CN106941762B - Manufacturing method of flexible circuit board - Google Patents
Manufacturing method of flexible circuit board Download PDFInfo
- Publication number
- CN106941762B CN106941762B CN201710263065.9A CN201710263065A CN106941762B CN 106941762 B CN106941762 B CN 106941762B CN 201710263065 A CN201710263065 A CN 201710263065A CN 106941762 B CN106941762 B CN 106941762B
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- CN
- China
- Prior art keywords
- product
- waste
- punching
- circuit board
- flexible circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a manufacturing method of a flexible circuit board, which comprises a product; the product is composed of five layers of structures, a base material layer is arranged in the middle of the product, copper foil layers are arranged on the upper side and the lower side of the base material layer, and a protective film layer is arranged on the outer side of each copper foil layer; the waste material with the thickness of 0.2mm is arranged at the outer edge of the product, and the waste material and the product are also composed of five layers of same structures; the method comprises the following steps of punching, wherein in the punching process, two steps of punching are carried out, in the first step, the waste is punched and a plurality of waste supporting blocks arranged at intervals are reserved, and in the second step, the waste supporting blocks are punched and cut; the manufacturing method of the flexible circuit board not only ensures the punching strength, but also effectively avoids the warping and the curling pressing damage of the product caused by too thin waste materials during punching.
Description
Technical Field
The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a flexible circuit board capable of preventing waste materials from curling edges and scratching the flexible circuit board.
Background
At present, in the product punching process in the flexible circuit board manufacturing in the electronic industry, as shown in the attached drawing 1-2, a product is of a five-layer structure and comprises a middle base material, copper foil layers are arranged on two sides of the base material, protective films are arranged on the outer sides of the copper foil layers, waste materials with the width of 0.2mm on the outer edge of the product are of a three-layer structure, and the copper foil layers are washed away in the copper etching process; when the product is punched, the waste material is of a three-layer structure, the supporting strength is not enough, the waste material is too thin, and the punched waste material is easy to warp and crush the product, so that the conductivity of the circuit board is influenced, and the qualified rate of the finished product made of the flexible circuit board is low. Therefore, a manufacturing method of the flexible circuit board capable of preventing the flexible circuit board from being curled by the waste materials and being scratched is developed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a manufacturing method of a flexible circuit board, which can prevent waste materials from curling and scratching the flexible circuit board.
In order to achieve the purpose, the invention adopts the technical scheme that: a method for manufacturing a flexible circuit board comprises an article; the product is composed of five layers of structures, a base material layer is arranged in the middle of the product, copper foil layers are arranged on the upper side and the lower side of the base material layer, and a protective film layer is arranged on the outer side of each copper foil layer; the waste material with the width of 0.2mm is arranged at the outer edge of the product, and the waste material and the product are formed by five layers of same structures; during punching, two-step punching is carried out, wherein in the first step, the waste is punched out and a plurality of waste supporting blocks arranged at intervals are reserved, and in the second step, the waste supporting blocks are punched out.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the manufacturing method of the flexible circuit board, the waste is formed by a five-layer structure, punching is carried out in two steps, the first step is to punch the waste and leave a plurality of waste supporting blocks, and the second step is to punch the waste supporting blocks, so that the punching strength is ensured, and the phenomena of warping and curling damage to products caused by too thin waste during punching are effectively avoided.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
FIG. 1 is a front view of a prior art flexible circuit board with scrap material;
FIG. 2 is a cross-sectional view of the scrap material of FIG. 1;
FIG. 3 is a front view of a flexible circuit board with waste in accordance with the present invention;
FIG. 4 is a cross-sectional view of the scrap material of FIG. 3;
wherein: 1. an article of manufacture; 2. waste materials; 3. a scrap support block; 4. a substrate layer; 5. a protective film layer; 6. and a copper foil layer.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
Fig. 3-4 illustrate a method of manufacturing a flexible circuit board according to the present invention, including a product 1; the product 1 is composed of five layers of structures, a base material layer 4 is arranged in the middle, copper foil layers 6 are arranged on the upper side and the lower side of the base material layer 4, and a protective film layer 5 is arranged on the outer sides of the copper foil layers 6; the waste material 2 with the width of 0.2mm is arranged on the outer edge of the product 1, and the waste material 2 is composed of five layers of the same structure as the product 1, which is not described again; when punching, the method comprises two-step punching, wherein in the first step, the waste material 2 is punched and cut off, and a plurality of waste material supporting blocks 3 arranged at intervals are reserved, and in the second step, the waste material supporting blocks 3 are punched and cut off.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the manufacturing method of the flexible circuit board, the waste is formed by a five-layer structure, punching is carried out in two steps, the first step is to punch the waste and leave a plurality of waste supporting blocks, and the second step is to punch the waste supporting blocks, so that the punching strength is ensured, and the phenomena of warping and curling damage to products caused by too thin waste during punching are effectively avoided.
The above-mentioned embodiments are merely illustrative of the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (1)
1. A method for manufacturing a flexible circuit board comprises an article; the product is composed of five layers of structures, a base material layer is arranged in the middle of the product, copper foil layers are arranged on the upper side and the lower side of the base material layer, and a protective film layer is arranged on the outer side of each copper foil layer; the outer edge of the product is provided with 0.2mm wide waste materials, and the method is characterized in that: and the waste material and the product are composed of five layers of same structures; when punching, the punching is carried out in two steps: the method comprises the steps of firstly, punching the waste materials out and leaving a plurality of waste material supporting blocks arranged at intervals, and secondly, punching the waste material supporting blocks out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106941762A CN106941762A (en) | 2017-07-11 |
| CN106941762B true CN106941762B (en) | 2020-07-07 |
Family
ID=59464689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710263065.9A Active CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106941762B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250900A (en) * | 1995-03-07 | 1996-09-27 | Matsushita Electric Ind Co Ltd | Multiple board and unit board by use of mulitple board and assembly method for unit board |
| JPH09148688A (en) * | 1995-11-28 | 1997-06-06 | Matsushita Electric Ind Co Ltd | Solder-precoated wiring board |
| JP5404118B2 (en) * | 2009-03-24 | 2014-01-29 | キヤノン株式会社 | Printed wiring board |
| CN108235569B (en) * | 2016-05-31 | 2020-01-14 | Oppo广东移动通信有限公司 | Circuit board jointed board |
-
2017
- 2017-04-20 CN CN201710263065.9A patent/CN106941762B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106941762A (en) | 2017-07-11 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171225 Address after: Wuzhong District Wuzhong road in Suzhou city of Jiangsu province 215104 No. 1083 Stonelake glorious city building 75 room 503 Applicant after: Jiang Mina Address before: 215164 Suzhou City, Jiangsu, Xiangcheng District Huangqiao Street Wood Lane Village Applicant before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180511 Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Applicant after: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. Address before: 215104 503 room, 75 Stone Lake Hua Town, 1083 Wuzhong Road, Wuzhong District, Suzhou, Jiangsu. Applicant before: Jiang Mina |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |