CN107057623A - A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application - Google Patents
A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application Download PDFInfo
- Publication number
- CN107057623A CN107057623A CN201710364008.XA CN201710364008A CN107057623A CN 107057623 A CN107057623 A CN 107057623A CN 201710364008 A CN201710364008 A CN 201710364008A CN 107057623 A CN107057623 A CN 107057623A
- Authority
- CN
- China
- Prior art keywords
- parts
- component
- filling
- large volume
- transformer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention provides a kind of filling special epoxy pouring sealant of transformer large volume, is made up of component A and B component, component A includes the raw material of following parts by weight:First 450~550 parts of epoxy resin, 200~450 parts of the second epoxy resin, 20~60 parts of endurable active toughener, 10~50 parts of the first heat filling, 100~200 parts of filler;B component includes the raw material of following parts by weight:260~400 parts of modified firming agent, 50~200 parts of curing agent, 10~30 parts of toughener, 2~5 parts of pigment, 2~5 parts of defoamer, 10~50 parts of the first anti-settling agent, 0.6~2 part of adhesion promoter, 400~550 parts of the second heat filling.The present invention also provides a kind of transformer large volume filling special epoxy pouring sealant preparation method and application.Product does not ftracture after the filling special epoxy pouring sealant of transformer large volume that the present invention is provided, system rapid heat dissipation when large volume is filling, filling formation, and product electrical insulation capability is excellent.
Description
Technical field
The present invention relates to casting glue technical field, and in particular to a kind of filling special epoxy pouring sealant of transformer large volume and
Preparation method and application.
Background technology
Embedding is manually or jelly is circulated into equipped with electronic component, the device of circuit by the mode of machinery, and
Solidify it under conditions of room temperature or heating, eventually become the thermosetting polymer insulating materials of function admirable.The mesh of embedding
Be for the globality of strengthening electronic device, to improve the water proof and dust proof performance of device, while improve device to from impact and
The resistance of vibration, can also reach the purpose of secrecy.Therefore, prepared casting glue solidfied material must possess low water absorption,
The features such as high intensity, high tenacity, excellent insulating properties and good thermal diffusivity, this is also a development trend of casting glue.
For electronics industry, it is requirement heat conduction and insulation the characteristics of casting glue, there are numerous researchers for this requirement
Idea in proposing, such as improve insulating properties by adding organic silicon rubber or plasticizer, and improve heat conduction and be usually
Realized by adding aluminum oxide, aluminium hydroxide, boron nitride, carborundum, nano-sized filler, but it is a large amount of for industrial goods
Boron carbide, carborundum, Nano filling it is costly, limit its application in the filling glue of general industry.
Transformer is the general designation of voltage transformer summation current transformer, can be by high-voltage variable into low-voltage, and high current becomes
Into low current, for measuring or protecting system.For the casting glue of transformer, potting compound is not required nothing more than has electronics industry excellent
Insulating properties and thermal conductivity, while requiring not ftracture after product solidification, hardness is high and shrinkage factor is low.Therefore the technology of transformer material
It is required that higher, the particularly filling transformer casting glue of large volume.In the market be used for transformer protect casting glue always all according to
Rely in external producer, and it is expensive, and the transformer embedding for having been reported that large volume primary filling is yet there are no at home
Glue.
In this regard, the present inventor has found that the current country lacks the main of large volume transformer casting glue by research
Reason is that technical difficulty requires high, and the casting glue of large volume filling requires casting glue rapid heat dissipation, while pouring after shaping product not
It can ftracture, and transformer is very high to casting glue requirement on electric performance;Simultaneously for the material selectivities such as high-end heat conduction, insulation compared with
Few, the particularly prices of raw materials such as modified resin, toughened resin, boron carbide, carborundum, Nano filling are higher, it is difficult to extensive
Industrial applications.Therefore, the present invention relies primarily on conventional filler, modified resin etc. and carries out rational allocation, and being prepared for one kind can
To be widely used in the epoxy resin embedding adhesive that large volume transformer is filling.
The content of the invention
For requiring casting glue rapid heat dissipation to large volume transformer casting glue in the prior art, pour product after shaping and do not open
Split, transformer provides a kind of new transformer large volume and filled to casting glue requirement on electric performance very high technical problem, the present invention
Fill special epoxy pouring sealant.
In order to solve the above-mentioned technical problem, present invention employs following technical scheme:
A kind of filling special epoxy pouring sealant of transformer large volume, is made up of component A and B component;Wherein, the component A
Include the raw material of following parts by weight:First 450~550 parts of epoxy resin, 200~450 parts of the second epoxy resin, endurable active toughener
20~60 parts, 10~50 parts of the first heat filling, 100~200 parts of filler;The B component includes the raw material of following parts by weight:Change
260~400 parts of curing agent of property, 50~200 parts of curing agent, 10~30 parts of toughener, 2~5 parts of pigment, 2~5 parts of defoamer,
One 10~50 parts of anti-settling agent, 0.6~2 part of adhesion promoter, 400~550 parts of the second heat filling.
Further, the component A includes the raw material of following parts by weight:First 480~520 parts of epoxy resin, the second epoxy
300~350 parts of resin, 30~40 parts of endurable active toughener, 20~30 parts of the first heat filling, 140~180 parts of filler;The B groups
Dividing includes the raw material of following parts by weight:300~350 parts of modified firming agent, 100~150 parts of curing agent, 20~30 parts of toughener,
3 parts of pigment, 5 parts of defoamer, 20~30 parts of the first anti-settling agent, 2 parts of adhesion promoter, 450~500 parts of the second heat filling.
Further, first epoxy resin is E51, E44 or E39D, and second epoxy resin is double for modified hydrogenation
Phenol A based epoxy resins or modifying epoxy resin by organosilicon, the endurable active toughener are epoxy hydroxyl terminated butadiene acrylonitrile copolymer, institute
State aluminium hydrate nano material, aluminium oxide nano material or nano-calcium carbonate material that the first heat filling is 40~60nm of granularity
Material, the filler is silicon powder, and the modified firming agent is the acid anhydride type curing agent of flexible, and the curing agent is conventional acid
Anhydride curing agents, the toughener is liquid nitrile rubber, and the defoamer is BYK-066, and first anti-settling agent is gas phase two
Silica, the adhesion promoter is KH-550, aluminium hydroxide or oxidation of second heat filling for 200~400 mesh
Aluminium.
Further, the modified firming agent is the poly- azelaic acid acid anhydride PAPA of tough curing agent or tough curing agent poly sebacic polyanhydride
PSPA, the curing agent is methyl hexahydrophthalic anhydride.
Further, the B component also includes the raw material of following parts by weight:Second 1,958 10~50 parts of anti-settling agent, dispersant
1~5 part of BYK110.
Further, the second anti-settling agent 1958 is 20~30 parts in the B component, and dispersant B YK110 is 2 parts.
Compared with prior art, the filling special epoxy pouring sealant of transformer large volume that the present invention is provided has following excellent
Point:1st, because epoxy pouring sealant hardness is big, easily ftracture, therefore added in the formula of the present invention after solidifying during large volume encapsulating
Modified firming agent with flexible hydrogenated bisphenol A based epoxy resin, endurable active toughener and long linear, efficiently solves production
Problem of Cracking after product solidification;2nd, the invention employs endurable active toughener, and the endurable active toughener viscosity is low, can drop
Low system viscosity, beneficial to the mobility of high filler formulation;The endurable active toughener is epoxy hydroxyl terminated butadiene acrylonitrile copolymer simultaneously
I.e. liquid modifying rubber, can improve the electrical insulating property of product;The other endurable active toughener contains epoxide group, can be with solidification
Agent participates in reaction, so as to maintain product hardness while toughness of products is improved;3rd, modified firming agent is made for long chain type acid anhydrides
For main curing agent, it is ensured that the toughness of product, while also having compounded the conventional anhydride curing agent in part to reduce cost;4th, fill out
The main thermal conductivity for considering product of material, so aluminum oxide and aluminium hydroxide that filler systems mainly employ low cost are main body
Filler, while with the addition of a small amount of nano material improves thermal conductivity, in order to reduce the cost of product, also added part silicon powder,
Such filler systems contain the filler of thickness different-grain diameter, also assures that while ensure that thermal conductivity product it is low into
This;5th, the second anti-settling agent is mainly that oily wax product and aerosil are compounded as anti-settling system, is conducive to the organic tree of system
Fat and the mixing of inorganic filler, are used for a long time result of prevention obvious;Dispersant B YK110 mainly serves for ensuring product in mixing point
Mutual wet face state is in during dissipating, the dispersed of organic system and other a small amount of auxiliary agents is particularly conducive to.
The present invention also provides a kind of preceding filling special epoxy pouring sealant preparation method of transformer large volume, including following
Step:
It is prepared by S1, component A:By the first epoxy resin, the second epoxy resin, endurable active toughener, the first heat filling and fill out
Material is added in stirred tank, is heated to 80~110 DEG C and is thoroughly mixed uniformly, and 55~60 DEG C, discharging are cooled to after vaccum dewatering
Produce component A;
S2, B component batch mixing:B component raw material in addition to the second heat filling is added into dispersion machine high speed scattered 9~11 points
Zhong Hou, adds the second heat filling redisperse 30~60 minutes, and the temperature of whole dispersion processes is maintained at 90~100 DEG C;
S3, B component are refined:B component raw material after being mixed fully in step S2 is transferred in refining kettle, is 110 in temperature
± 10 DEG C, under conditions of vacuum≤- 0.085MPa, vacuumize removing bubble and continue 3~5 hours, be then cooled to 55~60
DEG C, discharging produces B component;
S4, mixing:B component prepared by the step S1 component As prepared and step S3, by 1:1 weight ratio is added to mixed
Close in stirred tank, be 60~80 DEG C, under conditions of vacuum≤- 0.085MPa in temperature, uniformly mix 30~35 minutes, discharging
Obtain the filling special epoxy pouring sealant of the transformer large volume.
The present invention provides a kind of application of the filling special epoxy sealing of transformer large volume in transformer encapsulation again, by before
State the filling special epoxy filling of transformer large volume that the filling special epoxy pouring sealant preparation method of transformer large volume is prepared from
Sealing, is poured into transformer, and the transformer after pouring solidifies 4 hours under conditions of temperature is 140 DEG C, and room temperature is down to naturally
.
Compared with prior art, the filling special epoxy pouring sealant of the transformer large volume present invention provided is applied to mutual inductance
After in the encapsulation of device, the casting glue rapid heat dissipation on transformer is system rapid heat dissipation when large volume is filling, pour shaping after product not
Cracking, casting glue disclosure satisfy that transformer to insulating properties and the high requirement of thermal conductivity electrical property, i.e. the electrical insulation capability of product is excellent
It is different.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, below will
The present invention is expanded on further with reference to preferred embodiment.
Embodiment 1:
A kind of filling special epoxy pouring sealant of transformer large volume, is made up of component A and B component;Wherein, the component A
Include the raw material of following parts by weight:450 parts of epoxy resin E51, modified hydrogenated bisphenol A based epoxy resin NPST-5100 200
Part, 20 parts of epoxy hydroxyl terminated butadiene acrylonitrile copolymer, 10 parts of nano aluminium oxide, 100 parts of silicon powder;The B component includes following
The raw material of parts by weight:260 parts of the poly- azelaic acid acid anhydride PAPA of tough curing agent, 50 parts of methyl hexahydrophthalic anhydride, liquid nitrile rubber 10
Part, 2 parts of pigment, 2 parts of defoamer BYK-066,10 parts of anti-settling agent aerosil, 1,958 10 parts of anti-settling agent, dispersant
1 part of BYK110,0.6 part of adhesion promoter KH-550,400 parts of aluminum oxide.The filling special epoxy of the transformer large volume is filled
Sealing preparation method is as follows:
It is prepared by S1, component A:By epoxy resin E51, the hydrogenated bisphenol A based epoxy resin NPST-5100 of modification, epoxy end
Hydroxyl Polybutadiene Acrylonitrile, nano aluminium oxide, silicon powder are added in stirred tank, are heated to 80 DEG C and are thoroughly mixed uniformly,
55 DEG C are cooled to after vaccum dewatering, discharge to obtain A glue components;
S2, B component batch mixing:B component raw material outside alumina heat filling is added into dispersion machine high speed scattered 9 minutes
Afterwards, aluminum oxide heat filling redisperse is added 30 minutes, the temperature of whole dispersion processes is maintained at 90 DEG C;
S3, B component are refined:By the poly- azelaic acid acid anhydride PAPA of tough curing agent after mixing fully, methyl hexahydrophthalic anhydride, liquid
Nitrile rubber, pigment, defoamer BYK-066, anti-settling agent aerosil, anti-settling agent 1958, dispersant B YK110, adhesive force
Accelerator KH-550 and aluminum oxide are transferred in refining kettle, are 100 DEG C, under conditions of vacuum≤- 0.085MPa in temperature, take out true
Sky removing bubble continues 3 hours, is then cooled to 55 DEG C, discharge to obtain B glue components;
S4, mixing:A glue component and B glue component are pressed 1:1 weight ratio is added in mixing kettle, is 60 in temperature
DEG C, under conditions of vacuum≤- 0.085MPa, uniform mixing 30 minutes, it is filling specially that discharging obtains foregoing transformer large volume
Use epoxy pouring sealant.
Embodiment 2:
A kind of filling special epoxy pouring sealant of transformer large volume, is made up of component A and B component;Wherein, the component A
Include the raw material of following parts by weight:500 parts of epoxy resin E44, modified hydrogenated bisphenol A based epoxy resin NPST-5100 300
Part, 40 parts of epoxy hydroxyl terminated butadiene acrylonitrile copolymer, 20 parts of nano-aluminum hydroxide, 140 parts of silicon powder;The B component include with
The raw material of lower parts by weight:330 parts of the poly- azelaic acid acid anhydride PAPA of tough curing agent, 120 parts of methyl hexahydrophthalic anhydride, liquid nitrile rubber
20 parts, 3 parts of pigment, 4 parts of defoamer BYK-066,20 parts of anti-settling agent aerosil, 1,958 30 parts of anti-settling agent, dispersant
3 parts of BYK110,1 part of adhesion promoter KH-550,473 parts of aluminium hydroxide.The filling special epoxy of the transformer large volume is filled
Sealing preparation method is as follows:
It is prepared by S1, component A:By epoxy resin E44, the hydrogenated bisphenol A based epoxy resin NPST-5100 of modification, epoxy end
Hydroxyl Polybutadiene Acrylonitrile, nano-aluminum hydroxide, silicon powder are added in stirred tank, are heated to 100 DEG C and are thoroughly mixed
It is even, 58 DEG C are cooled to after vaccum dewatering, discharge to obtain A glue components;
S2, B component batch mixing:B component raw material in addition to aluminium hydroxide heat filling is added into dispersion machine high speed scattered 10
After minute, aluminium hydroxide heat filling redisperse is added 50 minutes, the temperature of whole dispersion processes is maintained at 96 DEG C;
S3, B component are refined:By the poly- azelaic acid acid anhydride PAPA of tough curing agent after mixing fully, methyl hexahydrophthalic anhydride, liquid
Nitrile rubber, pigment, defoamer BYK-066, anti-settling agent aerosil, anti-settling agent 1958, dispersant B YK110, adhesive force
Accelerator KH-550, aluminium hydroxide are transferred in refining kettle, are 110 DEG C, under conditions of vacuum≤- 0.085MPa in temperature, are taken out
Vacuum removal bubble continues 4 hours, is then cooled to 58 DEG C, and discharge to obtain B glue components;
S4, mixing:A glue component and B glue component are pressed 1:1 weight ratio is added in mixing kettle, is 70 in temperature
DEG C, under conditions of vacuum≤- 0.085MPa, uniform mixing 33 minutes, it is filling specially that discharging obtains foregoing transformer large volume
Use epoxy pouring sealant.
Embodiment 3:
A kind of filling special epoxy pouring sealant of transformer large volume, is made up of component A and B component;Wherein, the component A
Include the raw material of following parts by weight:550 parts of epoxy resin E39D, 450 parts of modifying epoxy resin by organosilicon, epoxy terminal hydroxy group gather
60 parts of butadiene acrylonitrile, 50 parts of Nano-Calcium Carbonate, 200 parts of silicon powder;The B component includes the original of following parts by weight
Material:400 parts of tough curing agent poly sebacic polyanhydride PSPA, 200 parts of methyl hexahydrophthalic anhydride, 30 parts of liquid nitrile rubber, 5 parts of pigment,
It is 5 parts of defoamer BYK-066,50 parts of anti-settling agent aerosil, 1,958 50 parts of anti-settling agent, 5 parts of dispersant B YK110, attached
2 parts of adhesion promoter KH-550,550 parts of aluminium hydroxide.The filling special epoxy pouring sealant preparation method of the transformer large volume is such as
Under:
It is prepared by S1, component A:By epoxy resin E39D, modifying epoxy resin by organosilicon, epoxy end hydroxy butadiene propylene
Nitrile, nano-aluminum hydroxide, silicon powder are added in stirred tank, are heated to 110 DEG C and are thoroughly mixed uniform, cooling after vaccum dewatering
To 60 DEG C, discharge to obtain A glue components;
S2, B component batch mixing:B component raw material in addition to aluminium hydroxide heat filling is added into dispersion machine high speed scattered 11
After minute, aluminium hydroxide heat filling redisperse is added 60 minutes, the temperature of whole dispersion processes is maintained at 100 DEG C;
S3, B component are refined:By the tough curing agent poly sebacic polyanhydride PSPA after mixing fully, methyl hexahydrophthalic anhydride, liquid
Nitrile rubber, pigment, defoamer BYK-066, anti-settling agent aerosil, anti-settling agent 1958, dispersant B YK110, adhesive force
Accelerator KH-550, aluminium hydroxide are transferred in refining kettle, are 120 DEG C, under conditions of vacuum≤- 0.085MPa in temperature, are taken out
Vacuum removal bubble continues 5 hours, is then cooled to 80 DEG C, and discharge to obtain B glue components;
S4, mixing:A glue component and B glue component are pressed 1:1 weight ratio is added in mixing kettle, is 80 in temperature
DEG C, under conditions of vacuum≤- 0.085MPa, uniform mixing 35 minutes, it is filling specially that discharging obtains foregoing transformer large volume
Use epoxy pouring sealant.
The Product checking result such as following table of embodiment 1, embodiment 2 and embodiment 3:
Host A in upper table is to refer to component A, and curing agent B is to refer to B component.
Prepared product index is contacted with result:60 kilograms of the product expendable in common market can ftracture, but the present invention
Product prepared by foregoing three embodiments will not ftracture;The thermal conductivity factor of common market product is general in 0.6-0.8, and this hair
Bright thermal conductivity factor can reach 1.6 in 1.1-1.6, highest;Electrical insulating property:The general proof voltage of common market product is 20,
And highest of the present invention can reach 38, therefore product prepared by the application will not ftracture, thermal conductivity factor is high, electrical insulating property is good.
Compared with prior art, the filling special epoxy pouring sealant of transformer large volume that the present invention is provided has following excellent
Point:1st, because epoxy pouring sealant hardness is big, easily ftracture, therefore added in the formula of the present invention after solidifying during large volume encapsulating
Modified firming agent with flexible hydrogenated bisphenol A based epoxy resin, endurable active toughener and long linear, efficiently solves production
Problem of Cracking after product solidification;2nd, the invention employs endurable active toughener, and the endurable active toughener viscosity is low, can drop
Low system viscosity, beneficial to the mobility of high filler formulation;The endurable active toughener is epoxy hydroxyl terminated butadiene acrylonitrile copolymer simultaneously
I.e. liquid modifying rubber, can improve the electrical insulating property of product;The other endurable active toughener contains epoxide group, can be with solidification
Agent participates in reaction, so as to maintain product hardness while toughness of products is improved;3rd, modified firming agent is made for long chain type acid anhydrides
For main curing agent, it is ensured that the toughness of product, while also having compounded the conventional anhydride curing agent in part to reduce cost;4th, fill out
The main thermal conductivity for considering product of material, so aluminum oxide and aluminium hydroxide that filler systems mainly employ low cost are main body
Filler, while with the addition of a small amount of nano material improves thermal conductivity, in order to reduce the cost of product, also added part silicon powder,
Such filler systems contain the filler of thickness different-grain diameter, also assures that while ensure that thermal conductivity product it is low into
This;5th, the second anti-settling agent is mainly that oily wax product and aerosil are compounded as anti-settling system, is conducive to the organic tree of system
Fat and the mixing of inorganic filler, are used for a long time result of prevention obvious;Dispersant B YK110 mainly serves for ensuring product in mixing point
Mutual wet face state is in during dissipating, the dispersed of organic system and other a small amount of auxiliary agents is particularly conducive to.
The present invention provides a kind of application of the filling special epoxy sealing of transformer large volume in transformer encapsulation again, by before
State the filling special epoxy filling of transformer large volume that the filling special epoxy pouring sealant preparation method of transformer large volume is prepared from
Sealing, is poured into transformer, and the transformer after pouring solidifies 4 hours under conditions of temperature is 140 DEG C, and room temperature is down to naturally
.
Compared with prior art, the filling special epoxy pouring sealant of the transformer large volume present invention provided is applied to mutual inductance
After in the encapsulation of device, the casting glue rapid heat dissipation on transformer is system rapid heat dissipation when large volume is filling, pour shaping after product not
Cracking, casting glue disclosure satisfy that transformer to insulating properties and the high requirement of thermal conductivity electrical property, i.e. the electrical insulation capability of product is excellent
It is different.
Finally illustrate, the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although with reference to compared with
The present invention is described in detail good embodiment, it will be understood by those within the art that, can be to skill of the invention
Art scheme is modified or equivalent substitution, and without departing from the objective and scope of technical solution of the present invention, it all should cover at this
Among the right of invention.
Claims (8)
1. a kind of filling special epoxy pouring sealant of transformer large volume, it is characterised in that be made up of component A and B component;Wherein,
The component A includes the raw material of following parts by weight:First 450~550 parts of epoxy resin, 200~450 parts of the second epoxy resin,
20~60 parts of endurable active toughener, 10~50 parts of the first heat filling, 100~200 parts of filler;The B component includes following weight
The raw material of part:260~400 parts of modified firming agent, 50~200 parts of curing agent, 10~30 parts of toughener, 2~5 parts of pigment, froth breaking
2~5 parts of agent, 10~50 parts of the first anti-settling agent, 0.6~2 part of adhesion promoter, 400~550 parts of the second heat filling.
2. the filling special epoxy pouring sealant of transformer large volume according to claim 1, it is characterised in that the component A
Include the raw material of following parts by weight:First 480~520 parts of epoxy resin, 300~350 parts of the second epoxy resin, endurable active toughener
30~40 parts, 20~30 parts of the first heat filling, 140~180 parts of filler;The B component includes the raw material of following parts by weight:Change
It is 300~350 parts of curing agent of property, 100~150 parts of curing agent, 20~30 parts of toughener, 3 parts of pigment, 5 parts of defoamer, first anti-settling
20~30 parts of agent, 2 parts of adhesion promoter, 450~500 parts of the second heat filling.
3. the filling special epoxy pouring sealant of transformer large volume according to claim 1, it is characterised in that first ring
Oxygen tree fat is E51, E44 or E39D, and second epoxy resin is modified hydrogenated bisphenol A based epoxy resin or organic-silicon-modified
Epoxy resin, the endurable active toughener be epoxy hydroxyl terminated butadiene acrylonitrile copolymer, first heat filling be granularity 40~
60nm aluminium hydrate nano material, aluminium oxide nano material or Nano-Calcium Carbonate, the filler is silicon powder, described to change
Property curing agent be flexible acid anhydride type curing agent, the curing agent is conventional anhydride curing agent, and the toughener is liquid
Nitrile rubber, the defoamer is BYK-066, and first anti-settling agent is aerosil, and the adhesion promoter is
KH-550, second heat filling is the aluminium hydroxide or aluminum oxide of 200~400 mesh.
4. the filling special epoxy pouring sealant of transformer large volume according to claim 3, it is characterised in that the modification is consolidated
Agent is tough curing agent poly- azelaic acid acid anhydride PAPA or tough curing agent poly sebacic polyanhydride PSPA, and the curing agent is methyl hexahydro
Phthalic anhydride.
5. the filling special epoxy pouring sealant of transformer large volume according to claim 1, it is characterised in that the B component
Also include the raw material of following parts by weight:Second 1,958 10~50 parts of anti-settling agent, 1~5 part of dispersant B YK110.
6. the filling special epoxy pouring sealant of transformer large volume according to claim 5, it is characterised in that the B component
In the second anti-settling agent 1958 be 20~30 parts, dispersant B YK110 be 2 parts.
7. a kind of filling special epoxy pouring sealant preparation side of transformer large volume according to any one of claim 1-6
Method, it is characterised in that comprise the following steps:
It is prepared by S1, component A:First epoxy resin, the second epoxy resin, endurable active toughener, the first heat filling and filler are added
Enter in stirred tank, be heated to 80~110 DEG C and be thoroughly mixed uniformly, 55~60 DEG C are cooled to after vaccum dewatering, discharging produces A
Component;
S2, B component batch mixing:B component raw material in addition to the second heat filling is added into dispersion machine high speed scattered 9~11 minutes
Afterwards, the second heat filling redisperse is added 30~60 minutes, the temperature of whole dispersion processes is maintained at 90~100 DEG C;
S3, B component are refined:B component raw material after being mixed fully in step S2 is transferred in refining kettle, is 110 ± 10 in temperature
DEG C, under conditions of vacuum≤- 0.085MPa, vacuumize removing bubble and continue 3~5 hours, be then cooled to 55~60 DEG C, go out
Material produces B component;
S4, mixing:B component prepared by the step S1 component As prepared and step S3, by 1:1 weight ratio is added to mixing and stirred
Mix in kettle, be 60~80 DEG C, under conditions of vacuum≤- 0.085MPa in temperature, uniformly mix 30~35 minutes, discharging is produced
To the filling special epoxy pouring sealant of the transformer large volume.
8. application of a kind of filling special epoxy sealing of transformer large volume in transformer encapsulation, it is characterised in that by basis
The transformer large volume that the filling special epoxy pouring sealant preparation method of transformer large volume described in claim 7 is prepared from is filled
Special epoxy pouring sealant is filled, is poured into transformer, the transformer after pouring solidifies 4 hours under conditions of temperature is 140 DEG C,
Naturally it is down to room temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710364008.XA CN107057623A (en) | 2017-05-22 | 2017-05-22 | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710364008.XA CN107057623A (en) | 2017-05-22 | 2017-05-22 | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107057623A true CN107057623A (en) | 2017-08-18 |
Family
ID=59609678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710364008.XA Withdrawn CN107057623A (en) | 2017-05-22 | 2017-05-22 | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107057623A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108913076A (en) * | 2018-06-29 | 2018-11-30 | 佛山市高明区爪和新材料科技有限公司 | A kind of heat conductive insulating casting glue |
CN109280520A (en) * | 2018-09-26 | 2019-01-29 | 重庆江川化工(集团)有限公司 | A kind of production technology of the dedicated two-component epoxy pouring sealant of electronic high voltage packet |
CN110724487A (en) * | 2019-10-23 | 2020-01-24 | 广州聚合新材料科技股份有限公司 | Infrared chip packaging adhesive with excellent cold and hot shock resistance and preparation method thereof |
CN110931208A (en) * | 2019-12-05 | 2020-03-27 | 百胜电气有限公司 | Dry-type transformer |
CN110982223A (en) * | 2019-10-16 | 2020-04-10 | 山东金鼎电子材料有限公司 | High-performance liquid heat-conducting paste material and preparation method thereof |
CN111944468A (en) * | 2020-07-28 | 2020-11-17 | 湖南创瑾科技有限公司 | Double-component heat-conducting flame-retardant epoxy resin pouring sealant, and preparation method and application thereof |
CN112898931A (en) * | 2021-03-22 | 2021-06-04 | 深圳市汇北川电子技术有限公司 | High-temperature epoxy resin potting material for preventing cold and hot alternating cracking after curing and use method thereof |
WO2021196510A1 (en) * | 2020-03-31 | 2021-10-07 | 苏州巨峰电气绝缘***股份有限公司 | High thermal conductivity electrical insulation packaging material and preparation method therefor |
CN114773789A (en) * | 2021-08-20 | 2022-07-22 | 广东四会互感器厂有限公司 | Epoxy resin for closed combined electrical appliance and preparation method thereof |
CN115093757A (en) * | 2022-06-21 | 2022-09-23 | 南京长江涂料有限公司 | Low-temperature applicable epoxy modified acrylic floor coating and preparation method thereof |
CN116239918A (en) * | 2023-03-01 | 2023-06-09 | 博尔泰(上海)化工科技发展有限公司 | Scratch-coatable low-density high-strength expansion type paint and preparation method thereof |
CN116970258A (en) * | 2023-08-09 | 2023-10-31 | 上海江天高分子材料有限公司 | Cracking-resistant high-heat-conductivity flame-retardant vacuum casting resin, preparation method and application |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
-
2017
- 2017-05-22 CN CN201710364008.XA patent/CN107057623A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108913076A (en) * | 2018-06-29 | 2018-11-30 | 佛山市高明区爪和新材料科技有限公司 | A kind of heat conductive insulating casting glue |
CN109280520A (en) * | 2018-09-26 | 2019-01-29 | 重庆江川化工(集团)有限公司 | A kind of production technology of the dedicated two-component epoxy pouring sealant of electronic high voltage packet |
CN110982223A (en) * | 2019-10-16 | 2020-04-10 | 山东金鼎电子材料有限公司 | High-performance liquid heat-conducting paste material and preparation method thereof |
CN110724487A (en) * | 2019-10-23 | 2020-01-24 | 广州聚合新材料科技股份有限公司 | Infrared chip packaging adhesive with excellent cold and hot shock resistance and preparation method thereof |
CN110931208A (en) * | 2019-12-05 | 2020-03-27 | 百胜电气有限公司 | Dry-type transformer |
WO2021196510A1 (en) * | 2020-03-31 | 2021-10-07 | 苏州巨峰电气绝缘***股份有限公司 | High thermal conductivity electrical insulation packaging material and preparation method therefor |
CN111944468A (en) * | 2020-07-28 | 2020-11-17 | 湖南创瑾科技有限公司 | Double-component heat-conducting flame-retardant epoxy resin pouring sealant, and preparation method and application thereof |
CN112898931A (en) * | 2021-03-22 | 2021-06-04 | 深圳市汇北川电子技术有限公司 | High-temperature epoxy resin potting material for preventing cold and hot alternating cracking after curing and use method thereof |
CN114773789A (en) * | 2021-08-20 | 2022-07-22 | 广东四会互感器厂有限公司 | Epoxy resin for closed combined electrical appliance and preparation method thereof |
CN115093757A (en) * | 2022-06-21 | 2022-09-23 | 南京长江涂料有限公司 | Low-temperature applicable epoxy modified acrylic floor coating and preparation method thereof |
CN115093757B (en) * | 2022-06-21 | 2023-03-31 | 南京长江涂料有限公司 | Low-temperature applicable epoxy modified acrylic floor coating and preparation method thereof |
CN116239918A (en) * | 2023-03-01 | 2023-06-09 | 博尔泰(上海)化工科技发展有限公司 | Scratch-coatable low-density high-strength expansion type paint and preparation method thereof |
CN116970258A (en) * | 2023-08-09 | 2023-10-31 | 上海江天高分子材料有限公司 | Cracking-resistant high-heat-conductivity flame-retardant vacuum casting resin, preparation method and application |
CN116970258B (en) * | 2023-08-09 | 2024-04-05 | 上海江天高分子材料有限公司 | Cracking-resistant high-heat-conductivity flame-retardant vacuum casting resin, preparation method and application |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107057623A (en) | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application | |
CN104178076B (en) | A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method | |
CN104152093B (en) | A kind of flame-retarded heat-conducting double-component epoxy resin embedding adhesive and preparation method thereof | |
CN104788911B (en) | A kind of epoxy resin composite material, its preparation method and application | |
CN103865271B (en) | A kind of preparation method of the modified organosilicon heat conductive electronic pouring sealant of nano-hybrid material | |
CN111073217A (en) | High-thermal-conductivity low-stress epoxy plastic packaging material for semiconductor packaging | |
CN104650817A (en) | Heat conductive phase-change material and production method thereof | |
CN104693686B (en) | A kind of GIS preparation method of micro nano structure epoxy composite insulant | |
CN101787132B (en) | Organic-silicon hybridization epoxy resin as well as preparation method and application thereof | |
CN106467652B (en) | A kind of composite encapsulating material and preparation method thereof of conduction | |
CN111040698A (en) | Epoxy resin pouring sealant, preparation method and novel electric drive motor | |
CN104559892A (en) | Novel epoxy resin sealant adhesive and preparation method thereof | |
CN105670555A (en) | High heat conductivity organosilicon potting compound | |
CN102516926B (en) | Pouring sealant for electronic components of automobile control system and preparation method thereof | |
CN113403022B (en) | Organic silicon heat-conducting pouring sealant and preparation method thereof | |
CN102093665B (en) | Heat conduction insulating casting glue and preparation method thereof | |
CN114032063B (en) | High-heat-conductivity low-viscosity bi-component organic silicon pouring sealant and preparation method thereof | |
CN106674891A (en) | High heat conduction and low stress type epoxy resin composition for fully encapsulated semiconductor device | |
CN105461963B (en) | A kind of boron nitride powder of surface organic modification and its preparation method and application | |
CN111394055A (en) | Organic silicon pouring sealant, preparation method and novel electric drive motor | |
CN106753213A (en) | A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance | |
CN114525100A (en) | High-thermal-conductivity low-viscosity epoxy pouring sealant and preparation method thereof | |
CN102850724A (en) | Green and environment-friendly epoxy resin composition for high-power device packaging | |
CN107501861A (en) | A kind of composite heat interfacial material based on graphene and preparation method thereof | |
CN107266864A (en) | It is a kind of for insulating materials of LED package and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170818 |