CN107001908B - 单组分uv和热固化高温可脱粘的胶粘剂 - Google Patents
单组分uv和热固化高温可脱粘的胶粘剂 Download PDFInfo
- Publication number
- CN107001908B CN107001908B CN201480080122.4A CN201480080122A CN107001908B CN 107001908 B CN107001908 B CN 107001908B CN 201480080122 A CN201480080122 A CN 201480080122A CN 107001908 B CN107001908 B CN 107001908B
- Authority
- CN
- China
- Prior art keywords
- carrier
- substrate
- adhesive composition
- assembly
- debondable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 51
- 239000000853 adhesive Substances 0.000 title claims abstract description 50
- 238000003848 UV Light-Curing Methods 0.000 title description 2
- 238000013007 heat curing Methods 0.000 title description 2
- 239000003999 initiator Substances 0.000 claims abstract description 14
- 239000001257 hydrogen Substances 0.000 claims abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 10
- 229910000077 silane Inorganic materials 0.000 claims abstract description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 9
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 7
- 150000002431 hydrogen Chemical class 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 58
- 239000000203 mixture Substances 0.000 claims description 46
- 230000005855 radiation Effects 0.000 claims description 18
- 150000003254 radicals Chemical class 0.000 claims description 13
- -1 dicumene peroxide Chemical class 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical class OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 claims description 2
- 229920006294 polydialkylsiloxane Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000004971 Cross linker Substances 0.000 claims 1
- 230000001133 acceleration Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 16
- 238000001723 curing Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000009472 formulation Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000002411 thermogravimetry Methods 0.000 description 4
- 239000013256 coordination polymer Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 238000001029 thermal curing Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 150000005840 aryl radicals Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 150000001364 polyalkylsilanes Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
- C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明提供了用于高温应用的单组分UV和热可固化的临时胶粘剂。所述胶粘剂包含：(i)1,3,5,7‑四乙烯基‑1,3,5,7‑四甲基环四硅氧烷上的乙烯基与具有末端Si‑H氢的硅烷或硅氧烷上的末端Si‑H氢之间发生反应的部分氢化硅烷化反应产物，和(ii)光和/或热自由基固化引发剂。还涉及包括这类胶粘剂的组件和使用所述胶粘剂的方法。
Description
本发明涉及用于高温应用的单组分UV和热可固化临时胶粘剂，特别是涉及用于一种基材与另一种基材的临时连接的胶粘剂。
在许多行业中，日渐关注于柔性和/或非常薄的基材的使用，例如不锈钢、硅晶片、玻璃、陶瓷、聚酰亚胺和聚酯膜。柔性和非常薄的基材太脆而不能在下游制造条件下不依靠支撑物进行加工，而是必须支撑在适合的载体上才能继续存在。在完成制造过程之后，基材必须优选在环境温度下能够从载体无破坏地移除。
在电子工业中，举例而言，成像显示器、传感器、光伏装置和射频识别(RFID)越来越需要薄和/或柔性基材用于手机、个人数字助手、iPad或电视的显示应用。一种示例性的基材为担负各种功能的非常薄(100μm)的玻璃。在300-500℃下对玻璃进行加工以沉积薄膜晶体管(TFT)，或者在150-400℃下对玻璃进行加工以沉积氧化铟锡(ITO)作为透明导体。由于玻璃的脆性以及严苛的加工条件，必须在制造过程中通过粘接于更稳定的基材来对玻璃进行强化或保护。并且，在触摸型传感器制造的片型方法中，触摸型传感器玻璃经预先切割并粘接到载体，随后进行如上所述的沉积过程。其它工业例如硅晶片制造也需要粘接于载体基材以在晶背研磨过程期间保护越来越薄的硅晶片，随后进行洁净脱离。
例如如上所述的那些用途需要高温稳定的胶粘剂，该胶粘剂可容易且干净地脱粘，这允许在高加工温度下临时粘接，并且不会折损基材的处理或性能。这是一个目标，特别是电子工业中的一个目标。这类胶粘剂的开发允许现有的制造方法例如半导体、有源矩阵薄膜晶体管、触摸型膜或光伏装置的制造方法使用制造工具和机器的当前的安装基础。然而，大多数当前可得的临时胶粘剂在制造步骤的最高加工下是热不稳定的，所述最高加工可高达400℃。
因此适用于高温临时粘接应用的胶粘剂将推进更薄或更柔性基材在各种行业的使用，所述胶粘剂可之后在室温下移除而对目标部件不造成破坏。
一般而言，常见的可脱粘胶粘剂由双组分体系组成。更精确地讲，在施用之前或在施用过程中这些双组分体系需要与其它添加剂混合以制备正确起作用的产物。因此，当前该类型的组合物在其可应用性和可管理性方面受到损害，原因是作用时间短、固化时间长以及特别是在包装容器打开之后储存寿命短。
本发明通过提供一种单组分UV和热可固化的高温稳定的可脱粘胶粘剂满足上述目标并克服了现有的缺点，所述胶粘剂在300℃至450℃的制造温度下提供了基材与载体足够的临时粘接，并且在环境温度下在基材和载体的界面处随着胶粘破坏而脱粘，且不会破坏基材。
在第一方面，本发明因此涉及一种单组分可脱粘的高温稳定的胶粘剂组合物，其包含：
(i)1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷上的乙烯基与具有末端Si-H氢的硅烷或硅氧烷上的末端Si-H氢之间发生反应的部分氢化硅烷化反应产物，和
(ii)光和/或热自由基固化引发剂。
在另一方面，本发明还涉及基材和载体的组件，其包含优选固化的如上所述的单组分可脱粘高温稳定的胶粘剂组合物，所述胶粘剂组合物布置在所述基材和载体之间。
在又一方面，本发明还涉及一种使基材与载体粘接的方法，其包括：
(a)提供基材和载体，
(b)将根据本发明的单组分可脱粘的胶粘剂布置在所述基材和/或载体上，
(c)使基材与载体接触，使得所述可脱粘的胶粘剂置于载体和基材之间，形成组件，
(d)通过如下方式自由基固化所述可脱粘的胶粘剂：
(i)加热所述组件，或
(ii)使所述组件暴露于辐射，或
(iii)使所述组件暴露于辐射，随后加热。
再一方面，本发明的特征是一种使基材从载体脱粘的方法，其包括：
(a)提供基材和载体，
(b)将如本文所述的单组分可脱粘的胶粘剂布置在所述基材和/或载体上，
(c)使基材与载体接触，使得所述可脱粘的胶粘剂置于其间，形成组件，
(d)通过如下方式自由基固化可脱粘的胶粘剂：
(i)加热所述组件，或
(ii)使所述组件暴露于辐射，或
(iii)使所述组件暴露于辐射，随后加热；和
(e)任选在使组件达到环境温度和/或经过一个或多个加工基材的步骤之后，以机械方式分离基材和载体。
在另一个方面，本发明还包括本文所述的组合物作为胶粘剂的用途，优选用于使基材和载体粘接。
本文所用的“两种或更多种”涉及至少两种且包括2、3、4、5、6、7、8、9或更多种所提到的物质。
本说明书和权利要求书中所用的“基材”是指用于制造过程的目标部件，“载体”是指用于所述“基材”的支撑结构。
本发明涉及单组分胶粘剂组合物，其包含1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷上的乙烯基与具有末端Si-H氢的硅烷或硅氧烷上的末端Si-H氢之间发生反应的氢化硅烷化反应产物，和辐射活化的光引发剂和/或热活化的自由基引发剂。
1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷与具有末端Si-H氢的硅烷或硅氧烷之间发生反应的部分氢化硅烷化反应产物在本文中将称作乙烯基碳硅氧烷(vinylcarbosiloxane)或VCS树脂或VCSR。一般而言，本文所用的术语“部分氢化硅烷化反应产物”是指1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷与具有末端Si-H氢的硅烷或硅氧烷上的末端Si-H氢之间的氢化硅烷化反应的产物，其中所述反应产物保留至少一个未反应的乙烯基。所述至少一个未反应的乙烯基在后续固化反应(通过自由基聚合)中充当交联部分。在各种实施方案中，所述VCSR具有的分子量Mw为至多200000g/mol，优选1000-150000g/mol。分子量Mw可通过凝胶渗透色谱(GPC)根据DIN 55672-1:2007-08使用THF作为洗脱剂来测定。
本发明的胶粘剂组合物在300℃或更高，至多450℃的温度下保持其粘合性，且在室温下在约0.1-5N/25mm，优选0.2-1.5N/25mm的作用力下以机械方式可脱粘。在施用温度下TGA重量损失优选小于5％。
在所述使基材与载体粘接或脱粘的方法的各种实施方案中，通过加热组件而固化包括施加100℃-175℃的一个温度或温度范围持续1-30分钟。通过UV辐射而固化可通过使组件暴露于通过UV/Vis灯，例如500W UV/Vis灯产生的辐射持续约1秒至4分钟来进行；也可由实践者决定使用其它辐射源。在各种实施方案中，任选通过施加如上所述的加热/辐射条件，可将加热和辐射组合。一般而言，本领域技术人员借助于公知常识或常规试验可容易地确定适合的固化条件。上述加热和/或辐射用于通过活化自由基引发剂(催化剂)来引发VCSR的自由基固化。固化条件取决于所用的催化剂，示例性的固化条件如下文所详细描述。
用于本文所述的胶粘剂中的VCS树脂通过具有以下结构的1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷与具有至少两个用于与1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷反应的末端Si-H氢的适合的硅烷或硅氧烷的部分氢化硅烷化反应而形成，
其中所述适合的硅烷或硅氧烷包括具有如下结构的那些：
其中R选自C1-C10烷基、芳基例如C6-C10芳基、氧、-(O-SiMe2)n-O-、-(O-SiAr2)n-O-、-(O-SiMeAr)n-O-和这些基团的任意组合，其中n为至少1的整数，Me为甲基，Ar为芳基例如C6-C10芳基；且其中R1、R2、R3、R4、R5和R6各自独立地为C1-C10烷基或芳基例如C6-C10芳基。优选R1、R2、R3、R4、R5和R6为C1-C10烷基，特别是C1-C4烷基，例如甲基或乙基，或苯基。
示例性的硅烷或硅氧烷包括聚烷基硅烷或聚烷基硅氧烷，其中硅原子上的烷基为C1-C10烷基。在各种实施方案中，所述硅烷和硅氧烷包括聚二烷基硅氧烷例如聚二甲基硅氧烷、聚烷基芳基硅氧烷例如聚甲基苯基硅氧烷、四烷基二硅氧烷例如四甲基硅氧烷、和聚二芳基硅氧烷。这些化合物可从Gelest购得。
优选的VCSR反应产物为具有以下理想化结构的那些，其中分子量为重均分子量。在各种实施方案中，VCSR反应产物的硅原子上的烷基包括C1-C10烷基。在以下理想化的结构中，在硅烷/硅氧烷部分中示出的为甲基，但是应当理解，可用其它C1-C10烷基代替。
VCSR-1,Mw＝1000–100,000
VCSR-2,Mw＝1000–150,000
VCSR-3,Mw＝1000–100,000
除了VCSR之外，所述胶粘剂组合物还包含光引发剂和/或热活化的自由基引发剂作为催化剂用于通过乙烯基的自由基聚合/交联来固化VCSR。
所述光引发剂为辐射活化的自由基引发剂，所述热固化自由基引发剂为热活化的自由基引发剂，使得固化为热固化或光固化。适合的自由基引发剂为本领域技术人员所公知。例如，所述光引发剂和/或热活化的自由基引发剂选自α-羟基酮类、二苯甲酮类、和苯基乙醛酸类。适合的还有本领域通常已知的所有类型的酰基膦氧化物和双酰基膦氧化物，以及过氧化二枯烯、氢过氧化枯烯和2-羟基-2-甲基-1-苯基丙-1-酮，但不限于此。一种优选的自由基引发剂为过氧化二枯烯。优选的光引发剂包括以商品名
1173和
184(1-羟基-环己基-α-羟基酮)或2100(单酰基膦氧化物(MAPO)和双酰基膦氧化物(BAPO)的共混物)销售的那些。
在许多反应中，催化剂的水平可以为仍有活性但又足够低，使得不需要将其从反应产物分离。
在各种实施方案中，所述组合物包含基于组合物的总重量40-95重量％，优选60-85重量％的VCSR和/或0.1-10重量％，优选0.1-2重量％的辐射活化的光引发剂和/或热活化的自由基引发剂。
典型的固化条件包括暴露于UV/Vis辐射和/或温度低于200℃的热。能量输入优选为2000-20,000mJ/cm2，优选7000-12,000mJ/cm2。
所述组合物还可包含固化加速助剂，例如甲基丙烯酸酯化硅氧烷或丙烯酸酯化硅氧烷。这类添加剂的量，相对于组合物的总重量，通常为约0-50重量％，优选5-15重量％。
还可包括各种填料，包括但不限于二氧化硅。如果存在的话，基于组合物的总重量，这类填料可以0-40重量％，优选5-25重量％的量存在。
本发明的组合物不需要加入额外的交联剂，特别是氢硅烷和/或氢硅氧烷交联剂。因此，在优选的实施方案中，本发明的组合物不含这类额外的交联剂，特别是不含氢硅烷和氢硅氧烷交联剂。在上下文中使用的“不含”是指所提到物质在组合物中的量，基于组合物的总重量，小于1重量％，优选小于0.1重量％。
如本文所述，由载体、基材和使载体与基材粘接的固化胶粘剂组成的粘接组件可经受基材的进一步加工步骤。所述加工步骤例如可包括暴露于300-500℃的温度以沉积薄膜晶体管(TFT)，或暴露于150-400℃的温度以沉积氧化铟锡(ITO)作为透明导体。在各种实施方案中，所述基材为玻璃基材或硅晶片，例如厚度小于0.5mm，优选为100μm或更小的超薄玻璃或晶片。在所述加工步骤期间基材与载体的粘接加固并保护了基材。所述载体可由任何适合的材料制成，包括金属、玻璃、塑料和陶瓷。在其它实施方案中，所述载体也可为基材，例如如上定义的基材。
在所述加工步骤完成之后，可将组件冷却，并以机械方式将载体与基材分离。在该机械分离步骤，在本文中也称作“脱粘”中，在环境温度下随着在基材和载体的界面处胶粘破坏而发生分离，并且没有损坏基材。
本发明还包括本文所述的组合物作为可脱粘胶粘剂，特别是用于基材和载体的可逆粘接的用途。所述用途可包括与上文描述的方法中类似的步骤。
一般而言，应当理解的是，本文公开的与本发明的组合物相关的所有实施方案可同等地应用于所公开的方法和用途，反之亦然。
实施例
对比例1:现有的双组分制剂
制剂
双组分制剂的A组分包含72.5％VCSR2(含有Pt催化剂)、6.5％热解二氧化硅、5％PDV-0535和1％Darocure 1173，B组分具有来自Gelest的SIB 6826.0氢硅氧烷。以85:15的重量比将A组分与B组分混合。将一些混合样品放在玻璃瓶中。将玻璃瓶置于UVLOC 1000中并送去UV暴露80秒(约8000-12000mJ/cm2)，随后将UV预固化的样品置于150℃的烘箱中进行后热固化15分钟。最后，固化的样品为透明的固体。该样品的TGA(热重分析)表明，在350℃下30分钟之后97.5％的物质得以保留(从室温升温速度为20℃/分钟)。
脱粘剥离力
将上述制剂涂布在标准载玻片(75x 25x 1mm)和交叉位置上的盖玻片(50x 24x0.1mm)上(粘接面积为25x 24mm)。随后在UV-热固化之后对组件进行简单的剥离力测试，随后在250℃下热老化1小时，在350℃下热老化10分钟，然后冷却到室温。将测力计连接于薄载玻片并对粘接体施加约90度的剥离力。用1-3牛顿的力就很容易地破坏了该粘接，而薄载玻片是完整的。
老化后的开裂
将上述制剂的样品(约0.1ml)置于50x 80x 1mm的载玻片上。将150微米的隔离物置于载玻片的两端，且相同的载玻片放置在由隔离物支撑的样品上，以提供约150微米的粘接间隙。将样品在UVLOC 1000中固化80秒并在150℃的烘箱中固化10分钟，随后移到室温下。在热老化之后，该室温胶粘剂样品是透明的且没有开裂。
粘度稳定性/有效期
使用Brookfield粘度计(动态)(RVT DV-II CP#5 2.5rpm，25℃)对上述制剂进行粘度随时间变化的监测试验。在快速混合机中将组分A与组分B混合，随后在0小时、0.5小时、1.5小时和2小时后测试粘度。结果(表1)表明，该双组分制剂具有非常短的有效期，因此难以应用于制造。
表1：双组分制剂的粘度随时间的变化
实施例2：本发明的单组分制剂
研发了新的单组分制剂来克服双组分体系有效期短的缺点，此外有利于在制造中的应用过程。在将胶粘剂施用于基材之前不需要混合不同的组分。此外，包装被简化。
制剂
将含有12.5％PDV-0535、5.5％热解二氧化硅、0.2％过氧化二枯烯和1％Darocure1173的含VCSR2的新制剂放在玻璃瓶中。将玻璃瓶置于2000rmp下的快速混合机中1分钟。随后将玻璃瓶置于UVLOC 1000中并暴露于500W UV下80秒(约8000-12000mJ/cm2)，随后将UV预固化的样品在150℃下完全固化15分钟。固化的样品为透明的固体。该样品的TGA表明，在350℃下30分钟之后96.8％的物质得以保留(从室温升温速度为20℃/分钟)。与实施例1相比较，这是大致相当的除气性能。
脱粘剥离力
将上述制剂的样品(约0.1ml)涂布在50x 80x 1mm的载玻片上。将150微米的隔离物置于载玻片的两端，且相同的载玻片放置在由隔离物支撑的样品上，以提供约150微米的粘接间隙。将样品用UVLOC 1000固化80秒并在150℃的烘箱中固化。将得到的透明的粘接的玻璃样品置于250℃的烘箱中1小时，在350℃的烘箱中10分钟，然后移到室温。在热老化之后，该室温胶粘剂样品是透明的且没有开裂。
粘度稳定性/有效期
用Brookfield粘度计(动态)(RVT DV-II CP#5 2.5rpm,25℃)对粘度进行跟踪数周，初始的新鲜样品的粘度为7966cps，12天后粘度仍然稳定在7542cps。完全克服了实施例1中明显的有效期问题。
Claims (11)
1.单组分可脱粘的高温稳定的胶粘剂组合物，其包含：
(i)1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷上的乙烯基与具有末端Si-H氢的硅烷或硅氧烷上的末端Si-H氢之间发生反应的部分氢化硅烷化反应产物，和
(ii)光和/或热自由基固化引发剂。
2.根据权利要求1所述的可脱粘的胶粘剂组合物，其中所述具有末端Si-H氢的硅烷或硅氧烷具有以下结构：
其中R选自C1-C10烷基、芳基、氧、-(O-SiMe2)n-O-、-(O-SiAr2)n-O-、-(O-SiMeAr)n-O-和这些基团的任意组合，其中n为至少1的整数，Me为甲基，Ar为芳基；且其中R1、R2、R3、R4、R5和R6各自独立地为C1-C10烷基或芳基。
3.根据权利要求2所述的可脱粘的胶粘剂组合物，其中所述具有末端Si-H氢的硅烷或硅氧烷选自聚二烷基硅氧烷、聚烷基芳基硅氧烷、四烷基二硅氧烷和聚二芳基硅氧烷。
4.根据权利要求1-3之一所述的可脱粘的胶粘剂组合物，其中所述自由基固化引发剂选自α-羟基酮类、二苯甲酮类、苯基乙醛酸类、酰基膦氧化物类、双酰基膦氧化物类、过氧化二枯烯、氢过氧化枯烯和2-羟基-2-甲基-1-苯基丙-1-酮。
5.根据权利要求1-3之一所述的可脱粘的胶粘剂组合物，其还包含选自丙烯酸酯化硅氧烷和/或甲基丙烯酸酯化硅氧烷的固化加速助剂。
6.根据权利要求1-3之一所述的可脱粘的胶粘剂组合物，其还包含填料。
7.根据权利要求1-3之一所述的可脱粘的胶粘剂组合物，其中所述组合物不含额外的交联剂。
8.根据权利要求7所述的可脱粘的胶粘剂组合物，其中所述组合物不含氢硅烷和氢硅氧烷交联剂。
9.基材和载体的组件，其包含根据权利要求1-8之一所述的单组分可脱粘的高温稳定的胶粘剂组合物，所述胶粘剂组合物布置在所述载体和基材之间。
10.使基材与载体粘接的方法，其包括：
(a)提供基材和载体，
(b)将根据权利要求1-8之一所述的单组分可脱粘的胶粘剂组合物布置在所述基材和/或载体上，
(c)使所述基材与载体接触，使得所述可脱粘的胶粘剂组合物布置在载体和基材之间，形成组件，
(d)通过如下方式自由基固化所述可脱粘的胶粘剂：
(i)加热所述组件，或
(ii)使所述组件暴露于辐射，或
(iii)使所述组件暴露于辐射，随后加热。
11.使基材从载体脱粘的方法，其包括：
(a)提供基材和载体，
(b)将根据权利要求1-8之一所述的单组分可脱粘的胶粘剂组合物布置在所述基材和/或载体上，
(c)使所述基材与载体接触，使得所述可脱粘的胶粘剂组合物布置在载体和基材之间，形成组件，
(d)通过如下方式自由基固化所述可脱粘的胶粘剂：
(i)加热所述组件，或
(ii)使所述组件暴露于辐射，或
(iii)使所述组件暴露于辐射，随后加热；和
(e)任选在使所述组件达到环境温度和/或经过一个或多个加工基材的步骤之后，以机械方式分离所述基材和载体。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/080578 WO2015196345A1 (en) | 2014-06-24 | 2014-06-24 | 1k uv and thermal cure high temperature debondable adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107001908A CN107001908A (zh) | 2017-08-01 |
| CN107001908B true CN107001908B (zh) | 2020-06-09 |
Family
ID=54936421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480080122.4A Expired - Fee Related CN107001908B (zh) | 2014-06-24 | 2014-06-24 | 单组分uv和热固化高温可脱粘的胶粘剂 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10280349B2 (zh) |
| EP (1) | EP3161094B1 (zh) |
| JP (1) | JP6479862B2 (zh) |
| KR (1) | KR102168052B1 (zh) |
| CN (1) | CN107001908B (zh) |
| TW (1) | TWI676662B (zh) |
| WO (1) | WO2015196345A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015196345A1 (en) | 2014-06-24 | 2015-12-30 | Henkel (China) Company Limited | 1k uv and thermal cure high temperature debondable adhesive |
| JP7182239B2 (ja) * | 2017-01-19 | 2022-12-02 | 協立化学産業株式会社 | 熱硬化性樹脂組成物及び複合構造物の製造方法 |
| JP6801882B2 (ja) * | 2017-05-19 | 2020-12-16 | 協立化学産業株式会社 | 熱硬化性樹脂組成物及び加工樹脂ワニス硬化フィルムの製造方法 |
| CN113372018B (zh) * | 2021-06-18 | 2022-12-02 | 江西沃格光电股份有限公司 | 超薄玻璃及其表面处理方法和显示装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3438936A (en) * | 1967-10-06 | 1969-04-15 | Gen Electric | Modified cyclotetrasiloxane polymers |
| WO2013181801A1 (en) * | 2012-06-06 | 2013-12-12 | Henkel Corporation | Vinyl carbosiloxane resins |
| CN103820036A (zh) * | 2014-02-21 | 2014-05-28 | 中国科学院长春应用化学研究所 | 一种胶粘剂及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4908086A (en) | 1985-06-24 | 1990-03-13 | National Semiconductor Corporation | Low-cost semiconductor device package process |
| WO1987001378A1 (en) | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
| US5278276A (en) | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
| US5256717A (en) | 1990-12-19 | 1993-10-26 | National Starch And Chemical Investment Holding Corporation | Hot melt adhesives useful in temporary bonding operations |
| FR2708272B1 (fr) * | 1993-07-26 | 1995-09-01 | Rhone Poulenc Chimie | Résines silicones à nÓoeuds de réticulation thermo- ou hydro-réversibles. |
| JP2000204332A (ja) | 1999-01-08 | 2000-07-25 | Minnesota Mining & Mfg Co <3M> | 熱剥離性接着剤組成物および接着構造体 |
| JP2007154008A (ja) * | 2005-12-02 | 2007-06-21 | Kaneka Corp | エポキシ基含有オルガノシロキサン化合物の製造方法 |
| US8399592B2 (en) | 2007-04-17 | 2013-03-19 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
| EP2265674A1 (en) * | 2008-03-04 | 2010-12-29 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
| US8092628B2 (en) | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| JP2010202801A (ja) * | 2009-03-04 | 2010-09-16 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
| TWI479259B (zh) | 2009-06-15 | 2015-04-01 | Sumitomo Bakelite Co | A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same |
| EP2442962B1 (en) | 2009-06-16 | 2014-08-27 | 3M Innovative Properties Company | Debondable adhesive article |
| JP5234064B2 (ja) * | 2010-08-23 | 2013-07-10 | 信越化学工業株式会社 | 無溶剤型付加型シリコーン粘着剤組成物及び粘着性物品 |
| JP5827834B2 (ja) * | 2011-07-22 | 2015-12-02 | 日東電工株式会社 | シリコーン樹脂組成物、シリコーン樹脂シート、シリコーン樹脂シートの製造方法および光半導体装置 |
| JP2014012769A (ja) * | 2012-07-04 | 2014-01-23 | Sekisui Chem Co Ltd | 粘着剤組成物、粘着テープ、及び、ウエハの処理方法 |
| WO2015000150A1 (en) | 2013-07-03 | 2015-01-08 | Henkel IP & Holding GmbH | High temperature debondable adhesive |
| JP2017519058A (ja) * | 2014-04-29 | 2017-07-13 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | 封止剤のためのポリカルボシロキサン含有硬化性組成物 |
| WO2015196345A1 (en) * | 2014-06-24 | 2015-12-30 | Henkel (China) Company Limited | 1k uv and thermal cure high temperature debondable adhesive |
| WO2016101129A1 (en) * | 2014-12-23 | 2016-06-30 | Henkel (China) Company Limited | 1k high temperature debondable adhesive |
-
2014
- 2014-06-24 WO PCT/CN2014/080578 patent/WO2015196345A1/en active Application Filing
- 2014-06-24 CN CN201480080122.4A patent/CN107001908B/zh not_active Expired - Fee Related
- 2014-06-24 EP EP14895595.8A patent/EP3161094B1/en not_active Not-in-force
- 2014-06-24 JP JP2016575056A patent/JP6479862B2/ja not_active Expired - Fee Related
- 2014-06-24 KR KR1020167036245A patent/KR102168052B1/ko active IP Right Grant
-
2015
- 2015-06-22 TW TW104119959A patent/TWI676662B/zh not_active IP Right Cessation
-
2016
- 2016-12-07 US US15/371,601 patent/US10280349B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3438936A (en) * | 1967-10-06 | 1969-04-15 | Gen Electric | Modified cyclotetrasiloxane polymers |
| WO2013181801A1 (en) * | 2012-06-06 | 2013-12-12 | Henkel Corporation | Vinyl carbosiloxane resins |
| CN103820036A (zh) * | 2014-02-21 | 2014-05-28 | 中国科学院长春应用化学研究所 | 一种胶粘剂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6479862B2 (ja) | 2019-03-06 |
| JP2017527636A (ja) | 2017-09-21 |
| KR102168052B1 (ko) | 2020-10-21 |
| US20170081574A1 (en) | 2017-03-23 |
| TWI676662B (zh) | 2019-11-11 |
| US10280349B2 (en) | 2019-05-07 |
| EP3161094A4 (en) | 2018-02-28 |
| EP3161094B1 (en) | 2019-02-13 |
| TW201610064A (zh) | 2016-03-16 |
| CN107001908A (zh) | 2017-08-01 |
| KR20170023010A (ko) | 2017-03-02 |
| WO2015196345A1 (en) | 2015-12-30 |
| EP3161094A1 (en) | 2017-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108472926B (zh) | 可剥离组合物 | |
| US9850409B2 (en) | High temperature debondable adhesive | |
| KR101822197B1 (ko) | 무용제형 부가형 실리콘 점착제 조성물 및 점착성 물품 | |
| KR102539917B1 (ko) | 경화성 및 광학적으로 투명한 감압성 접착제 및 그의 용도 | |
| JP5592330B2 (ja) | 仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法 | |
| CN107001908B (zh) | 单组分uv和热固化高温可脱粘的胶粘剂 | |
| US20170283671A1 (en) | 1K High Temperature Debondable Adhesive | |
| JP2012144616A (ja) | 仮接着材組成物、及び薄型ウエハの製造方法 | |
| TWI743238B (zh) | 黏著薄片 | |
| JP2020117654A (ja) | 紫外線硬化型シリコーン接着剤組成物および積層体の製造方法 | |
| KR20180048658A (ko) | 점착 시트 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 |