CN106753213A - A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance - Google Patents
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance Download PDFInfo
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- CN106753213A CN106753213A CN201611205583.7A CN201611205583A CN106753213A CN 106753213 A CN106753213 A CN 106753213A CN 201611205583 A CN201611205583 A CN 201611205583A CN 106753213 A CN106753213 A CN 106753213A
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- vinyl
- organic silicon
- waterproof performance
- silicone oil
- potting adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, it is made up of following raw materials according：Vinyl-terminated silicone fluid 1, vinyl-terminated silicone fluid 2,12% platinum catalyst, ethynylcyclohexanol, vinyl polysiloxane, 1 allyloxy 2,3 expoxy propane, 1,3,5,7 tetramethyl-ring tetrasiloxanes, silane coupling A 171, appropriate containing hydrogen silicone oil, CNT, feldspar powder, sodium metasilicate, silane coupler kh560, Lauryl Alcohol ester, styrene-acrylic emulsion, appropriate deionized water；Casting glue curing rate prepared by the present invention is fast, and good into performance, adhesive force is high, good fluidity, with performances such as excellent protection against the tide, water resistant, alkaline-resisting, scrubbing resistances, is extensively worthy to be popularized using scope.
Description
Technical field
It is the present invention relates to printed-circuit board encapsulating glue technical field more particularly to a kind of with excellent moistureproof and waterproof performance
PCB organic silicon electronic potting adhesive.
Background technology
With the fast development of electronic science and technology, electronic component, device, instrument and instrument are obtained in the electronics industry
It is widely applied.Because the working environment of many electronic equipments is complicated and changeable, exceedingly odious natural bar even can be run into sometimes
Part, to protect electronic component and integrated circuit not to be influenceed by working environment, improves the electric property and stability of electronic device, tastes
Tasting needs to carry out embedding protection to electronic equipment.Embedding is one of important procedure of electronic components, and it is by Embedding Material
It is filled into the space of electronic device with the method such as mechanical or manual, machine-shaping under certain condition makes device inside
The operating procedure that electronic component and circuit are environmentally isolated with.At present, electronic component and integrated circuit forward direction high-performance, densification,
High accuracy and powerful direction are fast-developing, and this necessarily causes the caloric value of electronic device to greatly improve.Meanwhile, electronics device
The miniaturization of part again strongly reduces its heat-dissipating space, and heat dissipation channel is more crowded, causes heat largely to gather, if heat is not
Can timely and effectively conduct, it will the operating temperature of circuit is increased rapidly, cause electronic device fail possibility into
Increase again, have a strong impact on the stability and reliability of electronic device, or even the service life that electronic equipment can be shortened.Therefore, use
In the Embedding Material of electronic device not only to have good electrical insulation capability should also have the capacity of heat transmission higher, in order to avoid height
Trigger Embedding Material to catch fire under the condition of work such as voltage and electric discharge, also require that Embedding Material has good fire resistance, additionally,
In order to prevent moisture and pernicious gas from causing the pollution and corrosion of circuit board, Embedding Material sea by the gap between electronic device
English has good adhesive property.Organosilicon material has excellent electrical insulation capability, especially additional organosilicon casting glue
The consumption of catalyst is less during solidification, and no coupling product is produced, and the dimensional stability of solidfied material is high, and linear shrinkage is low, and chemistry is steady
It is qualitative good, thus development prospect is extensively, but to there is low thermal conductivity, anti-flammability and adhesive property poor for common organic silicon potting adhesive
The shortcomings of, have a strong impact on range of application, although embedding can be improved by a large amount of addition heat fillings, fire retardant and bonding agent
The performance of glue, but the mechanical property of casting glue, processing characteristics can be had adverse effect on, so the Halogen resistance of research tack
Combustion heat conduction additional organosilicon casting glue has important theory significance and application prospect.
Huang Zhibin exists《The preparation of heat conductive transparent organic silicon potting adhesive and performance study》In one text, by vinyl silicone oil
Studied with architectural characteristic and reinforced filling Miscibility, the species of tackifier of containing hydrogen silicone oil etc., be prepared for possessing good
The organic silicon potting adhesive of good mechanical property, optical property and adhesive property, have studied VMQ silicones, nano silicon, thickening
The influence to casting glue performance such as agent, on this basis, adds heat filling nano aluminium oxide and nano zine oxide, is prepared for tool
The organic silicon potting adhesive of standby high intensity, high heat conductance and high transmission rate, and nano-particle, coupling agent modified etc. are have studied to filling
The influence of sealing performance.Result shows the vinyl-terminated silicone fluid of viscosity 19mPa S and 3000mPa S with mass ratio 8:100 compoundings
Based on polymer, addition reactive hydrogen mass fraction be 0.8% containing hydrogen silicone oil, make mol ratio n（Si-H）：n（Si-Vi）For
The consumption of 1.2, VMQ silicones prepares the LED casting glues of optimal synthesis performance when being 30phr, synthesized not using addition reaction
Congener tackifier DA, DAVE and DAVM, the wherein casting glue of DAVM possess optimal adhesive property and optical property, to leading
Hot filler carries out surface silanization treatment, and the thermal conductivity and refractive index of casting glue are gradually increasing, light transmittance, thermal coefficient of expansion and body
Product resistivity is gradually reduced, and heat resistance is significantly improved.But the casting glue synthesized in article is not met by the market PCB circuits
Plate is to the use requirement of casting glue, and various aspects of performance is not high, it is necessary to further improve to expand using scope.
The content of the invention
The object of the invention is exactly to make up the defect of prior art, there is provided a kind of with excellent moistureproof and waterproof performance
PCB organic silicon electronic potting adhesive.
The present invention is achieved by the following technical solutions：
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, by the raw material of following weight portion
Preparation is made：The 40-50 of vinyl-terminated silicone fluid -1, the 50-60 of vinyl-terminated silicone fluid -2,12% platinum catalyst 0.38-0.5, acetenyl
Cyclohexanol 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,7- tetra-
Methyl cyclotetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, CNT 2.3-2.8, feldspar powder
1.4-1.6, sodium metasilicate 2.8-3.5, silane coupler kh5600.22-0.28, Lauryl Alcohol ester 2-3, styrene-acrylic emulsion 3.8-5, go
Ion appropriate amount of water.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, by following specific
Step is made：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, is added dropwise 1/4 12% platinum catalyst under agitation, 2-3h is reacted at 40-45 DEG C, then rise high temperature
Degree to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（3）Carbon nano-tube fibre and feldspar powder are added in 15-20wt% sodium silicate aqueous solutions and are stirred, ultrasonic disperse 1-1.5h is obtained
To mixed liquor, pH value being adjusted to 7-9,2-3h being aged at room temperature, filtered, solid is dried after being washed with deionized, then will be compound
Particle and silane coupler kh560 are sequentially added in absolute ethyl alcohol, and 40-60min is heated to reflux at 110-130 DEG C, wherein without
The weight ratio of water-ethanol, compound particle and silane coupler kh560 is 75-85:18-20:1, filtering, product vacuum drying and crushing
Mixed with Lauryl Alcohol ester, styrene-acrylic emulsion afterwards standby；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing is sufficiently stirred for 35-45min and obtains B component in power mixer, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying chamber（Vacuum is -0.1MPa）Deaeration 10min, pours into mould
110 DEG C of solidification 2h are to obtain organic silicon potting adhesive.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, the end ethene
The viscosity of base silicone oil -1 is 300mPa s, and contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa
S, contents of ethylene is 0.8mol%.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, described is hydrogeneous
Active hydrogen content is 0.50Wt% in silicone oil, and the addition of containing hydrogen silicone oil is n (Si-H)：n（Si-Vi）It is 1.2-1.4.
It is an advantage of the invention that：Vinyl silicone oil is one of most basic composition of additional organosilicon casting glue, the present invention
Tensile strength and hardness, elongation at break are obtained by selecting the vinyl silicone oil of different viscosities coefficient and contents of ethylene to compound
With elasticity organic silicon potting adhesive all higher, containing hydrogen silicone oil as crosslinking agent, when its active hydrogen content is higher, with organosilicon embedding
The crosslink density of glue will be larger, and stress can be made to be dispersed on more strands, shows tensile strength higher, hardness
And elongation at break, but when active hydrogen content is too high, crosslinking rate is too fast, and strand has little time to form perfect cross-linked network
Network, and side reaction is also susceptible under the catalyst of Karst, make to form more bubble in organic silicon potting adhesive, cause to lack
Fall into, so present invention selection active hydrogen content is that 0.5Wt% is more suitable, present invention selection vinyl polysiloxane is filled out as reinforcement
Material because have that contents of ethylene is more, outer layer by organic team knowledge, molecular weight is small the characteristics of, and and organic silicon potting adhesive
With good dispersion and compatibility, preferable mobility and the transparency can be kept, and also can occur with containing hydrogen silicone oil
Hydrosilylation, it is possible to increase the mechanical property of casting glue, because the universal non-binding of organosilicon material, with base after solidification
There is space between material, the infiltration of long-time steam causes fault occur, and the present invention utilizes chemical reactive synthesis tackifier, energy
Enough effective caking property, tensile shear strengths for improving organic silicon potting adhesive, do not influence viscosity and mobility, the present invention also to utilize
Filler improves the thermal conductivity and anti-flammability of casting glue, but filler has pole with matrix in terms of molecular structure and physical property
Big difference, and the dispersiveness of system is poorer, and the thermal conductivity lifting of casting glue is more difficult to, and the surface modification of filler can promote filler
Dispersion in the base, reduces the interface resistance on direction of heat flow, so that the performances such as the thermal conductivity of system can be effectively lifted, also
It is impregnated into sodium metasilicate using carbon nano-tube fibre and feldspar powder and forms mixed sols, with silane coupled after colloidal sol ageing is crushed
Agent hydrolysis process, makes it have good crosslinked action in styrene-acrylic emulsion, and improves the compatibility in casting glue, carries
High its water repellent, moisture resistance, scrubbing resistance and the fast effect of film forming, casting glue curing rate prepared by the present invention are fast, good into performance, attached
Put forth effort height, good fluidity, with performances such as excellent protection against the tide, water resistant, alkaline-resisting, scrubbing resistances, is extensively worthy to be popularized using scope.
Specific embodiment
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, by following weight portion（It is public
Jin）Raw material be made：Vinyl-terminated silicone fluid -1 40, vinyl-terminated silicone fluid -2 50,12% platinum catalyst 0.38, acetenyl
Cyclohexanol 0.02, vinyl polysiloxane 25,1- allyloxy -2,3 expoxy propane 14.8,1,3,5,7- tetramethyl-ring tetrasiloxanes
23rd, silane coupling A 1712.7, appropriate containing hydrogen silicone oil, CNT 2.3, feldspar powder 1.4, sodium metasilicate 2.8, silane coupler
Kh560 0.22, Lauryl Alcohol ester 2, styrene-acrylic emulsion 3.8, appropriate deionized water.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, by following specific
Step is made：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, is added dropwise 1/4 12% platinum catalyst under agitation, 2h is reacted at 40 DEG C, then rise high-temperature to 68
DEG C reaction 2h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（3）Carbon nano-tube fibre and feldspar powder are added in 15wt% sodium silicate aqueous solutions and are stirred, ultrasonic disperse 1h is mixed
Liquid, regulation pH value is aged 2h at room temperature to 7, filters, and solid is dried after being washed with deionized, then by compound particle and silane
Coupling agent kh560 is sequentially added in absolute ethyl alcohol, is heated to reflux 40min at 110 DEG C, wherein absolute ethyl alcohol, compound particle and
The weight ratio of silane coupler kh560 is 75:18:1, filtering, with Lauryl Alcohol ester, styrene-acrylic emulsion after product vacuum drying and crushing
Mix standby；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing is sufficiently stirred for 35min and obtains B component in power mixer, by component A and B component according to mass ratio 1；1 in high speed shear
Mixed in the presence of dispersion, be placed in vacuum drying chamber（Vacuum is MPa）Deaeration 10min, pour into mould 110 DEG C it is solid
It is to obtain organic silicon potting adhesive to change 2h.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, the end ethene
The viscosity of base silicone oil -1 is 300mPa s, and contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa
S, contents of ethylene is 0.8mol%.
A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, described is hydrogeneous
Active hydrogen content is 0.50Wt% in silicone oil, and the addition of containing hydrogen silicone oil is n (SiH)：n（SiVi）It is 1.2.
According to casting glue prepared by embodiment, performance test is carried out to it, it is as a result as follows：
Thermal conductivity（W/m•K）：0.63；Tensile strength（MPa）：3.4；Shear strength（MPa）：1.5；Specific insulation（Ω•cm）：
2.7×1015；Anti-flammability (UL94；V 0)：Pass through；Dielectric constant（50HZ）：3.5；Elongation（%）：240.
Claims (4)
1. a kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance, it is characterised in that by following
The raw material of weight portion is made：The 40-50 of vinyl-terminated silicone fluid -1, the 50-60 of vinyl-terminated silicone fluid -2,12% platinum catalyst
0.38-0.5, ethynylcyclohexanol 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-
16.8th, 1,3,5,7- tetramethyl-ring tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, carbon nanometer
Pipe 2.3-2.8, feldspar powder 1.4-1.6, sodium metasilicate 2.8-3.5, silane coupler kh5600.22-0.28, Lauryl Alcohol ester 2-3,
Styrene-acrylic emulsion 3.8-5, appropriate deionized water.
2. a kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance according to claim 1,
Characterized in that, being made up of following specific steps：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, is added dropwise 1/4 12% platinum catalyst under agitation, 2-3h is reacted at 40-45 DEG C, then rise high temperature
Degree to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（3）Carbon nano-tube fibre and feldspar powder are added in 15-20wt% sodium silicate aqueous solutions and are stirred, ultrasonic disperse 1-1.5h is obtained
To mixed liquor, pH value being adjusted to 7-9,2-3h being aged at room temperature, filtered, solid is dried after being washed with deionized, then will be compound
Particle and silane coupler kh560 are sequentially added in absolute ethyl alcohol, and 40-60min is heated to reflux at 110-130 DEG C, wherein without
The weight ratio of water-ethanol, compound particle and silane coupler kh560 is 75-85:18-20:1, filtering, product vacuum drying and crushing
Mixed with Lauryl Alcohol ester, styrene-acrylic emulsion afterwards standby；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing is sufficiently stirred for 35-45min and obtains B component in power mixer, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying chamber（Vacuum is -0.1MPa）Deaeration 10min, pours into mould
110 DEG C of solidification 2h are to obtain organic silicon potting adhesive.
3. a kind of PCB organic silicon electronic embedding with excellent moistureproof and waterproof performance according to claim 1-2
Glue, it is characterised in that the viscosity of the vinyl-terminated silicone fluid -1 is 300mPa s, and contents of ethylene is 1.92mol%, holds ethene
The viscosity of base silicone oil -2 is 1000mPa s, and contents of ethylene is 0.8mol%.
4. a kind of PCB organic silicon electronic embedding with excellent moistureproof and waterproof performance according to claim 1-2
Glue, it is characterised in that active hydrogen content is 0.50Wt% in described containing hydrogen silicone oil, and the addition of containing hydrogen silicone oil is n (Si-
H)：n（Si-Vi）It is 1.2-1.4.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611205583.7A CN106753213A (en) | 2016-12-23 | 2016-12-23 | A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance |
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| CN201611205583.7A CN106753213A (en) | 2016-12-23 | 2016-12-23 | A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance |
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| CN108003830A (en) * | 2017-12-23 | 2018-05-08 | 苏州赛源微电子有限公司 | A kind of high-weatherability encapsulation of large scale integrated chip |
| CN108673911A (en) * | 2018-06-21 | 2018-10-19 | 上海大学 | A kind of preparation facilities and preparation method thereof based on graphene toughening high-performance carbon fibre polymer matrix composites battery tray |
| CN109652007A (en) * | 2018-12-06 | 2019-04-19 | 成都硅宝科技股份有限公司 | Impervious oily bi-component silicone sealant of one kind and preparation method thereof |
| CN116536029A (en) * | 2023-07-06 | 2023-08-04 | 广州以恒有机硅有限公司 | High-weather-resistance organic silicon sealant for automobiles and preparation method thereof |
| WO2023182346A1 (en) * | 2022-03-25 | 2023-09-28 | 積水フーラー株式会社 | Curable resin composition for electronic material |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108003830A (en) * | 2017-12-23 | 2018-05-08 | 苏州赛源微电子有限公司 | A kind of high-weatherability encapsulation of large scale integrated chip |
| CN108673911A (en) * | 2018-06-21 | 2018-10-19 | 上海大学 | A kind of preparation facilities and preparation method thereof based on graphene toughening high-performance carbon fibre polymer matrix composites battery tray |
| CN108673911B (en) * | 2018-06-21 | 2023-10-17 | 上海大学 | Preparation method of graphene-based toughened high-performance carbon fiber resin matrix composite battery tray |
| CN109652007A (en) * | 2018-12-06 | 2019-04-19 | 成都硅宝科技股份有限公司 | Impervious oily bi-component silicone sealant of one kind and preparation method thereof |
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| WO2023182346A1 (en) * | 2022-03-25 | 2023-09-28 | 積水フーラー株式会社 | Curable resin composition for electronic material |
| CN116536029A (en) * | 2023-07-06 | 2023-08-04 | 广州以恒有机硅有限公司 | High-weather-resistance organic silicon sealant for automobiles and preparation method thereof |
| CN116536029B (en) * | 2023-07-06 | 2023-08-25 | 广州以恒有机硅有限公司 | High-weather-resistance organic silicon sealant for automobiles and preparation method thereof |
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Application publication date: 20170531 |
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