CN106883505B - 一种柔性半导电屏蔽料及其制备方法 - Google Patents
一种柔性半导电屏蔽料及其制备方法 Download PDFInfo
- Publication number
- CN106883505B CN106883505B CN201710229651.1A CN201710229651A CN106883505B CN 106883505 B CN106883505 B CN 106883505B CN 201710229651 A CN201710229651 A CN 201710229651A CN 106883505 B CN106883505 B CN 106883505B
- Authority
- CN
- China
- Prior art keywords
- eva
- sebs
- uniform
- antioxidant
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims abstract description 29
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 20
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 11
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 238000004132 cross linking Methods 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 11
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims abstract description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 239000012188 paraffin wax Substances 0.000 claims abstract description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 25
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 25
- 239000011159 matrix material Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 239000006229 carbon black Substances 0.000 description 5
- 235000019241 carbon black Nutrition 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 101150087322 DCPS gene Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 101100386724 Schizosaccharomyces pombe (strain 972 / ATCC 24843) nhm1 gene Proteins 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- WORCCYVLMMTGFR-UHFFFAOYSA-M loxoprofen sodium Chemical compound [Na+].C1=CC(C(C([O-])=O)C)=CC=C1CC1C(=O)CCC1 WORCCYVLMMTGFR-UHFFFAOYSA-M 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0098—Shielding materials for shielding electrical cables
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/02—Heterophasic composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供一种柔性半导电屏蔽料及其制备方法,按照重量份数组成如下:EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.0~2.5;其制备包括以下步骤:(1)在高温混合器中,将EVA与高导电炭黑、抗氧剂熔融混合均匀;(2)之后加入SEBS热塑性弹性体,熔融混合均匀;(3)最后加入固体石蜡、交联剂DCP和交联助剂TAIC,熔融混合均匀后,迅速从混合器中取出物料并冷却至室温。本发明的半导电屏蔽料具有柔性和半导电功能。
Description
技术领域
本发明涉及一种柔性半导电屏蔽料及其制备方法,具体地说,涉及一种通过多相体系的组份调控而获得具有柔性的半导电屏蔽料的制备方法,属于电缆屏蔽料的制备与性能研究。
背景技术
高分子半导电屏蔽料在电缆屏蔽领域应用十分广泛,通常在电缆的导体***设置半导电屏蔽层来使电场分布均匀,提高电缆的电气强度和使用寿命。现有的交联聚乙烯电力电缆用内屏蔽料大多采用乙烯-醋酸乙烯共聚物(EVA)作为基础树脂,通过添加炭黑以及抗氧剂、润滑剂,经过挤出造粒后吸收过氧化物交联剂制备而成;为了使其具有较低的体积电阻率,常见的制备方法是在EVA基体中添加大量导电炭黑;但体系中的炭黑填充量过高,会使得复合体系硬化和脆化,导致力学性能的下降以及在电缆挤出时加工性能的恶化,使得屏蔽层表面粗糙,在高压电场条件下易导致电缆绝缘层击穿。如何在确保半导电屏蔽料具有半导电功能的同时,使其自身具有一定的柔软性,成为目前面临的难题。
本发明提供一种新的技术方案,对于以EVA基材的半导电屏蔽料,通过对多相体系的组份调控,在不提高导电材料含量的基础上,制备出具有柔性和良好加工性能的半导体屏蔽料。
发明内容
本发明针对在目前电力电缆用半导电屏蔽料的应用中,由于EVA基体中导电炭黑填充量过高而导致了半导电屏蔽料硬化脆化且加工性能下降的问题,制备了一种柔性电缆用半导电屏蔽料,进一步开发了半导电屏蔽料的产品品级,产物具有显著柔性。
本发明提供了一种柔性半导电屏蔽料及其制备方法,包括下列顺序步骤:
(1)通过熔融共混工艺,在115℃的高温混合器中,将EVA与高导电炭黑、抗氧剂混合均匀;
(2)将SEBS热塑性弹性体加入步骤(1)所获得的混合物中,继续熔融混合至均匀;
(3)最后将固体石蜡、交联剂DCP和交联助剂TAIC加入步骤(2)所获得的混合物中,熔融混合至均匀,之后迅速从混合器中取出物料并冷却至室温。
其中,按照重量份数组成如下:EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.5~2.5。
在上述的技术方案中,EVA是半导电屏蔽料的基体材料,也就是产物的连续相;而SEBS热塑性弹性体、高导电炭黑、抗氧剂、交联剂、交联助剂和固体石蜡等,则在熔融共混过程中,成为产物的分散相,并与基体共同构成了多相复合体系。SEBS热塑性弹性体是以聚苯乙烯为末端段,以聚丁二烯加氢得到的乙烯-丁烯共聚物为中间弹性嵌段的线性嵌段共聚物;SEBS中的聚苯乙烯链段赋予其良好的加工流动性能,而聚丁二烯链段则赋予其良好的橡胶高弹性;SEBS不含不饱和双键,具有良好的稳定性和耐老化性。当SEBS与EVA的复合体系进行熔融共混时,由于SEBS与EVA之间只具有一定的相容性,因此在熔融共混过程中,两者不能达到分子级的分散水平,最终SEBS只能以分散相分散于EVA基体中;另一方面,由于SEBS自身为热塑性弹性体,具有良好的加工流动性,因而在熔融过程中,在剪切力作用下,SEBS可以在EVA基体中形成尺寸较小的分散相。以EVA基材的半导电屏蔽料中SEBS分散相的存在,可以对EVA基体起到了良好的增韧效果,并由此赋予了复合体系一定的柔性;而且,SEBS在EVA中的分散相尺寸较小,这样SEBS的存在就不会对EVA半导电连续相的导电性造成明显的阻碍效应。将EVA与高导电炭黑、抗氧剂混合均匀之后,再加入SEBS进行熔融共混,可以保证体系中高导电炭黑分散于EVA基体中,而较少扩散到SEBS相,这样在确保基体EVA连续相导电的同时,降低了导电材料在整个复合体系中的重量含量。可见,将SEBS熔融共混到EVA半导电屏蔽料,SEBS以小的分散相分散于EVA基体,显著提高了基体的韧性,赋予了复合体系的柔性;SEBS分散相的细化,则对EVA连续相的导电性影响较小,确保了复合体系的半导电功能。
本发明与现有技术相比,具有显著的积极效果和先进性:本发明的半导电屏蔽料中适量SEBS热塑性弹性体的引入,赋予了复合体系良好的柔性和良好的加工性能。
本发明制得的柔性半导电屏蔽料可用于高压电缆的内屏蔽料。
具体实施方式:下面的实施例是对本发明的进一步说明,而不是限制本发明的范围。
实施例1:柔性半导电屏蔽料的制备
(1)先将70.0克EVA粒子加入的115℃的转矩流变仪,转速为65rpm,之后加入30.0克高导电炭黑和0.5克抗氧剂1010,熔融共混6分钟;
(2)将30.0克SEBS加入(1)的混合物中,熔融共混3分钟;
(3)将1.0克交联剂DCP、1.5克交联助剂TAIC及1.0克固体石蜡加入(2)的混合物中,熔融共混3分钟,迅速从混合器中取出物料并冷却至室温;
(4)将样品放入垫有聚四氟乙烯隔离膜的不锈钢模具内,用平板硫化机在160℃温度下预热1min,在10MPa的压力下模压8min,之后在室温条件的平板硫化机上冷压定型,获得测试用片状样品。
邵A硬度的测试:采用LX-A型橡胶硬度计,按照GB/T531.1-2008,测试样品邵A硬度。
正温度系数效应的测定:将模压制备的长*宽*厚为110mm*50mm*2mm的测试样品置于程序控温的真空干燥箱中升温,用电线电缆半导电橡塑电阻测试仪测量并记录体积电阻率数据,根据测试数据计算从25℃到90℃度这一温度范围内的正温度系数效应,即PTC强度,即升温过程中90℃时材料的体积电阻率与室温25℃时材料的体积电阻率的比值的对数值。
通过熔融共混所制备出的柔性半导电屏蔽料的邵A硬度,以及其在室温25℃时的体积电阻率、90℃时的体积电阻率及正温度系数效应见表1。
实施例2:柔性半导电屏蔽料的制备
70.0克EVA;35.0克高导电炭黑;1.0克抗氧剂1010;20.0克SBS热塑性弹性体;1.5克交联剂DCP、2.5克交联助剂TAIC及1.5克固体石蜡。其余与实施1相同。
实施例3:柔性半导电屏蔽料的制备
80.0克EVA;40.0克高导电炭黑;1.5克抗氧剂1010;25.0克SEBS热塑性弹性体;2.0克交联剂DCP、3.0克交联助剂TAIC及2.5克固体石蜡。其余与实施1相同。
实施例4:柔性半导电屏蔽料的制备
90.0克EVA;40.0克高导电炭黑;1.0克抗氧剂1010;10.0克SEBS热塑性弹性体;1.5克交联剂DCP、2.5克交联助剂TAIC及2.0克固体石蜡。其余与实施1相同。
表1半导电屏蔽料的邵A硬度、25℃时体积电阻率、90℃时体积电阻率及正温度系数效应
在柔性半导电屏蔽料中,决定其柔性和半导电性的主要因素分别是SEBS热塑性弹性体的含量以及导电材料的含量。提高导电材料的用量,可适当降低室温下的体积电阻率,但同时降低了屏蔽料的柔性和加工流动性,且容易造成表层粗糙;适量的SEBS热塑性弹性体在半导电屏蔽料中的存在,会在赋予复合体系柔软性的同时,确保复合体系必要的加工性;另外,从表1可以看出,柔性半导电屏蔽料可以显著弱化正温度系数效应,这就保证半导电屏蔽料在电缆额定工作温度下也能保证较低的体积电阻率,有效提高了半导体屏蔽料的性能。
显然,本发明上述实施例仅仅是为清楚地说明本发明所做的举例,而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无法对所有的实施方式予以穷举。凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。
Claims (1)
1.一种柔性半导电屏蔽料,其特征在于,包括下列顺序步骤:
(1)EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.0~2.5;
(2)在115℃的高温混合器中,将EVA与高导电炭黑、抗氧剂熔融混合均匀;之后加入SEBS热塑性弹性体,熔融混合均匀;最后加入固体石蜡、交联剂DCP和交联助剂TAIC,熔融混合均匀后,迅速从混合器中取出物料并冷却至室温。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710229651.1A CN106883505B (zh) | 2017-04-10 | 2017-04-10 | 一种柔性半导电屏蔽料及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710229651.1A CN106883505B (zh) | 2017-04-10 | 2017-04-10 | 一种柔性半导电屏蔽料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106883505A CN106883505A (zh) | 2017-06-23 |
CN106883505B true CN106883505B (zh) | 2019-05-28 |
Family
ID=59182891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710229651.1A Expired - Fee Related CN106883505B (zh) | 2017-04-10 | 2017-04-10 | 一种柔性半导电屏蔽料及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106883505B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110078990A (zh) * | 2019-04-01 | 2019-08-02 | 青岛科技大学 | 一种磁性复合高压直流电缆半导电屏蔽层及其制备方法 |
CN111454533B (zh) * | 2020-04-09 | 2023-01-31 | 立讯精密工业股份有限公司 | 一种导电塑胶及其应用 |
CN113621249B (zh) * | 2021-08-24 | 2022-07-26 | 浙江鼎富橡塑科技有限公司 | 一种防异响的tpe防尘套及其生产工艺 |
-
2017
- 2017-04-10 CN CN201710229651.1A patent/CN106883505B/zh not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
《功能型EVA/SBR TPV及EVA/EVM TPV的结构与性能》;王灿灿;《青岛科技大学硕士论文》;20160418;第89-96页 |
Also Published As
Publication number | Publication date |
---|---|
CN106883505A (zh) | 2017-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106883505B (zh) | 一种柔性半导电屏蔽料及其制备方法 | |
US3666876A (en) | Novel compositions with controlled electrical properties | |
Basfar et al. | Physico-chemical properties of low density polyethylene and ethylene vinyl acetate composites cross-linked by ionizing radiation | |
CN109608866B (zh) | 一种导热热塑性动态硫化硅橡胶及其制备方法 | |
CN106751911A (zh) | 低硬度高强度绝缘硅橡胶及其制备方法 | |
EP2095376A1 (en) | Field grading material | |
CN105837950B (zh) | 一种聚烯烃基导电和介电复合材料及其制备方法 | |
CN115322472B (zh) | 基于复配树脂的半导电屏蔽料及其制备方法和应用 | |
CN109456542A (zh) | 一种橡胶绝缘材料 | |
CN108314898A (zh) | 导电橡胶组合物、导电橡胶及其制备方法 | |
CN112280231A (zh) | 一种聚丙烯基热塑性电缆用屏蔽料及其制备方法 | |
CN109082123A (zh) | 石墨烯改性电磁屏蔽硅橡胶材料及其制备方法 | |
Zhao et al. | Globally reinforced mechanical, electrical, and thermal properties of nonlinear conductivity composites by surface treatment of varistor microspheres | |
CN101891915A (zh) | 交联电缆绝缘用可剥离半导电屏蔽料 | |
CN110938274B (zh) | 硅烷交联型半导电屏蔽材料及其制备方法和应用 | |
CN116063801A (zh) | 一种导热绝缘ev电缆料及其制备方法和应用 | |
CN107841145A (zh) | 一种变压器用导热绝缘硅橡胶复合材料 | |
JP2013113736A (ja) | 導電性組成物及びセンサーケーブル | |
CN103665529A (zh) | 半导电内屏蔽料组合物及半导电内屏蔽料及其制法和中低压及110千伏电缆 | |
KR102444559B1 (ko) | 다상 전도성 중합체 복합체 조성물 | |
KR101020377B1 (ko) | 도전성 탄성체의 조성물 및 제조방법 | |
CN109294050A (zh) | 硅烷交联型半导电内屏蔽料及其制备方法 | |
CN108676211A (zh) | 一种添加古马隆-茚树脂的缆线护套材料及其制备方法 | |
CN109251398A (zh) | 一种绝缘用半导电屏蔽料及其制备方法 | |
CN105153552A (zh) | 一种高柔性高电气性能电线电缆绝缘材料及制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190528 |
|
CF01 | Termination of patent right due to non-payment of annual fee |