CN110769607A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN110769607A CN110769607A CN201910983259.5A CN201910983259A CN110769607A CN 110769607 A CN110769607 A CN 110769607A CN 201910983259 A CN201910983259 A CN 201910983259A CN 110769607 A CN110769607 A CN 110769607A
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- China
- Prior art keywords
- copper foil
- manufacturing
- protective film
- circuit board
- windowing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: cutting a copper foil with copper thickness meeting preset requirements; laminating a first insulating protective film on the first surface of the copper foil; windowing the first insulating protection film to form a first windowing area; attaching a PET protective film to the first windowing region of the first surface; pressing a dry film at least on a second surface of the copper foil, wherein the second surface is opposite to the first surface; etching and dry film removing are carried out on the copper foil; and removing the PET protective film. The manufacturing method of the circuit board can realize the manufacturing of the false hollow-out board by using simpler processes and materials, has simple process and high efficiency, is not easy to generate circuit fracture in the manufacturing process, avoids wasting materials and manpower, and saves the manufacturing cost. The appearance quality after the pressing is not problematic, the conductivity is normal, and the reliability is qualified.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
The hollowed-out board is a circuit board with circuits suspended on two sides, wherein insulating layers on two sides of a conductive circuit of a partial area are hollowed out. Along with the continuous change of market demands, the plate also has new change on structure, and a double-sided false hollow plate is produced for convenient use. The manufacturing method is different from a hollow-out board in that part of circuits are in a hollow-out state in the manufacturing process, but the part of circuits is in a non-hollow-out state in the finished product, so that the manufactured product is called as a pseudo hollow-out board. The traditional false hollow-out plate manufacturing process is complex and low in efficiency, and the problem that the hollow-out part circuit is broken is often easy to occur in the manufacturing process, so that the manufacturing efficiency is influenced, materials and manpower are wasted, and the manufacturing cost is increased.
Disclosure of Invention
Therefore, the invention provides the circuit board and the manufacturing method thereof, and aims to overcome the defects that the manufacturing process of the false hollow-out board in the prior art is complex, the efficiency is low, and the broken circuit at the hollow-out part is easy to occur in the manufacturing process, so that the manufacturing efficiency is influenced, the material and the labor are wasted, and the manufacturing cost is increased.
The technical scheme is as follows:
a manufacturing method of a circuit board comprises the following steps:
cutting a copper foil with copper thickness meeting preset requirements;
laminating a first insulating protective film on the first surface of the copper foil;
windowing the first insulating protection film to form a first windowing area;
attaching a PET protective film to the first windowing region of the first surface;
pressing a dry film at least on a second surface of the copper foil, wherein the second surface is opposite to the first surface;
etching and dry film removing are carried out on the copper foil;
and removing the PET protective film.
According to the manufacturing method of the circuit board, the manufacturing of the false hollow-out board can be achieved through the simple process and materials, the process is simple, the efficiency is high, the circuit is not prone to being broken in the manufacturing process, the waste of materials and manpower is avoided, and the manufacturing cost is saved. The appearance quality after the pressing is not problematic, the conductivity is normal, and the reliability is qualified. Specifically, the circuit board of the technical scheme needs to select the copper foil with the copper thickness meeting the preset requirement, and the copper foil is cut, and when the copper thickness is smaller than the preset requirement, the risk of circuit breakage exists in the manufacturing process of the product. And pressing a first insulating protective film on the first surface of the copper foil, and windowing the exposed circuit layer area corresponding to the first insulating protective film to form a first windowing area. At the moment, the first windowing region is a hollow region due to the fact that the first insulating protection film is not supported and protected, and a layer of PET protection film is attached to the first windowing region of the first face and used for protecting and supporting the circuit of the first windowing region. And then, pressing a dry film on at least the second surface, etching the copper foil and removing the dry film, and tearing off the PET protective film after the manufacture is finished.
In one embodiment, the method further comprises the steps of pressing a second insulating protection film on the second surface after etching and dry film removing are carried out on the copper foil, and windowing the second insulating protection film to form a second windowing area; the first windowing area and the second windowing area are respectively located at two ends of the copper foil.
In one embodiment, the circuit board formed by the copper foil, the first insulating protective film and the second insulating protective film is in a central symmetry structure.
In one embodiment, the first side is rough relative to the second side.
In one embodiment, the second surface is chemically cleaned before the second insulating protective film is laminated.
In one embodiment, the second surface is subjected to super-roughening treatment before the second insulating protective film is pressed.
In one embodiment, the predetermined copper thickness requirement is that the copper thickness of the copper foil is greater than or equal to 25 μm.
In one embodiment, after the copper foil is cut, the copper foil is isolated and protected, and the mounting and moving are performed to the next process.
In one embodiment, the copper foil is insulation protected with a sulfur-free paper.
The technical scheme also provides a circuit board manufactured by the manufacturing method of any one of the claims. According to the manufacturing method of the circuit board, the manufacturing of the false hollow-out board can be achieved through the simple process and materials, the process is simple, the efficiency is high, the circuit is not prone to being broken in the manufacturing process, the waste of materials and manpower is avoided, and the manufacturing cost is saved. The appearance quality after the pressing is not problematic, the conductivity is normal, and the reliability is qualified. Specifically, the circuit board of the technical scheme needs to select the copper foil with the copper thickness meeting the preset requirement, and the copper foil is cut, and when the copper thickness is smaller than the preset requirement, the risk of circuit breakage exists in the manufacturing process of the product. And pressing a first insulating protective film on the first surface of the copper foil, and windowing the exposed circuit layer area corresponding to the first insulating protective film to form a first windowing area. At the moment, the first windowing region is a hollow region due to the fact that the first insulating protection film is not supported and protected, and a layer of PET protection film is attached to the first windowing region of the first face and used for protecting and supporting the circuit of the first windowing region. And then, pressing a dry film on at least the second surface, etching the copper foil and removing the dry film, and tearing off the PET protective film after the manufacture is finished.
Drawings
Fig. 1 is a first schematic diagram illustrating a manufacturing process of a circuit board according to an embodiment of the invention;
fig. 2 is a schematic diagram of a second manufacturing process of the circuit board according to the embodiment of the invention;
fig. 3 is a schematic diagram of a third manufacturing process of the circuit board according to the embodiment of the invention;
FIG. 4 is a diagram of a finished circuit board according to an embodiment of the present invention;
FIG. 5 is a bottom view of FIG. 2;
FIG. 6 is a bottom view of FIG. 3 after etching and dry film removal;
FIG. 7 is a top view of FIG. 4;
fig. 8 is a bottom view of fig. 4.
Description of reference numerals:
10. copper foil; 11. a first bare line; 12. a second bare line; 20. a first insulating protective film; 30. a first windowed area; 40. a PET protective film; 50. a second insulating protective film; 60. a second windowed area; 70. and (3) drying the film.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
The manufacturing method of the circuit board shown in fig. 1-8 comprises the following steps:
cutting a copper foil 10 with copper thickness meeting the preset requirement;
laminating a first insulating protective film 20 on a first surface of the copper foil 10;
performing a window opening on the first insulating protective film 20 to form a first window opening region 30;
attaching a PET protective film 40 to the first window area 30 of the first surface;
pressing a dry film 70 at least on a second side of the copper foil 10, the second side being opposite to the first side;
etching the copper foil 10 and removing a dry film 70;
and removing the PET protective film 40.
The manufacturing method of the circuit board of the embodiment can realize the manufacturing of the false hollow-out board by using simpler processes and materials, has simple process and high efficiency, is not easy to generate circuit fracture in the manufacturing process, avoids wasting materials and manpower, and saves the manufacturing cost. The appearance quality after the pressing is not problematic, the conductivity is normal, and the reliability is qualified. Specifically, the circuit board of the embodiment needs to select the copper foil 10 with the copper thickness meeting the preset requirement, and cut the copper foil, and when the copper thickness is smaller than the preset requirement, the product has the risk of circuit fracture in the manufacturing process. A first insulating protective film 20 is laminated on a first surface of the copper foil 10, and a corresponding exposed circuit layer region on the first insulating protective film 20 is windowed to form a first windowed region 30. At this time, the first windowing region 30 is a hollow region because the support and protection of the first insulating protective film 20 are lost, so that in the present embodiment, a layer of PET protective film 40 is attached to the first windowing region 30 on the first surface to protect and support the circuit of the first windowing region 30, and because the PET protective film 40 is attached instead of the insulating protective film, the PET protective film 40 can be torn off after the manufacturing is completed. And then, pressing a dry film 70 on at least the second surface, etching the copper foil 10 and removing the dry film 70, and tearing off the PET protective film 40 after the manufacture is finished.
Since the circuit is manufactured by pressing the dry film 70 on the first surface and the second surface in the conventional process, the dry film 70 is pressed on the first surface and the second surface simultaneously in the present embodiment in order to facilitate film pressing. In other embodiments, the circuit may be formed by pressing the dry film 70 only on the second surface.
The manufacturing method of the present embodiment further includes, after etching and removing the dry film 70 from the copper foil 10, pressing a second insulating protective film 50 on the second surface, and windowing the second insulating protective film 50 to form a second windowing region 60, where the first windowing region 30 and the second windowing region 60 are respectively located at two ends of the copper foil 10. Namely, the two opposite sides of the copper foil 10 are provided with exposed circuits, namely, the first side is provided with a first exposed circuit 11, the second side is provided with a second exposed circuit 12, and the first exposed circuit 11 and the second exposed circuit 12 are respectively positioned at the two ends of the copper foil 10, so that the circuit board can be conveniently bent.
Specifically, the circuit board formed by the copper foil 10, the first insulating protective film 20 and the second insulating protective film 50 in this embodiment is a central symmetric structure, that is, the circuit board is located in the area and the position of the first exposed line 11 and the second exposed line 12, so that the circuit board is a central symmetric structure, and the circuit board is further convenient to bend and use.
Since the copper foil 10 has different roughness on both sides during processing, that is, both sides of the copper foil 10 are respectively a rough surface and a non-rough surface, in the present embodiment, the first surface is rough surface and the second surface is non-rough surface. The rough surface is easier to press on the insulating protective layer than the non-rough surface, so the first surface is selected to press on the first insulating protective film 20 first.
Before the second insulating protective film 50 is pressed, the second surface is chemically cleaned, impurities are cleaned and then pressed, and the pressing effect is better.
In addition, since the second surface is not rough, in order to ensure the pressing effect, the second surface is subjected to a super-roughening treatment before the second insulating protective film 50 is pressed, which is more convenient for pressing.
In the present embodiment, the predetermined copper thickness is required to be 25 μm or more in the copper thickness of the copper foil 10. When the copper thickness is less than 25 μm, there is a risk of wire breakage during the manufacturing process of the product. And the first and second insulating protective films 20 and 50 have a thickness ranging from 15 to 35 μm.
After the copper foil 10 is cut, the copper foil 10 is isolated and protected, and the loading and moving are carried out to the next procedure, so that the cut copper foil 10 is prevented from being polluted in the conveying process. Specifically, the copper foil 10 is isolated and protected by the sulfur-free paper, so that the copper foil 10 is prevented from being polluted by the isolation paper.
This embodiment also provides a circuit board manufactured by the manufacturing method according to any one of the above claims.
The manufacturing method of the circuit board of the embodiment can realize the manufacturing of the false hollow-out board by using simpler processes and materials, has simple process and high efficiency, is not easy to generate circuit fracture in the manufacturing process, avoids wasting materials and manpower, and saves the manufacturing cost. The appearance quality after the pressing is not problematic, the conductivity is normal, and the reliability is qualified. Specifically, the circuit board of the embodiment needs to select the copper foil 10 with the copper thickness meeting the preset requirement, and cut the copper foil, and when the copper thickness is smaller than the preset requirement, the product has the risk of circuit fracture in the manufacturing process. A first insulating protective film 20 is laminated on a first surface of the copper foil 10, and a corresponding exposed circuit layer region on the first insulating protective film 20 is windowed to form a first windowed region 30. At this time, the first windowing region 30 is a hollow region because the support and protection of the first insulating protective film 20 are lost, so that in the present embodiment, a layer of PET protective film 40 is attached to the first windowing region 30 on the first surface to protect and support the circuit of the first windowing region 30, and because the PET protective film 40 is attached instead of the insulating protective film, the PET protective film 40 can be torn off after the manufacturing is completed. And then, pressing a dry film 70 on at least the second surface, etching the copper foil 10 and removing the dry film 70, and tearing off the PET protective film 40 after the manufacture is finished.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The manufacturing method of the circuit board is characterized by comprising the following steps:
cutting a copper foil with copper thickness meeting preset requirements;
laminating a first insulating protective film on the first surface of the copper foil;
windowing the first insulating protection film to form a first windowing area;
attaching a PET protective film to the first windowing region of the first surface;
pressing a dry film at least on a second surface of the copper foil, wherein the second surface is opposite to the first surface;
etching and dry film removing are carried out on the copper foil;
and removing the PET protective film.
2. The method for manufacturing a circuit board according to claim 1, further comprising pressing a second insulating protective film on the second surface after etching and de-drying the copper foil, and windowing the second insulating protective film to form a second windowed area; the first windowing area and the second windowing area are respectively located at two ends of the copper foil.
3. The method of claim 2, wherein the copper foil, the first protective insulating film and the second protective insulating film form a circuit board having a centrosymmetric structure.
4. The method of claim 2, wherein the first surface is roughened relative to the second surface.
5. The method of claim 4, wherein the second surface is chemically cleaned before the second insulating protective film is laminated.
6. The method of claim 4, wherein the second surface is subjected to super-roughening treatment before the second insulating protective film is laminated.
7. The method of claim 1, wherein the predetermined copper thickness is equal to or greater than 25 μm.
8. The method of manufacturing a circuit board according to any one of claims 1 to 7, wherein the copper foil is cut, isolated and protected, and then moved to a next step.
9. The method of claim 8, wherein the copper foil is protected from the sulfur-free paper.
10. A circuit board characterized in that the circuit board is manufactured by the manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910983259.5A CN110769607A (en) | 2019-10-16 | 2019-10-16 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910983259.5A CN110769607A (en) | 2019-10-16 | 2019-10-16 | Circuit board and manufacturing method thereof |
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| CN110769607A true CN110769607A (en) | 2020-02-07 |
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| CN201910983259.5A Pending CN110769607A (en) | 2019-10-16 | 2019-10-16 | Circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757597A (en) * | 2020-08-04 | 2020-10-09 | 景旺电子科技(龙川)有限公司 | Method for manufacturing double-sided anodic aluminum oxide-based circuit board by cover uncovering method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101360397A (en) * | 2007-08-03 | 2009-02-04 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
| CN102523691A (en) * | 2011-12-27 | 2012-06-27 | 厦门达尔电子有限公司 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
| CN102917532A (en) * | 2011-08-04 | 2013-02-06 | 刘艾萍 | Basic circuit board with isolating membrane protection and preparation method thereof |
| CN104349582A (en) * | 2013-07-30 | 2015-02-11 | 古河电气工业株式会社 | Copper foil for circuit board, and circuit board |
| CN104470239A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Method for ameliorating lateral erosion of flexible hollowed-out circuit board |
| CN204442825U (en) * | 2015-01-21 | 2015-07-01 | 广州杰赛科技股份有限公司 | A kind of flexible PCB with finger vacancy section |
| CN205912321U (en) * | 2016-07-19 | 2017-01-25 | 深圳市迅捷兴科技股份有限公司 | Flexible circuit board with hollow out construction |
| CN107529283A (en) * | 2016-06-21 | 2017-12-29 | 欣兴同泰科技（昆山）有限公司 | The production technology of FPC |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
-
2019
- 2019-10-16 CN CN201910983259.5A patent/CN110769607A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101360397A (en) * | 2007-08-03 | 2009-02-04 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
| CN102917532A (en) * | 2011-08-04 | 2013-02-06 | 刘艾萍 | Basic circuit board with isolating membrane protection and preparation method thereof |
| CN102523691A (en) * | 2011-12-27 | 2012-06-27 | 厦门达尔电子有限公司 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
| CN104349582A (en) * | 2013-07-30 | 2015-02-11 | 古河电气工业株式会社 | Copper foil for circuit board, and circuit board |
| CN104470239A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Method for ameliorating lateral erosion of flexible hollowed-out circuit board |
| CN204442825U (en) * | 2015-01-21 | 2015-07-01 | 广州杰赛科技股份有限公司 | A kind of flexible PCB with finger vacancy section |
| CN107529283A (en) * | 2016-06-21 | 2017-12-29 | 欣兴同泰科技（昆山）有限公司 | The production technology of FPC |
| CN205912321U (en) * | 2016-07-19 | 2017-01-25 | 深圳市迅捷兴科技股份有限公司 | Flexible circuit board with hollow out construction |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
Non-Patent Citations (3)
| Title |
|---|
| 张建强 等: "《电子电路设计与实践》", 31 January 2019, 西安：西安电子科技大学出版社 * |
| 张玉龙 等: "《常用热固性塑料及其成型技术》", 31 October 2004, 浙江：浙江科学技术出版社 * |
| 金鸿 等: "《印制电路技术》", 31 January 2004, 北京：化学工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757597A (en) * | 2020-08-04 | 2020-10-09 | 景旺电子科技(龙川)有限公司 | Method for manufacturing double-sided anodic aluminum oxide-based circuit board by cover uncovering method |
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