CN107022162A - A kind of Organic Conductive Films conditioner and preparation method thereof - Google Patents
A kind of Organic Conductive Films conditioner and preparation method thereof Download PDFInfo
- Publication number
- CN107022162A CN107022162A CN201710208305.5A CN201710208305A CN107022162A CN 107022162 A CN107022162 A CN 107022162A CN 201710208305 A CN201710208305 A CN 201710208305A CN 107022162 A CN107022162 A CN 107022162A
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- weight
- conditioner
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- conductive films
- organic conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
A kind of Organic Conductive Films conditioner, it is characterised in that：The component and its weight ratio of the Organic Conductive Films conditioner are as follows：The parts by weight of polyvinyl alcohol 5~10；The parts by weight of ethylene-vinyl acetate copolymer 1~3；The quaternary ammoniated parts by weight of imidazoles polymer 5~10；The parts by weight of sodium carbonate 0.1~1；The parts by weight of water 75~85.The present invention has excellent pore wall charge tuning performance, and one layer of coating film can be formed in hole wall, it is ready for the oxidation operation of Organic Conductive Films, oxidant can form uniform one layer of manganese dioxide with this cladding film reaction, and dirt-removing power of the present invention is strong, the residue that drilling leaves can effectively be removed, it is good that ability is sensitized simultaneously, conditioner of the present invention can adjust hole wall glass fibre and resin surface, it is allowed to preferably be combined with conducting metal level, and the present invention is widely applicable, go for various different plates, go for vertical equipment and horizontal plants simultaneously.
Description
Technical field
The present invention relates to printed-board technology field, more particularly, to a kind of Organic Conductive Films conditioner and its making
Method.
Background technology
It is one of key of printed circuit board (PCB) manufacturing technology that printed circuit board (PCB) after drilling, which carries out hole metallization technology,.For a long time
Since, people use the method for electroless copper plating always, but have larger harm to environment and operating personnel in electroless copper plating solution.
Therefore industry always searches for new hole metallization technology, and Organic Conductive Films Direct Electroplating technology is exactly to meet the tendency of under this background
And raw.The technological processes of Organic Conductive Films is simple, deburring after drilling holes on circuit board, into organic conductive membrane process after directly enter
Enter pattern transfer process, then electroplate two bronze medals, adapt to shorter process, environmental protection, meet automated production, PCB can be helped to produce
Producer effectively reduces production cost, improves product yield.Whole hole is the first procedure of Organic Conductive Films, for adjusting hole wall
Electron opaque material such as glass fibre and resin produce a hydrophilic surface, are that the process of next step is prepared, and whole hole exists
Following effect is primarily served in the technological process of whole print circuit plates making：1) hole wall is cleaned；2) pore wall charge is adjusted；3) exist
Coating film is formed at resin and glass fibre；4) fully soak also includes washing, aoxidizing, washing, urging behind hole wall, whole hole
The steps such as change, washing, drying.However, there is following technical problem in the conditioner for being traditionally used for the whole hole of printed circuit board (PCB)：1) go
Dirty ability is weak, it is impossible to the residue left after the printed circuit board drilling effectively removed；2) it is sensitized ability, it is impossible to effective to adjust
Whole hole wall glass fibre and resin surface, it is impossible to it is preferably combined with conducting metal level；3) scope of application is small, only adapts to
Single plate.
Therefore, it is necessary to provide a kind of new technical scheme to overcome drawbacks described above.
The content of the invention
It is an object of the invention to provide a kind of Organic Conductive Films conditioner that can effectively solve above-mentioned technical problem and
Its preparation method.
To reach the purpose of the present invention, adopt the following technical scheme that：
A kind of Organic Conductive Films conditioner, the component and its weight part ratio of the Organic Conductive Films conditioner are for example
Under：The parts by weight of polyvinyl alcohol 5~10；The parts by weight of ethylene-vinyl acetate copolymer 1~3；The quaternary ammoniated weight of imidazoles polymer 5~10
Measure part；The parts by weight of sodium carbonate 0.1~1；The parts by weight of water 75~85.
The polyvinyl alcohol is water solubility.
The quaternary ammoniated imidazoles polymer is polyethylene polymer.
The preparation method of the Organic Conductive Films conditioner comprises the following steps：
Step 1：First plus half water；
Step 2：It is proportionally added into polyvinyl alcohol, stirring is to being completely dissolved；
Step 3：It is proportionally added into ethylene-vinyl acetate copolymer, stirring to dissolving；
Step 4：It is proportionally added into quaternary ammoniated imidazoles polymer, stirring to dissolving；
Step 5：It is proportionally added into sodium carbonate, stirring to dissolving；
Step 6：The water of surplus is added, is persistently stirred 30 minutes；
Step 7：By the solution packaging after stirring；
The polyvinyl alcohol is water solubility.
The quaternary ammoniated imidazoles polymer is polyethylene polymer.
Compared with prior art, the present invention has the advantages that：Organic Conductive Films conditioner of the present invention has excellent
Good pore wall charge tuning performance, and one layer of coating film can be formed in hole wall, it is that the oxidation operation of Organic Conductive Films carries out standard
Standby, oxidant can form uniform one layer of manganese dioxide with this cladding film reaction, and dirt-removing power of the present invention is strong, can be effective
The residue that drilling leaves is removed, while the ability of sensitization is good, conditioner of the present invention can adjust hole wall glass fibre and resin table
Face, is allowed to preferably be combined with conducting metal level, and the present invention is widely applicable, goes for various different plates, simultaneously
Go for vertical equipment and horizontal plants.
Embodiment
Organic Conductive Films of the present invention use a kind of new cationic surfactant and a kind of polyphosphazene polymer with conditioner
Compound is formed by strict proportioning, and its component and weight part ratio are as follows：
The parts by weight of polyvinyl alcohol 5~10；
The parts by weight of ethylene-vinyl acetate copolymer 1~3；
The quaternary ammoniated parts by weight of imidazoles polymer 5~10；
The parts by weight of sodium carbonate 0.1~1；
The parts by weight of water 75~85.
Wherein：Above-mentioned polyvinyl alcohol is water solubility；Above-mentioned ethylene-vinyl acetate copolymer is ethene-vinyl acetate copolymerization
Thing (EVA)；Above-mentioned quaternary ammoniated imidazoles polymer is polyethylene polymer.
For above-mentioned component and weight part ratio, following embodiments can be specifically used：
The parts by weight of polyvinyl alcohol 5；
The parts by weight of ethylene-vinyl acetate copolymer 2；
The quaternary ammoniated parts by weight of imidazoles polymer 10；
The parts by weight of sodium carbonate 0.5；
The parts by weight of water 82.5.
Using above-mentioned component and the conditioner produced of proportioning in alkalescence, and the whole hole of printed circuit board (PCB) after to drilling
When, one layer of coating film can be formed at hole wall resin and glass fibre, the coating film is polymer, can be Organic Conductive Films
Oxidation operation be ready.The coating film can react to form one layer of catalyst manganese dioxide with oxidant.
Above-mentioned conditioner is made of following preparation method：
Step 1：First plus half water；
Step 2：It is proportionally added into polyvinyl alcohol, stirring is to being completely dissolved；
Step 3：It is proportionally added into ethylene-vinyl acetate copolymer, stirring to dissolving；
Step 4：It is proportionally added into quaternary ammoniated imidazoles polymer, stirring to dissolving；
Step 5：It is proportionally added into sodium carbonate, stirring to dissolving；
Step 6：The water of surplus is added, is persistently stirred 30 minutes；
Step 7：By the solution packaging after stirring.
Conditioner using the present invention is as follows to the manufacturing process of printed circuit board (PCB)：
Claims (6)
1. a kind of Organic Conductive Films conditioner, it is characterised in that：The component and its weight of the Organic Conductive Films conditioner
Part ratio is as follows：The parts by weight of polyvinyl alcohol 5~10；The parts by weight of ethylene-vinyl acetate copolymer 1~3；Quaternary ammoniated imidazoles polymer
5~10 parts by weight；The parts by weight of sodium carbonate 0.1~1；The parts by weight of water 75~85.
2. Organic Conductive Films conditioner as claimed in claim 1, it is characterised in that：The polyvinyl alcohol is water solubility.
3. Organic Conductive Films conditioner as claimed in claim 2, it is characterised in that：The quaternary ammoniated imidazoles polymer is poly-
Ethene polymers.
4. a kind of preparation method of Organic Conductive Films conditioner as claimed in claim 1, it is characterised in that：It is described organic to lead
The preparation method of electrolemma conditioner comprises the following steps：
Step 1：First plus half water；
Step 2：It is proportionally added into polyvinyl alcohol, stirring is to being completely dissolved；
Step 3：It is proportionally added into ethylene-vinyl acetate copolymer, stirring to dissolving；
Step 4：It is proportionally added into quaternary ammoniated imidazoles polymer, stirring to dissolving；
Step 5：It is proportionally added into sodium carbonate, stirring to dissolving；
Step 6：The water of surplus is added, is persistently stirred 30 minutes；
Step 7：By the solution packaging after stirring.
5. the preparation method of Organic Conductive Films conditioner as claimed in claim 4, it is characterised in that：The polyvinyl alcohol is
It is water-soluble.
6. the preparation method of Organic Conductive Films conditioner as claimed in claim 5, it is characterised in that：The quaternary ammoniated imidazoles
Polymer is polyethylene polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710208305.5A CN107022162A (en) | 2017-03-31 | 2017-03-31 | A kind of Organic Conductive Films conditioner and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710208305.5A CN107022162A (en) | 2017-03-31 | 2017-03-31 | A kind of Organic Conductive Films conditioner and preparation method thereof |
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| Publication Number | Publication Date |
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| CN107022162A true CN107022162A (en) | 2017-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710208305.5A Pending CN107022162A (en) | 2017-03-31 | 2017-03-31 | A kind of Organic Conductive Films conditioner and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN114845471A (en) * | 2022-07-04 | 2022-08-02 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
-
2017
- 2017-03-31 CN CN201710208305.5A patent/CN107022162A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN114845471A (en) * | 2022-07-04 | 2022-08-02 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
| CN114845471B (en) * | 2022-07-04 | 2022-09-27 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
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Application publication date: 20170808 |
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