CN107030403A - Metal or alloy product microcellular processing systems - Google Patents
Metal or alloy product microcellular processing systems Download PDFInfo
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- CN107030403A CN107030403A CN201710439591.6A CN201710439591A CN107030403A CN 107030403 A CN107030403 A CN 107030403A CN 201710439591 A CN201710439591 A CN 201710439591A CN 107030403 A CN107030403 A CN 107030403A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention provides a kind of metal or alloy product microcellular processing systems, it is related to capillary processing field.The metal or alloy Product processing system includes ultrashort laser pulse generator, laser state adjusting apparatus, Gauss laser pulse generating means, loop laser pulse generation device and laser pulse synthesizer, realize the residue in the drain time for reducing Primary plasma and Primary plasma discharge process, the smooth degree of the hole wall of micropore is improved, has deepened the Puncturing Limit depth to micropore；Small energy pulse laser is carried out in two times realizes energy injection, the big energy pulse laser of single than identical gross energy is more beneficial for the reduction of micropore caliber size, reduce the possibility cracked simultaneously, and the diameter ratio of the center loop wire of the Gaussian spot of the first laser beam formation after the diameter of the center loop wire of the ring-shaped light spot of the second laser beam after focusing on and focusing is more than 1, can improve the injection efficiency of laser energy.
Description
Technical field
The present invention relates to capillary processing field, in particular to a kind of metal or alloy product microcellular processing systems.
Background technology
In the capillary processing field of metal and alloy materials, laser micro deep-hole process technology is widely used in turbine leaf
The capillary processings such as piece, oil pump, oil nozzle, filter screen, spinneret, water knife, mould, medical instruments, clock and watch part, printed circuit board are led
Domain.For common Long Pulse LASER processing, such as ns laser, in aperture~50um, aspect ratio is about 10, processing hole
Hole wall surface roughness is poor；For another example PRK, but process velocity is extremely slow, high processing costs, um grades of holes of processing are appropriate only for
Process um grades of films.Or smaller micropore bore yardstick can be realized under low pulse energy for common UV laser but micropore is deep
Degree is difficult to meet to require again, otherwise using big single pulse energy, working depth is very deep but aperture but be also difficult to meet micro- greatly very much
The requirement of deep hole machining.These all seriously constrain the application of ultrashort laser pulse processing.And it is used as the allusion quotation of ultrashort laser pulse
Type is represented, and femtosecond laser is since 1980s is born, various ultrashort laser pulses particularly femtosecond pulse quilt
It is widely used in the subjects such as physics, chemistry, machinery and biology.Optical maser wavelength covering is almost infrared to arrive extreme ultraviolet waveband, and pulse is wide
Degree is also reduced to several photoperiods.
Because femtosecond laser can produce some extreme physical conditions, it is set to possess some uniquenesses in terms of manufacture field
Advantage.The Long Pulse LASER processing different from the past of its processing mechanism, can within the extremely short time (generally~100fs) by its
Whole energy injections are to the zone of action (usual 10~100um2 magnitudes) of very little, and the high-energy-density of moment, which is deposited, will make electronics
Absorption and motion mode change, the influence of laser linear absorption, energy transfer and diffusion process etc. can be avoided so that
Fundamentally changing the mechanism of high-order harmonics spectrum；Along with the threshold property of material so that machining area is far small
In laser action region, processing dimension can break through diffraction limit etc., and turning into its processing mode has superhigh precision, superaltitude
Between resolution ratio and rapidoprint scope non-selectivity.
Femtosecond laser capillary processing of the prior art, due to being influenceed by critical plasma shield, its aperture pole
Depth is limited generally all within 300um, limit depth is not deep enough, and ablation aperture is in more than 100um, and ablation aperture is larger, weight
Thick, the thick crackle of cast layer thickness is more and ultrashort laser pulse capacity usage ratio is low.
The content of the invention
It is an object of the invention to provide a kind of metal or alloy product microcellular processing systems, it is intended to improve above-mentioned ask
Topic.
The embodiments of the invention provide a kind of metal or alloy product microcellular processing systems, the metal or alloy product adds
Work system includes ultrashort laser pulse generator, laser state adjusting apparatus, Gauss laser pulse generating means, loop laser arteries and veins
Generating means and laser pulse synthesizer are rushed,
The ultrashort laser pulse generator is used to produce ultrashort laser pulse, and ultrashort laser pulse is exported to described
Laser state adjusting apparatus；
The laser state adjusting apparatus is used for the ultrashort laser pulse for adjusting the ultrashort laser pulse generator input
Comprising spot diameter big as low as required first spot diameter value, and be the by the ultrashort laser pulse beam splitting after regulation
One laser beam and second laser beam, and first laser beam, second laser beam are exported to Gauss laser pulse generation respectively
Device, the loop laser pulse generation device, wherein, first laser beam, of the light pulse of second laser beam unit interval
Number is presetting threshold value；
The light arm that the Gauss laser pulse generating means are constituted and structure described in the loop laser pulse generation device
Into light arm optical path difference in presetting threshold range, the Gauss laser pulse generating means be used for adjust first laser
The power of beam, and collimate first laser beam and adjust the spot size of first laser beam to reach that required second hot spot is straight
Footpath is worth, and then by the first laser Shu Jinhang delays after regulation so as to generate Gauss laser pulse, and exports to the laser arteries and veins
Rush synthesizer；
The loop laser pulse generation device is used to adjusting the power of second laser beam, and collimate second laser beam and
The spot size of second laser beam is adjusted to reach required 3rd spot diameter value, then by the second laser beam after regulation
Loop laser pulse is adjusted to, then prefocus is carried out to loop laser pulse, and is exported to the laser pulse synthesizer；
The laser pulse synthesizer is used to by Gauss laser pulse, loop laser pulse close Shu Shengcheng and mix surpassing
Short laser pulse, and the mixing ultrashort laser pulse closed after beam is focused so as to generate mixing ultrashort laser pulse, and will
A metal or alloy product to be detected is got in mixing ultrashort laser pulse after focusing.
Further, the laser state adjusting apparatus include aperture-variable diaphragm, optical shutter, the first control terminal with
And Amici prism, first control terminal electrically connects with the optical shutter,
The aperture-variable diaphragm is used for the size of the spot diameter by the ultrashort laser pulse generator input is adjusted
To required first spot diameter value, and the ultrashort laser pulse after regulation is exported to the optical shutter respectively；
First control terminal is used to control the optical shutter to open every presetting time, so that during by unit
Between the number control of light pulse of the input Amici prism be presetting threshold value；
It is first laser beam and second that the Amici prism, which is used for by the ultrashort laser pulse beam splitting of the optical shutter,
Laser beam, and first laser beam, second laser beam are exported sharp to the Gauss laser pulse generating means, the annular respectively
Light pulse generating means.
Further, the laser state adjusting apparatus includes aperture-variable diaphragm and Amici prism,
The ultrashort laser pulse generator is used to produce ultrashort laser pulse, and ultrashort laser pulse is exported to described
Aperture-variable diaphragm, wherein, of the light pulse of the input aperture-variable diaphragm of the ultrashort laser pulse unit interval
Numerical control is made as presetting threshold value；
The aperture-variable diaphragm is used for the ultrashort laser pulse bag by the ultrashort laser pulse generator input is adjusted
The big as low as required first spot diameter value of the spot diameter contained, and by the pulsed laser output after regulation to the light splitting
Prism；
It is first laser beam and second laser beam that the Amici prism, which is used for the ultrashort laser pulse beam splitting after regulation, and
First laser beam, second laser beam are exported to the Gauss laser pulse generating means, loop laser pulse life respectively
Into device.
Further, the Gauss laser pulse generating means include the first light energy control assembly, first looked in the distance microscope group
Part, the second control terminal, the first three-dimensional Micro-displacement Driving platform, right-angle prism, second control terminal and the described 1st
The electrical connection of Micro-displacement Driving platform is tieed up, the right-angle prism is installed on the described first three-dimensional Micro-displacement Driving platform,
The first light energy control assembly is for receiving the first laser beam of the laser state adjusting apparatus input simultaneously
The power of first laser beam is adjusted, and first laser beam is exported to described first looked in the distance mirror assembly；
Described first look in the distance mirror assembly be used for collimate first laser beam and adjust first laser beam spot size with up to
Exported to required second spot diameter value, and by the first laser beam after regulation to the right-angle prism；
Second control terminal is used to control the described first three-dimensional Micro-displacement Driving platform to drive the right-angle prism hair
Raw displacement, by the time presetting the first laser Shu Yanchi after regulation and generates Gauss laser pulse, and by after delay
First laser beam is exported to the laser pulse synthesizer.
Further, the loop laser pulse generation device includes the second light energy control assembly, second looked in the distance microscope group
Part, loop laser impulse modulation component and one-dimensional convex lens,
The second light energy control assembly is for receiving the second laser beam of the laser state adjusting apparatus input simultaneously
The power of second laser beam is adjusted, and second laser beam is exported to described second looked in the distance mirror assembly；
Described second look in the distance mirror assembly be used for collimate second laser beam and adjust second laser beam spot size with up to
Exported to required 3rd spot diameter value, and by the second laser beam after regulation to the loop laser impulse modulation group
Part；
The loop laser impulse modulation component is used to the second laser beam after regulation being adjusted to loop laser pulse；
The one-dimensional convex lens are used to carry out prefocus to loop laser pulse, and by the loop laser pulse after prefocus
Export to the laser pulse synthesizer.
Further, the loop laser pulse generation device also includes the second control terminal and the first space light modulation
Device, second control terminal is electrically connected with first spatial light modulator,
First spatial light modulator is used for the second laser beam for receiving the second light energy control assembly input；
Second control terminal be used for control first spatial light modulator to be modulated second laser beam so that
The Energy distribution homogenization of second laser beam；
First spatial light modulator is additionally operable to export the second laser beam after modulation to described second and looked in the distance microscope group
Part.
Further, the loop laser impulse modulation component is axicon lens, and the second laser beam is perpendicular to the cone
The optical axis weight of the optical axis and the axicon lens of the light arm that the surface output of the plane of mirror, the loop laser pulse generation device are constituted
Close；
Or the loop laser impulse modulation component is second space optical modulator, second control terminal is additionally operable to control
Make the second space optical modulator and the second laser beam is modulated to loop laser pulse.
Further, the second light energy control assembly be half-wave plate combined with polarizer variable optical attenuator or in
Property density filter group and variable optical attenuation piece set.
Further, the metal or alloy product microcellular processing systems also include：
Hot spot image checking and adjusting apparatus, for gathering mixing ultrashort laser pulse in metal or alloy product surface shape
Into hot spot in the image of plane residing for the surface to be detected of metal or alloy product, and judge according to the image that collects to focus on
Whether second laser beam afterwards is presetting in the Rayleigh range of the ring-shaped light spot on the surface to be detected of metal or alloy product
Whether the first length threshold and ring-shaped light spot produce in the first presetting focal position and second laser beam in metal or alloy
The Rayleigh range of the Gaussian spot on the surface to be detected of product whether be the second presetting length threshold and ring-shaped light spot whether
The second presetting focal position, if it is not, then the second laser beam after adjustment focusing is in the to be detected of metal or alloy product
The Rayleigh range of the ring-shaped light spot on surface and the first focal position of ring-shaped light spot and first laser beam are produced in metal or alloy
The Rayleigh range of the Gaussian spot on the surface to be detected of product and the second focal position of Gaussian spot, until second after focusing swashs
Light beam the ring-shaped light spot on the surface to be detected of metal or alloy product Rayleigh range for presetting the first length threshold and
Ring-shaped light spot the first presetting focal position and first laser beam the surface to be detected of metal or alloy product height
The Rayleigh range of this hot spot is presetting the second length threshold and ring-shaped light spot in the second presetting focal position.
Further, the hot spot image checking includes image capture module, the 3rd control terminal, second with adjusting apparatus
Three-dimensional Micro-displacement Driving platform, the 3rd control terminal respectively with described image acquisition module, the second three-dimensional micro-displacement
Platform electrical connection is driven,
Described image acquisition module is used to gather the light that mixing ultrashort laser pulse is formed in metal or alloy product surface
Image of the spot in plane residing for the surface to be detected of metal or alloy product；
3rd control terminal is used to judge the second laser beam after focusing in metal or conjunction according to the image collected
Whether the Rayleigh range of the ring-shaped light spot on the surface to be detected of golden product is the first presetting length threshold and ring-shaped light spot is
The Gaussian spot on the no surface to be detected in the first presetting focal position and second laser beam in metal or alloy product
Rayleigh range whether be the second presetting length threshold and Gaussian spot whether in the second presetting focal position, if
It is no, then control the described second three-dimensional Micro-displacement Driving platform to move so that the second laser beam after focusing on is in metal or alloy product
The Rayleigh range of ring-shaped light spot on surface to be detected be presetting the first length threshold and ring-shaped light spot presetting the
One focal position and first laser beam are pre- in the Rayleigh range of the Gaussian spot on the surface to be detected of metal or alloy product
The second length threshold and Gaussian spot of setting are in the second presetting focal position.
The beneficial effect for the metal or alloy product microcellular processing systems that the present invention is provided is：When mixing ultrashort laser pulse
By the time delay vertical output to the metal or alloy product surface to be detected when, can be by more energy injections
To the micropore bottom formed on surface to be detected, secondary plasma can be produced at micropore bottom position, is so conducive to micropore
Deepen, so that improving hole depth reaches required limit depth or depth requirements；First laser beam arrives first at surface to be detected
Implantation Energy produces Primary plasma, after Primary plasma generation and when this section before Primary plasma disappearance
In, the second laser beam now postponed reaches surface to be detected, and now annular ultrashort laser pulse penetrates and crossed just inferior
Gas ions realize second energy injection and produce secondary plasma in micropore bottom, pass through the annular ultrashort laser pulse of delay
Carry out Implantation Energy, middle hollow area is more beneficial for the formation of Primary plasma passing away；Localization two it is inferior from
The backward shock wave energy that daughter is produced accelerates the quick drain of Primary plasma, when reducing the discharge of Primary plasma
Between, reduce the residue in Primary plasma discharge process, improve the smooth degree of hole wall, localization two it is inferior from
The forward direction shock wave energy that daughter is produced further deepens micropore depth；Small energy pulse laser realizes that energy injection compares phase in two times
Be more beneficial for the reduction of micropore caliber size with the big energy pulse laser of single under gross energy, at the same reduce crack can
Can property.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the structured flowchart of metal or alloy product microcellular processing systems provided in an embodiment of the present invention；
Fig. 2 is the structural representation of laser state adjusting apparatus provided in an embodiment of the present invention；
Fig. 3 is the structural representation of Gaussian pulse laser generation devices provided in an embodiment of the present invention；
Fig. 4 is the structural representation of loop laser pulse generation device provided in an embodiment of the present invention；
Fig. 5 is the structural representation of laser pulse synthesizer provided in an embodiment of the present invention；
Fig. 6 is hot spot image checking provided in an embodiment of the present invention and the structural representation of adjusting apparatus；
Fig. 7 is the operation principle schematic diagram of metal or alloy product microcellular processing systems provided in an embodiment of the present invention.
Icon：101- ultrashort laser pulse generators；102- laser state adjusting apparatus；103- Gauss laser pulses are generated
Device；104- loop laser pulse generation devices；105- laser pulse synthesizers；106- hot spots image checking is filled with adjustment
Put；107- aperture-variable diaphragms；108- optical shutters；The control terminals of 109- first；110- Amici prisms；The light energies of 111- first
Control assembly；112- first looks in the distance mirror assembly；The control terminals of 113- second；The three-dimensional Micro-displacement Driving platforms of 114- first；115-
Right-angle prism；116- the second light energy control assemblies；117- second looks in the distance mirror assembly；118- loop laser impulse modulation components；
The one-dimensional convex lens of 119-；120- focal length microcobjectives；The spatial light modulators of 121- first；122- image capture modules；123-
Three control terminals；The three-dimensional Micro-displacement Driving platforms of 124- second；125- dielectric mirrors；126- stainless steel plates；In 127- micropores
Heart axis；To shock wave before 128-；To shock wave after 129-；130- secondary plasmas；131- owes close heating region；
132- loop laser pulses；133- critical densities surface；134- dense plasmas region；135- Gauss laser pulses；136-
Light-combining prism；137- laser power meters.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiments of the invention below to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, or should
Orientation or position relationship that invention product is usually put when using, or the orientation or position that those skilled in the art usually understand
Relation is put, the description present invention is for only for ease of and simplifies description, rather than indicate or imply that the equipment or element of meaning are necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In addition, term " first ", " second ", " the 3rd " etc. are only used for distinguishing description, and it is not intended that indicating or implying
Relative importance.
In the description of the invention, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one
Connect body；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirect by intermediary
It is connected, can is the connection of two element internals.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Embodiment
Referring to Fig. 1, a kind of metal or alloy product microcellular processing systems of the embodiment of the present invention, metal or alloy product adds
Work system include ultrashort laser pulse generator 101, laser state adjusting apparatus 102, Gauss laser pulse generating means 103,
Loop laser pulse generation device 104 and laser pulse synthesizer 105.
Ultrashort laser pulse generator 101 is used to produce ultrashort laser pulse, and ultrashort laser pulse is exported to laser
State adjusting device 102.
Wherein, in the present embodiment, ultrashort laser pulse is femtosecond ultrashort laser pulse, the items of femtosecond ultrashort laser pulse
Parameter is：Centre wavelength 800nm, laser linewidth 40nm, laser pulse width 120fs, repetition rate 1kHz, power output 1W,
Power jitter is less than 5%, and laser polarization direction is horizontal polarization state.
Laser state adjusting apparatus 102 is used for the ultrashort laser pulse for adjusting the input of ultrashort laser pulse generator 101
The big as low as required first spot diameter value of spot diameter, and be first laser by the ultrashort laser pulse beam splitting after regulation
Beam and second laser beam, and first laser beam, second laser beam are exported to Gauss laser pulse generating means 103, ring respectively
Shape laser pulse generating means 104, wherein, first laser beam, the number of the light pulse of second laser beam unit interval are default
Fixed threshold value.
Specifically, as shown in Fig. 2 in the present embodiment, laser state adjusting apparatus 102 includes aperture-variable diaphragm 107, light
Shutter 108, the first control terminal 109 and Amici prism 110 are learned, the first control terminal 109 is electrically connected with optical shutter 108,
Aperture-variable diaphragm 107 is used to that the big as low as required of the spot diameter that ultrashort laser pulse generator 101 is inputted will to be adjusted
First spot diameter value, and the ultrashort laser pulse after regulation is exported to optical shutter 108 respectively, it is variable in the present embodiment
The aperture of aperture diaphragm 107 is set to 10mm；First control terminal 109 is used to controlling optical shutter 108 when presetting
Between open so that by the unit interval input Amici prism 110 light pulse number control be presetting threshold value；This implementation
In example, pulse number is arranged on 10 pulse above continuously adjustabes, and the switch response time of shutter 3 is 1/10000s；Light splitting rib
It is first laser beam and second laser beam that mirror 110, which is used for by the ultrashort laser pulse beam splitting of optical shutter 108, and first is swashed
Light beam, second laser beam are exported to Gauss laser pulse generating means 103, loop laser pulse generation device 104 respectively.This reality
Apply in example, the wavelength of Amici prism 110 is the Amici prism 110 of 800nm wavelength, for by laser that a branch of wavelength is 800nm
The two beam 800nm laser of energy such as it is divided into.
Alternatively way of example, laser state adjusting apparatus 102 can also only include aperture-variable diaphragm 107
And Amici prism 110, now, ultrashort laser pulse generator 101 are used to produce femtosecond ultrashort laser pulse, and femtosecond is surpassed
Short laser pulse is exported to aperture-variable diaphragm 107, wherein, the input variable aperture light of femtosecond ultrashort laser pulse unit interval
The number control of the light pulse of door screen 107 is presetting threshold value；Aperture-variable diaphragm 107 is used for will regulation ultrashort laser pulse hair
The big as low as required first spot diameter value for the spot diameter that raw device 101 is inputted, and by the pulsed laser output after regulation
To Amici prism 110；It is first laser beam and second laser that Amici prism 110, which is used for the ultrashort laser pulse beam splitting after regulation,
Beam, and first laser beam, second laser beam are exported to Gauss laser pulse generating means 103, loop laser pulse life respectively
Into device 104.
Gauss laser pulse generating means 103 are used to adjusting the power of first laser beam, and collimate first laser beam and
The spot size of first laser beam is adjusted to reach required second spot diameter value, then by the first laser beam after regulation
Delay is carried out so as to generate Gauss laser pulse, and is exported to laser pulse synthesizer 105.
Specifically, as shown in figure 3, in the present embodiment, Gauss laser pulse generating means 103 are controlled including the first light energy
Component 111, first are looked in the distance the three-dimensional Micro-displacement Driving platform 114 of mirror assembly 112, the second control terminal 113, first, right-angle prism
115, the second control terminal 113 is electrically connected with the first three-dimensional Micro-displacement Driving platform 114, and right-angle prism 115 is installed on the one or three
Micro-displacement Driving platform 114 is tieed up, the first light energy control assembly 111 is used for the first laser beam for receiving the input of Amici prism 110
And adjust the power of first laser beam, and first laser beam is exported to first looked in the distance mirror assembly 112；First looks in the distance mirror assembly
112 are used to collimate first laser beam and adjust the spot size of first laser beam to reach required second spot diameter
Value, and the first laser beam after regulation is exported to right-angle prism 115；Second control terminal 113 is used to control the first three-dimensional micro-
Displacement drive platform 114 drives right-angle prism 115 to be subjected to displacement, by the presetting times of the first laser Shu Yanchi after regulation
And Gauss laser pulse is generated, and the first laser beam after delay is exported to laser pulse synthesizer 105.
Specifically, in the present embodiment, the first energy hole component is neutral density filter group and the collection of variable optical attenuation piece
Close, of course, the first energy hole component can also be combined or variable optical attenuator for half-wave plate with polarizer, not limited herein
System；First looks in the distance mirror assembly 112 including convex lens and concavees lens, and focal length of convex lens is 400mm, and Concave Mirrors Focus is negative 200mm,
The right side focus of convex lens and concavees lens, which is overlapped, to be constituted first and looks in the distance mirror assembly 112, the first three-dimensional Micro-displacement Driving platform 114
Adjustable range is ± 25mm, and Adjustment precision is 1um；A 800nm medium is placed with the reflected beam path of right-angle prism 115
Speculum 125, for first laser beam to be reflected into laser pulse synthesizer 105.
Loop laser pulse generation device 104 is used to adjusting the power of second laser beam, and collimate second laser beam and
The spot size of second laser beam is adjusted to reach required 3rd spot diameter value, then by the second laser beam after regulation
Loop laser pulse is adjusted to, then prefocus is carried out to loop laser pulse, and is exported to laser pulse synthesizer 105.
Specifically, as shown in figure 4, in the present embodiment, loop laser pulse generation device 104 is controlled including the second light energy
Component 116, second are looked in the distance mirror assembly 117, loop laser impulse modulation component 118 and one-dimensional convex lens 119.Second light energy
Control assembly 116 is used to receive the second laser beam of the input of Amici prism 110 and adjusts the power of second laser beam, and by second
Laser beam is exported to second and looked in the distance mirror assembly 117；Second looks in the distance mirror assembly 117 for collimating second laser beam and regulation second
The spot size of laser beam is exported the second laser beam after regulation to annular with reaching required 3rd spot diameter value
Laser pulse modulator component 118；Loop laser impulse modulation component 118 is used to the second laser beam after regulation being adjusted to annular
Laser pulse；One-dimensional convex lens 119 are used to carry out prefocus to loop laser pulse, and by the loop laser pulse after prefocus
Export to laser pulse synthesizer 105.
In the present embodiment, the second light energy control assembly is the set of neutral density filter group and variable optical attenuation piece, when
So, the second light energy control assembly can also be combined or variable optical attenuator for half-wave plate with polarizer, be not limited herein；
Second looks in the distance mirror assembly 117 also including convex lens and concavees lens, and focal length of convex lens is 400mm, and Concave Mirrors Focus is negative 200mm,
The right side focus of convex lens and concavees lens, which is overlapped, to be constituted first and looks in the distance mirror assembly 112；Loop laser impulse modulation component 118 is used
Axicon lens, axicon lens is installed on the two-dimensional micro-displacement adjusted manually a driving platform, and second laser beam is perpendicular to the plane of axicon lens
Surface output, loop laser pulse generation device 104 constitute light arm optical axis and the optical axis coincidence of axicon lens；Of course, ring
Shape Laser pulse modulator component 118 can also use second space optical modulator, now, and the second control terminal 113 is additionally operable to control
Second laser beam is modulated to loop laser pulse by second space optical modulator processed.Two-dimensional micro-displacement drives platform along x and y-axis side
It is 5um/step to displacement accuracy, the cone-apex angle of axicon lens is 179 degree, and loop laser pulse generation device 104 also includes two
Dielectric mirror 125, two dielectric mirrors 125 are used to from axicon lens reflect second laser beam into one-dimensional convex lens 119, one-dimensional
The focal length of convex lens 119 is 400mm, and one-dimensional convex lens 119 are installed on that to be fixed on a manual one-dimensional micro-displacement motion flat
Platform, one-dimensional micro-displacement does exercises direction of propagation adjustable range of the platform along light for ± 25mm, and Adjustment precision is 1um.
It is preferred that loop laser pulse generation device 104 also includes the second control terminal 113 and the first space light modulation
Device 121, the second control terminal 113 is electrically connected with the first spatial light modulator 121.First spatial light modulator 121 is used to receive
The second laser beam of second light energy control assembly 116 input；Second control terminal 113 is used to control the first spatial light modulator
121 pairs of second laser beams are modulated the Energy distribution homogenization so that second laser beam；First spatial light modulator 121 is also used
Second laser beam after by modulation is exported to second and looked in the distance mirror assembly 117.
The light that the light arm that Gauss laser pulse generating means 103 are constituted is constituted with loop laser pulse generation device 104
The optical path difference of arm is in presetting threshold range, in the present embodiment, and optical path difference is 36 μm；The laser arteries and veins that second laser beam is included
The time delayses for rushing the laser pulse included relative to first laser beam are 120fs, wherein, delay zero point is true by interference fringe
It is fixed.Laser pulse synthesizer 105 is used to carry out closing Shu Shengcheng mixing ultrashort lasers by Gauss laser pulse, loop laser pulse
Pulse, and the mixing ultrashort laser pulse closed after beam is focused so as to generate mixing ultrashort laser pulse, and by after focusing
Mixing ultrashort laser pulse get to a metal or alloy product to be detected, and the ring-shaped light spot of the second laser beam after focusing on
Center loop wire diameter and focusing after first laser beam formation Gaussian spot center loop wire diameter ratio be more than 1.
Specifically, as shown in figure 5, in the present embodiment, laser pulse synthesizer 105 includes light-combining prism 136, laser work(
Rate meter 137 and focal length microcobjective 120, light-combining prism 136 are used to Gauss laser pulse, loop laser pulse carrying out conjunction beam
Generation mixing ultrashort laser pulse, and the mixing ultrashort laser pulse closed after beam is exported to laser power meter 137, laser power
Meter 137 is used to detect the power for closing the laser pulse after beam, and power meter measurement accuracy is less than 1nW, and measurement range is more than 1W, blocked
The laser power of measurable second laser pulse, blocks loop laser during the light arm that Gauss laser pulse generating means 103 are constituted
The laser power of measurable Gaussian spot during the light arm that pulse generation device 104 is constituted.
Focal length microcobjective 120 is installed on a manual two-dimension displacement driving platform, and focal length microcobjective 120 is used to receive
Through the laser pulse of laser power meter 137, and laser pulse is focused so as to generate mixing ultrashort laser pulse, and incited somebody to action
The ring for the second laser beam that mixing ultrashort laser pulse after focusing is got to after a metal or alloy product to be detected, and focusing
The diameter ratio of the center loop wire of the Gaussian spot of first laser beam formation after the diameter of the center loop wire of shape hot spot and focusing
More than 1, for example, focus on after second laser beam ring-shaped light spot center loop wire diameter and focusing after first laser beam shape
Into the diameter ratio of center loop wire of Gaussian spot be 1.5, drive platform and focal length micro- by adjusting manual two-dimension displacement
Position of the object lens 120 along z-axis so that obtain front 50um of the Gaussian spot focus in the focus of ring-shaped light spot, and loop laser arteries and veins
The spot diameter of punching and the spot diameter of Gauss laser pulse are respectively less than the geometry aperture of focal length microcobjective 120.
In addition, metal or alloy product microcellular processing systems also include：
Hot spot image checking and adjusting apparatus 106, for gathering mixing ultrashort laser pulse in metal or alloy product table
The hot spot that face is formed and judges in the image of plane residing for the surface to be detected of metal or alloy product according to the image that collects
Whether second laser beam after focusing is default in the Rayleigh range of the ring-shaped light spot on the surface to be detected of metal or alloy product
The first fixed length threshold and ring-shaped light spot whether in the first presetting focal position and first laser beam in metal or conjunction
Whether the Rayleigh range of the Gaussian spot on the surface to be detected of golden product is the second presetting length threshold and Gaussian spot is
It is no in the second presetting focal position, if it is not, then to the second laser beam after focusing in the to be checked of metal or alloy product
The Rayleigh range of ring-shaped light spot on survey surface and the first focal position of ring-shaped light spot and second laser beam are in metal or alloy
The Rayleigh range of the Gaussian spot on the surface to be detected of product and the second focal position of Gaussian spot, until second after focusing
Laser beam is the first presetting length threshold in the Rayleigh range of the ring-shaped light spot on the surface to be detected of metal or alloy product
And ring-shaped light spot in the first presetting focal position and first laser beam on the surface to be detected of metal or alloy product
The Rayleigh range of Gaussian spot is presetting the second length threshold and Gaussian spot in the second presetting focal position.
Specifically, as shown in fig. 6, hot spot image checking is controlled with adjusting apparatus 106 including image capture module the 122, the 3rd
The three-dimensional Micro-displacement Driving platform 124 of terminal processed 123, second, the 3rd control terminal 123 respectively with image capture module 122, second
Three-dimensional Micro-displacement Driving platform 124 is electrically connected.Image capture module 122 is used to gather mixing ultrashort laser pulse in metal or conjunction
Image of the hot spot of golden product surface formation in plane residing for the surface to be detected of metal or alloy product.3rd control terminal
123 are used to judge ring of the second laser beam after focusing on the surface to be detected of metal or alloy product according to the image collected
Whether whether the Rayleigh range of shape hot spot be the first presetting length threshold and ring-shaped light spot in presetting the first focus position
Put and whether first laser beam in the Rayleigh range of the Gaussian spot on the surface to be detected of metal or alloy product is presetting
The second length threshold and Gaussian spot whether in the second presetting focal position, if it is not, then the three-dimensional microbit of control second
Move driving platform 124 move so that second laser beam after focusing on the surface to be detected of metal or alloy product ring-shaped light spot
Rayleigh range for presetting the first length threshold and Gaussian spot in the first presetting focal position and first laser
Beam is presetting the second length threshold and height in the Rayleigh range of the Gaussian spot on the surface to be detected of metal or alloy product
This hot spot is in the second presetting focal position.
In the present embodiment, metal or alloy product to be detected is installed on the second three-dimensional Micro-displacement Driving platform 124, by the
The Rayleigh that the controllable second three-dimensional micro-displacement platform of three control terminals 123 metal or alloy product to be detected is in ring-shaped light spot is long
Spend front position, and first laser beam the surface to be detected of metal or alloy product Gaussian spot presetting first
The ring-shaped light spot of focal position and second laser beam on the surface to be detected of metal or alloy product is burnt presetting second
Point position.In addition, the spatial resolution of image collecting device is less than 2um；Metal or alloy product to be detected is that 304# is stainless
Steel plate 126, thickness can be 0.300mm or 0.400mm or 0.500mm, surface roughness Ra<100nm.
The operating process of the metal or alloy product microcellular processing systems can be as follows：
Adjustment first laser pulse (i.e. Gauss laser pulse 135), second laser pulse (i.e. loop laser pulse 132) make
Be in conllinear transmission state, i.e., positioned at micropore center line axis 127, and ensure Gauss laser pulse 135 and loop laser pulse
132 spot center is overlapped and overlapped with laser center axis；Again by the micropore center line axis 127 and laser in the required hole beaten
Heart axis trimming is to coincidence status, it is ensured that the region surface to be punctured of stainless steel plate 126 is perpendicular to laser center axis.
The laser parameter of Gauss laser pulse 135 and loop laser pulse 132 is set again, make Gauss laser pulse 135 with
Loop laser pulse 132 meets processing request；Wherein, the laser parameter of Gauss laser pulse 135 include single-pulse laser energy,
Pulse width, pulse recurrence frequency, laser center wavelength, focal spot size and laser defocusing amount；In the present embodiment, gauss laser arteries and veins
The single-pulse laser energy of punching 135 is less than 10mJ, preferably such as 0.01~1mJ；Pulse width (FWHM) is less than 10ps, for example
It is preferably but not limited to as 10~200fs；Repetition rate is less than 10kHz, for example, be preferably but not limited to as 1kHz, 2kHz；In laser
Cardiac wave length is less than 1.5 μm, for example, be preferably but not limited to as 1.064 μm, 0.8 μm and 0.79 μm；Focused spot diameter after focusing is less than
25 μm, for example, it is preferably but not limited to as 2~10 μm；Focal spot after focusing is less than relative to the defocusing amount on the surface of stainless steel plate 126
± 100 μm, for example, it is preferably but not limited to as -50 μm~0 μm.
The parameter of loop laser pulse 132 is included in single-pulse laser energy, pulse width, pulse recurrence frequency, laser
Cardiac wave length, focal spot size and laser defocusing amount, loop laser pulse 132 relative to Gauss laser pulse 135 time delay；This
In embodiment, the single-pulse laser energy of loop laser pulse 132 is less than 10mJ, 0.01~1mJ of representative value；Pulse width
(FWHM) it is less than 10ps, for example, is preferably but not limited to as 10~200fs；Repetition rate is less than 10kHz, for example, be preferably but not limited to
For 1kHz, 2kHz；Laser center wavelength be less than 1.5 μm, be for example preferably but not limited to for 1.064 μm, 0.8 μm, 0.79 μm,
0.532μm、0.4μm、0.395μm；The interior diameter of focal spot annulus after focusing is slightly less than or equal to 25 μm, for example preferably but do not limit
Yu Wei, 2~10 μm, the overall diameter of the focal spot annulus after focusing is less than 50 μm, for example, be preferably but not limited to as 5~25 μm,；Focus on
Focal spot afterwards is less than ± 100 μm relative to the defocusing amount on the surface of stainless steel plate 126, for example, be preferably but not limited to as -25 μm~0 μ
m；Loop laser pulse 132 relative to Gauss laser pulse 135 time delay be less than Gauss laser pulse 135 produced by etc.
Ion body life time, the pulsewidth for being preferably but not limited to the ultrashort laser pulse 1 for 1 times~100 times of time delay.
As shown in fig. 7, the operation principle that the metal or alloy product microcellular processing systems are processed to stainless steel plate 126
It is as follows：
The Gauss laser pulse 135 for including the mixing ultrashort laser pulse of generation is irradiated to the preceding surface of stainless steel plate 126
Or previously in the micropore that has produced (the present embodiment to be illustrated in the micropore that had previously produced), so that stainless steel
The micropore of plate 126 produces Primary plasma, Primary plasma include dense plasma, critical plasma density face and
Close plasma is owed, the micropore that preceding surface has been produced refers to get in the pulse for irradiating first pre irradiation in punching using multiple-pulse
Micropore.
The central area for the loop laser pulse 132 that mixing ultrashort laser pulse is included can avoid dense plasma region
134 " plasma somascope " effect, reduces reflection and the scattering energy loss of the annular laser pulse 132 of delay；Owe close plasma
Body region 131 can realize the process of energy injection first of loop laser pulse 132；Simultaneously based on the grade of critical density surface 133 from
Daughter wave transfer characteristic, the energy that can realize loop laser pulse 132 using the interface for owing close plasma and workpiece material is noted
Enter the second process, so as to improve the energy injection efficiency of loop laser pulse 132, while again produce plasma and
Backward shock wave 129, it is super along mixing that the backward shock wave 129 that the plasma produced again is produced accelerates Primary plasma
The opposite direction discharge of short laser pulse output；Simultaneously first plasma has been got through using the central area of loop laser pulse 132
The discharge-channel of body, so as to improve the discharge efficiency of material；
It can further deepen the depth of micropore using the forward direction shock wave 128 of the plasma and its generation that produce again,
So as to improve utilization ratio of laser energy, follow-up mixing ultrashort laser pulse repeats said process, needed for hole depth reaches
Limit depth or depth requirements, so as to realize the micropore depth pole that only changes and can be reached under conditions of ultrashort laser pulse number
Limit.
In summary, the metal or alloy product microcellular processing systems that the present invention is provided, when mixing ultrashort laser pulse is pressed
Time delay vertical output to metal or alloy product surface to be detected when, can be by more energy injections to be detected
The micropore bottom that surface is formed, can produce secondary plasma 130 at micropore bottom position, so be conducive to the intensification of micropore, from
And improve hole depth and reach required limit depth or depth requirements；First laser beam arrives first at surface Implantation Energy to be detected
Primary plasma is produced, after Primary plasma generation and within this period before Primary plasma disappearance, this
Shi Yanchi second laser beam reaches surface to be detected, and it is real that now loop laser pulse 132 penetrates and crossed Primary plasma
Existing second energy injection simultaneously produces secondary plasma 130 in micropore bottom, is injected by the loop laser pulse 132 of delay
Energy, middle hollow area is more beneficial for the formation of Primary plasma passing away；The secondary plasma 130 of localization
The backward shock wave 129 produced can accelerate the quick drain of Primary plasma, reduce the drain time of Primary plasma,
Reduce the residue in Primary plasma discharge process, improve the smooth degree of the hole wall of micropore, localization it is secondary
The forward direction shock wave 128 that plasma 130 is produced can further deepen micropore depth；It is real that small energy pulse laser is carried out in two times
Existing energy injection, the big energy pulse laser of single than identical gross energy is more beneficial for the reduction of micropore caliber size, drops simultaneously
After the low possibility cracked, and the diameter of the center loop wire of the ring-shaped light spot of second laser beam after focusing on and focusing
First laser beam formation Gaussian spot center loop wire diameter ratio be more than 1, the injection efficiency of laser energy can be improved.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of metal or alloy product microcellular processing systems, it is characterised in that the metal or alloy Product processing system bag
Include ultrashort laser pulse generator, laser state adjusting apparatus, Gauss laser pulse generating means, loop laser pulse generation dress
Put and laser pulse synthesizer,
The ultrashort laser pulse generator is used to produce ultrashort laser pulse, and ultrashort laser pulse is exported to the laser
State adjusting device；
The ultrashort laser pulse that the laser state adjusting apparatus is used to adjust the ultrashort laser pulse generator input is included
Spot diameter big as low as required first spot diameter value, and be first to swash by the ultrashort laser pulse beam splitting after regulation
Light beam and second laser beam, and by first laser beam, second laser beam export respectively to the Gauss laser pulse generating means,
The loop laser pulse generation device, wherein, first laser beam, the number of the light pulse of second laser beam unit interval are pre-
The threshold value of setting；
Constituted described in the light arm and the loop laser pulse generation device that the Gauss laser pulse generating means are constituted
The optical path difference of light arm is in presetting threshold range, and the Gauss laser pulse generating means are used to adjust first laser beam
Power, and collimate first laser beam and adjust the spot size of first laser beam to reach required second spot diameter
Value, then by the first laser Shu Jinhang delays after regulation so as to generate Gauss laser pulse, and is exported to the laser pulse
Synthesizer；
The loop laser pulse generation device is used for the power for adjusting second laser beam, and collimates second laser beam and regulation
Then the spot size of second laser beam is adjusted the second laser beam after regulation with reaching required 3rd spot diameter value
For loop laser pulse, then prefocus is carried out to loop laser pulse, and exported to the laser pulse synthesizer；
The laser pulse synthesizer is used to Gauss laser pulse, loop laser pulse progress conjunction Shu Shengcheng mixing ultrashort sharp
Light pulse, and the mixing ultrashort laser pulse closed after beam is focused, and the mixing ultrashort laser pulse after focusing is got to
One metal or alloy product to be detected.
2. metal or alloy product microcellular processing systems according to claim 1, it is characterised in that the laser state is adjusted
Engagement positions include aperture-variable diaphragm, optical shutter, the first control terminal and Amici prism, first control terminal and institute
Optical shutter electrical connection is stated,
The aperture-variable diaphragm is used for include the ultrashort laser pulse for adjusting the ultrashort laser pulse generator input
The big as low as required first spot diameter value of spot diameter, and the ultrashort laser pulse after regulation is exported to described respectively
Optical shutter；
First control terminal is used to control the optical shutter to open every presetting time, so that by the unit interval
The number control for inputting the light pulse of the Amici prism is presetting threshold value；
It is first laser beam and second laser that the Amici prism, which is used for by the ultrashort laser pulse beam splitting of the optical shutter,
Beam, and first laser beam, second laser beam are exported to the Gauss laser pulse generating means, the loop laser arteries and veins respectively
Rush generating means.
3. metal or alloy product microcellular processing systems according to claim 1, it is characterised in that the laser state is adjusted
Engagement positions include aperture-variable diaphragm and Amici prism,
The ultrashort laser pulse generator is used to produce ultrashort laser pulse, and ultrashort laser pulse is exported to described variable
Aperture diaphragm, wherein, the individual numerical control of the light pulse of the input aperture-variable diaphragm of the ultrashort laser pulse unit interval
It is made as presetting threshold value；
The aperture-variable diaphragm is used for include the ultrashort laser pulse for adjusting the ultrashort laser pulse generator input
The big as low as required first spot diameter value of spot diameter, and by the pulsed laser output after regulation to the light splitting rib
Mirror；
It is first laser beam and second laser beam that the Amici prism, which is used for the ultrashort laser pulse beam splitting after regulation, and by the
One laser beam, second laser beam are exported to the Gauss laser pulse generating means, loop laser pulse generation dress respectively
Put.
4. metal or alloy product microcellular processing systems according to claim 1, it is characterised in that the gauss laser arteries and veins
Generating means are rushed to drive including look in the distance mirror assembly, the second control terminal, the first three-dimensional micro-displacement of the first light energy control assembly, first
Moving platform, right-angle prism, second control terminal are electrically connected with the described first three-dimensional Micro-displacement Driving platform, the right-angled edge
Mirror is installed on the described first three-dimensional Micro-displacement Driving platform,
The first light energy control assembly is used to receive the first laser beam of the laser state adjusting apparatus input and adjusted
The power of first laser beam, and first laser beam is exported to described first looked in the distance mirror assembly；
Described first looks in the distance mirror assembly for collimating first laser beam and adjusting the spot size of first laser beam to reach
Second spot diameter value of demand, and the first laser beam after regulation is exported to the right-angle prism；
Second control terminal is used to control the described first three-dimensional Micro-displacement Driving platform to drive the right-angle prism to occur position
Move, by the time presetting the first laser Shu Yanchi after regulation and generate Gauss laser pulse, and by first after delay
Laser beam is exported to the laser pulse synthesizer.
5. metal or alloy product microcellular processing systems according to claim 1, it is characterised in that the loop laser arteries and veins
Generating means are rushed to look in the distance mirror assembly, loop laser impulse modulation component and one-dimensional including the second light energy control assembly, second
Convex lens,
The second light energy control assembly is used to receive the second laser beam of the laser state adjusting apparatus input and adjusted
The power of second laser beam, and second laser beam is exported to described second looked in the distance mirror assembly；
Described second looks in the distance mirror assembly for collimating second laser beam and adjusting the spot size of second laser beam to reach
3rd spot diameter value of demand, and the second laser beam after regulation is exported to the loop laser impulse modulation component；
The loop laser impulse modulation component is used to the second laser beam after regulation being adjusted to loop laser pulse；
The one-dimensional convex lens are used to carry out loop laser pulse prefocus, and the loop laser pulse after prefocus is exported
To the laser pulse synthesizer.
6. metal or alloy product microcellular processing systems according to claim 5, it is characterised in that the loop laser arteries and veins
Rushing generating means also includes the second control terminal and the first spatial light modulator, and second control terminal is empty with described first
Between optical modulator electrically connect,
First spatial light modulator is used for the second laser beam for receiving the second light energy control assembly input；
Second control terminal is used to control first spatial light modulator to be modulated second laser beam so that second
The Energy distribution homogenization of laser beam；
First spatial light modulator is additionally operable to export the second laser beam after modulation to described second and looked in the distance mirror assembly.
7. metal or alloy product microcellular processing systems according to claim 6, it is characterised in that the loop laser arteries and veins
Modulated component is axicon lens, and the surface of plane of the second laser beam perpendicular to the axicon lens is exported, the loop laser
The optical axis for the light arm that pulse generation device is constituted and the optical axis coincidence of the axicon lens；
Or the loop laser impulse modulation component is second space optical modulator, second control terminal is additionally operable to control institute
State second space optical modulator and the second laser beam is modulated to loop laser pulse.
8. metal or alloy product microcellular processing systems according to claim 5, it is characterised in that
The second light energy control assembly is that half-wave plate is combined or variable optical attenuator or neutral density filter group with polarizer
With the set of variable optical attenuation piece.
9. metal or alloy product microcellular processing systems according to claim 1, it is characterised in that the metal or alloy
Product microcellular processing systems also include：
Hot spot image checking and adjusting apparatus, are formed for gathering mixing ultrashort laser pulse in metal or alloy product surface
Hot spot and is judged after focusing in the image of plane residing for the surface to be detected of metal or alloy product according to the image that collects
Whether second laser beam is presetting first in the Rayleigh range of the ring-shaped light spot on the surface to be detected of metal or alloy product
Length threshold and ring-shaped light spot whether in the first presetting focal position and first laser beam in metal or alloy product
Whether the Rayleigh range of the Gaussian spot on surface to be detected is the second presetting length threshold and whether Gaussian spot is being preset
The second fixed focal position, if it is not, then the second laser beam after adjustment focusing is on the surface to be detected of metal or alloy product
The Rayleigh range of ring-shaped light spot and the first focal position of ring-shaped light spot and first laser beam in metal or alloy product
The Rayleigh range of the Gaussian spot on surface to be detected and the second focal position of Gaussian spot, until the second laser beam after focusing
It is presetting the first length threshold and annular in the Rayleigh range of the ring-shaped light spot on the surface to be detected of metal or alloy product
Hot spot the first presetting focal position and first laser beam the surface to be detected of metal or alloy product Gauss light
The Rayleigh range of spot is presetting the second length threshold and Gaussian spot in the second presetting focal position.
10. metal or alloy product microcellular processing systems according to claim 9, it is characterised in that the hot spot imaging
Detection includes image capture module, the 3rd control terminal, the second three-dimensional Micro-displacement Driving platform, the 3rd control with adjusting apparatus
Terminal processed is electrically connected with described image acquisition module, the described second three-dimensional Micro-displacement Driving platform respectively,
Described image acquisition module is used for collection mixing ultrashort laser pulse and existed in the hot spot that metal or alloy product surface is formed
The image of plane residing for the surface to be detected of metal or alloy product；
3rd control terminal is used to judge that the second laser beam after focusing on is produced in metal or alloy according to the image collected
The Rayleigh range of the ring-shaped light spot on the surface to be detected of product whether be the first presetting length threshold and ring-shaped light spot whether
The Gaussian spot on to be detected surface of presetting the first focal position and first laser beam in metal or alloy product it is auspicious
Sharp length whether be the second presetting length threshold and Gaussian spot whether in the second presetting focal position, if not,
The described second three-dimensional Micro-displacement Driving platform is then controlled to move so that the second laser beam after focusing on is in metal or alloy product
The Rayleigh range of the ring-shaped light spot on surface to be detected is presetting the first length threshold and ring-shaped light spot presetting first
Focal position and first laser beam are default in the Rayleigh range of the Gaussian spot on the surface to be detected of metal or alloy product
The second fixed length threshold and Gaussian spot is in the second presetting focal position.
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| CN109648193A (en) * | 2019-01-24 | 2019-04-19 | 西安中科微精光子制造科技有限公司 | A kind of laser hole punched device and method |
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