CN107039305B - The method for monitoring substrate application place - Google Patents
The method for monitoring substrate application place Download PDFInfo
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- CN107039305B CN107039305B CN201710237323.6A CN201710237323A CN107039305B CN 107039305 B CN107039305 B CN 107039305B CN 201710237323 A CN201710237323 A CN 201710237323A CN 107039305 B CN107039305 B CN 107039305B
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- substrate
- edge
- glass substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
Abstract
The present invention provides a kind of method for monitoring substrate application place.This method is by forming photoresist layer on inorganic layer on flexible substrates, and it patterns the photoresist layer and obtains the monitoring position label of several lines with a scale, the picture of the monitoring position label and flexible substrate is shot later, and then by the graduation mark that monitoring position marks identify the edge of flexible substrate to the edge of glass substrate distance actual value, design value of the actual value of the distance at the edge at the edge of the flexible substrate to glass substrate at a distance from the edge at the edge of flexible substrate to glass substrate is compared again, the position for flexible substrate that you can get it is with the presence or absence of offset, compared to the method for existing manual measurement, substrate application place can be monitored automatically, promote the monitoring efficiency of substrate application place, it reduces because of the bad bring technological problems of substrate application place.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of methods for monitoring substrate application place.
Background technique
Flat panel display device has many merits such as thin fuselage, power saving, radiationless, is widely used.It is existing
Flat panel display device mainly includes liquid crystal display device (Liquid Crystal Display, LCD) and Organic Light Emitting Diode
Display device (Organic Light Emitting Display, OLED).
Organic light emitting diodde desplay device due to being provided simultaneously with self-luminous, be not required to backlight, contrast are high, thickness is thin,
The excellent characteristics such as visual angle is wide, reaction speed is fast, it is wide to can be used for flexibility panel, use temperature range, construction and processing procedure are simpler,
It is considered as the emerging application technology of next-generation flat-panel screens.OLED display can be divided into passive square according to driving method
Formation OLED (Passive Matrix OLED, PMOLED) and active array type OLED (Active Matrix OLED,
AMOLED two class of) two major classes, i.e. directly addressing and thin film transistor (TFT) (Thin Film Transistor, TFT) matrix addressing.Its
In, AMOLED has the pixel in array arrangement, belongs to active display type, and luminous efficacy is high, has excellent performance.
OLED display generally includes: substrate, the anode on substrate, the organic luminous layer on anode, with
And the cathode on organic luminous layer.To organic luminous layer emit hole from anode when work and from the electricity of cathode
Son combines these electrons and holes and generates excitability electron-hole pair, and excitability electron-hole pair is turned from excited state
Ground state realization is changed to shine.
Flexible Displays are a big characteristics of OLED display, and the flexible flexible display apparatus of changeable type can give user
Bring subversive usage experience.The manufacturing process of existing flexibility OLED display panel are as follows: be coated on the glass substrate first
Flexible substrate material forms flexible substrate, inorganic thin film is then covered in the flexible substrate, then in the inorganic thin film
Upper production OLED shows structure, obtains flexible OLED display panel；Wherein the flexible substrate material is usually polyimides
(Polyimide, PI), to prevent flexible substrate material from polluting to subsequent technique, flexibility must be completely covered in inorganic thin film
Therefore substrate needs to be monitored the application place of flexible substrate material during processing procedure, the monitoring side that the prior art uses
Method is usually the distance on four sides of four back gauge glass substrates of the flexible substrate after being coated with using manually measurement, then will be surveyed
Magnitude is compared with design value, and to judge whether the position of flexible substrate deviates design value, this method is cumbersome, precision
Difference, and be easy because personnel are too close to substrate, to increasing impurity on substrate.
Summary of the invention
The purpose of the present invention is to provide a kind of methods for monitoring substrate application place, can monitor substrate coating position automatically
It sets, promotes the monitoring efficiency of substrate application place, reduce because of the bad bring technological problems of substrate application place.
To achieve the above object, the present invention provides a kind of method for monitoring substrate application place, include the following steps:
Step S1, a glass substrate is provided, flexible substrate material is coated on the glass substrate, forms flexible substrate；
Step S2, the depositing inorganic films material in the flexible substrate and glass substrate obtains a transparent inorganic layer；
Step S3, deposit photoresist layer on the inorganic layer, the photoresist layer patterned, obtain it is several with it is described
The monitoring position of the strip of the edge-perpendicular of glass substrate marks；
The several monitoring positions label is alternatively arranged around four sides of the glass substrate, the glass substrate it is each
Side corresponds at least one monitoring position label, the midpoint of each monitoring position label to the edge of the glass substrate away from
Design value with a distance from the edge to the edge of glass substrate for being less than flexible substrate, each monitoring position label is far from described
The distance at the one end at the edge of glass substrate to the edge of the glass substrate is greater than the edge of flexible substrate to glass substrate
The design value of the distance at edge；
Each monitoring position label includes: the quarter along the extending direction equidistant radial arrangement of monitoring position label
Spend line；
Step S4, the picture of flexible substrate and monitoring position label on the glass substrate is shot, and according to taking
Picture and monitoring position label on graduation mark identification flexible substrate edge to the edge of glass substrate distance actual value,
Compare the edge of the flexible substrate to the edge of glass substrate distance actual value and flexible substrate edge to glass base
The design value of the distance at the edge of plate, to monitor the substrate coating accuracy.
The inorganic layer includes: inorganic insulation layer and the amorphous silicon layer on the inorganic insulation layer.
The material of the inorganic insulation layer is one of silica and silicon nitride or a variety of combinations.
To the photoresist pattern also obtained after photoresist pattern layers for patterning the amorphous silicon layer in the step 3.
The flexible substrate material is polyimides.
The graduation mark includes: alternately arranged multiple main scale marks and multiple subscale marks, the height of the main scale mark
Degree is greater than the height of the subscale mark.
The distance between two adjacent main scale marks are 1mm, an adjacent main scale mark and subscale mark it
Between distance be 0.5mm.
Each monitoring position label further include: the scale value of corresponding each main scale mark setting, the scale value table
Show the main scale mark corresponding to it to the edge of the glass substrate distance.
Flexible substrate and monitoring position on the glass substrate are shot by automatic optical detector platform in the step S4
The picture of label.
Beneficial effects of the present invention: the present invention provides a kind of method for monitoring substrate application place, by flexible substrate
On inorganic layer on form photoresist layer, and pattern the photoresist layer obtain several lines with a scale monitoring position label, later
The picture of monitoring position label and flexible substrate is shot, and then is identified by the graduation mark that monitoring position marks soft
The edge of property substrate to the edge of glass substrate distance actual value, then by the side at the edge of the flexible substrate to glass substrate
Design value of the actual value of the distance of edge at a distance from the edge at the edge of flexible substrate to glass substrate is compared, and can be obtained
The position of flexible substrate can monitor substrate coating compared to the method for existing manual measurement with the presence or absence of offset automatically out
Position promotes the monitoring efficiency of substrate application place, reduces because of the bad bring technological problems of substrate application place.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the top view of the step S1 and step S2 of the method for monitoring substrate application place of the invention；
Fig. 2 is the sectional view of the step S2 of the method for monitoring substrate application place of the invention；
Fig. 3 is the top view of the step S3 of the method for monitoring substrate application place of the invention；
Fig. 4 is the schematic diagram of monitoring position label in the method for monitoring substrate application place of the invention；
Fig. 5 is the schematic diagram of the step S4 of the method for monitoring substrate application place of the invention；
Fig. 6 is the flow chart of the method for monitoring substrate application place of the invention.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Referring to Fig. 6, the present invention provides a kind of method for monitoring substrate application place, include the following steps:
Step S1, as shown in Figure 1, providing a glass substrate 1, flexible substrate material, shape are coated on the glass substrate 1
At flexible substrate 2.
Specifically, the flexible substrate material is polyimides (Polyimide, PI), and the flexible substrate 2 is formed in institute
The center of glass substrate 1 is stated, the edge of glass substrate 1 described in Edge Distance is spaced a distance.
Step S2, as depicted in figs. 1 and 2, the depositing inorganic films material in the flexible substrate 2 and glass substrate 1 obtains
The inorganic layer 3 transparent to one.
Specifically, the inorganic layer 3 includes: inorganic insulation layer 31 and the amorphous on the inorganic insulation layer 31
Silicon (a-Si) layer 32.Preferably, the material of the inorganic insulation layer 31 is one of silica and silicon nitride or a variety of groups
It closes.
Step S3, photoresist layer as shown in Figure 3 and Figure 4, is deposited on the inorganic layer 3, pattern is carried out to the photoresist layer
Change, obtains several monitoring position labels 41 with the strip of the edge-perpendicular of the glass substrate 1.
Several monitoring position labels 41 are alternatively arranged around four sides of the glass substrate 1, the glass substrate 1
Each side corresponds at least one monitoring position label 41, the midpoint of each monitoring position label 41 to the glass substrate 1
Edge distance be less than flexible substrate 2 edge to the edge of glass substrate 1 distance design value, each monitoring position
The distance at the one end at edge of the label 41 far from the glass substrate 1 to the edge of the glass substrate 1 is greater than flexible substrate 2
Edge to the edge of glass substrate 1 distance design value；
Each monitoring position label 41 includes: the extending direction equidistant radial arrangement along the monitoring position label 41
Graduation mark 411.
Specifically, to the light also obtained after photoresist pattern layers for patterning the amorphous silicon layer 32 in the step 3
Resistance pattern namely the photoresist layer are in the prior art for patterning the photoresist layer of amorphous silicon layer 32, by existing light
The pattern for increasing monitoring position label 41 in (Mask) is covered, so that monitoring position label 41 and for patterning the amorphous silicon layer
32 photoresist pattern is formed simultaneously, and without increasing new optical cover process, is completed while completing existing processing procedure to substrate location
Monitoring, promoted substrate application place monitoring efficiency, improving production efficiency.
Specifically, as shown in figure 4, the graduation mark 411 includes: alternately arranged multiple main scale marks 4111 and multiple pairs
Graduation mark 4112, the height of the main scale mark 4111 are greater than the height of the subscale mark 4112, further, adjacent two
The distance between a main scale mark 4111 is 1mm, between adjacent a main scale mark 4111 and a subscale mark 4112
Distance is 0.5mm, meanwhile, in each monitoring position label 41, scale value is arranged in each corresponding main scale mark 4111
412, the scale value 412 indicates the main scale mark 4111 corresponding to it to the distance at the edge of the glass substrate 1.
Step S4, as shown in figure 5, shooting the picture of flexible substrate 2 and monitoring position label 41 on the glass substrate 1,
And according to the edge of the identification flexible substrate 2 of graduation mark 411 on the picture and monitoring position label 41 taken to glass substrate 1
Edge distance actual value, the actual value of the distance at edge of the edge of the flexible substrate 2 to glass substrate 1 and
The edge of flexible substrate 2 to the edge of glass substrate 1 distance design value, to monitor the substrate coating accuracy.
For example, as shown in figure 5, the edge of the flexible substrate 2 is located at the scale value 7 in the picture taken
8 between the corresponding main scale mark 4111 namely edge to the edge of the glass substrate 1 of the flexible substrate 2 and
Distance is 7mm to 8mm, and further, the edge of the flexible substrate 2 is located at the corresponding main scale mark of scale value 7 and 8
The right side of subscale mark 4112 between 4111 namely the edge of the flexible substrate 2 to the edge of the glass substrate 1 away from
From being 7mm between 7.5mm, if the design value of distance at the edge of flexible substrate 2 to the edge of glass substrate 1 is 8mm, this
When can determine that the marginal position of the flexible substrate 2 shifts, offset distance is 0.5mm to 1mm, and staff can be with accordingly
The precision of corresponding adjustment coating flexible substrate board carries out complement value.
Specifically, flexible liner on the glass substrate 1 is shot by automatic optical detector platform (AOI) in the step S4
The picture that shooting obtains can also be uploaded to correspondence by the picture of bottom 2 and monitoring position label 41, the automatic optical detector platform
Monitoring system checked for staff.
In conclusion the present invention provides a kind of method for monitoring substrate application place, it is inorganic by flexible substrates
Photoresist layer is formed on layer, and patterns the photoresist layer and obtains the monitoring position label of several lines with a scale, later described in shooting
The picture of monitoring position label and flexible substrate, and then flexible substrate is identified by the graduation mark on monitoring position label
Edge to the edge of glass substrate distance actual value, then by the distance at the edge at the edge of the flexible substrate to glass substrate
Design value of the actual value at a distance from the edge at the edge of flexible substrate to glass substrate be compared, flexible liner that you can get it
The position at bottom, compared to the method for existing manual measurement, can monitor substrate application place with the presence or absence of offset automatically, be promoted
The monitoring efficiency of substrate application place is reduced because of the bad bring technological problems of substrate application place.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (7)
1. a kind of method for monitoring substrate application place, which comprises the steps of:
Step S1, a glass substrate (1) is provided, flexible substrate material is coated on the glass substrate (1), form flexible substrate
(2)；
Step S2, it is transparent inorganic to obtain one for the depositing inorganic films material in the flexible substrate (2) and glass substrate (1)
Layer (3)；
Step S3, deposit photoresist layer on the inorganic layer (3), the photoresist layer patterned, obtain it is several with it is described
The monitoring position of the strip of the edge-perpendicular of glass substrate (1) marks (41)；
Several monitoring position labels (41) are alternatively arranged around four sides of the glass substrate (1), the glass substrate (1)
Each side correspond at least one monitoring position label (41), each monitoring position marks the midpoint of (41) to the glass
The distance at the edge of substrate (1) be less than flexible substrate (2) edge to the edge of glass substrate (1) distance design value, often
The one end to the edge of the glass substrate (1) at one edge of the monitoring position label (41) far from the glass substrate (1)
The design value of distance apart from the edge greater than flexible substrate (2) to the edge of glass substrate (1)；
Each monitoring position label (41) includes: the extending direction equidistant radial arrangement along monitoring position label (41)
Graduation mark (411)；
Step S4, the picture of flexible substrate (2) and monitoring position label (41) on the glass substrate (1) is shot, and according to bat
The edge to glass substrate (1) for graduation mark (411) identification flexible substrate (2) on picture and monitoring position label (41) taken the photograph
Edge distance actual value, the reality of the distance at edge of the edge of the flexible substrate (2) to glass substrate (1)
It is worth the design value with the distance at the edge of flexible substrate (2) to the edge of glass substrate (1), to monitor the substrate coating essence
Degree；
The graduation mark (411) includes: alternately arranged multiple main scale marks (4111) and multiple subscale marks (4112), described
The height of main scale mark (4111) is greater than the height of the subscale mark (4112)；
Each monitoring position marks (41) further include: the scale value (412) of corresponding each main scale mark (4111) setting, institute
State scale value (412) indicate main scale mark (4111) corresponding to it to the glass substrate (1) edge distance.
2. the method for monitoring substrate application place as described in claim 1, which is characterized in that the inorganic layer (3) includes: nothing
Machine insulating layer (31) and the amorphous silicon layer (32) being located on the inorganic insulation layer (31).
3. the method for monitoring substrate application place as claimed in claim 2, which is characterized in that the inorganic insulation layer (31)
Material is one of silica and silicon nitride or a variety of combinations.
4. the method for monitoring substrate application place as claimed in claim 2, which is characterized in that photoresist layer in the step S3
The photoresist pattern for patterning the amorphous silicon layer (32) is also obtained after patterning.
5. the method for monitoring substrate application place as described in claim 1, which is characterized in that the flexible substrate material is poly-
Acid imide.
6. the method for monitoring substrate application place as described in claim 1, which is characterized in that two adjacent main scale marks
It the distance between (4111) is 1mm, the distance between an adjacent main scale mark (4111) and a subscale mark (4112)
For 0.5mm.
7. the method for monitoring substrate application place as described in claim 1, which is characterized in that by automatic in the step S4
Optical detection board shoots the picture of flexible substrate (2) and monitoring position label (41) on the glass substrate (1).
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| CN201710237323.6A CN107039305B (en) | 2017-04-12 | 2017-04-12 | The method for monitoring substrate application place |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107195639B (en) * | 2017-06-27 | 2020-04-03 | 京东方科技集团股份有限公司 | Preparation method of array substrate mother board, array substrate mother board and detection method |
| CN109031713B (en) * | 2018-07-27 | 2020-12-25 | 南京中电熊猫平板显示科技有限公司 | Substrate alignment detection method and detection device thereof |
| CN110989217B (en) * | 2019-11-19 | 2021-09-24 | Tcl华星光电技术有限公司 | Substrate and method for monitoring boundary position of film layer on substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900572A (en) * | 2015-05-21 | 2015-09-09 | 深圳市华星光电技术有限公司 | Manufacturing method of alignment marks on a gate electrode layer |
| CN106299092A (en) * | 2015-06-02 | 2017-01-04 | 上海和辉光电有限公司 | Have and encapsulate the AMOLED panel to bit function and method for packing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0115259D0 (en) * | 2001-06-21 | 2001-08-15 | Esm Ltd | Method of monitoring and controlling a photoresist edge bead |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900572A (en) * | 2015-05-21 | 2015-09-09 | 深圳市华星光电技术有限公司 | Manufacturing method of alignment marks on a gate electrode layer |
| CN106299092A (en) * | 2015-06-02 | 2017-01-04 | 上海和辉光电有限公司 | Have and encapsulate the AMOLED panel to bit function and method for packing |
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