CN106903619A - A kind of grinding tool for jewel polishing and preparation method thereof - Google Patents

A kind of grinding tool for jewel polishing and preparation method thereof Download PDF

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Publication number
CN106903619A
CN106903619A CN201510981961.XA CN201510981961A CN106903619A CN 106903619 A CN106903619 A CN 106903619A CN 201510981961 A CN201510981961 A CN 201510981961A CN 106903619 A CN106903619 A CN 106903619A
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China
Prior art keywords
grinding tool
jewel
resin
metal dust
grinding
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CN201510981961.XA
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Chinese (zh)
Inventor
郑玉斌
王柳
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CHANGSHU RESEARCH INSTITUTE OF DLUT Co Ltd
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CHANGSHU RESEARCH INSTITUTE OF DLUT Co Ltd
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Priority to CN201510981961.XA priority Critical patent/CN106903619A/en
Publication of CN106903619A publication Critical patent/CN106903619A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • B24D3/285Reaction products obtained from aldehydes or ketones
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Abstract

The invention discloses a kind of grinding tool for jewel polishing and preparation method thereof, the grinding tool includes grinding layer, grinding layer contains resinoid bond and metal dust, relative to the metal dust of 100 weight portions, the content of resinoid bond is 10-100 weight portions, resinoid bond contains focus ratio and phenolic resin, and relative to the focus ratio of 100 weight portions, the content of phenolic resin is 60-120 weight portions.In grinding tool of the invention, grinding layer has suitable hardness and toughness, and bulky grain during polishing process in abrasive material can be partially submerged into grinding layer, so as to avoid bulky grain abrasive material from forming deep cut in gemstone surface.Meanwhile, resinoid bond can be with metal dust by the hot-forming abrasive sheet for obtaining even compact, it is to avoid the jewel that grinding tool defect is caused is damaged, and improves the machining accuracy of gemstone surface.

Description

A kind of grinding tool for jewel polishing and preparation method thereof
Technical field
The present invention relates to grinding tool, in particular it relates to a kind of grinding tool for jewel polishing and preparation method thereof.
Background technology
Jewel refers to the building stones or mineral assembly by that after grinding and buffing, can reach jewelry requirement, such as Sapphire, ruby and crystal etc..Natural jewel is generally used for traditional jewellery and adornment field, It is and with the development of modern science and technology, artificial synthesized jewel is also used widely, such as artificial synthesized Sapphire, also referred to as sapphire glass, its main component be aluminum oxide, with intensity it is high, hardness is high, resistance to The series of characteristics such as high temperature, resistance to abrasion, resistance to corrosion strong, translucidus energy, electrical insulation capability be excellent, So be used to making optical element, saturating infrared optical window etc., and be widely used in it is infrared and Far infrared military hardware aspect.
Jewel polishing is primarily referred to as reducing workpiece surface roughness with chemistry and mechanism, to obtain light Bright, flat surface processing method.It is to work using polishing tool, abrasive grain or other polishing mediums The modification processing that part surface is carried out., because its hardness is high and fragility big, machining is difficult, slight crack for jewel It is higher with chipping phenomenon ratio.In existing process, frequently with the additional free abrasive of abrasive surface Jewel is polished, but because the granular size of additional abrasive material is uneven, bulky grain abrasive material therein holds Depth cut is easily caused to gemstone surface, the defects such as stomata, impurity often occurs in the surface of existing grinding tool in addition There is cut, even chipping phenomenon etc. gemstone surface is caused.
The content of the invention
It is an object of the invention to provide a kind of grinding tool for jewel polishing, the grinding tool can solve existing skill Because the granular size of additional abrasive material is uneven in art, bulky grain abrasive material therein is easily made to gemstone surface Into the problem of depth cut;Often there are the defects such as stomata, impurity in the surface that existing grinding tool can be solved simultaneously Etc. the problem for causing gemstone surface cut or chipping occur.
To achieve these goals, the present invention provides a kind of grinding tool for jewel polishing, including grinding layer, It is characterized in that:The grinding layer contains resinoid bond and metal dust, relative to 100 weight portions Metal dust, the content of the resinoid bond is 10-100 weight portions, wherein, it is described resin-bonded Agent contains focus ratio and phenolic resin, relative to the focus ratio of 100 weight portions, the phenolic aldehyde The content of resin is 60-120 weight portions.
The preparation method that the present invention also provides the above-mentioned grinding tool for jewel polishing, the method includes following step Suddenly:(1) the resinoid bond solvent dissolving of requirement is obtained into resin-bonded agent solution;(2) The metal dust of requirement is added in the resin-bonded agent solution and is uniformly dispersed;(3) depressurize Solvent is removed, solid mixt is obtained;(4) solid mixt heating is carried out into precuring;(5) Solid mixt after precuring is crushed to particle diameter for 100-500 μm obtains compound particles;(6) will The compound particles are placed in and hot-forming in shaping mould obtain abrasive sheet;(7) abrasive sheet is bonded In on the substrate.
In grinding tool of the invention, grinding layer contains resinoid bond and metal dust, due to resinoid bond In the focus ratio containing phenolic resin and tenacity excellent so that grinding layer has suitable hardness and tough Property, bulky grain during polishing process in abrasive material can be partially submerged into grinding layer, so as to avoid bulky grain from grinding Material forms deep cut in gemstone surface.Meanwhile, the adhesive property of focus ratio sum is good, can be with metal Powder is by the hot-forming abrasive sheet for obtaining even compact, it is to avoid the jewel that grinding tool defect is caused is damaged Wound, improves the machining accuracy of gemstone surface.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Specific embodiment
Specific embodiment of the invention is described in detail below.It should be appreciated that this place is retouched The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
The present invention provides a kind of grinding tool for jewel polishing, including grinding layer, and the grinding layer contains resin Binding agent and metal dust, relative to the metal dust of 100 weight portions, the content of resinoid bond is 10-100 weight portions, wherein, resinoid bond contains focus ratio and phenolic resin, relative to 100 The focus ratio of weight portion, the content of phenolic resin is 60-120 weight portions.Due to resinoid bond In the focus ratio containing phenolic resin and tenacity excellent so that grinding layer has suitable hardness and tough Property, the bulky grain in polishing process in abrasive material can be partially submerged into grinding layer, so as to avoid bulky grain from grinding Material forms deep cut in gemstone surface.Meanwhile, the adhesive property of focus ratio sum is good, can be with metal Powder is by the hot-forming abrasive sheet for obtaining even compact, it is to avoid the jewel that grinding tool defect is caused is damaged Wound, improves the machining accuracy of gemstone surface.
According to the present invention, the implication of focus ratio is well known to those skilled in the art, and is by bisphenol-A It is obtained with epoxychloropropane polycondensation, its structure is shown in formula I.
Due to there is phenyl ring and propylidyne on the main chain of focus ratio, therefore with excellent mechanical strength And toughness.Because the great amount of hydroxy group in main chain is caused between focus ratio and metal material and nonmetallic materials With good caking property.
Wherein, the implication of abrasive material is well known to those skilled in the art, can include diamond, quartz, One or more in carborundum, aluminum oxide, zirconium oxide and silica, abrasive material can be it is granular, Can also be the suspension or ointment preparation during abrasive material particles are dispersed in organic or inorganic medium.
In the grinding tool for jewel polishing of the invention, under preferable case, the weight of focus ratio Average molecular weight can be 20,000-10 ten thousand, and the weight average molecular weight of phenolic resin can be 500-1000, and weight is equal Molecular weight focus ratio within the above range and phenolic resin can be such that resinoid bond possesses suitably Toughness, so as to improve the toughness of abrasive layer, improve grinding tool to the machining accuracy of jewel.
In the grinding tool for jewel polishing of the invention, in order to further improve the toughness of grinding layer And Forming Quality, it is preferable that the Young's modulus of focus ratio can be 2400-2800Mpa.Young Modulus focus ratio within the above range has more preferable toughness and mechanical strength, can make grinding tool Grinding layer possesses suitable toughness and hardness, so as to reduce damage of the polishing process to gemstone surface.First rank The preparation method of phenolic resin and linear phenol-aldehyde resin is well known to those skilled in the art, for example, can join According to chemistry and bonding, roll up within 1989 (1st), 1-7 pages, and aerospace material technique, 2003 years the 33 (1) volumes, the method preparation that the document such as 18-23 pages is recorded.
In the grinding tool for jewel polishing of the invention, the species of phenolic resin is no particularly will Ask, under preferable case, phenolic resin can be resol or linear phenol-aldehyde resin.Above two Phenolic resin can be dissolved in organic solvent, be easy to be processed further shaping to obtain high-quality grinding tool.
It is highly preferred that phenolic resin can be resol, its implication is those skilled in the art institute Know, be phenol with the formaldehyde of excess under the conditions of base catalysis, the thermosetting-resoles for obtaining, Contain a large amount of methylols and remaining phenol nuclear activity reflecting point in resol molecule, can be in shaping During further mutually polycondensation generation second rank and C-stage resin or with focus ratio in active hydroxyl Base reacts, and is conducive to obtaining toughness and the suitable resinoid bond of hardness.
In the grinding tool for jewel polishing of the invention, the particle diameter of metal dust is no particularly will Ask, can be particle size range well known to those skilled in the art, under preferable case, the particle diameter of metal dust It can be 10-250 μm.The metal dust of above-mentioned particle size range can disperse evenly in grinding layer, Be conducive to improving the Forming Quality of grinding layer.
In the grinding tool for jewel polishing of the invention, the species of metal dust is also without special It is required that, can be well known to those skilled in the art, for example, metal dust is preferably copper powder, glass putty With one or more in cerium oxide powder.In metal dust, the content of respective metal is not done yet and particularly Ask, as long as meeting the general requirement in gem grinding field.Above-mentioned three kinds of metals have suitable hardness And mechanical strength, grinding layer can be made to possess suitable hardness and heat conductivility.
In the grinding tool for jewel polishing of the invention, in order to further improve the heat conduction of grinding layer Effect, metal dust is preferably copper powder, wherein the species of copper powder can be it is well known to those skilled in the art, One or more in atomized copper powder, electrolytic copper powder, cupric oxide powder and bronze powder, copper can be for example selected from The copper content of powder also has no particular limits, as long as meeting the conventional requirement of gem grinding polishing field i.e. Can, under preferable case, copper content can be more than 80 weight %.
In the grinding tool for jewel polishing of the invention, grinding tool can also include substrate and bonding Layer, the grinding tool also includes substrate and tack coat, and the grinding layer is by the tack coat and the base One or more pieces abrasive sheets that plate is fixedly connected.The present invention is not required the shape of substrate, can be this Known to art personnel, under preferable case, substrate can be disc-shaped, grinding layer can be with The a piece of circular abrasive piece of substrate diameter identical, is fixedly connected by tack coat with substrate.For the ease of adding Work, grinding layer can also be the multi-disc abrasive sheet of uniform laying, wherein all passing through tack coat per slice lapping piece It is fixedly connected with substrate, under preferable case, gap can be left between multi-disc abrasive sheet, in order to polish When abrasive material be uniformly distributed on abrasive sheet surface, improve polishing effect.
The preparation method that the present invention also provides the above-mentioned grinding tool for jewel polishing, the method includes following step Suddenly:(1) the resinoid bond solvent dissolving of requirement is obtained into resin-bonded agent solution;(2) need to The metal dust to be measured is added in the resin-bonded agent solution and is uniformly dispersed;(3) removal of solvent under reduced pressure, Obtain solid mixt;(4) solid mixt heating is carried out into precuring;(5) by precuring after consolidate State mixture is crushed to particle diameter for 100-500 μm obtains compound particles;(6) compound particles are placed in It is hot-forming in shaping mould to obtain abrasive sheet;(7) abrasive sheet is bonded on the substrate.
Wherein, the operation such as dissolving, dispersion and decompression is well known to the skilled person, and the present invention is not Special requirement is done, such as dispersion can take the mode of stirring, and decompression operation can be in vacuum drying oven Carry out, under preferable case, the temperature of vacuum drying oven can be 50-80 DEG C.
According to the present invention, the condition that solid mixt heating carries out precuring is not required particularly, as long as Satisfaction can react focus ratio and phenolic resin moiety, under preferable case, precuring it is anti- Answering condition can be:100 DEG C -120 DEG C of temperature, time 1-2h.
According to the present invention, the mode that solid mixt is crushed also is well known to those skilled in the art, example Such as solid mixt can be crushed to for 100-500 μm obtains compound particles by particle diameter by pulverizer.
According to the present invention it is possible to abrasive sheet is bonded in into base by mode well-known to those skilled in the art On plate, for example by abrasive sheet and substrate it is hot-forming or using binding agent by abrasive sheet bond with substrate on, Wherein the species of binding agent can be well known to those skilled in the art, for example can be selected from UV without shadow One or more in glue, AB glue or seccotine.
In the preparation method of the grinding tool for jewel polishing of the invention, solvent species is without special Limitation, as long as satisfaction can dissolve focus ratio, it is preferable that solvent be selected from tetrahydrofuran, One or more in dioxane, benzene, toluene and n-butanol.
It is of the invention for jewel polishing grinding tool preparation method, it is above-mentioned it is hot-forming can this Carried out on device known to art personnel, such as heat pressing forming machines or compression molding instrument.In order that The Forming Quality of abrasive sheet is improved, hot-forming to be divided into two stages, the first rank under preferable case Section reaction condition can be:120 DEG C -150 DEG C of temperature, pressure 6-10MPa, hot pressing time is 0.5-1h; The reaction condition of second stage can be:180 DEG C -220 DEG C of temperature, pressure 18-24MPa, hot pressing time It is 1-2h.Above-mentioned hot pressure reaction condition can be such that focus ratio fully melts, and the abrasive sheet for obtaining is fine and close Uniform pore-free, advantageously reduces damage of the polishing journey to jewel.
The invention is further illustrated by the following examples, but therefore the present invention should not be subject to any limit System.In following embodiments of the invention, focus ratio is purchased from Japanese Toto Kasei KK;First Rank phenolic resin and linear phenol-aldehyde resin are self-control, and its weight average molecular weight uses gel osmoticing chromatogram analysis instrument (coulomb Science and Technology Ltd., Waters 2414) is tested.It is hot-forming (northern in heat pressing forming machines The rich friend's science and technology limited Company in capital, FM1202) on carry out.The Young's modulus of focus ratio is used Bending method is in measure apparatus of youngs modulus (Beijing perseverance Order instrument and meter Co., Ltd, HA-XN-YM-III) Upper measure, remaining reagent is commercially available prod.
Embodiment 1
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 20,000, and Young's modulus is 2400MPa, the weight average molecular weight of resol It is 1000.
The resol of the focus ratio of 45 weight portions and 54 weight portions is dissolved with dioxane Focus ratio solution is obtained, the particle diameter for being added thereto to 100 weight portions is 30-50 μm of glass putty and divides Dissipate uniform, removal of solvent under reduced pressure obtains solid mixt, and solid mixt is heated to 100 DEG C of precuring 2h After be crushed to particle diameter for 100-500 μm obtains compound particles, compound particles are placed in shaping mould heat It is molded to obtain abrasive sheet, finally abrasive sheet is bonded on substrate and obtains being thrown for jewel for the present embodiment The grinding tool of light.Hot-forming reaction condition is:120 DEG C of first stage temperature, pressure 10MPa, heat The pressure time is 0.5-1h;180 DEG C of second stage temperature, pressure 24MPa, hot pressing time is 2h.
Embodiment 2
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 100,000, and Young's modulus is 2800MPa, the Weight-average molecular of linear phenol-aldehyde resin Measure is 500.
The linear phenol-aldehyde resin toluene dissolving of the focus ratio of 8 weight portions and 5 weight portions is gathered Phenoxy resin solution, the particle diameter for being added thereto to 100 weight portions is 10-20 μm of cerium oxide powder and disperses Uniformly, removal of solvent under reduced pressure obtains solid mixt, and solid mixt is heated to 120 DEG C of precuring 1h After be crushed to particle diameter for 100-500 μm obtains compound particles, compound particles are placed in shaping mould heat It is molded to obtain abrasive sheet, finally abrasive sheet is bonded on substrate and obtains being thrown for jewel for the present embodiment The grinding tool of light.Hot-forming reaction condition is:150 DEG C of first stage temperature, pressure 6MPa, heat The pressure time is 0.5h;220 DEG C of second stage temperature, pressure 18MPa, hot pressing time is 1h.
Embodiment 3
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 80,000, and Young's modulus is 2760MPa, the weight average molecular weight of resol It is 1000.
The resol of the focus ratio of 15 weight portions and 15 weight portions is dissolved with tetrahydrofuran Obtain focus ratio solution, the particle diameter for being added thereto to 100 weight portions be 38 μm of atomized copper powder simultaneously It is uniformly dispersed, removal of solvent under reduced pressure obtains solid mixt, solid mixt is heated to 100 DEG C of precuring Particle diameter is crushed to after 2h for 100-500 μm obtains compound particles, compound particles are placed in shaping mould In it is hot-forming obtain abrasive sheet, finally abrasive sheet is bonded on substrate obtain the present embodiment for treasured The grinding tool of stone polishing.Hot-forming reaction condition is:140 DEG C of first stage temperature, pressure 8MPa, Hot pressing time is 1h;200 DEG C of second stage temperature, pressure 20MPa, hot pressing time is 1h.
Embodiment 4
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 60,000, and Young's modulus is 2650MPa, the weight average molecular weight of resol It is 800.
The resol benzene dissolving of the focus ratio of 30 weight portions and 20 weight portions is gathered Phenoxy resin solution, the particle diameter for being added thereto to 100 weight portions is 250 μm of electrolytic copper powder and disperses Uniformly, removal of solvent under reduced pressure obtains solid mixt, and solid mixt is heated to 120 DEG C of precuring 1h After be crushed to particle diameter for 100-500 μm obtains compound particles, compound particles are placed in shaping mould heat It is molded to obtain abrasive sheet, finally abrasive sheet is bonded on substrate and obtains being thrown for jewel for the present embodiment The grinding tool of light.Hot-forming reaction condition is:130 DEG C of first stage temperature, pressure 7MPa, heat The pressure time is 1h;190 DEG C of second stage temperature, pressure 21MPa, hot pressing time is 0.5h.
Embodiment 5
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 60,000, and Young's modulus is 2642MPa, the weight average molecular weight of resol It is 900.
The resol of the focus ratio of 45 weight portions and 40 weight portions is dissolved with tetrahydrofuran Focus ratio solution is obtained, the particle diameter for being added thereto to 100 weight portions is 74 μm of bronze powder and divides Dissipate uniform, removal of solvent under reduced pressure obtains solid mixt, and solid mixt is heated to 110 DEG C of precuring 2h After be crushed to particle diameter for 100-500 μm obtains compound particles, compound particles are placed in shaping mould heat It is molded to obtain abrasive sheet, finally abrasive sheet is bonded on substrate and obtains being thrown for jewel for the present embodiment The grinding tool of light.Hot-forming reaction condition is:135 DEG C of first stage temperature, pressure 9MPa, heat The pressure time is 0.5h;195 DEG C of second stage temperature, pressure 20MPa, hot pressing time is 1h.
Embodiment 6
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.In the present embodiment, poly phenol oxygen tree The weight average molecular weight of fat is 60,000, and Young's modulus is 2670MPa, the weight average molecular weight of resol It is 1000.
The resol of the focus ratio of 35 weight portions and 35 weight portions is dissolved with tetrahydrofuran Focus ratio solution is obtained, the particle diameter for being added thereto to 100 weight portions is 150 μm of cupric oxide powder And be uniformly dispersed, removal of solvent under reduced pressure obtains solid mixt, solid mixt be heated to 120 DEG C it is pre- solid Particle diameter is crushed to for 100-500 μm obtains compound particles after changing 1.5h, and compound particles are placed in into It is hot-forming in pattern to obtain abrasive sheet, abrasive sheet is finally bonded on substrate the use for obtaining the present embodiment In the grinding tool of jewel polishing.Hot-forming reaction condition is:125 DEG C of first stage temperature, pressure 10MPa, hot pressing time is 0.5h;210 DEG C of second stage temperature, pressure 20MPa, hot pressing time is 1h。
Embodiment 7
The present embodiment is used to illustrate grinding tool of the invention and preparation method thereof.Using same as Example 1 Raw material and preparation method, except that, glass putty is replaced with etc. the atomization of 38 μm of the particle diameter position of weight Copper powder, the grinding tool for jewel polishing to the present embodiment of preparation.
Comparative example 1
Using preparation method same as Example 1, except that by focus ratio and first rank phenolic aldehyde Resin replacement into etc. weight linear phenol-aldehyde resin (weight average molecular weight is 1000).
Comparative example 2
Using preparation method same as Example 1, except that by focus ratio and first rank phenolic aldehyde Resin replacement into etc. weight epoxy resin (trade mark Taiwan mould E44, epoxide equivalent 220).
Testing example
Use embodiment 1-7 and the grinding tool obtained in comparative example 1 identical operating mode (control pressure for 0.12-0.15MPa, rotating speed is 60-70rpm, and abrasive material is the diamond of w2-3) under sapphire is carried out Polishing experiments, the surface roughness of the jewel after test polishing, data result is listed in Table 1 below.
According to the data of table 1, use can be seen that by the Data Comparison of embodiment 1-6 and comparative example 1 The gemstone surface roughness that grinding tool for jewel polishing of the invention is processed by shot blasting to obtain to jewel It is relatively low, this be because in grinding tool of the invention, grinding layer contains focus ratio and metal dust, due to Focus ratio possesses excellent toughness so that grinding layer has suitable hardness and toughness, it is to avoid throw The damage of bulky grain in light time abrasive material to gemstone surface, improves the machining accuracy to gemstone surface.
Table 1
Surface roughness Ra/nm
Embodiment 1 37
Embodiment 2 42
Embodiment 3 26
Embodiment 4 28
Embodiment 5 19
Embodiment 6 15
Embodiment 7 27
Comparative example 1 82
Comparative example 2 84
Be can be seen that by the Data Comparison of embodiment 1 and comparative example 1 and thrown for jewel using of the invention The grinding tool of light is processed by shot blasting that the gemstone surface roughness for obtaining is relatively low to jewel, and this is due to the present invention Grinding tool in, grinding layer contains focus ratio and metal dust, because focus ratio possesses excellent Toughness so that grinding layer has suitable hardness and toughness, it is to avoid the bulky grain pair during polishing in abrasive material The damage of gemstone surface, improves the machining accuracy to gemstone surface.From embodiment 1 and embodiment 7 Data Comparison can be seen that in the case where currently preferred metal dust is copper powder, prepare Grinding tool can further improve the machining accuracy on processing gem surface.
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited to above-mentioned reality The detail in mode is applied, in range of the technology design of the invention, can be to technical side of the invention Case carries out various simple variants, and these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique described in above-mentioned specific embodiment is special Levy, in the case of reconcilable, can be combined by any suitable means.In order to avoid need not The repetition wanted, the present invention is no longer separately illustrated to various possible combinations.
Additionally, can also be combined between a variety of implementation methods of the invention, as long as its Without prejudice to thought of the invention, it should equally be considered as content disclosed in this invention.

Claims (12)

1. a kind of grinding tool for jewel polishing, including grinding layer, it is characterised in that:The grinding layer It is described resin-bonded relative to the metal dust of 100 weight portions containing resinoid bond and metal dust The content of agent is 10-100 weight portions, wherein, the resinoid bond contains focus ratio and phenolic aldehyde Resin, relative to the focus ratio of 100 weight portions, the content of the phenolic resin is 60-120 weights Amount part.
2. the grinding tool for jewel polishing according to claim 1, it is characterised in that described poly- The weight average molecular weight of phenoxy resin is 20,000-10 ten thousand, and the weight average molecular weight of the phenolic resin is 500-1000。
3. it is according to claim 1 and 2 for jewel polishing grinding tool, it is characterised in that institute The Young's modulus for stating focus ratio is 2400-2800MPa.
4. it is according to claim 1 and 2 for jewel polishing grinding tool, it is characterised in that institute Phenolic resin is stated for resol or linear phenol-aldehyde resin.
5. it is according to claim 1 for jewel polishing grinding tool, it is characterised in that the gold The particle diameter for belonging to powder is 10-250 μm.
6. the grinding tool of jewel polishing is used for according to claim 1 or 5, it is characterised in that institute It is selected from one or more in copper powder, glass putty and cerium oxide powder to state metal dust.
7. according to any one in claim 1,5 or 6 for jewel polishing grinding tool, its It is characterised by, the metal dust is copper powder, and the copper powder is selected from atomized copper powder, electrolytic copper powder, oxygen Change one or more in copper powder and bronze powder.
8. it is according to claim 1 for jewel polishing grinding tool, it is characterised in that the mill Tool also includes substrate and tack coat, and the grinding layer is to be fixedly connected with the substrate by the tack coat One or more pieces abrasive sheets.
9. the preparation method of the grinding tool in claim 1-8 described in any one, it is characterised in that bag Include following steps:
(1) the resinoid bond solvent dissolving of requirement is obtained into resin-bonded agent solution;
(2) metal dust of requirement is added in the resin-bonded agent solution and is uniformly dispersed;
(3) removal of solvent under reduced pressure, obtains solid mixt;
(4) solid mixt heating is carried out into precuring;
(5) solid mixt after precuring is crushed to particle diameter for 100-500 μm obtains compound particles Grain;
(6) compound particles are placed in and hot-forming in shaping mould obtain abrasive sheet;
(7) abrasive sheet is bonded on the substrate.
10. preparation method according to claim 10, it is characterised in that the solvent be selected from One or more in tetrahydrofuran, dioxane, benzene, toluene and n-butanol.
11. preparation methods according to claim 10, it is characterised in that the precuring it is anti- The condition is answered to be:100 DEG C -120 DEG C of temperature, time 1-2h.
12. preparation methods according to claim 10, it is characterised in that described hot-forming point It it is two stages, the reaction condition of first stage is:125 DEG C -150 DEG C of temperature, pressure 6-10MPa, Hot pressing time is 0.5-1h;The reaction condition of second stage is:180 DEG C -220 DEG C of temperature, pressure 18-24MPa, hot pressing time is 1-2h.
CN201510981961.XA 2015-12-23 2015-12-23 A kind of grinding tool for jewel polishing and preparation method thereof Pending CN106903619A (en)

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CN110355699A (en) * 2019-05-19 2019-10-22 北京工业大学 A kind of aluminium base diamond composite ELID grinding wheel for grinding and preparation method thereof
CN112621579A (en) * 2020-11-19 2021-04-09 广东奔朗新材料股份有限公司 Grinding wheel and manufacturing method thereof

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