CN106991466A - Double-interface smart card and its manufacture method - Google Patents
Double-interface smart card and its manufacture method Download PDFInfo
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- CN106991466A CN106991466A CN201710223681.1A CN201710223681A CN106991466A CN 106991466 A CN106991466 A CN 106991466A CN 201710223681 A CN201710223681 A CN 201710223681A CN 106991466 A CN106991466 A CN 106991466A
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- plastic
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000004033 plastic Substances 0.000 claims abstract description 118
- 229920003023 plastic Polymers 0.000 claims abstract description 118
- 239000000463 material Substances 0.000 claims abstract description 58
- 238000003801 milling Methods 0.000 claims abstract description 35
- 239000007769 metal material Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 2
- 238000012797 qualification Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 54
- 229910052751 metal Inorganic materials 0.000 description 54
- 238000004891 communication Methods 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- -1 almag Inorganic materials 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention provides a kind of double-interface smart card and its manufacture method, and smart card includes card body, and card body includes plastic layer and the rigid material layer positioned at plastic layer side, and antenna is embedded with plastic layer；Wherein, plastic layer, which is provided with mounting seat, mounting seat, is provided with mounting groove, and IC chip is arranged in mounting groove；The first mounting hole is provided with rigid material layer, the first mounting hole is the through hole of the upper and lower surface through rigid material layer, and mounting seat is located in the first mounting hole, and the inwall adjoining of the perisporium of mounting seat and the first mounting hole；The electric contact of IC chip is exposed on the surface of smart card.This method, which is included on the plastic plate for be embedded with antenna, encapsulates IC chip；Milling is carried out to plastic plate；Rigid material plate is bonded on the side of plastic plate, IC chip is located in the first mounting hole, and the electric contact of IC chip is exposed on the surface of smart card.The present invention can improve the production efficiency and product qualification rate of smart card, and be prevented effectively from the damage of IC chip.
Description
Technical field
The present invention relates to field of intelligent cards, more particularly, to a kind of double-interface smart card and this double-interface smart card
Manufacture method.
Background technology
Smart card, which is also known as in chip, IC-card or CPU card, smart card, is generally integrated a chip, and chip can be run
The operating system COS of smart card, and various application modules can be run in the operating system of smart card, such as pay
Application module so that smart card possesses payment function.The common smart card with payment function includes bank card, public affairs
Hand over card etc..
Smart card generally includes the card body of sheet, is packaged with IC chip on card body, and the card body of traditional smart card
Mainly make made of plastic, so, technique is simple during encapsulation IC chip, is also very easy to realize.However, with science and technology hair
Exhibition, people it is also proposed higher requirement to the material of smart card, for example, it is desirable to be made using rigid materials such as metals
Smart card, people attempt to be gone to make high-end bank card, consumption card, the various cards of daily use with various metal materials.By
Seem air, luxurious, high-grade and have feel in the card of metal material, it is very popular.
Existing smart card develops into double-interface card from traditional single interface card, and double-interface card refers to that smart card has
The smart card that contact communicates with two kinds of communication modes of contactless communication.When realizing contact communication, it is necessary on smart card
Multiple electric contacts are set, and smart card is communicated by multiple electric contacts with the electric contact on terminal device.Therefore, smart card
The upper electrical contact of IC chip needs to be exposed on the surface of smart card.When realizing contactless function, it is necessary in smart card
Antenna is set, the antenna for transmission signal is also provided with terminal device, thus smart card close to terminal device when, pass through intelligence
Antenna in card sends, receives data, so as to complete the communication with terminal device.
Contactless communication such as is realized on the smart card that metal is made, due to needing that antenna is set in smart card, but
Metal has the characteristic of shielding electromagnetic wave, allows the antenna of the interior encapsulation of smart card can not receive the transmission of the terminal devices such as card reader
Signal, so that contactless communication function can not be realized.Therefore, current metal smart card is realizing contactless communication function
When, smart card is made using mixing material.
As shown in Figure 1, existing smart card is provided with plastic layer 10 and the metal level 15 positioned at the side of plastic layer 10,
It is embedded into antenna 11 in plastic layer 10, and IC chip 17 is encapsulated in metal level 15.Therefore, setting an installation in metal level 15
Seat 16, IC chip 17 is encapsulated in mounting seat 16.
When manufacturing this smart card, antenna 11 is embedded in plastic layer 10 first, then the plastics that antenna 11 will be embedded with
Layer 10 is adhered to the side of metal level 15, forms one piece of smooth card.Then, using process equipment, such as milling device is to viscous
The card of conjunction is processed, i.e., a groove for being used to encapsulate IC chip 17 is milled out in metal level 15, and form mounting seat 16.
Then, in addition it is also necessary to milling is carried out to the regional area of plastic layer 10 and the termination of antenna 11 is found out, and the end of antenna 11 is allowed
Head exposes outside plastic layer 10., it is necessary to which antenna 11 to be connected to the bottom of IC chip 17 when IC chip 17 is encapsulated in into mounting seat 16
Portion, so that the electrical connection of IC chip 17 and antenna 11 is realized, and it also requires IC chip 17 is encapsulated in mounting seat 16, it is such as logical
Cross glue etc. IC chip 17 is bonded in mounting seat 16.
But, the processing technology of existing smart card is extremely complex, and there is problems with：It is conventional card system first
Making business's equipment directly can not process and make metal card, also, in milling metal, metal will produce substantial amounts of heat, these
Heat will cause the damage of plastic layer 10 and antenna 11, therefore, when carrying out Milling Process to metal level 15, it is necessary to card
Coolant is irrigated, and coolant can destroy plastic layer 10 speciality of itself, cause the scrappage of smart card very high.Furthermore, to gold
When belonging to the progress Milling Process of layer 15, the chip of generation can pollute the color of the plastic layer 10 at the back side.Finally, existing processing technology
In the smart card produced, the bonding force between mounting seat 16 in IC chip 17 and metal level 15 can be excessively poor, causes IC cores
Piece 17 easily comes off from mounting seat 16.
The content of the invention
The problem of in order to solve above-mentioned, the main object of the present invention is to provide a kind of double interfaces intelligence of simple production process
Card.
It is a further object of the present invention to provide the manufacture method of a kind of manufacture efficiency height and the good double-interface smart card of performance.
To realize above-mentioned main purpose, the double-interface smart card that the present invention is provided includes card body, and card body includes plastic layer
And the rigid material layer positioned at plastic layer side, and antenna is embedded with plastic layer；Wherein, plastic layer is provided with mounting seat,
Mounting groove is provided with mounting seat, IC chip is arranged in mounting groove；The first mounting hole is provided with rigid material layer, first installs
Hole is the through hole of the upper and lower surface through rigid material layer, and mounting seat is located in the first mounting hole, and the perisporium of mounting seat and the
The inwall adjoining of one mounting hole；The electric contact of IC chip is exposed on the surface of smart card.
From such scheme, due to the mounting seat for encapsulating IC chip is arranged on plastic layer, therefore on the double boundaries of manufacture
During the smart card of face, IC chip can be encapsulated in after plastic layer in advance, then the metal level that milling is formed into the first mounting hole is bonded
On plastic layer, it can so avoid plastic layer being adhered to after metal level again to metal level progress milling, it is to avoid to plastic layer
Cause to damage, and the production efficiency of double-interface smart card can be improved, while IC chip can also be avoided to be taken off from mounting seat
Fall, improve the performance of smart card.
One preferred scheme is that rigid material includes metal material, glass fiber material, carbon fibre material or wooden
Material.
As can be seen here, using the higher material of hardness, double interfaces intelligence is made in such as metal, glass fibre, carbon fiber material
The card body that can block, improves the feel of smart card, meets people to the increasingly increased requirement of smart card.
Further scheme is that rigid material layer is conductive material layer, is provided between rigid material layer and plastic layer
Screen layer, screen layer is provided with the second mounting hole, and the second mounting hole is the through hole through screen layer upper and lower surface, and second installs
The shape in hole is identical with the shape of the first mounting hole, in the projection of the plane where plastic layer, the first mounting hole and the second peace
Fill hole overlapping.
It can be seen that, the influence in order to avoid metal level to Antenna Operation sets screen layer between metal level and plastic layer, can
The radiofrequency signal sent with being prevented effectively from metal level to terminal devices such as card reader is absorbed by metal level, it is ensured that double interface intelligence
The contactless communication of card.
Further scheme is that screen layer is made up of permeability magnetic material, and screen layer is at least covered in plastic layer and is provided with
On the region of antenna.
As can be seen here, screen layer is made using permeability magnetic material, it can be ensured that the radiofrequency signal that terminal device is sent being capable of day
Line is received, and then ensures that double-interface smart card can use contactless mode to be communicated.
To realize above-mentioned another object, the manufacture method of intelligent cards that the present invention is provided is included in the plastics for being embedded with antenna
IC chip is encapsulated on plate；Milling is carried out to plastic plate：The region of plastic plate to being packaged with beyond IC chip carries out milling；By milling
Cut and to form the rigid material plate of the first mounting hole and be bonded on the side of plastic plate, the first mounting hole is through rigid material layer
The through hole of upper and lower surface, makes IC chip be located in the first mounting hole, and the electric contact of IC chip is exposed at the surface of smart card
On.
From such scheme, during manufacture double-interface smart card, first IC chip is encapsulated in after plastic layer, then by milling shape
Metal level into the first mounting hole is bonded on plastic layer, can so avoid plastic layer being adhered to after metal level again to metal
Layer carries out milling, it is to avoid the heat of generation causes to damage to plastic layer when carrying out milling to metal level, improves double interface intelligence
The production efficiency of card.
One preferred scheme is that IC chip is encapsulated on the plastic plate for be embedded with antenna to be included：It is being embedded with antenna
A mounting seat is provided with plastic plate, mounting seat is provided with mounting groove, IC chip is encapsulated in mounting groove.
As can be seen here, because IC chip is fixed in the mounting seat of plastic layer, IC chip is fixed such as by glue
It in mounting seat, can so avoid IC chip from being come off from mounting seat, improve the performance of double-interface smart card.
Brief description of the drawings
Fig. 1 is a kind of partial sectional view of existing double-interface smart card.
Fig. 2 is the structure decomposition figure of double-interface smart card embodiment of the present invention.
Fig. 3 is the structure decomposition figure of plastic layer and IC chip in double-interface smart card embodiment of the present invention.
Fig. 4 is the partial sectional view of double-interface smart card embodiment of the present invention.
Fig. 5 is the flow chart of manufacture method of intelligent cards embodiment of the present invention.
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment
The smart card of the present invention is to be provided with an IC chip, and IC chip energy in double-interface smart card, i.e. smart card
Contact communication and contactless communication are enough realized, therefore IC chip needs to set multiple electricity for being used to realize contact communication
Also need to be provided for the antenna for realizing contactless communication in contact, and smart card.In addition, the matter in order to lift smart card
Sense, the card body of smart card includes the rigid material layer being made up of rigid material, and the signified rigid material of the present invention is relative to PVC
For material, PET material, PC materials, PET-G material plastics, therefore hardness can be as this more than the material of the plastics such as PVC
The making material of the card body of the smart card of invention, i.e., rigid material of the invention is non-plastic material, such as metal, glass fibre,
The larger material of the hardness such as carbon fiber or wood materials.The solution of the present invention is entered exemplified by below using metal as rigid material
Row is described in detail.
Smartcard embodiment：
Referring to Fig. 2, the double-interface smart card of the present embodiment includes plastic layer 20, and the side of plastic layer 20 is provided with metal level
50, and it is provided between plastic layer 20 and metal level 50 screen layer 40.In the present embodiment, plastic layer 20, screen layer 40 with
And metal level 50 constitutes the card body of smart card, and card body is generally rectangular shaped, and is provided with chamfering on four angles.Certainly, card body
Shape can be customized particularly according to actual needs, therefore card body is not limited to rectangle, can also be circular or oval
The shapes such as shape.
Plastic layer 20 is made of plastics, and such as PVC material, PET material, PC materials, PET-G materials are made, and plastic layer 20 has
There are insulating properties, and the thickness of plastic layer 20 is smaller, between such as 0.2 millimeter to 0.4 millimeter, it is preferred that the thickness of plastic layer is only
There is 0.3 millimeter.Referring to Fig. 3, be provided with a mounting seat 22 on plastic layer 20, mounting seat 22 from the upper table of plastic layer 20 towards
Upper extension, and a mounting groove 23 is provided with mounting seat 22, IC chip 30 is in mounting groove 23.
, can be with plastics as shown in figure 4, being embedded with antenna 21 in plastic layer 20, it is preferred that antenna 21 is flexible antennas
The bending of layer 20 and bend, and will not be damaged because of the bending of plastic layer 20.And antenna 21 needs to electrically connect with IC chip 30,
Therefore the upper end of antenna 21 is electrically connected with the lower end of IC chip 30.Therefore antenna 21 extends upwardly to the lower section of mounting seat 22, and
And the lower end of IC chip 30 is provided with the terminal being connected with antenna 21.
In the present embodiment, the upper surface of IC chip 30 is provided with multiple electric contacts 32, multiple electric contacts of IC chip 30 32
In the outer surface of smart card, i.e., multiple electric contacts 32 need to be exposed at the outer surface of smart card, in order to smart card and card reader
Connection, so as to realize the communication between smart card and card reader.Also, IC chip 30 is provided with wafer close to the side of mounting seat 22
31, wafer 31 extends to the side of mounting seat 22.Also, in order to which IC chip 30 is fixed in mounting seat 22, the shape of mounting groove 23
Shape is consistent with the shape of the lower surface of IC chip 30, i.e., mounting groove 23 is step trough.Also, IC chip 30 can be viscous by glue etc.
Agent 35 is connect to be bonded in mounting seat 22.
Metal level 50 is made up of metal material, for example, by metal materials such as aluminium alloy, almag, stainless steel, copper alloys
It is made, and the surface of metal level 50 can also be painted or the processing such as coating pigment, so as to improve the aesthetic property of smart card.
A mounting hole 51 is provided with metal level 50, as it is clear from fig. 2 that mounting hole 51 is generally rectangular shaped, and four angles are provided with
Chamfering.In the present embodiment, mounting hole 51 is the through hole through the upper and lower surface of metal level 50, and the Internal periphery of mounting hole 51 should be with
The outline of mounting seat 22 is consistent, on the finished product to ensure double-interface smart card, and the outer wall of mounting seat 22 is interior with mounting hole 51
Wall is abutted.
Due to the conductive energy of metal level 50, therefore metal level 50 is actually what is be made of an electrically conducting material.Although my god
Line 21 is simultaneously not arranged on metal level 50, but if plastic layer 20 and metal level 50 are directly bonded, then double-interface smart card is leaned on
During nearly card reader, the radiofrequency signal that card reader is sent can be absorbed by metal level 50 and lead to not realize contactless lead to
Letter, accordingly, it would be desirable to set screen layer 40 between metal level 50 and plastic layer 20.
In the present embodiment, the shape of screen layer 40 is identical with the shape of metal level 50, and one also is provided with screen layer 40
Mounting hole 41, mounting hole 41 is on the through hole through the upper and lower surface of screen layer 40, and the shape and metal level 50 of mounting hole 41
The shape of through hole is identical.Specifically, in the projection of the plane where plastic layer 20, mounting hole 51 and the weight of mounting hole 41
It is folded, it so may insure mounting seat 22 through mounting hole 41 and in mounting hole 41.
In order to realize that screen layer can be made of permeability magnetic material in function of shielding, the present embodiment, such as using ferrite
Sheet material is made.Also, the thickness of screen layer 40 is less than the thickness of metal level 50, for example, the thickness of metal level 50 is 0.5 millimeter,
And the thickness of screen layer 40 only has 0.04 millimeter.
Certainly, the shape of screen layer is not necessarily to identical with the shape of metal level, and the area of screen layer can be with small
In the area of metal level, as long as screen layer can block the antenna on plastic layer completely, that is, screen layer needs at least
The region where antenna on plastic covering layer.
Due to metal level 50 is adhered to after plastic layer 20, metal level 50 will be abutted with mounting seat 22, in order to avoid IC cores
Piece 30 directly abutted with metal level 50 and cause IC chip 30 can not normal work, therefore the side wall of mounting seat 22 should be located at IC
It can't directly be contacted between the outside of chip 30, the i.e. perisporium of IC chip 30 and metal level 50, but be separated with mounting seat 22
Side wall.Because mounting seat 22 is also to be made of plastics, with insulating properties, therefore, it is possible to protect IC chip 30 will not be by gold
Belong to the influence of layer 50.
Manufacture method of intelligent cards embodiment：
The manufacture method of double-interface smart card is introduced with reference to Fig. 5.First, plastic layer of the manufacture with antenna, that is, perform step
Rapid S1.For example, being embedded into antenna in plastic plate, because plastic plate can be molded, therefore antenna can be put in injection
Put in mould, plastics are parcel antenna after injection molding, so as to form the plastic plate for being embedded with antenna.
Need to carry out milling machine operation to plastic plate due to follow-up, mill away antenna during in order to avoid milling, therefore antenna
The side of plastic plate, such as lower end close to plastic plate should be arranged on.For example, the gross thickness of double-interface smart card is in 0.8 milli
Rice is between 0.9 millimeter, then being molded the plastic plate to form thickness in 0.8 millimeter, but because subsequent handling is by milling
Fall 0.5 millimeter of thickness, therefore antenna should be arranged on the region within one of 0.3 millimeter of the side of plastic plate, with
Avoid being milled away,
Then, mounting seat is set on plastic plate, for example, milling forms mounting seat on plastic plate, and step S2 is performed, will
IC chip is encapsulated in mounting seat.For example, dripping glue in mounting seat, then IC chip is bonded in mounting seat.Certainly, will
, it is necessary to which IC chip is connected with the antenna in plastic plate during IC chip encapsulation, it is therefore desirable to which the end of antenna is extended up to
The lower end of mounting seat, the end of antenna is milled out, when milling forms mounting seat so that the end of IC chip and antenna be entered
Row welding or the electrical connection of other modes.
Then, step S3 is performed, milling processing is carried out to plastic plate, i.e., the thickness milling of plastic plate is obtained thinner.Due to
The thickness of the plastic plate formed is molded at 0.8 millimeter, and the thickness of metal level is at 0.5 millimeter, in order to avoid the thickness of smart card
Excessive, it is therefore desirable to which that plastic plate is milled away into 0.5 millimeter, the thickness of the plastic plate after milling only has 0.3 millimeter.Certainly, milling
Shi Buneng falls the area milling where mounting seat, therefore the plastic plate after milling is not one block of smooth sheet material, but in
Between there is the sheet material of raised mounting seat.
While plastic plate is made, in addition it is also necessary to manufacture metallic plate and barricade, that is, perform step S4 and step S5.
When making metallic plate, the mode of punching press can be used to be stamped and formed out the metallic plate of required shape, it is preferred that the thickness of metallic plate
Be stamped to form a mounting hole in 0.5 millimeter, and on metallic plate, the mounting hole be the first mounting hole, and first peace
The shape for filling the mounting seat in the shape and plastic plate in hole matches.
Barricade is also that can be made by the way of punching press, in the present embodiment, can be in the larger iron oxygen of one piece of area
The barricade of shape required for being stamped and formed out on body sheet material, and need to be stamped and formed out the second mounting hole, and the second peace on barricade
Size, the shape needs for filling hole are identical with size, the shape of the first mounting hole on metallic plate.
Finally, step S6 is performed, metallic plate, barricade are bonded in the side of plastic plate, so as to form complete intelligence
Card.During bonding, bonding agent can be coated between metallic plate and barricade, and coating is Nian Jie between barricade and plastic plate
Agent, is bonded metallic plate, barricade and plastic plate using bonding agent.Due to being provided with mounting seat, IC chip envelope on plastic plate
In mounting seat, therefore in step S6, metallic plate and barricade are arranged on into plastic plate has the side of mounting seat, and installs
Seat is through the mounting hole on metallic plate and barricade, and the outer wall of the inwalls of two mounting holes with mounting seat is abutted, so that it is guaranteed that
IC chip is firmly fixed on smart card.
It should be noted that what above-mentioned steps S4 and S5 were not necessarily performed successively, the making of plastic plate, metallic plate
Make and the making of barricade can be carried out independently, that is, can first make metallic plate, barricade, plastics are made afterwards
Plate, is finished as long as performing and making plastic plate, metallic plate and barricade before step S6.
In addition, the solution of the present invention is not limited to the card body for using metal as smart card, such as using carbon fiber, glass fibers
The card body that the larger materials of hardness such as dimension are made, can also realize the purpose of the present invention.
Because the double-interface smart card of the present invention can't be to being provided with harder firm of the material of antenna in manufacturing process
Property material layer carry out milling, milling be only plastic plate, because the hardness of plastic plate is smaller, the heat produced during milling also compared with
It is small, antenna will not be impacted, and the fraction defective of product is greatly reduced also without addition coolant in milling process,
And the production efficiency of smart card can also be heightened.Further, since metal fragment will not be produced in the milling process of plastic plate,
The pigment of plastics back would not be impacted, and IC chip is fixed on plastic layer, the encapsulation of IC chip is very firm.
Certainly, above-described embodiment is only the preferred embodiment of the present invention, during practical application, and the present invention is also more
Change, for example, the thickness of IC chip can be actually needed adjustment, also, according to the thickness of the thickness of IC chip adjustment insulation lamellar body
Degree etc., such change can also realize the purpose of the present invention.
Claims (10)
1. double-interface smart card, including：
Card body, the card body includes plastic layer and the rigid material layer positioned at the plastic layer side, and in the plastic layer
It is embedded with antenna；
It is characterized in that：
The plastic layer, which is provided with mounting seat, the mounting seat, is provided with mounting groove, and IC chip is arranged in the mounting groove；
The first mounting hole is provided with the rigid material layer, first mounting hole is above and below the rigid material layer
The through hole on surface, the mounting seat is located in first mounting hole, and the perisporium of the mounting seat and first mounting hole
Inwall adjoining；
The electric contact of the IC chip is exposed on the surface of the smart card.
2. double-interface smart card according to claim 1, it is characterised in that：
The rigid material layer is metal material layer, glass fiber layer, layer of carbon fiber material or wood materials layer.
3. double-interface smart card according to claim 2, it is characterised in that：
The rigid material layer is conductive material layer, and screen layer is provided between the rigid material layer and the plastic layer,
The screen layer is provided with the second mounting hole, and second mounting hole is the through hole through the screen layer upper and lower surface, and institute
The shape for stating the second mounting hole is identical with the shape of first mounting hole, in the projection of the plane where the plastic layer,
First mounting hole is overlapping with second mounting hole.
4. double-interface smart card according to claim 3, it is characterised in that：
The screen layer is made up of permeability magnetic material.
5. the double-interface smart card according to claim 3 or 4, it is characterised in that：
The screen layer is at least covered in the plastic layer and is provided with the region of the antenna.
6. the manufacture method of double-interface smart card, it is characterised in that including：
IC chip is encapsulated on the plastic plate for be embedded with antenna；
Milling is carried out to the plastic plate：The region of the plastic plate to being packaged with beyond the IC chip carries out milling；
The rigid material plate that milling is formed into the first mounting hole is bonded on the side of the plastic plate, and first mounting hole is
Through the through hole of the upper and lower surface of the rigid material layer, the IC chip is located in first mounting hole, and make described
The electric contact of IC chip is exposed on the surface of the smart card.
7. the manufacture method of double-interface smart card according to claim 6, it is characterised in that：
IC chip is encapsulated on the plastic plate for be embedded with antenna to be included：It is provided with the plastic plate for being embedded with the antenna
One mounting seat, the mounting seat is provided with mounting groove, and the IC chip is encapsulated in the mounting groove.
8. the manufacture method of double-interface smart card according to claim 7, it is characterised in that：
The rigid material plate is plate of conductive material；
When the rigid material plate that milling is formed into the first mounting hole is bonded in the plastic plate, milling is also formed second and pacified
The barricade in dress hole is bonded between the plastic plate and the rigid material plate；
Second mounting hole be through the screen layer upper and lower surface through hole, and the shape of second mounting hole with it is described
The shape of first mounting hole is identical, in the projection of the plane where the plastic layer, first mounting hole and described second
Mounting hole is overlapping.
9. the manufacture method of double-interface smart card according to claim 8, it is characterised in that：
The barricade is made up of permeability magnetic material.
10. the manufacture method of double-interface smart card according to claim 8 or claim 9, it is characterised in that：
The barricade is at least covered in the plastic plate and is provided with the region of the antenna.
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| CN201710223681.1A CN106991466A (en) | 2017-04-07 | 2017-04-07 | Double-interface smart card and its manufacture method |
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