown converter carries out melting；By step（1）Screen the electronic component separated and step（2）Detin substrate continuous uniform after coarse crushing adds
Enter oxygen-enriched top blowing stove；Spray gun is inserted by oxygen-enriched top blowing furnace roof, oxygen-enriched air is blown；Control gas in oxygen-enriched air concentration, control stove
Atmosphere and bath temperature are 1150~1300 DEG C, and continuous charging continuously releases melt；
（4）Melt treatment：By step（3）Described has trapped the polymetallic melt feeding electric furnace sedimentation separation of useless circuit board, group
Clinker phase into melt is different from copper matte regulus phase factor density and is layered in electric furnace, and clinker mutually swims in more than copper matte regulus phase, respectively from
Put copper mouthful and the slag tap of electric furnace release copper matte regulus and clinker, and copper matte regulus is with copper smelting by pyrometallurgy PROCESS FOR TREATMENT, by bessemerizing-pyrogenic process essence
Refining-electrorefining obtains tough cathode, and reclaims after earth of positive pole extraction rare precious metal, cooling of furnace slag, fine grinding flotation copper therein；
（5）Inner flue gas of the stove processing：In uphill process of the flue gas produced in fusion process in burner hearth, blasted by spray gun sleeve layer
Air, sleeve layers are located at more than bath surface, are not inserted into molten bath；Flue-gas temperature is set to rise to 1200~1300 DEG C, by flue gas
The undecomposed organic matter, bioxin predecessor oxidation Decomposition contained, in-furnace temperature is consistently higher than bioxin decomposition temperature, it is impossible to shape
The formation condition of Cheng bioxin；
（6）Come out of the stove fume treatment：After flue gas is come out of the stove, collected by heat recovery boiler recovery section heat, then with cottrell
Flue dust in flue gas, it is to avoid catalysis of the metallic catalyst of flue dust surface attachment to low-temperature space bioxin reaction of formation, flue dust is opened
Collect on road；SO in flue gas2Concentration is higher, can effectively suppress the generation of flue Nei bioxin；The flue gas for removing flue dust is sprayed
Water cooling, makes flue-gas temperature be rapidly decreased to below bioxin low temperature generation interval, low-temperature flue gas finally is sent into acid making system.
Further, step（1）In, the temperature of described waste printed circuit board heating removing scolding tin is 180~300 DEG C.
Further, step（2）In, the size of described detin substrate coarse crushing is 5~60mm.
Further, step（3）In, described copper concentrate includes copper sulfide concentrate and smelting slag, blowing slag dilution are reclaimed
The slag concentrate arrived.
Further, step（3）In, described auxiliary material is the one or more in high silicon river sand, lime stone, quartz etc..
Further, step（3）In, described oxygen-enriched air volumetric concentration is 45~65%.
Further, step（3）In, the detin substrate after described electronic component and coarse crushing is in electronic component, coarse crushing
The blend proportion that detin substrate afterwards always enters in stove inventory with copper concentrate is 1~20wt%.
Further, step（5）In, the air capacity that should accurately control spray gun sleeve layer to blast is prevented SO2It is oxidized to SO3,
It can be adjusted according to the residual oxygen rate of kiln gas is gone out, it is 5~7% to keep residual oxygen rate.
Further, step（6）In, the flue dust in flue gas is collected using cottrell process.
Further, step（6）In, water-spraying control process should make flue-gas temperature be no more than 200 DEG C.
Novelty of the present invention is：
（1）Collocation processing waste printed circuit board, comprehensively recovering valuable metal in copper oxygen-enriched top blowing melting.In waste printed circuit board
Copper and bullion content it is higher, copper, trapping noble metal can be simply, efficiently reclaimed during matte smelting, and by glass
The slag making such as fiber are removed, and flow is succinct.Utilize organic constituent element and copper sulfide concentrate oxidation autogenous smelting, energy-saving and emission-reduction.
（2）Integrated whole technological process, eliminates bioxin formation condition, and precaution sets up bioxin and decomposes control measure.
Using organic constituent element in the abundant combustion decomposition waste printed circuit board of high temperature bath smelting, two are blown in the oxygen-enriched top blowing stove ascent stage
Secondary air, and divided using the extension of chamber structure advantage in residing time in furnace, oxidation Decomposition useless circuit board charging dropping process
The organic matters such as the aliphatic hydrocarbon produced, aromatic hydrocarbon, and the bioxin predecessor formed are solved, bioxin High Temperature Gas phase reaction of formation is destroyed
Condition.By building high concentration SO2Flue gas suppression-flue dust of the collection containing metallic catalyst-rapidly Tong Guo bioxin low temperature life
The de novo formation of flue low-temperature range bioxin is avoided into the overall suppression mechanism such as interval.
（3）Waste printed circuit board pyrogenic process collocation melting theoretical mechanism and technology are set up, by controlling useless circuit board rich
The process conditions of oxygen top blast collocation fusion process, build energy-saving and emission-reduction, environment-friendly whole technological process, realize useless circuit board
Cleaning, recycling treatment.
Compared with prior art, the advantage of the invention is that：
（1）Present invention mixed processing waste printed circuit board in copper concentrate oxygen-enriched top blowing melting, can be during matte smelting
The valuable metals such as Cu, Ag, Au, Pt, Pd in waste printed circuit board are enriched in copper matte regulus, reclaimed with copper refining process.And will
Glass fibre etc. melt slag making, be not required to additionally add flux for the collocation of useless circuit board, effectively, easily separating valuable metals with
Glass fibre, saves the component separation device system of complexity, reduces cost, improves the synthetical recovery of valuable metal in useless circuit board
Rate and synthetical recovery benefit.
（2）Oxygen-enriched top blowing stove bath temperature is high in the present invention, and useless circuit board is quick in molten bath, fully reaction is decomposed, with
Waste printed circuit board pyrolysis processing is compared, the generation of unharmful substance；The oxygen-enriched top blowing stove burner hearth ascent stage blasts auxiliary air, temperature
Degree is higher, and gas residence time is long, can effectively decompose harmful substance remaining in flue gas；What copper sulfide concentrate oxidizing fire was produced
The SO of high concentration2Flue gas can suppress the secondary synthesis of the outer low-temperature space bioxin of stove；Using the very big limit reduction cigarette of electrostatic dust collection
Dirt rate, is prevented effectively from the catalysis of the metallic catalyst Dui bioxin reactions of formation of flue dust surface attachment, destruction bioxin generation bar
Part.By integrated system above technique, do not constitute the formation condition of bioxin in overall flow, and precaution form bioxin
Decomposition measure, without extra addition high-temperature incinerator and secondary combustion chamber processing tail gas, process equipment is simple, production process environment
It is friendly.
（3）During the mixed smelting of the present invention, using the oxidation of organic constituent element in copper sulfide concentrate and useless circuit board
Thermal discharge maintains production, realizes autogenous smelting process, reduces energy consumption, reduces exhaust gas volumn.
（4）The oxygen-enriched top blowing smelting furnace disposal ability of the present invention is big, and adaptability to raw material is strong, without strict pretreatment work
Sequence, valuable metal synthetical recovery energy rate is high, and effective new way is provided for the minimizing of waste printed circuit board, recycling treatment.
Brief description of the drawings
The process chart of Fig. 1 present invention；
The structural representation of Fig. 2 device therefors of the present invention；
Fig. 3 oxygen-enriched air injection method schematic diagrames.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Referring to the drawings, the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board, step is as follows：
（1）Heat detin processing：By waste printed circuit board in 200 DEG C of heating removing scolding tin, scolding tin, detin substrate and electronics are obtained
Component, ingot casting is melted by scolding tin, and screening separates electronic component, detin substrate feeding step（2）；
（2）Break process：By the disintegrating machine coarse crushing to 50mm × 50mm of detin substrate；
（3）Mixed smelting：Detin substrate after will be broken delivers to top filling with 6t/h with electronic component with rubber conveyer
Mouth 3, continuous uniform adds oxygen-enriched top blowing stove 1；
Using high silicon river sand, lime stone as flux, copper concentrate, high silicon river sand, lime stone are pressed into mixing granulation after consumption dispensing, with sulphur
Change copper concentrate 185t/h, high silicon river sand 12t/h, lime stone 2t/h continuous uniforms to add in oxygen-enriched top blowing stove 1, with it is broken after it is de-
Tinbase plate, electronic component carry out mixed smelting, and as shown in table 1, by adjusting technique, oxygen-enriched volume is dense for melting material composition table
Spend for 60%, amount of oxygen 9.88Nm3/ s, air capacity：10.15 Nm3/ s, controls 1250 DEG C of bath temperature, continuous charging is continuously put
Go out melt；
（4）The processing of melt：By step（3）Described has trapped the polymetallic melt feeding sedimentation electric furnace sedimentation point of useless circuit board
From, the clinker phase of composition melt is different from copper matte regulus phase factor density and is layered in electric furnace, and clinker is mutually swum in more than copper matte regulus phase, point
Copper mouthful and slag tap releasing copper matte regulus and clinker are not put from electric furnace, copper matte regulus is with copper smelting by pyrometallurgy PROCESS FOR TREATMENT, by bessemerizing-fire
Method refining-electrorefining obtains tough cathode, and reclaims earth of positive pole extraction rare precious metal；Clinker is after slow natural cooling, fine grinding
Flotation copper therein；
（5）Inner flue gas of the stove processing：In uphill process of the flue gas produced in fusion process in burner hearth, sprayed by the sleeve layers 4 of spray gun 2
Blow auxiliary air（Spray gun is four layers of concentric tube-in-tube structure, and sleeve layers 4, combustion-aid air pipe 5, oxygen hose 6 are respectively equipped with from outside to inside
With cartridge 7）, sleeve layers are located at more than bath surface, are not inserted into molten bath, the air that accurate control spray gun sleeve layer is blasted
Amount, air capacity should be adjusted according to the residual oxygen rate of kiln gas is gone out, and it is 7% to keep residual oxygen rate；Flue-gas temperature is set to rise to 1200~1300
DEG C, by the undecomposed organic matter, bioxin predecessor oxidation Decomposition contained in flue gas, in-furnace temperature is consistently higher than bioxin decomposition
Temperature, it is impossible to form the formation condition of bioxin；
（6）Come out of the stove fume treatment：After flue gas is come out of the stove through flue gas plug for outlet 8, by heat recovery boiler recovery section heat, then use
Cottrell collects out the flue dust in kiln gas, flue dust open circuit collection；Water-spraying control is carried out to the flue gas for removing flue dust, by flue gas
Temperature is down to less than 200 DEG C, and low-temperature flue gas is sent into acid making system extracting sulfuric acid.
The melting material composition table of table 1
Claims (10)
1. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board, it is characterised in that specifically include following steps：
（1）Heat detin processing：By waste printed circuit board heating removing scolding tin, scolding tin, detin substrate and electronic component are obtained,
Scolding tin is melted into ingot casting, screening separates electronic component, detin substrate feeding step（2）；
（2）Break process：By step（1）The detin substrate disintegrating machine coarse crushing of gained；
（3）Mixed smelting：By copper concentrate and auxiliary material in mixing granulation after materials ratio dispensing, oxygen-enriched top is added by top filling mouthful
Blown converter carries out melting；By step（1）Screen the electronic component separated and step（2）Detin substrate Belt Conveying after coarse crushing
Machine continuous uniform adds oxygen-enriched top blowing stove；Spray gun is inserted by oxygen-enriched top blowing furnace roof, oxygen-enriched air is blown；Control oxygen-enriched air dense
Degree, it is 1150~1300 DEG C to control furnace atmosphere and bath temperature, and continuous charging continuously releases melt；
（4）Melt treatment：By step（3）Described has trapped the polymetallic melt feeding electric furnace sedimentation separation of useless circuit board, group
Clinker phase into melt is different from copper matte regulus phase factor density and is layered in electric furnace, and clinker mutually swims in more than copper matte regulus phase, respectively from
Put copper mouthful and the slag tap of electric furnace release copper matte regulus and clinker, and copper matte regulus is with copper smelting by pyrometallurgy PROCESS FOR TREATMENT, by bessemerizing-pyrogenic process essence
Refining-electrorefining obtains tough cathode, and reclaims earth of positive pole extraction rare precious metal；After cooling of furnace slag, fine grinding flotation copper therein；
（5）Inner flue gas of the stove processing：In uphill process of the flue gas produced in fusion process in burner hearth, blasted by spray gun sleeve layer
Air, sleeve layers are located at more than bath surface, are not inserted into molten bath；Flue-gas temperature is set to rise to 1200~1300 DEG C, by flue gas
The undecomposed organic matter, bioxin predecessor oxidation Decomposition contained, in-furnace temperature is consistently higher than bioxin decomposition temperature, it is impossible to shape
The formation condition of Cheng bioxin；
（6）Come out of the stove fume treatment：After flue gas is come out of the stove, collected by heat recovery boiler recovery section heat, then with cottrell
Flue dust in flue gas, it is to avoid catalysis of the metallic catalyst of flue dust surface attachment to low-temperature space bioxin reaction of formation, flue dust is opened
Collect on road；SO in flue gas2Concentration is higher, can effectively suppress the generation of flue Nei bioxin；The flue gas for removing flue dust is sprayed
Water cooling, makes flue-gas temperature be rapidly decreased to below bioxin low temperature generation interval, low-temperature flue gas finally is sent into acid making system.
2. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1, it is characterised in that step
Suddenly（1）In, the temperature of described waste printed circuit board heating removing scolding tin is 180~300 DEG C.
3. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（2）In, the size of described detin substrate coarse crushing is 5~60mm.
4. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（3）In, described copper concentrate includes copper sulfide concentrate and smelting slag, the dilution of blowing slag reclaim obtained slag concentrate.
5. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（3）In, the auxiliary material is the one or more in high silicon river sand, lime stone, quartz.
6. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（3）In, described oxygen-enriched air volumetric concentration is 45~65%.
7. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（3）In, detin substrate of the detin substrate after electronic component, coarse crushing after described electronic component and coarse crushing
It is 1~20wt% always to enter the blend proportion in stove inventory with copper concentrate.
8. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（5）In, the air capacity that should accurately control spray gun sleeve layer to blast is prevented SO2It is oxidized to SO3, can be according to cigarette of coming out of the stove
The residual oxygen rate of gas is adjusted, and it is 5~7% to keep residual oxygen rate.
9. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（6）In, the flue dust in flue gas is collected using cottrell process.
10. the method for oxygen-enriched top blowing copper weld pool collocation processing waste printed circuit board as claimed in claim 1 or 2, its feature exists
In step（6）In, the water-spraying control process should make flue-gas temperature be no more than 200 DEG C.
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Effective date of registration: 20191210 Address after: Yuelu District City, Hunan province 410083 Changsha Lushan Road No. 932 Co-patentee after: Daye Nonferrous Metals Co., Ltd. Patentee after: Central South University Address before: Yuelu District City, Hunan province 410083 Changsha Lushan Road No. 932 Patentee before: Central South University |
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