CN106952996A - A kind of LED packagings and its method for packing - Google Patents
A kind of LED packagings and its method for packing Download PDFInfo
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- CN106952996A CN106952996A CN201710280931.5A CN201710280931A CN106952996A CN 106952996 A CN106952996 A CN 106952996A CN 201710280931 A CN201710280931 A CN 201710280931A CN 106952996 A CN106952996 A CN 106952996A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 12
- 238000012856 packing Methods 0.000 title claims description 11
- 239000000843 powder Substances 0.000 claims abstract description 58
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 239000000741 silica gel Substances 0.000 claims description 24
- 229910002027 silica gel Inorganic materials 0.000 claims description 24
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 description 24
- 239000004033 plastic Substances 0.000 description 24
- 229920003023 plastic Polymers 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000005273 aeration Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of LED packagings, including substrate, chip and encapsulated layer, and chip is two or more；Substrate is provided with the mounting groove of respective amount, and chip is installed in corresponding mounting groove, and through hole is provided between adjacent fitting grooves；Encapsulated layer is filled in mounting groove through through hole, and encapsulated layer coating chip, encapsulated layer upper surface is provided with phosphor powder layer；LED packagings encapsulation operation of the present invention is simple, and packaging efficiency is high；Encapsulated layer is difficult for drop-off, and encapsulation is firm.
Description
Technical field
The present invention relates to LED field, and in particular to a kind of LED packagings and its method for packing.
Background technology
Light emitting diode（LED）Start since by extensive research, just in building decoration, backlight, car headlamp, room
The technical fields such as internal-external lighting, traffic signals are widely used.Because the field of application is extensive, therefore, light-emitting diodes
Pipe（LED）Packaging must be fulfilled for the use requirement of varying environment.
Now, the LED encapsulation structure of the market mainstream is encapsulated as using PLCC/EMC stent-types, it include copper sheet, plastics and
Silver surface processing is arranged at the support bowl of plastics forming, the bottom of support bowl, to strengthen reflection, improves packaging efficiency.But
It is that under hot and humid environment, the LED component encapsulated using PLCC/EMC stent-types is easy to fail, main table
It is now：Packaging plastic easy aging under hot and humid environment so that packaging plastic and bowl are easily separated, because packaging plastic is mixed with
Fluorescent material, the packaging plastic normal luminous easy to fall off that will directly affect LED component.
Application No. Chinese patent 2016109292875 discloses a kind of LED packagings, in metal substrate and white reflection
Compactness and viscosity good primary coat transition zone are set between plastic cement bowl, and applying transition zone itself, there is fine and close molecule to ask gap,
It can effectively prevent that the external substances such as steam from penetrating into, so that the ability of the high-temp resisting high-humidity resisting of LED packagings is effectively improved,
And then improve reliability and the life-span of LED component：Another aspect, because primary coat transition zone has good viscosity so that white is anti-
Adhesion between light plastic cement and metal substrate is improved with great generosity, can effectively prevent that steam from penetrating into, so that LED
The ability of the high-temp resisting high-humidity resisting of packaging is significantly increased.But the patent improves white reflection by primary coat transition zone
Adhesion between plastic cement and metallic plate, so as to improve the high temperature resistant moisture-proof ability of LED component, solve packaging plastic due to
Aging, caducous problem.
Therefore, the LED packagings that a kind of encapsulated layer is connected firmly are needed badly.
The content of the invention
In view of this, the present invention is intended to provide the LED packagings that a kind of encapsulated layer is connected firmly.
The purpose of the present invention is achieved through the following technical solutions：
A kind of LED packagings, including substrate, chip and encapsulated layer, the chip are two or more；The substrate is set
There is the mounting groove of respective amount, the chip is installed in the corresponding mounting groove, through hole is provided between the adjacent mounting groove；
The encapsulated layer is filled in the mounting groove through the through hole, and the encapsulated layer coats the chip, the encapsulated layer upper table
Face is provided with phosphor powder layer.
Encapsulated layer can contain fluorescent material.
During encapsulation, connected between adjacent fitting grooves by through hole, during encapsulation, it is only necessary in multiple mounting grooves any one
Inject packaging plastic, you can realize the encapsulation of multiple chips, encapsulation operation is simple, efficiency high；The packaging plastic filling of injection is full to install
Groove, it is cured after encapsulated layer laminating mounting groove inwall, and through through hole, under the fixation of through-hole wall, integrally formed envelope
Dress layer is connected firmly, and encapsulating structure stability is high.
It is preferred that, the mounting groove side is provided with groove, and the encapsulated layer corresponding part is provided with what is coordinated with groove shapes
It is raised.
Encapsulated layer side is correspondingly provided with the projection coordinated with groove, further strengthens encapsulated layer on three dimensions with installing
The connectivity robustness of groove, further strengthens the stability of encapsulating structure.
Further, the groove is dovetail groove, and the upper surface of the dovetail groove is the openend of dovetail groove.
The setting of dovetail groove, prevents that the raised of encapsulated layer side from deviating from dovetail groove from horizontal direction, further improves encapsulation
The connectivity robustness of layer and mounting groove, is prevented because encapsulated layer comes off, and influences LED component normal luminous.
It is preferred that, the mounting groove inwall is mat surface.
Mounting groove inner wall coarse, when encapsulated layer solidifies, packaging plastic can fully soak coarse mounting groove inwall, install
Groove inwall has bigger contact area with encapsulated layer, connects more firm；In addition, coarse surface can produce larger frictional force,
So as to prevent that encapsulated layer from occurring relative displacement with mounting groove, strengthen the connectivity robustness of encapsulated layer and mounting groove.
Further, the mounting groove and/or through hole and/or groove inner wall are provided with reflecting layer.
Mounting groove and/or through hole and/or groove inner wall are provided with reflecting layer, the blue light of chip sides and encapsulated layer upper surface
The light that is excited toward irradiation in mounting groove of fluorescent material reflected by reflecting layer, the phosphor powder layer of last encapsulated layer upper surface swashs
Hair, so as to improve LED component luminous flux.
Further, the encapsulated layer side is provided with phosphor powder layer.
Encapsulated layer side sets phosphor powder layer, and multiaspect and multi-angle are excited, so as to improve the luminous flux of LED component；It is many
The reflected layer reflection of phosphor powder layer that face is set, comes together in encapsulated layer upper surface, the light for further improving LED packagings leads to
Amount；Fluorescent material is evenly mixed in packaging plastic relative to prior art, part fluorescent material is blocked by surrounding fluorescent material, blue light swashs
Send out intensity inconsistent, or even part fluorescent material can not be stimulated by blue light, and cause non-uniform light, produce hot spot, it is each in encapsulated layer
Surface sets phosphor powder layer, lights uniform, is not likely to produce hot spot.
Further, concavees lens are provided between the encapsulated layer and the chip, the concavees lens surround the chip.
Chip is kept apart with encapsulated layer using concavees lens, it is to avoid encapsulated layer is directly contacted with chip, luminous chip list
Face produces high temperature, so as to cause the packaging plastic aging of encapsulated layer and chip contact surface, influences the luminous flux of LED component；It is another
Aspect, concavees lens have disperse function to the blue light of chip, the angle of blue light illumination are improved, so that preferably excitated fluorescent powder
Layer, improves the luminous flux of LED packagings.
The present invention also provides a kind of method for packing of LED component, comprises the following steps：
S1：Chip is installed in the mounting groove of substrate；
S2：Injection LED silica gel extremely fills full mounting groove in toward mounting groove；
S3：LED component is placed in prebake conditions 2h in baking box, 60 DEG C of baking temperature is cooled to room temperature；
S4：LED silica gel packagings layer upper surface coating phosphor powder layer after prebake conditions, is placed in the baking of baking box gradient increased temperature, cooling
To room temperature；
Wherein, phosphor powder layer is that LED silica gel and the mixing cured of fluorescent material form；
Gradient increased temperature is toasted：60 DEG C of bakings 4h, 80 DEG C of bakings 2h, 100 DEG C of bakings 1h, 120 DEG C of baking 2h.
Using prebake conditions by LED silica gel precuring, it is to avoid phosphor powder layer solidifies after directly solidifying, phosphor powder layer and encapsulated layer
State of cure difference is larger, causes to combine unstable, influence luminous flux；, can be by encapsulated layer, phosphor powder layer using gradient increased temperature
Bubble discharged through gradient increased temperature, prevent the luminous flux of aeration LED component；On the other hand, 60 DEG C of low temperature precuring fluorescence
Bisque, it is ensured that fluorescent material prevents that fluorescent material from settling in the distribution of phosphor powder layer, so as to influence the luminous flux of LED component.
It is preferred that, step S3Afterwards, phosphor powder layer is coated in mounting groove inwall, in prebake conditions 2h in baking box, baking temperature 60
DEG C, it is cooled to room temperature.
Encapsulated layer side sets phosphor powder layer, and multiaspect and multi-angle are excited, so as to improve the luminous flux of LED component；It is many
The reflected layer reflection of phosphor powder layer that face is set, comes together in encapsulated layer upper surface, the light for further improving LED packagings leads to
Amount；Fluorescent material is evenly mixed in packaging plastic relative to prior art, part fluorescent material is blocked by surrounding fluorescent material, blue light swashs
Send out intensity inconsistent, or even part fluorescent material can not be stimulated by blue light, and cause non-uniform light, produce hot spot, it is each in encapsulated layer
Surface sets phosphor powder layer, lights uniform, is not likely to produce hot spot；60 DEG C of low temperature precuring phosphor powder layers, it is ensured that fluorescent material is glimmering
The distribution of light bisque, prevents that fluorescent material from settling, so as to influence the luminous flux of LED component.
Further, fluorescent material and the mass ratio of LED silica gel are 1 in phosphor powder layer：20.
Fluorescent material is 1 with the mass ratio of LED silica gel：When 20, LED component luminous flux of the present invention is higher.
Beneficial effects of the present invention：
1. LED packagings provided by the present invention, during encapsulation, are connected between adjacent fitting grooves by through hole, during encapsulation, only need
Any one packaging plastic is injected in multiple mounting grooves, you can realize the encapsulation of multiple chips, encapsulation operation is simple, efficiency
It is high；The full mounting groove of packaging plastic filling of injection, it is cured after encapsulated layer laminating mounting groove inwall, and through through hole, in through hole
Under the fixation of inwall, integrally formed encapsulated layer is connected firmly, and encapsulating structure stability is high.
2. LED packagings provided by the present invention, the setting of dovetail groove, prevent the raised from horizontal side of encapsulated layer side
To abjection dovetail groove, the connectivity robustness of encapsulated layer and mounting groove is further improved, is prevented because encapsulated layer comes off, influence LED
Device normal luminous.
3. LED packagings provided by the present invention, mounting groove inner wall coarse, when encapsulated layer solidifies, packaging plastic energy
Coarse mounting groove inwall is fully soaked, mounting groove inwall has bigger contact area with encapsulated layer, connects more firm；In addition,
Coarse surface can produce larger frictional force, so as to prevent that encapsulated layer and mounting groove from occurring relative displacement, strengthen encapsulated layer with
The connectivity robustness of mounting groove.
4. LED packagings provided by the present invention, encapsulated layer side sets phosphor powder layer, multiaspect and multi-angle swash
Hair, so as to improve the luminous flux of LED component；The reflected layer reflection of phosphor powder layer that multiaspect is set, comes together in encapsulated layer upper surface,
Further improve the luminous flux of LED packagings；Fluorescent material is evenly mixed in packaging plastic relative to prior art, part is glimmering
Light powder is blocked by surrounding fluorescent material, and blue light excitation intensity is inconsistent, or even part fluorescent material can not be stimulated by blue light, and cause to light
It is uneven, hot spot is produced, phosphor powder layer is set on each surface of encapsulated layer, lights uniform, is not likely to produce hot spot.
5. the method for packing of LED component provided by the present invention, using prebake conditions by LED silica gel precuring, it is to avoid directly
Phosphor powder layer solidifies after solidification, and phosphor powder layer differs larger with encapsulated layer state of cure, causes, with reference to unstable, to influence light to lead to
Amount；Using gradient increased temperature, the bubble in encapsulated layer, phosphor powder layer can be discharged through gradient increased temperature, prevent aeration LED component
Luminous flux；On the other hand, 60 DEG C of low temperature precuring phosphor powder layers, it is ensured that fluorescent material prevents fluorescence in the distribution of phosphor powder layer
Powder is settled, so as to influence the luminous flux of LED component.
Brief description of the drawings
Fig. 1 is LED packaging sectional views in embodiment 1；
Fig. 2 is LED packaging sectional views in embodiment 2.
Wherein：10- substrates；101- mounting grooves；102- through holes；103- grooves；20- chips；30- encapsulated layers；40- fluorescent material
Layer；50- concavees lens.
Embodiment 1
As shown in figure 1, the present embodiment provides a kind of LED packagings, including substrate 10, chip 20 and encapsulated layer 30, chip 20
For two；Substrate 10 is provided with the mounting groove 101 of two, and chip 20 is installed in corresponding mounting groove 101, adjacent fitting grooves 101
Between be provided with through hole 102；Encapsulated layer 30 is filled in mounting groove 101, the coating chip 20 of encapsulated layer 30, encapsulated layer 30 through through hole 102
Upper surface is provided with phosphor powder layer 40；The side of mounting groove 101 is provided with groove 103, and the corresponding part of encapsulated layer 30 is provided with and the shape of groove 103
The projection that shape coordinates；Groove 103 is dovetail groove, and the upper surface of dovetail groove is the openend of dovetail groove；Mounting groove 101, through hole 102
Reflecting layer is provided with the inwall of groove 103；The side of encapsulated layer 30 is provided with phosphor powder layer 40；Provided with recessed between encapsulated layer 30 and chip 20
Lens 50, concavees lens 50 surround chip 20.
During encapsulation, connected between adjacent fitting grooves 103 by through hole 102, during encapsulation, it is only necessary in two mounting grooves 101
In any one injection packaging plastic, you can realize the encapsulation of multiple chips 20, encapsulation operation is simple, efficiency high；The encapsulation of injection
The full mounting groove 101 of glue filling, it is cured after the laminating inwall of mounting groove 101 of encapsulated layer 30, and through through hole 102, in through hole 102
Integrally formed encapsulated layer 30 is connected firmly under the fixation of inwall, and encapsulating structure stability is high.
The side of encapsulated layer 30 is correspondingly provided with the projection coordinated with groove 103, further strengthens encapsulated layer on three dimensions
30 with the connectivity robustness of mounting groove 101, further strengthen the stability of encapsulating structure.
The setting of dovetail groove, prevents that the raised of the side of encapsulated layer 30 from deviating from dovetail groove from horizontal direction, further improves envelope
The connectivity robustness of layer 30 and mounting groove 101 is filled, is prevented because encapsulated layer 30 comes off, LED component normal luminous is influenceed.
Encapsulated layer 30 sets phosphor powder layer 40 sideways, and LED packagings multiaspect and multi-angle are excited, so as to improve LED
The luminous flux of device；The reflected layer of phosphor powder layer 40 reflection that multiaspect is set, comes together in the upper surface of encapsulated layer 30, further improves
The luminous flux of LED packagings；Fluorescent material is evenly mixed in packaging plastic relative to prior art, part fluorescent material is by surrounding
Fluorescent material is blocked, and blue light excitation intensity is inconsistent, or even part fluorescent material can not be stimulated by blue light, and cause non-uniform light, production
Third contact of a total solar or lunar eclipse spot, phosphor powder layer 40 is set on each surface of encapsulated layer 30, is lighted uniform, is not likely to produce hot spot.
Chip 20 is kept apart with encapsulated layer 30 using concavees lens 50, it is to avoid encapsulated layer 30 is directly contacted with chip 20, sent out
The surface of chip 20 of light produces high temperature, so as to cause the packaging plastic aging of encapsulated layer 30 and the contact surface of chip 20, influences LED component
Luminous flux；On the other hand, concavees lens 50 have disperse function to the blue light of chip 20, improve the angle of blue light illumination, so that
Preferably excitated fluorescent powder layer 40, improves the luminous flux of LED packagings.
Embodiment 2
As shown in Fig. 2 the present embodiment provides a kind of LED packagings, including substrate 10, chip 20 and encapsulated layer 30, chip 20
For two；Substrate 10 is provided with the mounting groove 101 of two, and chip 20 is installed in corresponding mounting groove 101, adjacent fitting grooves 101
Between be provided with through hole 102；Encapsulated layer 30 is filled in mounting groove 101, the coating chip 20 of encapsulated layer 30, encapsulated layer 30 through through hole 102
Upper surface is provided with phosphor powder layer 40.
Embodiment 3
The present embodiment provides a kind of LED packagings, including substrate 10, chip 20 and encapsulated layer 30, and chip 20 is two；Substrate
10 are provided with the mounting groove 101 of two, and chip 20 is installed in corresponding mounting groove 101, and through hole is provided between adjacent fitting grooves 101
102；Encapsulated layer 30 is filled in mounting groove 101 through through hole 102, the coating chip 20 of encapsulated layer 30, and the upper surface of encapsulated layer 30 is provided with
Phosphor powder layer 40；The inwall of mounting groove 101 is mat surface.
The inner wall coarse of mounting groove 101, when encapsulated layer 30 solidifies, packaging plastic can fully soak coarse mounting groove 101
Inwall, the inwall of mounting groove 101 has bigger contact area with encapsulated layer 30, connects more firm；In addition, coarse mounting groove 101
Inwall can produce larger frictional force, so as to prevent that encapsulated layer 30 and mounting groove 101 from occurring relative displacement, strengthen encapsulated layer 30 with
The connectivity robustness of mounting groove 101.
Embodiment 4
The present embodiment provides a kind of LED packagings, including substrate 10, chip 20 and encapsulated layer 30, and chip 20 is 3；Substrate
10 are provided with the mounting groove 101 of 3, and chip 20 is installed in corresponding mounting groove 101, and through hole is provided between adjacent fitting grooves 101
102；Encapsulated layer 30 is filled in mounting groove 101 through through hole 102, the coating chip 20 of encapsulated layer 30, and the upper surface of encapsulated layer 30 is provided with
Phosphor powder layer 40；The side of mounting groove 101 is provided with groove 103, and the corresponding part of encapsulated layer 30 is provided with convex with the form fit of groove 103
Rise；Groove 103 is dovetail groove, and the upper surface of dovetail groove is the openend of dovetail groove；Mounting groove 101, through hole 102 and groove 103
Inwall is provided with reflecting layer；The side of encapsulated layer 30 is provided with phosphor powder layer 40.
Embodiment 5
The present embodiment provides a kind of LED packagings, including substrate 10, chip 20 and encapsulated layer 30, and chip 20 is two；Substrate
10 are provided with the mounting groove 101 of two, and chip 20 is installed in corresponding mounting groove 101, and through hole is provided between adjacent fitting grooves 101
102；Encapsulated layer 30 is filled in mounting groove 101 through through hole 102, the coating chip 20 of encapsulated layer 30, and the upper surface of encapsulated layer 30 is provided with
Phosphor powder layer 40；The side of mounting groove 101 is provided with groove 103, and the corresponding part of encapsulated layer 30 is provided with convex with the form fit of groove 103
Rise；Groove 103 is dovetail groove, and the upper surface of dovetail groove is the openend of dovetail groove；Mounting groove 101, the inwall of groove 103 are provided with anti-
Penetrate layer.
Embodiment 6
The present embodiment provides a kind of method for packing of LED component as claimed in claim 1 of LED packagings in a kind of embodiment 1,
Comprise the following steps：
S1：Chip 20 is installed in the mounting groove 101 of substrate 10；
S2：Injection LED silica gel extremely fills full mounting groove 101 in toward any one mounting groove 101；
S3：LED component is placed in prebake conditions 2h in baking box, 60 DEG C of baking temperature is cooled to room temperature；
S4：LED silica gel packagings layer 30 upper surfaces coating phosphor powder layer 40 after prebake conditions, is placed in the baking of baking box gradient increased temperature,
It is cooled to room temperature；Wherein, phosphor powder layer 40 is that LED silica gel and the mixing cured of fluorescent material form；Gradient increased temperature is toasted：60℃
Toast 4h, 80 DEG C of bakings 2h, 100 DEG C of bakings 1h, 120 DEG C of baking 2h；
Step S3Afterwards, phosphor powder layer 40 is coated in the inwall of mounting groove 101, in prebake conditions 2h in baking box, 60 DEG C of baking temperature, cooling
To room temperature.
Using prebake conditions by LED silica gel precuring, it is to avoid directly phosphor powder layer 40 solidifies after solidification, phosphor powder layer 40 with
The state of cure of encapsulated layer 30 difference is larger, causes to combine unstable, influence luminous flux；Using gradient increased temperature, can by encapsulated layer 30,
Bubble in phosphor powder layer 40 is discharged through gradient increased temperature, prevents the luminous flux of aeration LED component；On the other hand, it is 60 DEG C low
Warm precuring phosphor powder layer 40, it is ensured that fluorescent material prevents that fluorescent material from settling in the distribution of phosphor powder layer 40, so as to influence LED devices
The luminous flux of part.
Embodiment 7
The present embodiment provides a kind of method for packing of LED component as claimed in claim 1 of LED packagings in a kind of embodiment 2,
Comprise the following steps：
S1：Chip 20 is installed in the mounting groove 101 of substrate 10；
S2：Injection LED silica gel extremely fills full mounting groove 101 in toward any one mounting groove 101；
S3：LED component is placed in prebake conditions 2h in baking box, 60 DEG C of baking temperature is cooled to room temperature；
S4：LED silica gel packagings layer 30 upper surfaces coating phosphor powder layer 40 after prebake conditions, is placed in the baking of baking box gradient increased temperature,
It is cooled to room temperature；Wherein, phosphor powder layer 40 is that LED silica gel and the mixing cured of fluorescent material form；Gradient increased temperature is toasted：60℃
Toast 4h, 80 DEG C of bakings 2h, 100 DEG C of bakings 1h, 120 DEG C of baking 2h.
LED silica gel is the BQ-4305LED silica gel of Dongguan Sheng Libao organosilicons Science and Technology Ltd. in the present invention；Fluorescent material
For Ying Te Micron Technologys electricity（Shenzhen）Co., Ltd's YAG-02 fluorescent material.
Comparative example 1
Using the packaging technology of prior art：Fluorescent material is mixed with LED silica gel, is injected mounting groove 101, LED component is placed in roasting
100 DEG C of bakings 2h, 120 DEG C of baking 2h in case.
Comparative example 2
Using the packaging technology of prior art：LED silica gel is mixed into injection mounting groove 101, LED component is placed in 100 in baking box
DEG C baking 2h, 120 DEG C baking 2h；LED layer of silica gel upper surface after hardening sets phosphor powder layer 40；LED component is placed in roasting
100 DEG C of bakings 2h, 120 DEG C of baking 2h in case.
According to LED in integration ball light-metering flux testing example 1,2,4 in GB/T 2428-2009 and comparative example 1-2
Packaging luminous flux, wherein embodiment 1 and 4 use the method for packing of embodiment 6, and embodiment 2 uses the encapsulation side of embodiment
Method, chip power is 3W, and test result is as shown in table 1
| Project | Fluorescent material and LED silica gel quality mass ratioes | Luminous flux/lm |
| Embodiment 1 | 1：15 | 321 |
| Embodiment 1 | 1：20 | 336 |
| Embodiment 1 | 1：25 | 315 |
| Embodiment 2 | 1：20 | 309 |
| Embodiment 4 | 1：20 | 318 |
| Comparative example 1 | 1：20 | 285 |
| Comparative example 2 | 1：20 | 279 |
Table 1
It is the wherein specific implementation of the present invention above, it describes more specific and detailed, but can not therefore manage
Solve as the limitation to the scope of the claims of the present invention.For the person of ordinary skill of the art, present inventive concept is not being departed from
Under the premise of, various modifications and improvements can be made, these obvious alternative forms belong to protection scope of the present invention.
Claims (10)
1. a kind of LED packagings, including substrate, chip and encapsulated layer, it is characterised in that the chip be two or two with
On；The substrate is provided with the mounting groove of respective amount, and the chip is installed in the corresponding mounting groove, the adjacent installation
Through hole is provided between groove；The encapsulated layer is filled in the mounting groove through the through hole, and the encapsulated layer coats the chip, institute
Encapsulated layer upper surface is stated provided with phosphor powder layer.
2. LED packagings according to claim 1, it is characterised in that the mounting groove side is provided with groove, the encapsulation
Layer corresponding part is provided with the projection coordinated with the groove shapes.
3. LED packagings according to claim 2, it is characterised in that the groove is dovetail groove, the dovetail groove it is upper
Surface is the openend of dovetail groove.
4. LED packagings according to claim 1, it is characterised in that the mounting groove inwall is mat surface.
5. the LED packagings according to claim 3 or 4, it is characterised in that the mounting groove and/or through hole and/or groove
Inwall is provided with reflecting layer.
6. LED packagings according to claim 5, it is characterised in that the encapsulated layer side is provided with phosphor powder layer.
7. LED packagings according to claim 6, it is characterised in that provided with recessed between the encapsulated layer and the chip
Lens, the concavees lens surround the chip.
8. a kind of method for packing of LED component as claimed in claim 1, comprises the following steps：
S1：Chip is installed in the mounting groove of substrate；
S2：Injection LED silica gel extremely fills full mounting groove in toward mounting groove；
S3：LED component is placed in prebake conditions 2h in baking box, 60 DEG C of baking temperature is cooled to room temperature；
S4：LED silica gel packagings layer upper surface coating phosphor powder layer after prebake conditions, is placed in the baking of baking box gradient increased temperature, is cooled to
Room temperature；
Wherein, phosphor powder layer is that LED silica gel and the mixing cured of fluorescent material form；
Gradient increased temperature is toasted：60 DEG C of bakings 4h, 80 DEG C of bakings 2h, 100 DEG C of bakings 1h, 120 DEG C of baking 2h.
9. the method for packing of LED component according to claim 8, it is characterised in that, step S3Afterwards, coated in mounting groove inwall
Phosphor powder layer, in prebake conditions 2h in baking box, 60 DEG C of baking temperature is cooled to room temperature.
10. the method for packing of LED component according to claim 9, it is characterised in that in the phosphor powder layer fluorescent material with
The mass ratio of LED silica gel is 1：20.
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| CN201710280931.5A CN106952996A (en) | 2017-04-26 | 2017-04-26 | A kind of LED packagings and its method for packing |
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| CN201710280931.5A CN106952996A (en) | 2017-04-26 | 2017-04-26 | A kind of LED packagings and its method for packing |
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Cited By (1)
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|---|---|---|---|---|
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