CN106928650B - A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it - Google Patents

A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it Download PDF

Info

Publication number
CN106928650B
CN106928650B CN201511028636.8A CN201511028636A CN106928650B CN 106928650 B CN106928650 B CN 106928650B CN 201511028636 A CN201511028636 A CN 201511028636A CN 106928650 B CN106928650 B CN 106928650B
Authority
CN
China
Prior art keywords
filler
polyaryletherketone
fiber
sheet material
space network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201511028636.8A
Other languages
Chinese (zh)
Other versions
CN106928650A (en
Inventor
孟运东
杨中强
张艳华
方克洪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Technology Co Ltd
Original Assignee
Shengyi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shengyi Technology Co Ltd filed Critical Shengyi Technology Co Ltd
Priority to CN201511028636.8A priority Critical patent/CN106928650B/en
Publication of CN106928650A publication Critical patent/CN106928650A/en
Application granted granted Critical
Publication of CN106928650B publication Critical patent/CN106928650B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/028—Net structure, e.g. spaced apart filaments bonded at the crossing points
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/20—All layers being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0223—Vinyl resin fibres
    • B32B2262/023—Aromatic vinyl resin, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0246—Acrylic resin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/14—Mixture of at least two fibres made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0207—Particles made of materials belonging to B32B25/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0257—Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/16—Condensation polymers of aldehydes or ketones with phenols only of ketones with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Abstract

The invention belongs to technical field of copper clad laminate, are related to a kind of polyaryletherketone composite material, sheet material and circuit substrate containing filler.The composite material containing filler includes space network material and the filler that is dispersed in space network material hole, wherein the space network material is mainly mutually overlapped or bonded by polyaryletherketone fiber；The polyaryletherketone fiber in backbone structure mainly by selected from containing the Linear aromatic macromolecular compound of ketonic bond and ehter bond as repetitive unit, such as any one or at least two combination in polyether-ether-ketone, polyether-ketone and polyetherketoneetherketoneketone etc. and its modifier are made.The composite material containing filler, which assigns the sheet material obtained using it and circuit substrate, has dielectric constant in X, Y-direction isotropism and low dielectric constant and dielectric loss and excellent mechanical property, proof voltage energy and processing performance.

Description

A kind of polyaryletherketone composite material containing filler, sheet material and the circuit containing it Substrate
Technical field
The invention belongs to technical field of copper clad laminate, be related to a kind of polyaryletherketone composite material containing filler, sheet material and Contain its circuit substrate.
Background technique
In recent years, with information communication device high performance, multifunction and the development of networking, for high-speed transfer And processing large capacity information, operation signal are intended to higher frequency, the frequency of use Continued of electronic product, it is desirable that substrate material The dielectric constant of material is lower and lower, and dielectric loss requirement is smaller and smaller, and the uniformity of substrate dielectric constant is required to get well.
Currently, high-frequency high-speed circuit substrate obtains good high frequency performance using the resin of low-k, these are low The resin of dielectric constant mainly has polyphenylene oxide, cyanate, the thermosetting property tree being only made of carbon hydrogen element containing unsaturated double-bond Rouge, polytetrafluoroethylene (PTFE) and polyimide resin etc..And generally using glass fabric as reinforcing material.But glass fibers Tie up cloth dielectric constant it is minimum can only accomplish 3.7, therefore, influenced by glass fabric dielectric constant is bigger than normal, resin/glass The dielectric constant of the circuit substrate of fiber cloth system production is difficult to reduce.
On the other hand, in current high-frequency circuit board, because reinforcing material is braided material, so that circuit substrate exists There are anisotropy in the direction XY of plane, i.e., different in the dielectric properties through broadwise of braided material node and braided material. Therefore, high-frequency signal is on high-frequency circuit board when transmitting, can because it is each to dielectric properties it is different and cause on each route The weak degree of signal is different, and signal transmission delay degree is different, eventually leads to stable signal transmission and goes wrong.
Polyaryletherketone can be continued working in 260 DEG C or so in air, and highest can work in 310 DEG C of short time, and And more stable dielectric properties are kept at 260 DEG C or less, and have rigidity and hardness height, high temperature resistant, outstanding chemical resistance and Hydrolysis resistance, while there is high creep strength, fabulous dimensional stability, outstanding anti-ultraviolet property, outstanding resistance to High-energy radiation performance, and have many advantages, such as low combustible, it is few to produce cigarette in burning.From performance indicator, polyaryletherketone is The fabulous material of circuit substrate application aspect, but polyaryletherketone is difficult to use as epoxy resin.
The circuit substrate using organic fiber cloth as reinforcing material is mentioned in CN104582254, polyether-ether-ketone, which is used as, to be had Machine fiber cloth material is applied in circuit substrate.Polyether-ether-ketone is only used as a kind of dystectic material in the prior art, and Do not embody its application advantage completely, and the problem of the circuit substrate not can solve braided material anisotropy.
Thermosetting resin glue is mixed into using short glass fiber or aramid staple fiber as filler in CN102573276 In, it is subsequently used for circuit substrate production, to increase the intensity of thin plate.It mentions in the prior art using polyether-ether-ketone as thermosetting property The possible component of one of resin, but do not refer to its concrete application mode and feature.
Also it is applied to polyether-ether-ketone as a kind of thermoplastic material in template casting in CN1254512, but for that will gather Method of the ether ether ketone for thin circuit substrate does not refer to directly, and the method for being cast into thin plate finished product general on the implementation Rate is very low, and the intensity of its thin plate is also bad.
Summary of the invention
Based on the problems in prior art, it is multiple that one of the objects of the present invention is to provide a kind of polyaryletherketone containing filler Condensation material, the composite material include space network material and are dispersed in filling out in space network material hole Material.
In the present invention, the space network material mainly mutually overlapped or bonded by polyaryletherketone fiber and At；
In the present invention, the polyaryl ether ketone fiber is mainly by the various combination of ether and ketone group as repetitive unit In Linear aromatic macromolecular compound and its modified product any one or at least two combination be made.The poly- virtue Base ether ketone fiber is made by any one or at least two combination in polyether-ether-ketone, polyether-ketone and polyetherketoneetherketoneketone, And/or by any one in polyether-ether-ketone modifier, polyether-ketone modifier and polyetherketoneetherketoneketone modifier or extremely Few two kinds of combination is made.
In the present invention, those skilled in the art can the fiber-forming process according to disclosed in prior art obtain the present invention The polyaryletherketone fiber.Illustrative fiber-forming process such as, dry spinning, wet spinning, melt process and electrostatic Spin processes etc..
In the present invention, the modified polyether ether ketone can be used polyether-ether-ketone method of modifying disclosed in prior art and obtain It arrives, main modified method has particles filled polyether-ether-ketone, polyether-ether-ketone surface modified and polymer blending modification polyethers ether Ketone.The particles filled polyether-ether-ketone can for example change it by addition inorganic filler, metal powder and nanoparticle Property.Polyether-ether-ketone surface modification can be realized by plasma method or laser modified method.Further, it is also possible to pass through addition PEI, PTFE, PES and LCP carry out blending and modifying to polyether-ether-ketone.
In addition, polyether-ketone and polyetherketoneetherketoneketone can equally use the side similar with the modification of above-mentioned polyether-ether-ketone Method, it is only necessary to which above-mentioned polyether-ether-ketone is replaced with into polyether-ketone or polyetherketoneetherketoneketone.
In the present invention, the space network material refers to that polyaryletherketone fiber mutually overlaps or bond the nothing formed Woven fabric (non-woven cloth) can be sheet or bulk material.
Polyaryletherketone fiber is mutually overlapped or bonded first by the present invention forms space network material, and by its hole Evenly dispersed filler in gap.In the present invention, the composite material can also include in addition to space network material and filler Other components, but there are shapes by its any without containing other polyaryletherketone in addition to other of polyaryletherketone fibers form Substance of state, such as polyaryl ether ketone resin, powder, die casting film, dispersion liquid and organic fiber cloth etc. and other kinds of The organic fiber cloth of resin.
Non-woven fabrics (non-woven cloth) made of present invention use is mutually overlapped or bonded as polyaryletherketone fiber, without making Made with braided material (woven cloths), the polyaryletherketone of other existences (such as organic fiber cloth or die casting film) poly- containing filler Aryl ether ketones composite material is assigned has dielectric constant normal in X, Y-direction isotropism, low dielectric using the sheet material that it is obtained Several and dielectric loss and excellent proof voltage energy and processability.
In addition to this, the polyaryletherketone composite material containing filler also assigns sheet material following performance:
(1) it assigns the space network material excellent mechanical property since fiber orientation crystallizes, makes the strong of sheet material Spend relative in prior art film or die casting film strength and toughness it is higher, the defects of being not susceptible to crackle；
(2) since space network material has flourishing pore structure, functional filler can uniformly exist respectively In hole, being uniformly distributed for filler is realized, imparts sheet material specific function；
(3) since uniform filling is dispersed in hole, sheet material will not generate gap, avoid and directly adopt poly- virtue The sheet material that base ether ketone fiber hot pressing obtains increases hygroscopic disadvantage there are gap；
(4) since the space network material has flourishing pore structure, more fillers can be introduced into stereoscopic graticule In shape structural material, it is remarkably improved the content of filler.
In the present invention, it is preferred to be about with diameter between polyaryletherketone fiber in space network material The hole of 0.1-60 μm (such as 5 μm, 10 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 50 μm or 60 μm). Pore size in space network is impossible all identical, and the pore diameter of the space network material refers to The average value for maximum 20 pore diameters observed under the microscope.Hole in space network is irregular shape Shape, the pore diameter refer to the diameter for the maximum spherical that may pass through in hole.
In the present invention, the interfibrous hole of polyaryletherketone is the open pores with extraneous intercommunication, pore diameter pair The processing of composite material and quality have highly important influence.Pore diameter is bigger, and filler easily enters hole, is conducive to add Work, but filler is excessive in hole then will lead to the filler after hot pressing in composite material and excessively concentrate.Pore size and fibre diameter Between ratio it is particularly significant, preferably polyaryletherketone interfiber pore diameter is the 0.1 of polyaryletherketone fibre diameter ~30 times, such as 0.2 times, 0.8 times, 3 times, 6 times, 12 times, 15 times, 19 times, 22 times, 26 times, 28 times etc..It is current in order to be suitable for Common filler and fiber, and processing is taken into account, further preferred interfiber pore diameter is 0.1~50 μm.
The diameter of polyaryletherketone fiber and the porosity of space network determine the mean size of interfiber pore. Under the conditions of i.e. identical porosity, the diameter of fiber is bigger, then interfibrous pore diameter is bigger.In the present invention, porosity Size the number of filler that space network material can accommodate determined.The porosity of space network material is got over Greatly, then the filer content of composite material is generally higher, but porosity is excessive, then filler distribution can be made uneven, and composite wood Filler is easy to fall off in material, reduces the intensity of composite material.In order to facilitate selection raw material, the hole of the space network material Gap rate is preferably 40%-90%, and further preferred porosity is 50% to 85%.
In the present invention, the thickness of the space network material is bigger, and filler is well into space network material The difficulty of material is bigger, and thickness is smaller, then space network material is weaker to the limitation capability of filler.Polyaryletherketone fiber Diameter, porosity and application field are larger to the thickness effect of material, and specific thickness requirements are depending on the circumstances.It is preferred that Space network material with a thickness of 10 μm -500 μm.
Preferably, the diameter of the polyaryletherketone fiber be 0.01-100 μm, such as 0.1 μm, 0.5 μm, 1 μm, 2 μm, 2.5 μm, 3 μm, 5 μm, 7 μm, 9 μm, 10 μm, 13 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 100 μm.For The uniformity of sheet material after easy to process and hot pressing, it is preferably 0.1-50 μm, solid netted made of the fiber in the diameter range Structural material is easier to meet above-mentioned interfiber pore diametric requirements.
It, can also be containing good with polyaryletherketone compatibility in the polyaryletherketone fiber in order to reduce difficulty of processing Other polymers, including it is polystyrene, polyarylate, polyetherimide, polyether sulfone, polysulfones, polyolefin, polyester, polycarbonate, poly- In amide imide, polyamide and polytetrafluoroethylene (PTFE) etc. any one or at least two combination.
In the present invention, it is preferred to can also contain additive in the polyaryletherketone fiber, which includes function The auxiliary agents such as the nanoparticle and superfine fibre of energy property.
In the present invention, the space network material mainly mutually overlapped or bonded by polyaryletherketone fiber and At, it is intended that, the space network material only mutually can be overlapped or be bonded by polyaryletherketone fiber, can also be contained There are other fibers.For example, liquid crystalline polyester fiber, polyester fiber, poly- carbonic acid can also be contained in the space network material Ester fiber, polyethylene fibre, polypropylene fibre, Fypro, polyacrylonitrile fibre, polyimide fiber, polyphenylether fibre, Appointing in polyphenylene sulfide fibre, polytetrafluoroethylene fibre, styroflex, glass fibre, basalt fibre or carbon fiber etc. It anticipates a kind of or at least two combinations, shared mass ratio is less than 50% in space network material.
Preferably, in the present invention, the partial size of filler is less than the interfibrous pore diameter of polyaryletherketone.Preferably, it fills out The partial size D90 of material be 30 μm hereinafter, such as 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 2 μm, 3 μm, 7 μm, 11 μm, 15 μm, 18 μm, 21 μm, 24 μm or 27 μm, the D50 of further preferred filler is 0.1-5 μm, for example, 0.1 μm, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, 2.5 μm, 3 μm, 4 μm or 5 μm.
Preferably, the filler is inorganic filler and/or organic filler.
Preferably, the inorganic filler is selected from carbon black, silicon powder, aluminum oxide, titanate, metatianate, titanium dioxide Titanium, draw ratio are less than any one in the quartzy staple fiber of 20 staple glass fibre, draw ratio less than 20 or metal powder etc. Or at least two combination.
Preferably, the organic filler is selected from polyphenylene ether powder, pps powder, teflon resin powder, gathers In imide resin powder or rubber particle etc. any one or at least two combination.
Preferably, the wire feeding be functional filler, preferably dielectric ceramics filler, heat-resistant filler, fire-retardant filler, In heat filling, conductive filler, fluorescer, UV absorbent, magnetic fillers or reactive filler etc. any one or at least Two kinds of combination.
Preferably, the conductive filler is metal powder, draw ratio less than one of short fibre of 20 carbon fiber or at least two The combination of kind.
The second object of the present invention is to provide a kind of sheet material, and the sheet material is by the poly- aryl as described above containing filler The resin film that ether ketone composite material hot pressing obtains.
By the polyaryletherketone composite material hot pressing as described above containing filler, in hot pressing, partial size is less than hole The filler of diameter can be melted during forming sheet material or the polyaryletherketone fiber of adhesion is firmly blocked or adhered to In hole, polyaryletherketone fiber forms resin film in hot pressing, and then obtains sheet material.
The third object of the present invention is to provide a kind of preparation method of sheet material, the described method comprises the following steps:
(1) the space network material for mainly mutually being overlapped or being bonded by polyaryletherketone fiber and formed is incorporated fillers into In the hole of material, the polyaryletherketone composite material containing filler is formed；
(2) lamination formed by at least one polyaryletherketone composite material containing filler is obtained by way of hot pressing Sheet material.
In the present invention, the space network material mainly mutually overlapped or bonded by polyaryletherketone fiber and At；
In the present invention, the polyaryl ether ketone fiber is mainly by the various combination of ether and ketone group as repetitive unit In Linear aromatic macromolecular compound and its modified product any one or at least two combination be made.Such as polyethers In ether ketone, polyether-ketone and polyetherketoneetherketoneketone etc. and its modifier any one or at least two combination be made.
In the present invention, those skilled in the art can the fiber-forming process according to disclosed in prior art obtain the present invention The polyaryletherketone fiber.Illustrative fiber-forming process such as, dry spinning, wet spinning, melt process and electrostatic Spin processes etc..
In the present invention, the modified polyether ether ketone can be used polyether-ether-ketone method of modifying disclosed in prior art and obtain It arrives, main modified method has particles filled polyether-ether-ketone, polyether-ether-ketone surface modified and polymer blending modification polyethers ether Ketone.The particles filled polyether-ether-ketone can for example change it by addition inorganic filler, metal powder and nanoparticle Property.Polyether-ether-ketone surface modification can be realized by plasma method or laser modified method.Further, it is also possible to pass through addition PEI, PTFE, PES and LCP carry out blending and modifying to polyether-ether-ketone.
In addition, polyether-ketone and polyetherketoneetherketoneketone can equally use the side similar with the modification of above-mentioned polyether-ether-ketone Method, it is only necessary to which above-mentioned polyether-ether-ketone is replaced with into polyether-ketone or polyetherketoneetherketoneketone.
In the present invention, the space network material refers to that polyaryletherketone fiber mutually overlaps or bond the nothing formed Woven fabric (non-woven cloth) can be sheet or bulk material.
Polyaryletherketone fiber is mutually overlapped or bonded first by the present invention forms space network material, and by its hole Evenly dispersed filler in gap.In the present invention, the composite material can also include in addition to space network material and filler Other components, but there are shapes by its any without containing other polyaryletherketone in addition to other of polyaryletherketone fibers form Substance of state, such as polyaryl ether ketone resin, powder, die casting film, dispersion liquid and organic fiber cloth etc. and other kinds of The organic fiber cloth of resin.
Non-woven fabrics (non-woven cloth) made of present invention use is mutually overlapped or bonded as polyaryletherketone fiber, without making Made with braided material (woven cloths), the polyaryletherketone of other existences (such as organic fiber cloth or die casting film) poly- containing filler Aryl ether ketones composite material is assigned has dielectric constant normal in X, Y-direction isotropism, low dielectric using the sheet material that it is obtained Several and dielectric loss and excellent proof voltage energy and processability.
In addition to this, the polyaryletherketone composite material containing filler also assigns sheet material following performance:
(1) it assigns the space network material excellent mechanical property since fiber orientation crystallizes, makes the strong of sheet material Spend relative in prior art film or die casting film strength and toughness it is higher, the defects of being not susceptible to crackle；
(2) since space network material has flourishing pore structure, functional filler can uniformly exist respectively In hole, being uniformly distributed for filler is realized, imparts sheet material specific function；
(3) since uniform filling is dispersed in hole, sheet material will not generate gap, avoid and directly adopt poly- virtue The sheet material that base ether ketone fiber hot pressing obtains increases hygroscopic disadvantage there are gap；
(4) since the space network material has flourishing pore structure, more fillers can be introduced into stereoscopic graticule In shape structural material, it is remarkably improved the content of filler.
In the present invention, it is preferred to be about with diameter between polyaryletherketone fiber in space network material The hole of 0.1-60 μm (such as 5 μm, 10 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 50 μm or 60 μm). Pore size in space network is impossible all identical, and the pore diameter of the space network material refers to The average value for maximum 20 pore diameters observed under the microscope.Hole in space network is irregular shape Shape, the pore diameter refer to the diameter for the maximum spherical that may pass through in hole.
In the present invention, the interfibrous hole of polyaryletherketone is the open pores with extraneous intercommunication, pore diameter pair The processing of composite material and quality have highly important influence.Pore diameter is bigger, and filler easily enters hole, is conducive to add Work, but filler is excessive in hole then will lead to the filler after hot pressing in composite material and excessively concentrate.Pore size and fibre diameter Between ratio it is particularly significant, preferably polyaryletherketone interfiber pore diameter is the 0.1 of polyaryletherketone fibre diameter ~30 times, such as 0.2 times, 0.8 times, 3 times, 6 times, 12 times, 15 times, 19 times, 22 times, 26 times, 28 times etc..It is current in order to be suitable for Common filler and fiber, and processing is taken into account, further preferred interfiber pore diameter is 0.1~50 μm.
The diameter of polyaryletherketone fiber and the porosity of space network determine the mean size of interfiber pore. Under the conditions of i.e. identical porosity, the diameter of fiber is bigger, then interfibrous pore diameter is bigger.In the present invention, porosity Size the number of filler that space network material can accommodate determined.The porosity of space network material is got over Greatly, then the filer content of composite material is generally higher, but porosity is excessive, then filler distribution can be made uneven, and composite wood Filler is easy to fall off in material, reduces the intensity of composite material.In order to facilitate selection raw material, the hole of the space network material Gap rate is preferably 40%-90%, and further preferred porosity is 50% to 85%.
In the present invention, the thickness of the space network material is bigger, and filler is well into space network material The difficulty of material is bigger, and thickness is smaller, then space network material is weaker to the limitation capability of filler.Polyaryletherketone fiber Diameter, porosity and application field are larger to the thickness effect of material, and specific thickness requirements are depending on the circumstances.It is preferred that Space network material with a thickness of 10 μm -500 μm.
Preferably, the diameter of the polyaryletherketone fiber be 0.01-100 μm, such as 0.1 μm, 0.5 μm, 1 μm, 2 μm, 2.5 μm, 3 μm, 5 μm, 7 μm, 9 μm, 10 μm, 13 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 100 μm.For The uniformity of sheet material after easy to process and hot pressing, it is preferably 0.1-50 μm, solid netted made of the fiber in the diameter range Structural material is easier to meet above-mentioned interfiber pore diametric requirements.
It, can also be containing good with polyaryletherketone compatibility in the polyaryletherketone fiber in order to reduce difficulty of processing Other polymers, including it is polystyrene, polyarylate, polyetherimide, polyether sulfone, polysulfones, polyolefin, polyester, polycarbonate, poly- In amide imide, polyamide and polytetrafluoroethylene (PTFE) any one or at least two combination.
In the present invention, it is preferred to can also contain additive in the polyaryletherketone fiber, which includes function The auxiliary agents such as the nanoparticle and superfine fibre of energy property.
In the present invention, the space network material mainly mutually overlapped or bonded by polyaryletherketone fiber and At, it is intended that, the space network material only mutually can be overlapped or be bonded by polyaryletherketone fiber, can also be contained There are other fibers.For example, liquid crystalline polyester fiber, polyester fiber, poly- carbonic acid can also be contained in the space network material Ester fiber, polyethylene fibre, polypropylene fibre, Fypro, polyacrylonitrile fibre, polyimide fiber, polyphenylether fibre, It is any in polyphenylene sulfide fibre, polytetrafluoroethylene fibre, styroflex, glass fibre, basalt fibre or carbon fiber It is a kind of or at least two combination, shared mass ratio is less than 50% in space network material.
Preferably, in the present invention, the partial size of filler is less than the interfibrous pore diameter of polyaryletherketone.Preferably, it fills out The partial size D90 of material be 30 μm hereinafter, such as 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 2 μm, 3 μm, 7 μm, 11 μm, 15 μm, 18 μm, 21 μm, 24 μm or 27 μm, the D50 of further preferred filler is 0.1-5 μm, for example, 0.1 μm, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, 2.5 μm, 3 μm, 4 μm or 5 μm.
Preferably, the filler is inorganic filler and/or organic filler.
Preferably, the inorganic filler is selected from carbon black, silicon powder, aluminum oxide, titanate, metatianate, titanium dioxide Titanium, draw ratio less than in 20 staple glass fibre, quartzy staple fiber of the draw ratio less than 20 or metal powder any one or At least two combination.
Preferably, the organic filler is selected from polyphenylene ether powder, pps powder, teflon resin powder, gathers In imide resin powder or rubber particle etc. any one or at least two combination.
Preferably, the wire feeding be functional filler, preferably dielectric ceramics filler, heat-resistant filler, fire-retardant filler, In heat filling, conductive filler, fluorescer, UV absorbent, magnetic fillers or reactive filler etc. any one or at least Two kinds of combination.
Preferably, the conductive filler is metal powder, draw ratio less than one of short fibre of 20 carbon fiber or at least two The combination of kind.
Preferably, filler is pre-dispersed in mounting medium, then is introduced into the hole of space network material In.
Preferably, the mounting medium is liquid solvent and optionally auxiliary agent.
Preferably, the liquid solvent is water, halogenated hydrocarbon solvent, halogenated phenols solvent, ether solvents, ketone solvent, ester solvent, carbon Acid esters solvent, amine solvent, nitrogenous heterocyclic aromatic compounds solvent, nitrile solvent, amide solvent, carbamide compound solvent, nitration Close in object solvent, sulphur compound solvent or phosphorus compound solvent etc. any one or at least two combination.
Preferably, the auxiliary agent includes coupling agent, dispersing agent or surface tension processing for dispersing and stablizing filler, auxiliary agent In agent etc. any one or at least two combination.
Preferably, the mounting medium may be gas.
Preferably, the gas includes air, nitrogen, carbon dioxide or inert gas etc..
Preferably, the space network material for mainly mutually being overlapped and being formed by polyaryletherketone fiber is incorporated fillers into Hole in method include: in extrusion, infusion process, ultrasonic method, vacuum decompression method, gunite or dynamic negative-pressure method etc. appoint It anticipates a kind of or at least two combinations.Various action intensities are so that space network material fracture or damaged for the upper limit.
In the present invention, it is various incorporate fillers into mainly mutually overlapped by polyaryletherketone fiber form it is solid netted The action intensity in method in the hole of structural material is so that space network material fracture or damaged for the upper limit.
Preferably, the extrusion, refer to space network material some tension effect under with roll shaft or other objects Body contact or space network material cause solid netted between the object of the mutual extrusion of two or more quantity Structural material is squeezed power, make wherein hole in extrusion process with the external world generate pressure difference, pressure difference promotes solid netted Filler near structural material enters in hole.
In the present invention, the infusion process refers to filler being pre-dispersed in formation filler dispersion liquid, institute in mounting medium Stating mounting medium is liquid solvent and optionally auxiliary agent, then impregnates space network material in filler dispersion liquid, with Filler is set to be introduced into hole in the diffusion process of mounting medium.
In the present invention, the ultrasonic method refers to and impregnates space network material in filler dispersion liquid, and is aided with super Sound further promotes filler to be introduced into hole in the diffusion process of mounting medium.
In the present invention, the vacuum decompression method refers to and places point of filler or filler in the side of stereo net material Dispersion liquid applies vacuum decompression in the other side, so that the two sides of material is generated pressure difference, filler or filler dispersion liquid is promoted to be moved by side The other side is moved on to, so that filler be made to enter in hole.
In the present invention, the gunite, be directed to space network material one or both sides injection filler or Filler dispersion liquid enters filler in material hole.
In the present invention, the dynamic negative-pressure method refers to and applies certain frequency in the one or both sides of stereo net material The hydraulic or air pressure change of variation promotes filler or filler point to make to generate dynamic pressure difference with extraneous in material hole Dispersion liquid enters in hole.
Preferably, when mounting medium is liquid solvent and optional auxiliary agent, the method also includes going before hot pressing The step of except liquid solvent.
For the removal liquid solvent generally by the way of heat treatment, the temperature of heat treatment is preferably greater than the boiling of liquid solvent Point；When heat treatment temperature is less than 220 DEG C, convection oven or heat radiation baking oven can be used, when heat treatment temperature is greater than 220 DEG C When, vacuum drying oven need to be used, or heat in the inert gas environments such as nitrogen.Heat treatment time need to meet the following conditions: Material after heat treatment dries 1h in the temperature greater than 20 DEG C of liquid adjuvants boiling point or more, and weightlessness is less than 3%.In order to further It avoids will volatilize part and be introduced into sheet material or circuit substrate, preferably weightlessness is less than 1%.
Preferably, the method also includes removing the filler of space network material surface before hot pressing.
The processing of the present invention for removing surface filler can be before or after removing liquid solvent.Removing liquid solvent Before, scraper can be used or press from both sides the filler dispersion liquid that axis scrapes off space network material surface.After removing liquid solvent, it can adopt The filler on surface is removed with the mode patted or struck off.The filler on removing surface is the fiber in order to make space network material It exposes, there is between lamination better bonding force when guaranteeing hot pressing.
In the present invention, the purpose of hot pressing is to make polyaryletherketone fibers melt or semi-molten, so that polyaryletherketone is fine Dimension melting is sticked together.In hot pressing, the filler in hole can be melted or glue during forming sheet material Polyaryletherketone fiber even coats, blocks or be adhered in resin.
The mode of hot pressing of the present invention refers to and is placed on the lamination of individual or multiple composite materials for containing filler Hot pressing obtains sheet material in hot press.Hot pressing temperature is 250 DEG C~450 DEG C, such as 270 DEG C, 290 DEG C, 310 DEG C, 330 DEG C, 350 DEG C, 370 DEG C, 390 DEG C, 410 DEG C or 430 DEG C, preferably 300 DEG C~380 DEG C.Hot pressing pressure be 2MPa~20MPa, such as 3MPa, 5MPa, 7MPa, 9MPa, 11MPa, 13MPa, 15MPa, 17MPa or 19MPa, preferably 6MPa~11MPa.
Hot pressing of the present invention can also refer to and form individual or multiple polyaryletherketone composite materials for containing filler Be stacked on high temperature roll squeezer and carry out hot-pressing processing, obtain sheet material.
Hot pressing temperature be 250 DEG C~450 DEG C, such as 270 DEG C, 290 DEG C, 310 DEG C, 330 DEG C, 350 DEG C, 370 DEG C, 390 DEG C, 410 DEG C or 430 DEG C, preferably 300 DEG C~380 DEG C, hot pressing pressure is generally 8-18kN, preferably 10-15kN.High temperature roll squeezer hot pressing Lamination embryo material preheating 160 DEG C to 280 DEG C of preheating temperature, can further can be heat-treated, at heat after hot-pressing processing before processing 160 DEG C to 340 DEG C of temperature of reason.
It PI film or nitrogen can be used to be protected in hot pressing and front and back treatment process, prevent copper foil from aoxidizing.
Release film need to be used in hot pressing, the use temperature of the release film should be greater than practical hot pressing temperature, to prevent from containing It is bonded between the space network material of filler, polluted product.The polytetrafluoroethyl-ne of glass fabric enhancing can be used in release film Alkene thin plate or surface are coated with metal foil or plate of the high temperature mould release such as silicone grease etc..
The fourth object of the present invention is to provide a kind of circuit substrate, i.e., multiple in an at least polyaryletherketone containing filler Conductive film is covered in the one or both sides of the lamination of condensation material or sheet material composition, and then hot pressing obtains together.
In the hot pressing of circuit substrate of the present invention, according to actual needs, enhancement layer can be inserted among lamination And/or adhesive layer.
The enhancement layer includes inorfil cloth, inorganic fibre paper, is prepared by inorfil cloth impregnating resin composition Prepreg, prepreg, ceramic wafer, the film of metal plate or thin plate for being prepared by inorganic fibre paper impregnating resin composition etc. One or more of combination.
The adhesive layer include the thermosetting resin film not being fully cured, melting temperature be less than hot pressing temperature thermoplastic resin Membrane of lipoprotein or toner etc..
Conductive film of the present invention, including copper foil, aluminium foil, silver foil, goldleaf or electrically conductive macromolecule membrane etc..
When only covering conductive film on one side in lamination, another side needs to cover release film.The use temperature of release film should be big In practical hot pressing temperature.
Compared with the prior art, the invention has the following beneficial effects:
The present invention by using filler is dispersed in mainly mutually overlapped or bonded as polyaryletherketone fiber made of stand In body mesh material, without the use of braided material (woven cloths), the polyaryletherketone of other existences (such as die casting film or Organic fiber cloth), so that the polyaryletherketone composite material containing filler is assigned the sheet material obtained using it has dielectric constant in X, Y Direction isotropism, low dielectric constant and dielectric loss and excellent proof voltage energy and processability.
In addition to this, the polyaryletherketone composite material containing filler also assigns sheet material and the following performance of circuit substrate:
(1) it assigns the space network material excellent mechanical property since fiber orientation crystallizes, makes the strong of sheet material Spend relative in prior art film or die casting film strength and toughness it is higher, the defects of being not susceptible to crackle；Such as polyethers The tensile strength of ether ketone resin film is 80MPa, and the tensile strength for passing through the polyetheretherketonefiber fiber of oriented crystalline is then more than 200MPa.Therefore the tensile strength of polyaryletherketone bonded fabric product is higher than film class intensity and toughness；
(2) since space network material has flourishing pore structure, functional filler can uniformly exist respectively In hole, being uniformly distributed for filler is realized, imparts sheet material specific function；
(3) since uniform filling is dispersed in hole, sheet material will not generate gap, avoid and directly adopt poly- virtue The sheet material that base ether ketone fiber hot pressing obtains increases hygroscopic disadvantage there are gap；
(4) since the space network material has flourishing pore structure, more fillers can be introduced into stereoscopic graticule In shape structural material, it is remarkably improved the content of filler.
(5) compared with directlying adopt the mixture of resin and filler, since the surface area of polyaryletherketone fiber is bigger, because This heating surface area in hot pressing is big, easily melts, and makes it easier for bonding with metal foil such as copper foil, improves the knot of circuit substrate With joint efforts, peel strength can reach 0.6N/mm or more.
Specific embodiment
The technical scheme of the invention is further explained by means of specific implementation.
Preparation example
Polyether-ether-ketone non-woven fabrics is prepared using meltblown.Use single axle extruding machine (bore 30mm, L/D=24) by polyethers Importing after ether ketone resin (Solvay, KetaSpire KT-810) melting, there is flow adjustment structure and heating air to import Then the special dies of structure (have 10 circular molten resin discharge holes (400 μm of internal diameter) from the spinning-nozzle on mold With the gas discharge hole (wide 1mm) of slit-shaped, these molten resin discharge holes are formed a line with the effective width of 5cm, the gas The body discharge Kong Nengyu orientation sprays heating air in parallel, to apply tensile stress to molten resin.) in spray, Stretching forms fiber.And collect the fiber on the surface of film-like substrate, formation width is about 5cm to dressed nonwoven fabrics.So Afterwards by this wait for dressed nonwoven fabrics by between a pair of of heating roller for being made of metallic roll and rubber rollers, thus make it by hot pressing and Non-woven fabrics as specific thicknesses.
The fineness that fiber is adjusted by the flow of the heating air in regulating gas discharge hole collects fiber by adjusting The movement speed of film-like substrate adjusts the substance of non-woven fabrics, and temperature, pressure and two roller gaps when by adjusting hot pressing is adjusted The thickness of whole non-woven fabrics.To obtain the non-woven fabrics of following corresponding index.
(avarage fiber diameter is 3 μm to polyether-ether-ketone non-woven fabrics, substance 40g/m2, 100 μm of thickness, porosity is about 70%, interfiber pore diameter is about 14 μm)
(avarage fiber diameter is 3 μm to polyether-ether-ketone non-woven fabrics, substance 40g/m2, 100 μm of thickness, porosity is about 70%, interfiber pore diameter is about 14 μm)
(avarage fiber diameter is 7 μm to polyether-ether-ketone non-woven fabrics, substance 40g/m2, 100 μm of thickness, porosity is about 70%, interfiber pore diameter is about 30 μm)
(avarage fiber diameter is 3 μm to polyether-ether-ketone non-woven fabrics, substance 18g/m2, 150 μm of thickness, porosity is about 92%, interfiber pore diameter is about 70 μm)
(avarage fiber diameter is 3 μm to polyether-ether-ketone non-woven fabrics, substance 40g/m2, 35 μm of thickness, porosity is about 17%, interfiber pore diameter is about 0.1 μm)
(avarage fiber diameter is 45 μm to polyether-ether-ketone non-woven fabrics, substance 115g/m2, 220 μm of thickness, porosity is about 60%, interfiber pore diameter is about 50 μm)；
(avarage fiber diameter is 0.5 μm to polyether-ether-ketone non-woven fabrics, substance 16g/m2, 50 μm of thickness, porosity is about 75%, interfiber pore diameter is about 8 μm)；
Embodiment 1
By the polyether-ether-ketone non-woven fabrics of sheet, (avarage fiber diameter is 3 μm, substance 40g/m2, 100 μm of thickness, hole Rate is about 70%, and interfiber pore diameter is about 14 μm), ball-shaped silicon micro powder slurry (ball-type silicon powder partial size D90 be 3 μm, D50 is about 1 μm, slurry be 70% butanone suspension) in dipping, then by the gap of 0.15mm, scrape off surface size, dry Except solvent, then infiltrates again, solvent is removed by gap and baking, repeatedly for three times.The non-woven fabrics for being impregnated with slurry is dried in air blast In 155 DEG C of baking 5min in case, the non-woven fabrics of drying is patted, the filler on surface is removed, it is compound to obtain the polyether-ether-ketone containing filler Material.Then the polyether-ether-ketone composite material lamination by 6 containing filler, two sides are coated with 35 μm of copper foil (copper foil light of mould release Facing towards non-woven fabrics) it is used as release film, in 360 DEG C, under vacuum environment, the hot pressing 1h in electric heating press, pressure 8MPa are obtained Polyether-ether-ketone resin sheet material containing filler.
Comparative example 1
With extruder, by polyether-ether-ketone resin (commercially available), (ball-type silicon powder partial size D90 is 3 μm, and D50 is about with ball-shaped silicon micro powder It is 1 μm, powder) it is uniformly mixed, about 370 DEG C of processing temperature, mixed proportion 4:6.Then mixture tiling is put into hot press In, surrounding places the epoxy resin glass-fiber-plate of 0.4mm thickness for limiting thickness, and two sides is coated with 35 μm of copper foil (copper foil light of mould release Facing towards non-woven fabrics) it is used as release film, in 360 DEG C, under vacuum environment, the hot pressing 1h in electric heating press, pressure 8MPa are obtained Polyether-ether-ketone sheet material containing filler.
Comparative example 2
By the polyether-ether-ketone non-woven fabrics of 6 sheets, (avarage fiber diameter is 3 μm, substance 40g/m2, 100 μm of thickness, hole Gap rate is about 70%, and interfiber pore diameter is about 14 μm) lamination, two sides is coated with 35 μm of copper foil (copper foil smooth surfaces of mould release Towards non-woven fabrics) it is used as release film, in 360 DEG C, under vacuum environment, the hot pressing 1h in electric heating press, pressure 8MPa are obtained not Polyether-ether-ketone sheet material containing filler.
Comparative example 3
A kind of polyether-ether-ketone sheet material of the short fibre containing glass fibre.Preparation method is identical as comparative example 1, but spherical silicon is micro- Powder replaces with the short fibre of glass fibre, and (fibre diameter is 7 μm, and draw ratio is about the 10) mixed proportion of resin and the short fibre of glass fibre For 10:1.
Embodiment 2
A square box is made, is opened wide above box, connects a suction pipe in side, suction pipe connects vacuum pump.By piece (avarage fiber diameter is 7 μm to the polyether-ether-ketone non-woven fabrics of shape, substance 40g/m2, 100 μm of thickness, porosity is about 70%, fine Pore diameter is about 30 μm between dimension) it is placed on above box, and the edge that non-woven fabrics is open with box is come into full contact with, then by glass Glass fiber is short, and fine (fibre diameter is 7 μm, and draw ratio is about that aqueous dispersions 10) drench on non-woven fabrics, opens vacuum pump, and hold It is continuous to spread the short fine dispersion liquid of glass fibre.After spreading 1min, vacuum pump is closed, the short fibre of nonwoven surface is scraped off, dried in 160 DEG C Dry 30min, then by non-woven fabrics it is another up, repeat above-mentioned to spread dispersion liquid and drying operation.By the nonwoven of drying Cloth is patted, and the filler on surface is removed, and obtains the polyether-ether-ketone composite material containing filler.Then by 6, treated containing filler Polyether-ether-ketone composite material lamination, two sides are coated with 35 μm of copper foils (copper foil smooth surface towards non-woven fabrics) of mould release as release Film, in 360 DEG C, under vacuum environment, the hot pressing 1h in electric heating press, pressure 6MPa obtain the polyethers of the short fibre containing glass fibre Ether ketone sheet material.
Embodiment 3
Polyether-ether-ketone circuit substrate containing filler.The production method and embodiment 1 of polyether-ether-ketone composite material containing filler Identical, then by 6 polyether-ether-ketone composite material laminations, 18 μm of copper foils (copper foil hair side towards composite material) is covered on two sides, in 360 DEG C, under vacuum environment, the hot pressing 1h in electric heating press, pressure 6MPa obtain the polyether-ether-ketone circuit substrate containing filler.
Embodiment 4
Polyether-ether-ketone circuit substrate containing filler, production method is same as Example 3, but by the spherical silicon in embodiment 3 Micro mist slurry replaces with dispersion liquid of the barium titanate in ethylene glycol monomethyl ether, and (barium titanate D90 is about 3 μm, and D50 is about 2 μm, solid content For 80%).
Embodiment 5
By the polyether-ether-ketone resin non-woven fabrics of sheet, (avarage fiber diameter is 3 μm, substance 40g/m2, 100 μm of thickness, Porosity is about 70%, and interfiber pore diameter is about 14 μm) it evens up, and be horizontally arranged.By barium titanate powder (barium titanate D90 About 3 μm, D50 is about 2 μm) uniformly it is sprinkled upon on non-woven fabrics, and ceaselessly shake non-woven fabrics.Then non-woven fabrics top and bottom are exchanged, It is uniformly sprinkled with barium titanate powder again, and shakes non-woven fabrics.It claps after removing surface filler powder, by 3 polyether-ether-ketones containing filler Composite lay, 18 μm of copper foils are covered on two sides, and in 350 DEG C, under vacuum environment, the hot pressing 1h in electric heating press is obtained containing filler Polyether-ether-ketone resin circuit substrate.
Embodiment 6
Polyether-ether-ketone sheet material containing filler, production method is same as Example 1, but by the sheet polyethers ether in embodiment 1 Ketone resin non-woven fabrics replaces with the higher non-woven fabrics of porosity, and (avarage fiber diameter is 3 μm, substance 18g/m2, 150 μ of thickness M, porosity are about 92%, and interfiber pore diameter is about 70 μm).
Embodiment 7
Polyether-ether-ketone resin sheet material containing filler, production method is same as Example 1, but the sheet in embodiment 1 is gathered Ether ether ketone resin non-woven fabrics replace with the lower non-woven fabrics of porosity, and (avarage fiber diameter is 3 μm, substance 40g/m2, thickness 35 μm, porosity is about 17%, and interfiber pore diameter is about 0.1 μm).Non-woven fabrics used is by the polyethers ether in embodiment 1 The appropriate hot pressing in electric heating press of ketone non-woven fabrics obtains.Embodiment 8
Polyether-ether-ketone sheet material containing filler, production method is same as Example 1, but by the sheet polyethers ether in embodiment 1 Ketone non-woven fabrics replaces with polyether-ether-ketone non-woven fabrics, and (avarage fiber diameter is 45 μm, substance 115g/m2, 220 μm of thickness, hole Rate is about 60%, and interfiber pore diameter is about 50 μm)；The slurry that ball-shaped silicon micro powder slurry is replaced with melting silicon powder is (molten Melting silicon powder partial size D90 is about 20 μm, and D50 is about 5 μm, the butanone suspension that slurry is 75%)；Lamination when by hot pressing is changed to 2 layers of polyether-ether-ketone composite material containing filler.
Embodiment 9
Polyether-ether-ketone sheet material containing filler, production method is same as Example 1, but by the sheet polyethers ether in embodiment 1 Ketone non-woven fabrics replaces with polyether-ether-ketone non-woven fabrics, and (avarage fiber diameter is 0.8 μm, substance 16g/m2, 50 μm of thickness, porosity About 75%, interfiber pore diameter is about 8 μm)；Ball-shaped silicon micro powder slurry is replaced with into solid content lower slurry (ball-type silicon Grain size of micropowder D90 is about 3 μm, and D50 is about 1 μm, the butanone suspension that slurry is 45%)；Lamination when by hot pressing is changed to 10 layers Polyether-ether-ketone composite material containing filler.
The performance of each Examples and Comparative Examples see the table below shown.
Table 1
Continued 1
In above-described embodiment and comparative example, the resulting sheet material dielectric properties of embodiment 1 are preferable, and filer content is high, and are distributed Uniformly, cross section tight etc., tensile strength is preferable, and water absorption rate is very low.Embodiment 3 is circuit substrate corresponding with embodiment 1, Performance is close with embodiment 1, and its peel strength reaches 0.8N/mm, meets the needs of circuit substrate.
Comparative example 1 is that resin sheet is made in tabletting after mixing resin and filler, and the sheet material time is apparent poor, has crackle to lack It falls into, tensile strength is very low.Comparative example 2 be directly non-woven fabrics hot pressing is obtained resin sheet, dielectric properties and tensile strength compared with It is good, but since in hot pressing fiber can not melted completely, lead to inside sheet material the suction there are a large amount of gap, in test Water rate is higher.
Comparative example 3 is using resin sheet made from tabletting after the short fine mixing of resin and glass fibre, and embodiment 2 is this hair Sheet material identical with 3 component of comparative example is made in bright method.The results show that comparative example 3 is secondary apparent poor, there is the defects of crackle, And the tensile strength of embodiment 2 is much higher than comparative example 3.
Dielectric ceramics filler barium titanate is used in embodiment 4 and embodiment 5, properties are preferable, and assign sheet material With circuit substrate high dielectric constant, it can satisfy the application demands such as capacitor, buried capacitor circuit.In embodiment 6 and embodiment 7 respectively Use porosity excessive or too small non-woven fabrics, the filer content of 6 resulting sheet of embodiment is very high, but lacks the branch of resin Support, sheet material is frangible, easily loses powder.The hole of embodiment 7 is smaller, so that filler cannot be introduced into inside non-woven fabrics, resulting sheet Filer content is very low, and is almost distributed in the surface layer of non-woven fabrics, is unevenly distributed, therefore preferable porosity 40% to 90%
Sheet structure prepared by embodiment 8 and embodiment 9 is complete, and defect is less, and dielectric properties and tensile strength are good.
The test method of the above characteristic is as follows:
(1) thickness of dielectric layers: with the thickness (if it is circuit substrate, copper foil is etched away) of miking insulating layer.
(2) it peel strength: is tested referring to IPC-TM-6502.4.8 test method, test condition is normality.
(3) dielectric constant of 5GHz, dielectric loss angle tangent: flat referring to the test of IPC-TM-6502.5.5.9 test method Plate capacitance method.
(4) it is sliced gap: observing plate cross-sectional slices using scanning electron microscope, observe in sample with the presence or absence of sky Gap.
(5) picking rate: taking the composite sample (no copper foil, or copper foil is etched after) having a size of 100mm*100mm, On a piece of smooth A4 paper, above-mentioned composite sample is cut out as the strip of size 10mm*100mm, then picks up strip sample Product, measurement fall the quality of powder or disintegrating slag on A4 paper and the mass ratio of former composite sample.
(6) secondary apparent: apparent after visually observing copper foil etching.
(7) filer content: by mass change of the space network material before and after adding filler, filler is calculated compound Quality specific gravity in material, as filer content.
(8) tensile strength test, Sample Width 15mm, collet distance tensile strength: are carried out using Material Testing Machine 50.8mm, speed of experiment 12.5mm/min.
(9) composite sample of 100mm*100mm (no copper foil, or copper foil is etched after) water absorption rate: is immersed in 25 DEG C water in for 24 hours, then take out the water stain of wipe samples surface, then measure sample impregnate front and back quality difference and proper mass Between ratio.
The Applicant declares that the present invention is explained by the above embodiments method detailed of the invention, but the present invention not office Be limited to above-mentioned method detailed, that is, do not mean that the invention must rely on the above detailed methods to implement.Technical field Technical staff it will be clearly understood that any improvement in the present invention, equivalence replacement and auxiliary element to each raw material of product of the present invention Addition, selection of concrete mode etc., all of which fall within the scope of protection and disclosure of the present invention.

Claims (57)

1. a kind of sheet material, which is characterized in that the sheet material is by at least one polyaryletherketone composite material hot pressing containing filler Obtained resin film, the hot pressing temperature are 250 DEG C~450 DEG C；
The composite material is made of space network material and the filler being dispersed in space network material hole, Wherein, the space network material is mainly mutually overlapped or is bonded by polyaryletherketone fiber；The polyaryl ether Ketone fiber in backbone structure mainly by selected from containing the linear aromatic macromolecule chemical combination of ketonic bond and ehter bond as repetitive unit Object.
2. sheet material as described in claim 1, which is characterized in that the polyaryletherketone fiber by polyether-ether-ketone, polyether-ketone and Any one or at least two combination in polyetherketoneetherketoneketone are made, and/or are changed by polyether-ether-ketone modifier, polyether-ketone Property object and polyetherketoneetherketoneketone modifier in any one or at least two combination be made.
3. sheet material as described in claim 1, which is characterized in that in space network material, between polyaryletherketone fiber The hole for being 0.1-60 μm with diameter.
4. sheet material as described in claim 1, which is characterized in that in space network material, between polyaryletherketone fiber The hole for being 0.1-50 μm with diameter.
5. sheet material as described in claim 1, which is characterized in that in space network material, between polyaryletherketone fiber Pore diameter size is 0.1~30 times of polyaryletherketone fibre diameter.
6. sheet material as described in claim 1, which is characterized in that polyaryletherketone fibre diameter is 0.01-100 μm.
7. sheet material as described in claim 1, which is characterized in that polyaryletherketone fibre diameter is 0.1-50 μm.
8. sheet material as described in claim 1, which is characterized in that it is straight that the partial size of filler is less than the interfibrous hole of polyaryletherketone Diameter.
9. sheet material as described in claim 1, which is characterized in that the partial size D90 of filler is less than 30 μm.
10. sheet material as described in claim 1, which is characterized in that the D50 of filler is 0.1~5 μm.
11. sheet material as described in claim 1, which is characterized in that the porosity of the space network material be 40% to 90%.
12. sheet material as described in claim 1, which is characterized in that the porosity of the space network material be 50% to 85%.
13. sheet material as described in claim 1, which is characterized in that also contain polystyrene in the polyaryletherketone fiber, gather Aromatic ester, polyetherimide, polyether sulfone, polysulfones, polyolefin, polyester, polycarbonate, polyamidoimide, polyamide and polytetrafluoro In ethylene any one or at least two combination.
14. sheet material as described in claim 1, which is characterized in that in the space network material also containing polyester fiber, Polycarbonate, polyethylene fibre, polypropylene fibre, Fypro, polyacrylonitrile fibre, polyimide fiber, polyphenyl In ether fiber, polyphenylene sulfide fibre, polytetrafluoroethylene fibre, styroflex, glass fibre, basalt fibre or carbon fiber Any one or at least two combination, shared mass ratio is less than 50% in space network material.
15. sheet material as described in claim 1, which is characterized in that the filler is inorganic filler and/or organic filler.
16. sheet material as claimed in claim 15, which is characterized in that the inorganic filler is selected from carbon black, silicon powder, three oxidations two The short fibre of quartz of aluminium, titanate, metatianate, titanium dioxide, draw ratio less than 20 staple glass fibre, draw ratio less than 20 Dimension, draw ratio be short less than 20 carbon fiber fine or metal powder in any one or at least two combination.
17. sheet material as claimed in claim 15, which is characterized in that the organic filler is selected from polyphenylene ether powder, polyphenylene sulfide Powder, teflon resin powder, polyimide resin powder end or rubber particle in any one or at least two group It closes.
18. sheet material as described in claim 1, which is characterized in that the wire feeding is functional filler.
19. sheet material as described in claim 1, which is characterized in that the wire feeding is dielectric ceramics filler, heat-resisting fills out It is any one in material, fire-retardant filler, heat filling, conductive filler, fluorescer, UV absorbent, magnetic fillers or reactive filler Kind or at least two combination.
20. sheet material as claimed in claim 19, which is characterized in that the conductive filler is metal powder, draw ratio less than 20 One of short fibre of carbon fiber or at least two combination.
21. a kind of preparation method of the sheet material as described in any one of claim 1~20, the described method comprises the following steps:
(1) it incorporates fillers into and mainly mutually overlaps or bond the space network material formed by polyaryletherketone fiber In hole, the polyaryletherketone composite material containing filler is formed；
(2) lamination formed by at least one polyaryletherketone composite material containing filler is obtained into piece by way of hot pressing Material.
22. method as claimed in claim 21, which is characterized in that in space network material, polyaryletherketone fiber Between with diameter be 0.1-60 μm of hole.
23. method as claimed in claim 21, which is characterized in that in space network material, polyaryletherketone fiber Between with diameter be 0.1-50 μm of hole.
24. method as claimed in claim 21, which is characterized in that in space network material, polyaryletherketone fiber Between pore diameter size be 0.1~30 times of polyaryletherketone fibre diameter.
25. method as claimed in claim 21, which is characterized in that polyaryletherketone fibre diameter is 0.01-100 μm.
26. method as claimed in claim 21, which is characterized in that polyaryletherketone fibre diameter is 0.1-50 μm.
27. method as claimed in claim 21, which is characterized in that the partial size of filler is less than the interfibrous hole of polyaryletherketone Diameter.
28. method as claimed in claim 21, which is characterized in that the partial size D90 of filler is 30 μm or less.
29. method as claimed in claim 21, which is characterized in that the D50 of filler is 0.1-5 μm.
30. method as claimed in claim 21, which is characterized in that the porosity of the space network material be 40% to 90%.
31. method as claimed in claim 21, which is characterized in that the porosity of the space network material be 50% to 85%.
32. method as claimed in claim 21, which is characterized in that in the polyaryletherketone fiber also containing polystyrene, Polyarylate, polyetherimide, polyether sulfone, polysulfones, polyolefin, polyester, polycarbonate, polyamidoimide, polyamide and poly- four In vinyl fluoride any one or at least two combination.
33. method as claimed in claim 21, which is characterized in that also fine containing polyester in the space network material Dimension, polyethylene fibre, polypropylene fibre, Fypro, polyacrylonitrile fibre, polyimide fiber, is gathered polycarbonate Phenylate fiber, polyphenylene sulfide fibre, polytetrafluoroethylene fibre, styroflex, glass fibre, basalt fibre or carbon fiber In any one or at least two combination, shared mass ratio is less than 50% in space network material.
34. method as claimed in claim 21, which is characterized in that the filler is inorganic filler and/or organic filler.
35. method as claimed in claim 34, which is characterized in that the inorganic filler is selected from carbon black, silicon powder, three oxidations two The short fibre of quartz of aluminium, titanate, metatianate, titanium dioxide, draw ratio less than 20 staple glass fibre, draw ratio less than 20 Dimension, draw ratio be short less than 20 carbon fiber fine or metal powder in any one or at least two combination.
36. method as claimed in claim 34, which is characterized in that the organic filler is selected from polyphenylene ether powder, polyphenylene sulfide Powder, teflon resin powder, polyimide resin powder end or rubber particle in any one or at least two group It closes.
37. method as claimed in claim 21, which is characterized in that the wire feeding is functional filler.
38. method as claimed in claim 21, which is characterized in that the wire feeding is dielectric ceramics filler, heat-resisting fills out It is any one in material, fire-retardant filler, heat filling, conductive filler, fluorescer, UV absorbent, magnetic fillers or reactive filler Kind or at least two combination.
39. method as claimed in claim 21, which is characterized in that filler is pre-dispersed in mounting medium, then is drawn Enter into the hole of space network material.
40. method as claimed in claim 39, which is characterized in that the mounting medium is liquid solvent and optionally helps Agent.
41. method as claimed in claim 40, which is characterized in that the liquid solvent is that water, halogenated hydrocarbon solvent, halogenated phenols are molten Agent, ether solvents, ketone solvent, ester solvent, amine solvent, nitrogenous heterocyclic aromatic compounds solvent, nitrile solvent, amide solvent, urea Close object solvent, nitro compound solvent, in sulphur compound solvent or phosphorus compound solvent any one or at least two Combination.
42. method as claimed in claim 40, which is characterized in that the auxiliary agent includes coupling agent, any one in dispersing agent Kind or at least two combination.
43. method as claimed in claim 39, which is characterized in that the mounting medium is gas.
44. method as claimed in claim 43, which is characterized in that the gas includes air, nitrogen, carbon dioxide or inertia Gas.
45. method as claimed in claim 21, which is characterized in that incorporate fillers into mainly mutual by polyaryletherketone fiber Overlap composition space network material hole in method include: extrusion, infusion process, ultrasonic method, vacuum decompression method, In gunite or dynamic negative-pressure method any one or at least two combination.
46. method as claimed in claim 39, which is characterized in that when mounting medium is liquid solvent and optional auxiliary agent When, the method also includes removing liquid solvent before hot pressing.
47. method as claimed in claim 21, which is characterized in that the method also includes: it removes before hot pressing solid netted The step of filler on structural material surface.
48. the method as described in claim 1, which is characterized in that the mode of the hot pressing refers at least one containing filler The lamination that composite material is formed is placed on hot pressing in the hot press heated up and down.
49. method as claimed in claim 21, which is characterized in that hot pressing temperature is 250 DEG C~450 DEG C.
50. method as claimed in claim 21, which is characterized in that hot pressing temperature is 300 DEG C~380 DEG C.
51. method as claimed in claim 21, which is characterized in that hot pressing pressure is 2MPa~20MPa.
52. the method as described in claim 1, which is characterized in that hot pressing pressure is 6MPa~11MPa.
53. method as claimed in claim 21, which is characterized in that the mode of the hot pressing refers at least one containing filler Composite material formed be stacked on high temperature roll squeezer and carry out hot-pressing processing.
54. the method as described in claim 1, which is characterized in that hot pressing pressure is 8~18kN.
55. method as claimed in claim 21, which is characterized in that hot pressing pressure is 10~15kN.
56. a kind of circuit substrate passes through the lamination for forming sheet material described at least any one of claim 1~20 One or both sides cover conductive film, then hot pressing obtains.
57. circuit substrate according to claim 56, which is characterized in that have enhancement layer and/or adhesive layer in the lamination.
CN201511028636.8A 2015-12-30 2015-12-30 A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it Active CN106928650B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511028636.8A CN106928650B (en) 2015-12-30 2015-12-30 A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201511028636.8A CN106928650B (en) 2015-12-30 2015-12-30 A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it

Publications (2)

Publication Number Publication Date
CN106928650A CN106928650A (en) 2017-07-07
CN106928650B true CN106928650B (en) 2019-06-14

Family

ID=59442063

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201511028636.8A Active CN106928650B (en) 2015-12-30 2015-12-30 A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it

Country Status (1)

Country Link
CN (1) CN106928650B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108017875A (en) * 2017-12-08 2018-05-11 浙江工业大学之江学院 A kind of electroplating tooling thermostabilization fabroil and its manufacture method
CN113043681A (en) * 2019-12-27 2021-06-29 广东生益科技股份有限公司 Magnetic material and preparation method and application thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3010840B2 (en) * 1991-09-26 2000-02-21 日東紡績株式会社 Mixed nonwoven fabric for low dielectric constant printed circuit boards
US6485828B2 (en) * 2000-12-01 2002-11-26 Oji Paper Co., Ltd. Flat synthetic fiber, method for preparing the same and non-woven fabric prepared using the same
US20080289743A1 (en) * 2003-05-02 2008-11-27 Tsotsis Thomas K Highly porous interlayers to toughen liquid-molded fabric-based composites
KR20090108834A (en) * 2008-04-14 2009-10-19 삼성전기주식회사 Method of manufacturing insulating sheet and laminated plate clad with metal foil and printed circuit board and printed circuit board thereof using the same
CN101649902A (en) * 2009-09-10 2010-02-17 大连路阳科技开发有限公司 Polyether-ether-ketone (PEEK) combined seal ring
JP2014094501A (en) * 2012-11-09 2014-05-22 Daicel Corp Porous film laminate and method for manufacturing the same
KR20150048484A (en) * 2013-10-28 2015-05-07 삼성전기주식회사 Substrate raw material and method for manufacturing the same, and circuit board manufactured using the same

Also Published As

Publication number Publication date
CN106928650A (en) 2017-07-07

Similar Documents

Publication Publication Date Title
CN106928744B (en) A kind of composite material containing filler, sheet material and the circuit substrate containing it
CN106928660A (en) A kind of composite containing filler, sheet material and the circuit substrate containing it
TWI460077B (en) Carbon fiber structure and method for manufacturing the same
CN106928705A (en) A kind of composite polyimide material containing filler, sheet material and the circuit substrate containing it
CN106928599B (en) A kind of ptfe composite containing filler, sheet material and the circuit substrate containing it
TWI448378B (en) Method for manufacturing c/c composite material molded body
US7238413B2 (en) Conductive sheet material
JP6251392B2 (en) Flame retardant sheet material
CN109478654A (en) Porous substrate, porous electrode, carbon fiber paper, the manufacturing method of carbon fiber paper, the manufacturing method of porous substrate
CN111375317B (en) High-strength nanofiber composite membrane and preparation method thereof
CN106928650B (en) A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it
JP5779893B2 (en) Laminate made of nonwoven fabric and film
TWI763889B (en) Fiber-reinforced body and components using the same
JP4276830B2 (en) Prepreg base material and multilayer printed wiring board using the same
CN106928709A (en) A kind of polyarylether or polyarylene sulfide composite containing filler, sheet material and the circuit substrate containing it
JP2003193358A (en) Substrate for circuit board and circuit board using the same
CN107408707A (en) Porous electrode base material and its manufacture method
JP2004324007A (en) Treating agent for polyimide fiber, polyimide fiber treated therewith, nonwoven fabric and composite material
JP4778833B2 (en) Laminate substrate and prepreg, and laminate
JP7432539B2 (en) Glass wool board and method for manufacturing glass wool board
KR20180028079A (en) Multi-layered composite containing carbon-based wet-laid nonwoven fabric, manufacturing method thereof and heat releasing and emi shielding materials usingg the same
JP2018182251A (en) Method of manufacturing piezoelectric laminate and piezoelectric laminate
JP6866626B2 (en) Prepreg and its manufacturing method, fiber reinforced thermoplastic resin sheet manufacturing method, metal-clad laminated sheet manufacturing method, and wiring board manufacturing method
JP5501418B2 (en) Composite sheet
JP2006022432A (en) Electric insulating base material and method for producing the same, prepreg using the base material and substrate for printed circuit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant