CN106941762B - Manufacturing method of flexible circuit board - Google Patents
Manufacturing method of flexible circuit board Download PDFInfo
- Publication number
- CN106941762B CN106941762B CN201710263065.9A CN201710263065A CN106941762B CN 106941762 B CN106941762 B CN 106941762B CN 201710263065 A CN201710263065 A CN 201710263065A CN 106941762 B CN106941762 B CN 106941762B
- Authority
- CN
- China
- Prior art keywords
- product
- waste
- punching
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106941762A CN106941762A (en) | 2017-07-11 |
CN106941762B true CN106941762B (en) | 2020-07-07 |
Family
ID=59464689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710263065.9A Active CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106941762B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子(深圳)有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08250900A (en) * | 1995-03-07 | 1996-09-27 | Matsushita Electric Ind Co Ltd | Multiple board and unit board by use of mulitple board and assembly method for unit board |
JPH09148688A (en) * | 1995-11-28 | 1997-06-06 | Matsushita Electric Ind Co Ltd | Solder-precoated wiring board |
JP5404118B2 (en) * | 2009-03-24 | 2014-01-29 | キヤノン株式会社 | Printed wiring board |
CN108235569B (en) * | 2016-05-31 | 2020-01-14 | Oppo广东移动通信有限公司 | Circuit board jointed board |
-
2017
- 2017-04-20 CN CN201710263065.9A patent/CN106941762B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子(深圳)有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
Also Published As
Publication number | Publication date |
---|---|
CN106941762A (en) | 2017-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171225 Address after: Wuzhong District Wuzhong road in Suzhou city of Jiangsu province 215104 No. 1083 Stonelake glorious city building 75 room 503 Applicant after: Jiang Mina Address before: 215164 Suzhou City, Jiangsu, Xiangcheng District Huangqiao Street Wood Lane Village Applicant before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
|
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180511 Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Applicant after: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. Address before: 215104 503 room, 75 Stone Lake Hua Town, 1083 Wuzhong Road, Wuzhong District, Suzhou, Jiangsu. Applicant before: Jiang Mina |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |