CN104361381A - Double-interface card and method for packaging double-interface card - Google Patents
Double-interface card and method for packaging double-interface card Download PDFInfo
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- CN104361381A CN104361381A CN201410652145.XA CN201410652145A CN104361381A CN 104361381 A CN104361381 A CN 104361381A CN 201410652145 A CN201410652145 A CN 201410652145A CN 104361381 A CN104361381 A CN 104361381A
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Abstract
The invention discloses a double-interface card and a method for packaging the double-interface card. The method includes the following steps that a chip groove is milled in a card body where an antenna has already been embedded, wherein the chip groove comprises an inner groove and an outer groove, and metal parts of two connectors of the antenna are exposed on the groove face of the outer groove when the outer groove is milled; an annular hot melt glue sheet is laminated on the back face of the chip, wherein the annular hot melt glue sheet comprises two conductive parts and two insulating parts in the circumferential direction, and the two conductive parts are separated through the two insulating parts; the two conductive parts are attached to two antenna contacts on the back face of the chip respectively; the chip with the annular hot melt glue sheet laminated on the back face is sealed into the chip groove in the card body through heat, wherein the conductive parts of the annular hot melt glue sheet on the back face of the chip are connected with the metal parts of the two connectors of the antenna respectively. The chip of the double-interface card and the antenna of the card body are directly hot-pressed and bonded through the annular hot melt glue sheet, the process is simple, production efficiency is high, and production cost is low.
Description
[technical field]
The present invention relates to smart card, particularly relate to the method for packing of a kind of double-interface card and double-interface card.
[background technology]
Double-interface card closes chip coil by layer of PVC to form, based on single-chip, integrate the smart card of contact and non-contact interface, it has two operation interfaces, to the access of chip, by the contact of the way of contact, also by separated by a distance, can visit chip with RF-wise.Card only has a chip, two interfaces, identical operation can be performed by contact interface and non-contact interface.
Application for a patent for invention 201010580948.0 discloses a kind of method for making of double-interface smart card, comprise the steps: that (one) is in the center core layer (4) of card (11), go out two conductive welding disk putting holes, for placing conductive welding disk; (2) in described two conductive welding disk putting holes, conductive welding disk (6) is loaded respectively; (3) line burying machine is utilized to be implanted by coil in center core layer (4), and by antenna (7) starting point butt-joint to conductive welding disk (6); (4) closed assembly lamination, first places sheet material at described center core layer (4) upper and lower surface and carries out closed assembly, then the card that closed assembly is good is put into laminating machine carry out lamination, form card (11); (5) complete the Xiyanping injection of one deck groove (8) and two layers of groove (9) in card (11) last time, the milling depth of wherein said one deck groove (8) is less than the sheet thickness that center core layer (4) top laminates; (6) in the upper position corresponding to two conductive welding disk putting holes of described one deck groove (8), mill out a conductive hole (10) respectively, make described conductive welding disk (6) expose at the bottom of conductive hole; (7) conductive material (12) is filled in described two conductive holes (10); (8) by the two ends butt-joint of antenna to pad (2) place on chip (1), namely form described double-interface smart card after further encapsulation process.
Disclosed in this application for a patent for invention, the method for making of double-interface smart card needs to mill out conductive hole, and is filled into by conductive material in described two conductive holes, and manufacturing procedure is many, and efficiency is low, production cost is higher.
Patent application 201210473695.6 discloses a kind of method for packing of double-interface card, the step comprised is: groove milling in the card of having buried antenna, antenna terminal to be exposed during groove milling, and the insulation course of antenna terminal will be ground off, the conductive antenna heart is exposed; Or the embedding sheet metal having welding on card internal antenna, should exposing sheet metal milling during groove milling; Synchronously, at the antenna contacts place spot printing tin cream of chip to be packaged, other places beyond antenna contacts and chip center's silicon gel part are mounted and are coated with hot melt adhesive or other jointing materials; Then to tin cream and hot melt adhesive heating, and chip is put into groove card milling out and comes, according to the temperature and time preset hot pressing carried out to chip and cold pressing.
Although the method for packing of double-interface card does not need milling conductive hole disclosed in this application for a patent for invention, but need at the antenna contacts place spot printing tin cream at chip to be packaged, other places beyond antenna contacts and chip center's silicon gel part are mounted and are coated with hot melt adhesive or other jointing materials, be complex process equally, efficiency is low, production cost is higher.
[summary of the invention]
The technical problem to be solved in the present invention is to provide that a kind of operation is simple, production efficiency is higher, the method for packing of the double-interface card that production cost is lower.
Another technical matters that will solve of the present invention is to provide that a kind of production process is simple, production efficiency is higher, lower-cost double-interface card.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is, a kind of method for packing of double-interface card, comprises the following steps:
101, milling chip groove in the card of having buried antenna, chip groove comprise inside groove and water jacket, on the groove face of water jacket, expose the metallic member of antenna two joints during milling water jacket;
102, chip back pressing annular hot-melt film, annular hot-melt film circumferentially comprises two conductive parts and two insulation divisions, and two conductive parts are separated by two insulated parts; Two conductive parts fit in chip back two antenna contacts respectively;
103, be heat sealed in the chip groove in card by the chip of back side pressing annular hot-melt film, the antenna contacts of chip back and antenna terminal link together by the conductive part of annular hot-melt film.
The method for packing of above-described double-interface card, antenna terminal by antenna line body in one plane alternating bending formed.
The method for packing of above-described double-interface card, step 102 comprises the following steps:
301, go out chip package emptiness avoiding hole in hot melt adhesive material strip upper punch, hot melt adhesive material strip combines by the conductive part of bar shaped is alternate with the insulation division of bar shaped, and the conductive part of bar shaped cuts off by encapsulating emptiness avoiding hole;
302, the back side that the hot melt adhesive material strip of hole punch is hot-pressed onto chip material strip is completed chip for glue;
303, with rushing Chip mold by out die-cut from chip material strip for the chip getting glue ready.
A kind of double-interface card, comprise card, chip and annular hot-melt film, be embedded with antenna in card, card comprises chip groove, and chip package is in chip groove; Annular hot-melt film circumferentially comprises two conductive parts and two insulation divisions, and two conductive parts are separated by two insulated parts; Chip groove comprise inside groove and water jacket, the groove face of water jacket exposes the metallic member of antenna two joints; Annular hot-melt film is between chip back and water jacket groove face, and the upper surface of annular hot-melt film conductive part is adhered in the antenna contacts of chip back, and lower surface is adhered on the joint of antenna, realizes the electrical connection of antenna and chip.
Above-described double-interface card, antenna terminal by antenna line body in one plane alternating bending formed.
Above-described double-interface card, the conductive part of annular hot-melt film is conductive hot melt glue, and insulation division is ordinary hot melten gel.
The chip of double-interface card of the present invention and the antenna of the card direct heat pressure adhesive of annular hot-melt film, technique is simple, and production efficiency is high, production cost is low.
[accompanying drawing explanation]
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the stereographic map of embodiment of the present invention double-interface card.
Fig. 2 is the stereographic map before the heat-sealing of embodiment of the present invention double-interface card.
Fig. 3 is the front view of the complete chip groove of milling in embodiment of the present invention double-interface card card.
Fig. 4 is that A in Fig. 3 is to cut-open view.
Fig. 5 is the partial enlarged drawing at I position in Fig. 4.
Fig. 6 is the partial enlarged drawing at II position in Fig. 5.
Fig. 7 is the enlarged partial sectional view that embodiment of the present invention double-interface card has sealed rear chip back antenna contacts and antenna terminal position.
Fig. 8 is the schematic diagram of embodiment of the present invention double-interface card card coil and joint.
Fig. 9 is the stereographic map at the embodiment of the present invention double-interface card chip back side.
Figure 10 is that the embodiment of the present invention double-interface card chip back side is for the stereographic map after glue.
Figure 11 is the stereographic map of embodiment of the present invention double-interface card hot melt adhesive material strip.
Figure 12 is the stereographic map of embodiment of the present invention double-interface card chip material strip.
Figure 13 is the stereographic map that the embodiment of the present invention rushes sealing rubber die.
Figure 14 is the stereographic map of the embodiment of the present invention for glue pot weldering group.
Figure 15 is the stereographic map that the embodiment of the present invention rushes Chip mold.
[embodiment]
The structure of embodiment of the present invention double-interface card is as shown in Fig. 1 to 11, and comprise card (card base) 1, chip 2 and annular hot-melt film 3, be embedded with antenna 4 in card 1, card 1 comprises chip groove, and chip 2 is encapsulated in chip groove.
As shown in Figure 10, annular hot-melt film 3 circumferentially comprises two conductive parts 301 and two insulation divisions, 302, two conductive parts 301 are separated by two insulation divisions 302.The conductive part 301 of annular hot-melt film 3 is conductive hot melt glue, and insulation division 302 is ordinary hot melten gels.
Chip groove comprise inside groove 102 and water jacket 101, inside groove 102 is escape groove of chip package 201.The groove face 101a of water jacket 101 exposes the metallic member of antenna two joints 401.Antenna terminal 401 is formed by line body alternating bending on groove face 101a of antenna 4, has larger surface of contact to make the electrical joint of joint 401.
Chip 2, between chip 2 back side and water jacket groove face 101a, is bonded in the chip groove of card 1 by annular hot-melt film 3.The upper surface of annular hot-melt film 3 conductive part 301 is adhered in the antenna contacts 202 of two, chip 2 back side respectively, and lower surface is adhered on antenna 4 two joints 401 respectively, realizes the electrical connection of antenna 4 and chip 2.
The method for packing of the double-interface card of the above embodiment of the present invention comprises the following steps:
1. sharp antenna implanter implants antenna 4 inside of card 1, milling chip groove in the card 1 of having buried antenna 4, chip groove comprise inside groove 102 and water jacket 101, by the insullac mill off of antenna terminal enameled wire during milling water jacket 101, the groove face 101a of water jacket 101 exposes the metallic member of antenna terminal 401.
2. go out by hot melt adhesive material strip 100 upper punch of sealing rubber die shown in Figure 11 of rushing shown in Figure 13 the emptiness avoiding hole 303 that chip 2 encapsulates 201, hot melt adhesive material strip combines by the conductive part 301 (conductive hot melt glue) of bar shaped is alternate with the insulation division 302 (ordinary hot melten gel) of bar shaped, and the conductive part 301 (conductive hot melt glue) of bar shaped is divided into two pieces by encapsulating emptiness avoiding hole.
3. by the standby glue pot weldering group shown in Figure 14, the back side that the hot melt adhesive material strip 100 of hole punch is hot-pressed onto the chip material strip 200 shown in Figure 12 is completed chip for glue.
4. with the Chip mold that rushes shown in Figure 15, the chip 2 getting glue ready to be cut out from chip material strip 200 upper punch, now the chip 2 back side annular hot-melt film 3 of pressing.Two conductive parts 301 of annular hot-melt film 3 are separated by two insulation divisions 302.Two conductive parts 301 fit on antenna 4 contact, two, chip 2 back side respectively.
5. the chip 2 of back side pressing annular hot-melt film 3 is heat sealed in the chip groove in card 1, the conductive part 301 of annular hot-melt film 3 the antenna contacts 202 at chip 2 back side is linked together with the antenna terminal 401 in card.
The chip of double-interface card of the above embodiment of the present invention and the antenna of the card direct heat pressure adhesive of annular hot-melt film, technique is simple, and production efficiency is high, production cost is low.
Claims (6)
1. a method for packing for double-interface card, is characterized in that, comprises the following steps:
101, milling chip groove in the card of having buried antenna, chip groove comprise inside groove and water jacket, on the groove face of water jacket, expose the metallic member of antenna two joints during milling water jacket;
102, chip back pressing annular hot-melt film, annular hot-melt film circumferentially comprises two conductive parts and two insulation divisions, and two conductive parts are separated by two insulated parts; Two conductive parts fit in chip back two antenna contacts respectively;
103, be heat sealed in the chip groove in card by the chip of back side pressing annular hot-melt film, the antenna contacts of chip back and antenna terminal link together by the conductive part of annular hot-melt film.
2. the method for packing of double-interface card according to claim 1, is characterized in that, antenna terminal by antenna line body in one plane alternating bending formed.
3. the method for packing of double-interface card according to claim 1, is characterized in that, step 102 comprises the following steps:
301, go out chip package emptiness avoiding hole in hot melt adhesive material strip upper punch, hot melt adhesive material strip combines by the conductive part of bar shaped is alternate with the insulation division of bar shaped, and the conductive part of bar shaped cuts off by encapsulating emptiness avoiding hole;
302, the back side that the hot melt adhesive material strip of hole punch is hot-pressed onto chip material strip is completed chip for glue;
303, with rushing Chip mold by out die-cut from chip material strip for the chip getting glue ready.
4. a double-interface card, comprise card and chip, antenna is embedded with in card, card comprises chip groove, chip package, in chip groove, is characterized in that, comprises annular hot-melt film, annular hot-melt film circumferentially comprises two conductive parts and two insulation divisions, and two conductive parts are separated by two insulated parts; Chip groove comprise inside groove and water jacket, the groove face of water jacket exposes the metallic member of antenna two joints; Annular hot-melt film is between chip back and water jacket groove face, and the upper surface of annular hot-melt film conductive part is adhered in the antenna contacts of chip back, and lower surface is adhered on the joint of antenna, realizes the electrical connection of antenna and chip.
5. double-interface card according to claim 4, is characterized in that, antenna terminal by antenna line body in one plane alternating bending formed.
6. double-interface card according to claim 4, is characterized in that, the conductive part of annular hot-melt film is conductive hot melt glue, and insulation division is ordinary hot melten gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410652145.XA CN104361381A (en) | 2014-11-17 | 2014-11-17 | Double-interface card and method for packaging double-interface card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410652145.XA CN104361381A (en) | 2014-11-17 | 2014-11-17 | Double-interface card and method for packaging double-interface card |
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| Publication Number | Publication Date |
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| CN104361381A true CN104361381A (en) | 2015-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410652145.XA Pending CN104361381A (en) | 2014-11-17 | 2014-11-17 | Double-interface card and method for packaging double-interface card |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN108564159A (en) * | 2018-07-09 | 2018-09-21 | 东莞市芯安智能科技有限公司 | A kind of double-interface smart card |
| CN114421139A (en) * | 2022-04-01 | 2022-04-29 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
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| CN1338084A (en) * | 1999-11-29 | 2002-02-27 | Ask股份有限公司 | Method for making a non-contact hybrid smart card with an antenna support made of fibrous material |
| US20050001033A1 (en) * | 2001-11-03 | 2005-01-06 | Cheol Ho Cheong | Apparatus and method for recognizing code |
| CN101971194A (en) * | 2007-12-19 | 2011-02-09 | 谢玉莲 | Contact-less and dual interface inlays and methods for producing the same |
| CN102063637A (en) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | Intelligent double-interface card and welding packaging technology thereof |
| CN102969254A (en) * | 2012-11-21 | 2013-03-13 | 包邦枝 | Dual-interface card packaging method |
| CN103199024A (en) * | 2012-12-31 | 2013-07-10 | 向泽亮 | Manufacturing method and production device of double-interface card |
| CN204288258U (en) * | 2014-11-17 | 2015-04-22 | 深圳市华鑫精工机械技术有限公司 | A kind of double-interface card |
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2014
- 2014-11-17 CN CN201410652145.XA patent/CN104361381A/en active Pending
Patent Citations (7)
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| CN1338084A (en) * | 1999-11-29 | 2002-02-27 | Ask股份有限公司 | Method for making a non-contact hybrid smart card with an antenna support made of fibrous material |
| US20050001033A1 (en) * | 2001-11-03 | 2005-01-06 | Cheol Ho Cheong | Apparatus and method for recognizing code |
| CN101971194A (en) * | 2007-12-19 | 2011-02-09 | 谢玉莲 | Contact-less and dual interface inlays and methods for producing the same |
| CN102063637A (en) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | Intelligent double-interface card and welding packaging technology thereof |
| CN102969254A (en) * | 2012-11-21 | 2013-03-13 | 包邦枝 | Dual-interface card packaging method |
| CN103199024A (en) * | 2012-12-31 | 2013-07-10 | 向泽亮 | Manufacturing method and production device of double-interface card |
| CN204288258U (en) * | 2014-11-17 | 2015-04-22 | 深圳市华鑫精工机械技术有限公司 | A kind of double-interface card |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN108564159A (en) * | 2018-07-09 | 2018-09-21 | 东莞市芯安智能科技有限公司 | A kind of double-interface smart card |
| CN108564159B (en) * | 2018-07-09 | 2023-11-24 | 东莞市芯安智能科技有限公司 | Double-interface smart card |
| CN114421139A (en) * | 2022-04-01 | 2022-04-29 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
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Application publication date: 20150218 |
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