CN107022336A - A kind of organosilicon adhesive of modification and preparation method thereof - Google Patents
A kind of organosilicon adhesive of modification and preparation method thereof Download PDFInfo
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- CN107022336A CN107022336A CN201710227721.XA CN201710227721A CN107022336A CN 107022336 A CN107022336 A CN 107022336A CN 201710227721 A CN201710227721 A CN 201710227721A CN 107022336 A CN107022336 A CN 107022336A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to technical field of polymer materials, organosilicon adhesive of a kind of modification and preparation method thereof is disclosed.Organosilicon adhesive provided by the present invention includes following components in parts by weight：1~2 part of 15~20 parts of aminated compounds, 20~25 parts of epoxy resin compound, 20~30 parts of polysiloxane, 2~4 parts of toughener, 0.001~0.005 part of platinum catalyst and curing agent.This kind of modified organosilicon adhesive is simultaneously comprising aminated compounds component and epoxy resin compound component, with epoxy resin compound addition reaction occurs for aminated compounds, epoxy resin compound is modified, so that the adhesive after solidification not only has very high adhesion strength, also there is preferably heat endurance simultaneously, the industries such as Aero-Space, ship, automobile, electronic product, building are can be widely applied to.
Description
Technical field
The present invention relates to technical field of polymer materials, the organosilicon adhesive of more particularly to a kind of modification and its preparation side
Method.
Background technology
In the 1950s, with military development, the structural member of aircraft, guided missile, spaceship etc. is required to can be
The adhesive of long-term work under high temperature loading environment.The need for meeting aviation and electronics industry, many scientific research personnel open
Begin to develop high-temperature Resistance Adhesives.The heat-resisting quantity of adhesive is according to can keep setting in specific temperature, time and medium
Count desired glue-joint strength or evaluated with certain strength retention, i.e., high-temperature Resistance Adhesives must be fulfilled for it is following will
Ask：1) thermal weight loss temperature height, heat distortion temperature and decomposition temperature are high, there is good ermal physics and thermochemical property；2) higher
Under the condition of work of temperature, there are a preferable physical and mechanical properties and higher adhesive strength, and interior holding can be asked when defined
Such a performance；3) good processing characteristics；4) heat resistance under temperature cycle change is preferable, and can bear height in a short time
The test of temperature.
Organosilicon adhesive is widely used in Aero-Space, ship, vapour with its excellent gluing performance and resistance to elevated temperatures
The industries such as car, electronic product, building.As other adhesive, organosilicon adhesive bonding adherend will reach good glue
Connect effect, it is necessary to possess two conditions：First, adhesive can will well soak adherend surface；Secondly, adhesive is with being glued
There is the stronger power that be combined with each other between thing.In the preparation of existing organosilicon adhesive, exist in bonding process and be also easy to produce
The shortcomings of bubble and resistance to extreme temperature (high temperature, low temperature) poor performance, existing organosilicon adhesive is caused seldom to be provided simultaneously with excellent
Gluing performance, high-fire resistance energy.
The content of the invention
It is an object of the invention to possess excellent gluing performance and height there is provided a kind of for above-mentioned the deficiencies in the prior art
The organosilicon adhesive of the modification of heat resistance.
Another object of the present invention is to the preparation method for the organosilicon adhesive for providing above-mentioned modification.
In order to solve the above technical problems, embodiments of the present invention provide a kind of organosilicon adhesive of modification, with weight
Measure part meter and include following components：15~20 parts of aminated compounds, 20~25 parts of epoxy resin compound, polysiloxane 20
1~2 part of~30 parts, 2~4 parts of toughener, 0.001~0.005 part of platinum catalyst and curing agent.
It is relative to prior art, the characteristics of the organosilicon adhesive for the modification that embodiments of the present invention are provided,
Contain aminated compounds component and epoxy resin compound component simultaneously.It is used as the material component of organosilicon adhesive, ring
Oxygen tree fat shrinkage factor is low, adhesive strength is high, excellent electrical property, but the resistance to elevated temperatures of solidified after-product is poor, not in high temperature
Used in environment, it is therefore desirable to it is modified to strengthen its heat endurance.Thus embodiments of the present invention are added simultaneously
With epoxy resin compound addition reaction can occur for aminated compounds, aminated compounds, well modified epoxy
Class compound so that the adhesive after solidification not only has very high adhesion strength, while also having higher heat endurance.By
There is excellent gluing performance, high-fire resistance energy in this kind of modified organosilicon adhesive, can be widely applied to Aero-Space,
The industries such as ship, automobile, electronic product, building.
Preferably, in the organosilicon adhesive for the modification that embodiments of the present invention are provided, the amine chemical combination added
Thing is benzimidazole.Contained phenyl ring and nitrogen-atoms make it show good heat resistance in benzimidazole molecular structure, but
It is almost without cohesive force；And exactly good toughness, adhesion strength are high for epoxy resin compound, but heat resistance it is not good one
Class material, the addition of benzimidazole adds the content of phenyl ring in organosilicon adhesive system, improve system heat resistance and
Toughness.During benzimidazole and epoxy resin hybrid reaction, with epoxy resin addition reaction occurs for benzimidazole, so that
Substantially increase the gluing performance of epoxy resin so that the organosilicon adhesive of the modification finally obtained has been provided simultaneously with excellent
Gluing performance, high-fire resistance energy.
Preferably, in the organosilicon adhesive for the modification that embodiments of the present invention are provided, the epoxy resin added
Class compound is glycidyl ether type epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, line style
Aliphatic category epoxy resin or alicyclic based epoxy resin.Wherein, glycidyl ether type epoxy resin and glycidol esters ring
Oxygen tree fat has following features：Viscosity is low, uses good manufacturability；Reactivity is high；Bonding force is higher than general purpose epoxy resin, solidification
Thing mechanical property is good；Electrical insulating property is good；Against weather is good, and has good resistance to ultralow warm nature, under condition of ultralow temperature, still
With the adhesion strength higher than other type of epoxy resin.Glycidyl amine epoxy resin has superior cementability and heat-resisting
Property.The characteristics of cycloaliphatic epoxy resin is that have higher compression and tension intensity, puts cruelly remain to protect under the high temperature conditions for a long time
Good mechanical property is held, arc resistance, resistance to UV aging energy and against weather are preferable.
Further, in the organosilicon adhesive for the modification that embodiments of the present invention are provided, polysiloxane
Molecular formula isIn formula：R1For C1-10Saturated alkane base, Y is C1-5Alkylidene, m is
Integer, and m >=10, n is 0 or 1.
It is further preferred that in the organosilicon adhesive for the modification that embodiments of the present invention are provided, toughener is carboxylic
Base LNBR, polysulfide rubber, liquid silastic, polyethers, polysulfones, nano-calcium carbonate or nano titanium oxide；Platinum catalysis
Agent is chloroplatinic acid tetramethyl divinyl disiloxane complex compound；Curing agent is diamino diphenyl sulfone.
Embodiments of the present invention also provide the preparation method of the organosilicon adhesive of above-mentioned modification, and step is as follows：With weight
Amount part meter is weighed：15~20 parts of aminated compounds, 20~25 parts of epoxy resin compound, 20~30 parts of polysiloxane,
0.001~0.005 part of 2~4 parts of toughener and platinum catalyst, add in reaction unit under inert gas shield, are added after stirring
1~2 part of curing agent, is heated to 30~60 DEG C, continues to stir 20~30 minutes, is cooled to room temperature, obtains colourless transparent liquid, subtract
Bubble is removed in pressure-off, and be heating and curing heating 10~30 minutes at 20~40 DEG C, that is, the organosilicon adhesive of the modification is made.
Embodiment
Preparation method (the following embodiment of the organosilicon adhesive of the present invention is illustrated below by way of embodiment is prepared
In, various raw materials are 1 gram per mass parts).
Embodiment 1
Weigh 16 parts of benzimidazole, 23 parts of epoxy resin compound benzenediol type epoxy resin, polysiloxane25 parts, 3 parts of toughener polysulfide rubber, platinum catalyst chloroplatinic acid tetramethyl
0.002 part of divinyl disiloxane complex compound, adds in reaction unit under inert gas shielding, curing agent is added after stirring
1.6 parts of diamino diphenyl sulfone, is heated to 40 DEG C, continues to stir 20 minutes, is cooled to room temperature, obtains colourless transparent liquid, subtract
Bubble is removed in pressure-off, and be heating and curing heating 10 minutes at 30 DEG C, that is, organosilicon adhesive is made.
Embodiment 2
Weigh 16 parts of benzimidazole, 21 parts of epoxy resin compound bisphenol-A type epoxy resin, polysiloxane25 parts, 3 parts of toughener polysulfide rubber, platinum catalyst chloroplatinic acid tetramethyl
0.002 part of divinyl disiloxane complex compound, adds in reaction unit under inert gas shielding, curing agent is added after stirring
1.5 parts of diamino diphenyl sulfone, is heated to 40 DEG C, continues to stir 20 minutes, is cooled to room temperature, obtains colourless transparent liquid, subtract
Bubble is removed in pressure-off, and be heating and curing heating 10 minutes at 30 DEG C, that is, organosilicon adhesive is made.
Embodiment 3
Weigh 16 parts of benzimidazole, 23 parts of epoxy resin compound benzenediol type epoxy resin, polysiloxane25 parts, 3 parts of toughener liquid silastic, platinum catalyst chloroplatinic acid tetramethyl
0.002 part of base divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, and solidification is added after stirring
1.7 parts of agent diamino diphenyl sulfone, is heated to 40 DEG C, continues to stir 20 minutes, is cooled to room temperature, obtains colourless transparent liquid,
Bubble is sloughed in decompression, and be heating and curing heating 10 minutes at 30 DEG C, that is, organosilicon adhesive is made.
Embodiment 4
Weigh 18 parts of benzimidazole, 20 parts of epoxy resin compound alkene bisphenol F type epoxy tree, polysiloxane20 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine platinum
Sour 0.003 part of tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, is added after stirring
Enter 1.0 parts of curing agent diamino diphenyl sulfone, be heated to 40 DEG C, continue to stir 25 minutes, be cooled to room temperature, obtain water white transparency
Bubble is sloughed in liquid, decompression, and be heating and curing heating 15 minutes at 20 DEG C, that is, organosilicon adhesive is made.
Embodiment 5
Weigh 18 parts of benzimidazole, 20 parts of epoxy resin compound benzenediol type epoxy resin, polysiloxane20 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine platinum
Sour 0.003 part of tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, is added after stirring
Enter 1.5 parts of curing agent diamino diphenyl sulfone, be heated to 40 DEG C, continue to stir 25 minutes, be cooled to room temperature, obtain water white transparency
Bubble is sloughed in liquid, decompression, and be heating and curing heating 15 minutes at 20 DEG C, that is, organosilicon adhesive is made.
Embodiment 6
Weigh 18 parts of benzimidazole, 20 parts of epoxy resin compound alkene bisphenol f type epoxy resin, polysiloxane20 parts, 3 parts of toughener polysulfide rubber, platinum catalyst chloroplatinic acid tetramethyl
0.003 part of divinyl disiloxane complex compound, adds in reaction unit under inert gas shielding, curing agent is added after stirring
1.7 parts of diamino diphenyl sulfone, is heated to 40 DEG C, continues to stir 25 minutes, is cooled to room temperature, obtains colourless transparent liquid, subtract
Bubble is removed in pressure-off, and be heating and curing heating 15 minutes at 20 DEG C, that is, organosilicon adhesive is made.
Embodiment 7
Weigh 17 parts of benzimidazole, 23 parts of epoxy resin compound bisphenol-A type epoxy resin, polysiloxane29 parts, 3 parts of toughener polysulfide rubber, 0.003 part of platinum catalyst, lazy
Property gas shield under add in reaction unit, 1.3 parts of curing agent diamino diphenyl sulfone is added after stirring, 30 DEG C are heated to, after
Continuous stirring 30 minutes, is cooled to room temperature, obtains colourless transparent liquid, and bubble is sloughed in decompression, and be heating and curing heating 10 at 30 DEG C
Minute, that is, organosilicon adhesive is made.
Embodiment 8
Weigh 17 parts of benzimidazole, 23 parts of the oxybenzene methylmethane type epoxy resin of epoxy resin compound three, poly-organosilicon
Oxygen alkane29 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst
0.003 part of chloroplatinic acid tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, stirring
1.8 parts of curing agent diamino diphenyl sulfone is added afterwards, 30 DEG C are heated to, and is continued to stir 30 minutes, is cooled to room temperature, obtains colourless
Bubble is sloughed in transparency liquid, decompression, and be heating and curing heating 10 minutes at 30 DEG C, that is, organosilicon adhesive is made.
Embodiment 9
Weigh 17 parts of benzimidazole, 23 parts of the phenolic group ethane type epoxy resin of epoxy resin compound four, poly organo
Alkane29 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine
0.003 part of platinic acid tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, after stirring
1.9 parts of curing agent diamino diphenyl sulfone is added, 30 DEG C are heated to, continues to stir 30 minutes, is cooled to room temperature, obtains colourless
Bubble is sloughed in prescribed liquid, decompression, and be heating and curing heating 10 minutes at 30 DEG C, that is, organosilicon adhesive is made.
Comparative example 1 (is free of aminated compounds)
Weigh 23 parts of the phenolic group ethane type epoxy resin of epoxy resin compound four, polysiloxane29 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine platinum
Sour 0.003 part of tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, is added after stirring
Enter 1.9 parts of curing agent diamino diphenyl sulfone, be heated to 30 DEG C, continue to stir 30 minutes, be cooled to room temperature, obtain water white transparency
Bubble is sloughed in liquid, decompression, and be heating and curing heating 10 minutes at 30 DEG C, and organosilicon adhesive is made.
Comparative example 2 (is free of epoxy resin compound)
Weigh 17 parts of benzimidazole, polysiloxane29 parts, increase
Tough dose of 3 parts of carboxyl LNBR, 0.003 part of platinum catalyst chloroplatinic acid tetramethyl divinyl disiloxane complex compound,
Added under inert gas shielding in reaction unit, 1.9 parts of curing agent diamino diphenyl sulfone added after stirring, 30 DEG C are heated to,
Continue to stir 30 minutes, be cooled to room temperature, obtain colourless transparent liquid, bubble is sloughed in decompression, and be heating and curing heating at 30 DEG C
10 minutes, that is, the organosilicon adhesive is made.
Comparative example 3 (component of aminated compounds is 5 parts)
Weigh 5 parts of benzimidazole, 23 parts of the phenolic group ethane type epoxy resin of epoxy resin compound four, polysiloxane29 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine platinum
Sour 0.003 part of tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, is added after stirring
Enter 1.9 parts of curing agent diamino diphenyl sulfone, be heated to 30 DEG C, continue to stir 30 minutes, be cooled to room temperature, obtain water white transparency
Bubble is sloughed in liquid, decompression, and be heating and curing heating 10 minutes at 30 DEG C, that is, the organosilicon adhesive is made.
Comparative example 4 (component of aminated compounds is 35 parts)
Weigh 35 parts of benzimidazole, 23 parts of the phenolic group ethane type epoxy resin of epoxy resin compound four, poly organo
Alkane29 parts, 3 parts of toughener carboxyl LNBR, platinum catalyst chlorine
0.003 part of platinic acid tetramethyl divinyl disiloxane complex compound, is added in reaction unit under inert gas shielding, after stirring
1.9 parts of curing agent diamino diphenyl sulfone is added, 30 DEG C are heated to, continues to stir 30 minutes, is cooled to room temperature, obtains colourless
Bubble is sloughed in prescribed liquid, decompression, and be heating and curing heating 10 minutes at 30 DEG C, that is, the organosilicon adhesive is made.
Performance comparison test's example：The organosilicon adhesive performance test of modification after solidification
Gluing strength detection
By it is above-mentioned it is each implement in example obtained by colourless transparent liquid, removed under reduced pressure bubble, take it is a small amount of be respectively coated in
On long 10cm, wide 5cm, thick 2mm glass plate, the thickness of the organosilicon adhesive of coating is 0.5mm, then same by other one
The glass plate of size is overlapped, and is then heated to after 30 DEG C, 20 minutes and is taken out, is cooled to cold curing, is entered by puller system
Row test.Test result is as shown in table 1 below：
The organosilicon adhesive gluing strength detection of modification after the solidification of table 1.
Resistance to elevated temperatures is tested
By colourless transparent liquid resulting in above-mentioned implementation example, removed under reduced pressure bubble is then heated to 30 DEG C, 20 points
Taken out after clock, cold curing is cooled to, then high-temperature baking 30 minutes in the range of 100-300 DEG C, to the organosilicon adhesive
Heatproof determine.As a result it is as shown in table 2 below：
The organosilicon adhesive resistance to elevated temperatures test of modification after the solidification of table 2.
Claims (8)
1. the organosilicon adhesive of a kind of modification, it is characterised in that in parts by weight comprising following components：
15~20 parts of aminated compounds；
20~25 parts of epoxy resin compound；
20~30 parts of polysiloxane；
2~4 parts of toughener；
0.001~0.005 part of platinum catalyst；
1~2 part of curing agent.
2. the organosilicon adhesive of modification according to claim 1, it is characterised in that the aminated compounds is benzo miaow
Azoles.
3. the organosilicon adhesive of modification according to claim 1, it is characterised in that the epoxy resin compound is
Glycidyl ether type epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, linear aliphatic class ring
Oxygen tree fat or alicyclic based epoxy resin.
4. the organosilicon adhesive of modification according to claim 1, it is characterised in that the molecule of the polysiloxane
Formula isIn formula：R1For C1-10Saturated alkane base, Y is C1-5Alkylidene, m is integer,
And m >=10, n is 0 or 1.
5. the organosilicon adhesive of modification according to claim 1, it is characterised in that the toughener is carboxyl liquid fourth
Nitrile rubber, polysulfide rubber, liquid silastic, polyethers, polysulfones, nano-calcium carbonate or nano titanium oxide.
6. the organosilicon adhesive of modification according to claim 1, it is characterised in that the platinum catalyst is chloroplatinic acid four
Divinyl disiloxane complex compound.
7. the organosilicon adhesive of modification according to claim 1, it is characterised in that the curing agent is diaminourea hexichol
Base sulfone.
8. the preparation method of the organosilicon adhesive of the modification described in claim 1, it is characterised in that step is as follows：With weight
Part meter is weighed：15~20 parts of aminated compounds, 20~25 parts of epoxy resin compound, 20~30 parts of polysiloxane, increasing
Tough dose 2~4 parts and 0.001~0.005 part of platinum catalyst, are added in reaction unit under inert gas shield, are added after stirring solid
1~2 part of agent, is heated to 30~60 DEG C, continues to stir 20~30 minutes, is cooled to room temperature, obtains colourless transparent liquid, depressurizes
Bubble is sloughed, be heating and curing heating 10~30 minutes at 20~40 DEG C, that is, the organosilicon adhesive of the modification is made.
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| CN201710227721.XA CN107022336B (en) | 2017-04-10 | 2017-04-10 | Modified organic silicon adhesive and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107652943A (en) * | 2017-09-05 | 2018-02-02 | 复旦大学 | A kind of ultraviolet resistance high-low temperature resistant organosilicon adhesive and preparation method thereof |
| CN107686717A (en) * | 2017-09-05 | 2018-02-13 | 复旦大学 | A kind of preparation method of high-temperature resistant silicone adhesive |
| CN107722892A (en) * | 2017-09-05 | 2018-02-23 | 复旦大学 | It is a kind of can the organosilicon adhesive sprawled of high thickness and preparation method thereof |
| CN110484200A (en) * | 2019-09-11 | 2019-11-22 | 丁爱顺 | A kind of the macromolecule organic silicon adhesive and preparation method thereof |
| CN110511723A (en) * | 2019-08-23 | 2019-11-29 | 复旦大学 | A kind of liquid crystal screen displays fitting organic silica gel sticks agent and preparation method thereof |
| CN116769438A (en) * | 2023-07-31 | 2023-09-19 | 苏州添易朗科技有限公司 | Preparation method and application of organic silicon glue |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN107722892A (en) * | 2017-09-05 | 2018-02-23 | 复旦大学 | It is a kind of can the organosilicon adhesive sprawled of high thickness and preparation method thereof |
| CN110511723A (en) * | 2019-08-23 | 2019-11-29 | 复旦大学 | A kind of liquid crystal screen displays fitting organic silica gel sticks agent and preparation method thereof |
| CN110484200A (en) * | 2019-09-11 | 2019-11-22 | 丁爱顺 | A kind of the macromolecule organic silicon adhesive and preparation method thereof |
| CN116769438A (en) * | 2023-07-31 | 2023-09-19 | 苏州添易朗科技有限公司 | Preparation method and application of organic silicon glue |
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