CN107052989A - Quartz wafer glossing - Google Patents
Quartz wafer glossing Download PDFInfo
- Publication number
- CN107052989A CN107052989A CN201710327952.8A CN201710327952A CN107052989A CN 107052989 A CN107052989 A CN 107052989A CN 201710327952 A CN201710327952 A CN 201710327952A CN 107052989 A CN107052989 A CN 107052989A
- Authority
- CN
- China
- Prior art keywords
- quartz
- wafer
- disk
- quartz wafer
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of quartz wafer glossing, and its step includes：Quadrate Piezoelectric Quartz chip after chamfered is provided and is placed in the circular pleasure boat hole of erratic star wheel；Ground respectively on grinder on disk and grinder under grind on disk adhering polishing pads and processing be ground to the polishing pad using diamond dressing wheel；Then fix on described and grind disk, the erratic star wheel is processed by shot blasting together with the quartz wafer being placed in the erratic star wheel using disc spins are ground under described, so that Quadrate Piezoelectric Quartz chip polishing body is made.The direct square shaped quartz wafer of the technique is polished, eliminate rounding wafer and disk changes back the two procedures of square piece, greatly reduce raw materials consumption and production cost, shorten production procedure, and there is quartz wafer polishing body performance made from this technique to be fully able to reach that use Circular wafer is polished obtained properties of product.
Description
Technical field
The present invention relates to a kind of glossing, specifically, a kind of quartz wafer glossing relate to.
Background technology
(CMP) technology of chemically mechanical polishing is one of key technology of quartz wafer Surface Machining, in the naked quartz of large scale
Chip, integrated circuit are obtained with ultra-thin silicon list quartz wafer, LED with the processing of surface polishing of Sapphire Substrate quartz wafer etc.
Extensive use.CMP processes are the processes that a mechanism and chemical action balance each other, such as in advanced double-side ultrathin quartz
In wafer polishing procedure, using two deep bid sandwich erratic star wheels, quartz wafer is fixed on erratic star wheel, passes through deep bid
The autorotation of backwards rotation and erratic star wheel drives quartz wafer with being acted on polishing pad, and now chemical action is alkaline polishing fluid
Generation corrosion reaction is contacted with quartz wafer surface, quartz wafer surface can be by alkali liquid corrosion, by the friction with polishing pad then
The corrosion layer is removed, by circulating the two mechanisms, it is possible to realize the polishing of quartz wafer.
And in practical operation, in order that obtaining quartz wafer is easier dish out preferable waveform and frequency scattered error, generally choosing
It is polished with circular quartz chip, then the quartz wafer after polishing is cut into the Quadrate Piezoelectric Quartz chip of needs again, so
The waste of quartz wafer is not only caused, twice manufacturing procedure is also add, adds production cost.
In order to solve the problem of above is present, people are seeking a kind of preferable technical solution always.
The content of the invention
The purpose of the present invention is that in view of the shortcomings of the prior art, so as to provide, a kind of step is simple, can effectively reduce quartz
Polishing crystal piece cost and the quartz wafer glossing that the quartzy Wafer yield rate of polishing can be significantly improved.
To achieve these goals, the technical solution adopted in the present invention is：A kind of quartz wafer glossing, its step
Including：
Wafer chamfering is processed：The Quadrate Piezoelectric Quartz chip after a kind of ground processing is provided, after the ground processing
Four right angles position of Quadrate Piezoelectric Quartz chip carries out chamfered, obtains quartz wafer pre-add the Worker's Stadium；
A kind of milling apparatus is provided：The milling apparatus include above grinding disk, under grind disk, ring gear, central gear and with circle
The erratic star wheel in shape pleasure boat hole；Wherein, the aperture in the circular pleasure boat hole is more than the length of the quartz wafer pre-add the Worker's Stadium, described
On grind disk flatness be less than or equal to 0.003mm, it is described on grind disk weight be 4Kg, it is described under grind disk flatness be less than etc.
In 0.003mm；Grind on disk on described respectively first and grind adhering polishing pads on disk, the air vent aperture of the polishing pad under described
For 60 μm~70 μm, and processing is ground to the polishing pad using diamond dressing wheel respectively, obtains polishing pad and locate in advance
Manage body and lower polishing pad pretreatment body；Then the erratic star wheel is engaged between the ring gear and the central gear and incited somebody to action
Three is placed on the lower polishing pad pretreatment body；
Chip is arranged：The quartz wafer pre-add the Worker's Stadium is placed in the circular pleasure boat hole on the erratic star wheel, and controlled
The quartz wafer pre-add the Worker's Stadium coordinates with the circular pleasure boat hole for gap；
Wafer polishing：Adjusting the upper polishing pad pretreatment body first makes itself and the quartz that is placed in the circular pleasure boat hole
Wafer preparation body phase is contacted, and then fixes and disk and upper polishing pad pretreatment body are ground on described, and dribbling is ground using under described
The dynamic lower polishing pad pretreatment body rotation is processed by shot blasting to the quartz wafer pre-add the Worker's Stadium, so that square quartz is made
Wafer polishing body.
Based on above-mentioned, in the step of wafer chamfering is processed, by the Quadrate Piezoelectric Quartz chip after the ground processing
It is processed into 0.5mm~1.5mm chamfering in four right angles position.
Also included based on above-mentioned, described quartz wafer glossing pre- to the upper polishing pad using diamond dressing wheel
The step of processing body and the lower polishing pad pretreatment body carry out secondary milled processed respectively.
It should be noted that using quartz wafer glossing provided by the present invention to the quartz-crystal after ground processing
When piece is polished, it is not necessary to which square quartz wafer is first cut into circle, it is polished after square needed for cutting meeting.
Importantly, from geometrical relationship, if desired quartz wafer is first cut into circular then again from the circle after polishing
Required Quadrate Piezoelectric Quartz chip finished product is cut out in quartz wafer, then the geometrical relationship based on inscribed circle and circumscribed circle, it is inevitable
It is required that the size of the Quadrate Piezoelectric Quartz chip after ground processing is more than inscribe diameter of a circle, while the circular quartz after by polishing
When chip cuts squarely, the size of obtained Quadrate Piezoelectric Quartz chip finished product is cut certainly less than the circular quartz chip
Size.As can be seen here, there is great waste of material phenomenon in original technique.And utilize quartz wafer provided by the present invention to throw
When light technique is polished, it is only necessary to Quadrate Piezoelectric Quartz chip finished product will be cut into chamfering Quadrate Piezoelectric Quartz chip after polishing,
Therefore when producing the Quadrate Piezoelectric Quartz chip polishing body of same size, glossing provided by the present invention can greatly reduce material
Waste.
The present invention is compared with the prior art with prominent substantive distinguishing features and significantly progressive, specifically, institute of the present invention
The quartz wafer glossing of offer is swum by the way that the Quadrate Piezoelectric Quartz chip after chamfered is movably placed in into the circular of erratic star wheel
In wheel bore, it is polished using the direct square shaped quartz wafer of polishing pad, under erratic star wheel drive, due to Quadrate Piezoelectric Quartz chip not
It is set to be rotated freely in circular pleasure boat hole by the control of pleasure boat hole, so that the quartz wafer surface after the polishing produced
Flatness is preferable.On the other hand, the present invention is after a disk quartz wafer is processed, using diamond dressing wheel to the upper polishing
Pad and the lower polishing pad carry out secondary milled processed respectively so that be deposited on the upper polishing pad and the lower polishing pad
Sand crystallization is removed in time, it is ensured that the hole of the upper polishing pad and the lower polishing pad is unimpeded so that with a collection of quartz
The consistency of performance of wafer polishing piece is preferable.More importantly：The square wafer that this technique is eliminated in original technique change circle and
Disk changes back the two procedures of square piece, greatly reduces raw materials consumption and production cost, shortens production procedure, and by this
Quadrate Piezoelectric Quartz chip polishing body performance made from technique is fully able to reach is polished obtained product using Circular wafer
Energy.
Brief description of the drawings
Fig. 1 is the quartz wafer glossing quartz wafer pre-add the Worker's Stadium structural representation that the present invention is provided.
Fig. 2 is that erratic star wheel grinds disk assembling schematic diagram with in the quartz wafer glossing that provides of the present invention.
Fig. 3 is erratic star wheel and the assembling signal of quartz wafer pre-add the Worker's Stadium in the quartz wafer glossing that the present invention is provided
Figure.
Fig. 4 is when testing the Quadrate Piezoelectric Quartz chip scattered error after polishing in the quartz wafer glossing that provides of the present invention
Test point distribution schematic diagram.
Fig. 5 is distributed using test point when being tested in conventional glossing the circular quartz chip scattered error after polishing
Schematic diagram.
Fig. 6 is the chip oscillogram of the Quadrate Piezoelectric Quartz chip after polishing in the quartz wafer glossing that provides of the present invention.
Fig. 7 is the chip oscillogram of the circular quartz chip after polishing in the quartz wafer glossing that provides of the present invention.
In figure：1st, ring gear；2nd, disk is ground under；3rd, erratic star wheel；4th, central gear；5th, circular pleasure boat hole；6th, quartz wafer is pre-
Processome.
Embodiment
Below by embodiment, technical scheme is described in further detail.
Embodiment 1
The present embodiment provides a kind of quartz wafer glossing, and its step includes：
Wafer chamfering is processed：The Quadrate Piezoelectric Quartz chip after a kind of ground processing is provided, after the ground processing
Four right angles position of Quadrate Piezoelectric Quartz chip carries out chamfered, quartz wafer pre-add the Worker's Stadium is obtained, wherein controlling chamfer dimesion
For 0.5mm~1.5mm, the specific size of the Quadrate Piezoelectric Quartz chip is long 11mm, width 5.8mm, and concrete structure is as shown in Figure 1；
A kind of milling apparatus is provided：As shown in Fig. 2 providing a kind of aperture respectively first more than the quartz wafer preprocessing
The erratic star wheel 3 and a kind of flatness with circular pleasure boat hole 5 of body length are less than or equal to 0.003mm, weight to grind disk on 4Kg
And flatness is less than or equal to grind disk 2 under 0.003mm；Grind on disk and ground under described on described respectively and a throwing is bonded on disk 2
Light pad, and processing is ground using diamond dressing wheel respectively to two polishing pads, obtain polishing pad pretreatment body
Body is pre-processed with lower polishing pad；Wherein, the air vent aperture size of the polishing pad is 60 μm~70 μm；Then by the erratic star wheel
It is engaged between the ring gear and the central gear, and three is placed in the lower polishing pad and pre-processes on body；
Chip is arranged：As shown in figure 3, the quartz wafer pre-add the Worker's Stadium 6 to be movably placed in the circle on the erratic star wheel 3
In pleasure boat hole 5, and the quartz wafer pre-add the Worker's Stadium 6 is controlled to coordinate with the circular pleasure boat hole 5 for gap；
Wafer polishing：Adjusting the upper polishing pad pretreatment body first makes itself and the quartz that is placed in the circular pleasure boat hole
Wafer preparation body phase is contacted, and then fixes and disk and upper polishing pad pretreatment body are ground on described, and dribbling is ground using under described
The dynamic lower polishing pad pretreatment body rotation is processed by shot blasting to the quartz wafer pre-add the Worker's Stadium, so that square quartz is made
Wafer polishing body.
Wherein, in order to ensure the quality stability of the quartz wafer after same equipment polishing, the present embodiment institute
The quartz wafer glossing of offer need to also be pre-processed including often polishing a disk using diamond dressing wheel to the upper polishing pad
Body and the lower polishing pad pretreatment body carry out secondary milled processed 100 and enclose~200 circles respectively.
Contrast test：
In order to verify a kind of quartz wafer glossing provided by the present invention and existing circular quartz wafer polishing work
The difference of skill, the present embodiment has also carried out the polishing experiment of circular quartz chip, specific process of the test and burnishing parameters with it is above-mentioned
Step is roughly the same with parameter, and difference is：
The erratic star wheel that six circular pleasure boat holes are offered on a matrix is used in contrast test, then will be a diameter of
13.5mm circular quartz chip is placed in the circular pleasure boat hole and is polished.
After off-test, respectively according to the selecting test point method in Fig. 4 and Fig. 5, after the polishing obtained to the present embodiment
The scattered error and quartz wafer waveform of circular quartz chip after Quadrate Piezoelectric Quartz chip and polishing are tested, specific scattered error test knot
Respectively as shown in Table 1 and Table 2, specific quartz wafer waveform testing result difference is as shown in Figure 6 and Figure 7 for fruit.
The dot frequency summary sheet of Quadrate Piezoelectric Quartz chip five after table 1, polishing
The dot frequency summary sheet of circular quartz chip five after table 2, polishing
Square wafer after being polished it can be seen from Fig. 6 and Fig. 7 and Tables 1 and 2 by technique provided by the present invention
Frequency and chip waveform and common process polish after Circular wafer frequency and chip waveform no significant difference.Therefore, it is sharp
The quartz wafer glossing provided with the present invention can be directly polished with square shaped quartz wafer completely, can be eliminated often
Rounding wafer and disk in rule glossing change back the two procedures of square piece, shorten production procedure, reduce raw material and disappear
Consumption and production cost, and there is quartz wafer polishing body performance made from this technique to be fully able to reach using Circular wafer progress
Polish obtained properties of product.
Finally it should be noted that：The above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof；To the greatest extent
The present invention is described in detail with reference to preferred embodiments for pipe, those of ordinary skills in the art should understand that：Still
The embodiment of the present invention can be modified or equivalent substitution is carried out to some technical characteristics；Without departing from this hair
The spirit of bright technical scheme, it all should cover among claimed technical scheme scope of the invention.
Claims (3)
1. a kind of quartz wafer glossing, its step includes：
Wafer chamfering is processed：The Quadrate Piezoelectric Quartz chip after a kind of ground processing is provided, to square after the ground processing
Four right angles position of quartz wafer carries out chamfered, obtains quartz wafer pre-add the Worker's Stadium；
A kind of milling apparatus is provided：The milling apparatus include above grind disk, under grind disk, ring gear, central gear and with circle trip
The erratic star wheel of wheel bore；Wherein, the aperture in the circular pleasure boat hole be more than the quartz wafer pre-add the Worker's Stadium length, it is described on grind
The flatness of disk is less than or equal to 0.003 mm, it is described on to grind the weight of disk be 4 Kg, it is described under grind the flatness of disk and be less than or equal to
0.003 mm；Grind on disk on described respectively first and grind adhering polishing pads on disk, the air vent aperture of the polishing pad under described
For 60 μm~70 μm, and processing is ground to the polishing pad using diamond dressing wheel respectively, obtains polishing pad pre-
Handle body and lower polishing pad pretreatment body；Then the erratic star wheel is engaged between the ring gear and the central gear simultaneously
Three is placed on the lower polishing pad pretreatment body；
Chip is arranged：The quartz wafer pre-add the Worker's Stadium is placed in the circular pleasure boat hole on the erratic star wheel, and controlled described
Quartz wafer pre-add the Worker's Stadium coordinates with the circular pleasure boat hole for gap；
Wafer polishing：Adjusting the upper polishing pad pretreatment body first makes itself and the quartz wafer that is placed in the circular pleasure boat hole
Preprocessing body phase is contacted, and then fixes and disk and upper polishing pad pretreatment body are ground on described, and institute is driven using disk is ground under described
State lower polishing pad pretreatment body rotation to be processed by shot blasting the quartz wafer pre-add the Worker's Stadium, so that Quadrate Piezoelectric Quartz chip is made
Polishing body.
2. quartz wafer glossing according to claim 1, it is characterised in that：The step of the wafer chamfering is processed
In, four right angles of Quadrate Piezoelectric Quartz chip position after the ground processing is processed into the mm of 0.5 mm~1.5 chamfering.
3. quartz wafer glossing according to claim 1 or 2, it is also included using diamond dressing wheel on described
Polishing pad pre-processes body and the lower polishing pad pre-processes the step of body carries out secondary milled processed respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710327952.8A CN107052989A (en) | 2017-05-11 | 2017-05-11 | Quartz wafer glossing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710327952.8A CN107052989A (en) | 2017-05-11 | 2017-05-11 | Quartz wafer glossing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107052989A true CN107052989A (en) | 2017-08-18 |
Family
ID=59596807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710327952.8A Pending CN107052989A (en) | 2017-05-11 | 2017-05-11 | Quartz wafer glossing |
Country Status (1)
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| CN (1) | CN107052989A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584411A (en) * | 2017-10-25 | 2018-01-16 | 德清凯晶光电科技有限公司 | A kind of erratic star wheel for twin grinder |
| CN107598762A (en) * | 2017-10-21 | 2018-01-19 | 德清凯晶光电科技有限公司 | Large scale erratic star wheel and its uniform grinding method |
| CN110103134A (en) * | 2019-05-14 | 2019-08-09 | 应达利电子股份有限公司 | Wafer processing method |
| CN110126106A (en) * | 2019-06-17 | 2019-08-16 | 浙江晶特光学科技有限公司 | Wafer processing method |
| CN114029851A (en) * | 2021-11-24 | 2022-02-11 | 济源石晶光电频率技术有限公司 | High fundamental frequency wafer grinding process |
| CN117549205A (en) * | 2024-01-11 | 2024-02-13 | 东晶电子金华有限公司 | Quartz wafer polishing method |
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| CN203636573U (en) * | 2013-12-31 | 2014-06-11 | 江西海纳川科技有限公司 | Device for polishing glass with cambered surface |
| JP2015112678A (en) * | 2013-12-11 | 2015-06-22 | 京セラクリスタルデバイス株式会社 | Polishing carrier for crystal wafer and polishing method of crystal wafer using the same |
| CN104842253A (en) * | 2014-02-19 | 2015-08-19 | 中国科学院上海硅酸盐研究所 | Polishing device for optical grade plane processing of silicon carbide crystals and processing method |
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| CN103240666A (en) * | 2013-05-15 | 2013-08-14 | 中锗科技有限公司 | Grinding method for solar battery germanium substrate slices |
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| CN103817806A (en) * | 2013-12-24 | 2014-05-28 | 珠海东精大电子科技有限公司 | Loose wheel and method of producing quartz wafers |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598762A (en) * | 2017-10-21 | 2018-01-19 | 德清凯晶光电科技有限公司 | Large scale erratic star wheel and its uniform grinding method |
| CN107598762B (en) * | 2017-10-21 | 2023-10-31 | 德清凯晶光电科技有限公司 | Large-size planetary wheel and uniform polishing method thereof |
| CN107584411A (en) * | 2017-10-25 | 2018-01-16 | 德清凯晶光电科技有限公司 | A kind of erratic star wheel for twin grinder |
| CN110103134A (en) * | 2019-05-14 | 2019-08-09 | 应达利电子股份有限公司 | Wafer processing method |
| CN110126106A (en) * | 2019-06-17 | 2019-08-16 | 浙江晶特光学科技有限公司 | Wafer processing method |
| CN114029851A (en) * | 2021-11-24 | 2022-02-11 | 济源石晶光电频率技术有限公司 | High fundamental frequency wafer grinding process |
| CN117549205A (en) * | 2024-01-11 | 2024-02-13 | 东晶电子金华有限公司 | Quartz wafer polishing method |
| CN117549205B (en) * | 2024-01-11 | 2024-04-02 | 东晶电子金华有限公司 | Quartz wafer polishing method |
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