CN106862758A - A kind of compound standard laser-processing system - Google Patents
A kind of compound standard laser-processing system Download PDFInfo
- Publication number
- CN106862758A CN106862758A CN201710179096.6A CN201710179096A CN106862758A CN 106862758 A CN106862758 A CN 106862758A CN 201710179096 A CN201710179096 A CN 201710179096A CN 106862758 A CN106862758 A CN 106862758A
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- CN
- China
- Prior art keywords
- laser
- coupling unit
- processing system
- power
- peak power
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
Abstract
The present invention discloses a kind of compound standard laser-processing system, including high power CW laser, high peak power pulse laser, coupling unit, control unit and optic fiber coupling unit, described control unit is electrically connected with high power CW laser and high peak power pulse laser respectively, and the coupling unit receives the laser of high power CW laser and the transmitting of high peak power pulse laser and outputs it to optic fiber coupling unit.The present invention can reach lifting process velocity, realize that output parameter is adjusted, and extend machinable material scope, and realize being cut by laser, clean, the effect of the integrated design of mark.
Description
Technical field
The invention belongs to technical field of laser processing, more particularly to a kind of compound standard laser-processing system.
Background technology
LASER Light Source or be pulse mode (such as laser marking machine) that current existing laser-processing system is used, or for even
Discontinuous Conduction mode (such as laser cutting system), form is more single, and laser parameter adjustability is poor, and stand-alone application scope is narrower.Known arteries and veins
Working mechanism of the impulse light with continuous laser in laser processing procedure is different, and pulse laser has peak power very high, example
Such as in metal process is laser machined, metal evaporation is caused using peak power high, can moment to the surface shape of metal material
Into damage, but, often power output is limited for high-peak power laser, this resulted in laser processing procedure in energy accumulation not
Foot, process velocity is limited, is typically only capable of causing metal surface texturing, lifts the roughness of metal surface；Continuous laser can have
There is very big power output, mainly heat accumulation is carried out in metal surface using laser energy in laser processing procedure, by fusing
Mechanism carries out intermetallic composite coating, but high-intensity laser beam is when exposing to material surface, and metal surface will have swashing for 60%-80%
Light energy reflects and loses, and because the process of heat accumulation fusing metal is time process more long, and metal thermal conductivity
Rate is higher, has so not only easily caused the waste of laser energy, expands Laser Processing heat affected area, influences the follow-up of workpiece
Use, and influence Laser Processing surface evenness.Furthermore, high-power laser output, it is meant that technical difficulty high and cost
Input, and system working service engineering risk is higher.
The content of the invention
Laser parameter adjustability for laser-processing system present in prior art of the invention is poor, stand-alone application scope
A kind of narrow technical problem in face, there is provided compound standard laser-processing system, can reach lifting process velocity, realize that output parameter is adjusted
Section, extends machinable material scope, and realize being cut by laser, clean, the beneficial effect of the integrated design of mark.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of compound standard laser-processing system, bag
High power CW laser, high peak power pulse laser, coupling unit, control unit and optic fiber coupling unit are included,
Described control unit is electrically connected with high power CW laser and high peak power pulse laser respectively, described
Coupling unit receives the laser of high power CW laser and the transmitting of high peak power pulse laser and outputs it to optical fiber
Coupling unit.
Preferably, the coupling unit is made up of polarization coupled outgoing mirror and Gauss beam reshaping focus lens group, or
It is made up of wavelength output coupling mirror and Gauss beam reshaping focus lens group.
Preferably, the high power CW laser provides high power CW laser, using polarization-maintaining type or medium-sized
Laser, including but not limited to optical fiber laser, or solid, gas, semiconductor, the quasi-molecule that high power laser light can be provided
Or other types laser；When subsequent coupling mode uses polarization coupled mode, using polarization-maintaining type laser, work as subsequent structural
During using wavelength coupled modes, using plain edition laser.
Preferably, the high peak power pulse laser provides high peak power pulse laser, using polarization-maintaining type or
Medium-sized laser, refers mainly to using the laser for adjusting the modulation systems such as Q, locked mode or Q-switch and mode-locking to produce pulse laser, laser
Device type is included and is not limited to the types such as solid, optical fiber, gas, semiconductor.When subsequent coupling mode uses polarization coupled mode
When, polarization-maintaining type laser need to be used, when subsequent structural uses wavelength coupled modes, using plain edition laser.
Preferably, the coupling unit includes laser alignment focusing system so that the light of continuous laser and pulse laser
Spot effectively overlaps.
Preferably, described control unit includes system power supply device；Described control unit is by controlling high power CW
The supply current of laser and high peak power pulse laser, realizes the control of the power to exporting laser.
Preferably, be coupled into recombination laser in Transmission Fibers by the optic fiber coupling unit, the biography of recombination laser is realized
Defeated property.
Compared with prior art, the present invention is had an advantageous effect in that：The present invention is by high peak power pulse laser, height
Power output continuous laser is combined, the characteristics of make full use of both, not only can effective lifting system process velocity,
And output laser peak power, the isoparametric regulation of power output can be realized, the scope of machinable material is greatly expanded,
It is capable of achieving laser cutting, cleaning, the integrated design of mark.
Brief description of the drawings
Fig. 1 is structural representation of the invention；
Fig. 2 is polarization coupled schematic diagram of the invention；
Fig. 3 is wavelength coupling principle figure of the invention.
Specific embodiment
To make those skilled in the art be better understood from technical scheme, below in conjunction with the accompanying drawings and specific embodiment
The present invention is elaborated.
Embodiment of the invention discloses that a kind of compound standard laser-processing system, including high power CW laser, height
Peak power pulses laser, coupling unit, control unit and optic fiber coupling unit, control unit swash with high power CW respectively
Light device and high peak power pulse laser are electrically connected with, and coupling unit receives high power CW laser and high-peak power arteries and veins
Rush the laser of laser transmitting and output it to optic fiber coupling unit.
Coupling unit includes laser alignment focusing system so that continuous laser effectively overlaps with the hot spot of pulse laser.
Control unit includes system power supply device；Control unit is by controlling high power CW laser and high-peak power
The supply current of pulse laser, realizes the control of the power to exporting laser.
Be coupled into recombination laser in Transmission Fibers by optic fiber coupling unit, realizes the transporting of recombination laser.
Embodiment 1：
When continuous laser is equal with the wavelength of pulse laser,
Coupling unit is made up of polarization coupled outgoing mirror and Gauss beam reshaping focus lens group.
High power CW laser provides high power CW laser, using the optical fiber laser of polarization-maintaining type, or can carry
Solid, gas, semiconductor, quasi-molecule or other types laser for the polarization-maintaining type of high power laser light.
High peak power pulse laser provides high peak power pulse laser, using polarization-maintaining type laser, refers mainly to adopt
With the laser for adjusting the modulation system such as Q, locked mode or Q-switch and mode-locking to produce pulse laser, laser type includes and be not limited to solid,
The types such as optical fiber, gas, semiconductor.
In coupling unit, continuous wave laser and the laser that pulse laser is provided are polarization laser, and both polarizations
Direction is mutually perpendicular to, for example, using polarizer as bundling device main body, its principle is as shown in Fig. 2 polarization direction is parallel to paper
Continuous laser (or pulse laser) with perpendicular to paper pulse laser (or continuous laser) respectively from polarizer both sides distinguish
It is incident with Brewster angle θ 1 and θ 2.It is apparent from, when both optical maser wavelengths are equal, θ 1=θ 2=θ 3, two light can overlap.Separately
Outward, laser alignment focusing system is included in coupled system, may be such that continuous laser is effectively working with pulse laser output laser
Hot spot can effectively overlap in distance range.
Embodiment 2：
When unequal or both the polarization state of the wavelength of continuous laser and pulse laser is relatively difficult to achieve,
Coupling unit is made up of wavelength output coupling mirror and Gauss beam reshaping focus lens group.
High power CW laser provides high power CW laser, using medium-sized optical fiber laser, or can carry
Medium-sized solid, gas, semiconductor, quasi-molecule or other types laser for high power laser light.
High peak power pulse laser provides high peak power pulse laser, using plain edition laser, refers mainly to adopt
With the laser for adjusting the modulation system such as Q, locked mode or Q-switch and mode-locking to produce pulse laser, laser type includes and be not limited to solid,
The types such as optical fiber, gas, semiconductor.
In coupling unit, the polarization state to laser is not required, it is bundling device main body to use dichroscope, and its principle is such as
Shown in Fig. 3, continuous laser and pulse laser are respectively reflecting and reflect, or pulse laser and continuous laser are reflecting and reflect
By dichroscope, incident angle is that θ 1 and θ 2 is respectively dichroscope film layer required angle, and θ 1=θ 2=θ 3, two light to mode
Can overlap.In addition, including laser alignment focusing system in coupled system, may be such that continuous laser exists with pulse laser output laser
Hot spot can effectively overlap in the range of effective working distance.
The present invention is laser machined by the way of pulse laser and continuous laser are combined.For example in laser cutting process
In, using the high-peak power of pulse laser, the damage of metal surface to be processed is caused, otch is manufactured, it is high using continuous laser
The characteristics of power output, there is provided energy support, carry out depth cutting；During laser cleaning, using pulse laser peak value
Power feature, depth to metal surface forms shock wave between metal surface and pollution layer so that separated from contaminants, utilizes
The characteristics of continuous laser reaches power so that pollutant ablation.Can so cause that various Laser Processing mechanism are concured, i.e.,
Systematic difference scope can be expanded with improving laser process velocity, the index request to laser can be reduced again, so as to reduce
Cost.
The present invention is combined high peak power pulse laser, high-output power continuous laser, makes full use of both
The characteristics of, not only can effective lifting system process velocity, and output laser peak power, power output can be realized
Isoparametric regulation, greatly expands the scope of machinable material, is capable of achieving laser cutting, cleaning, the integrated design of mark.
The present invention has been described in detail above by embodiment, but the content is only exemplary implementation of the invention
Example, it is impossible to be considered as limiting practical range of the invention.Protection scope of the present invention is defined by the claims.All utilizations
Technical solutions according to the invention, or those skilled in the art is under the inspiration of technical solution of the present invention, in reality of the invention
In matter and protection domain, design similar technical scheme and reach above-mentioned technique effect, or application range is made
Impartial change and improvement etc., all should still belong to patent of the invention and cover within protection domain.
Claims (7)
1. a kind of compound standard laser-processing system, including high power CW laser, high peak power pulse laser, coupling
Unit, control unit and optic fiber coupling unit, it is characterised in that
Described control unit is electrically connected with high power CW laser and high peak power pulse laser respectively, the coupling
Unit receives the laser of high power CW laser and the transmitting of high peak power pulse laser and outputs it to fiber coupling
Unit.
2. a kind of compound standard laser-processing system according to claim 1, it is characterised in that the coupling unit is by inclined
Shake output coupling mirror and Gauss beam reshaping focus lens group composition, or is focused on by wavelength output coupling mirror and Gauss beam reshaping
Lens group is constituted.
3. a kind of compound standard laser-processing system according to claim 1, it is characterised in that the high power CW swashs
Light device provides high power CW laser, using polarization-maintaining type or medium-sized laser.
4. a kind of compound standard laser-processing system according to claim 1, it is characterised in that the high-peak power arteries and veins
Rush laser and high peak power pulse laser is provided, using polarization-maintaining type or medium-sized laser.
5. a kind of compound standard laser-processing system according to claim 1, it is characterised in that the coupling unit is included
Laser alignment focusing system so that continuous laser effectively overlaps with the hot spot of pulse laser.
6. a kind of compound standard laser-processing system according to claim 1, it is characterised in that described control unit includes
System power supply device；Described control unit is by controlling the power supply of high power CW laser and high peak power pulse laser
Electric current, realizes the control of the power to exporting laser.
7. a kind of compound standard laser-processing system according to claim 1, it is characterised in that the optic fiber coupling unit
Recombination laser is coupled into Transmission Fibers, the transporting of recombination laser is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710179096.6A CN106862758A (en) | 2017-03-23 | 2017-03-23 | A kind of compound standard laser-processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710179096.6A CN106862758A (en) | 2017-03-23 | 2017-03-23 | A kind of compound standard laser-processing system |
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| CN106862758A true CN106862758A (en) | 2017-06-20 |
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| CN201710179096.6A Pending CN106862758A (en) | 2017-03-23 | 2017-03-23 | A kind of compound standard laser-processing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719088A (en) * | 2019-01-24 | 2019-05-07 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaner |
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| US20060237402A1 (en) * | 2005-04-22 | 2006-10-26 | Takahiro Nagashima | Laser welding method and laser welding apparatus |
| CN103182604A (en) * | 2013-03-12 | 2013-07-03 | 镭射谷科技(深圳)有限公司 | Laser hybrid welding method and system |
| CN105397314A (en) * | 2015-12-31 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Composite pulse laser drilling method and device |
| CN105921884A (en) * | 2015-10-29 | 2016-09-07 | 福建中科光汇激光科技有限公司 | Pulse-continuous wave compound laser machining system |
| CN106346141A (en) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | Metal cutting device based on composite laser beams |
| CN106425085A (en) * | 2016-10-13 | 2017-02-22 | 武汉市凯瑞迪激光技术有限公司 | Laser roughening machining device |
-
2017
- 2017-03-23 CN CN201710179096.6A patent/CN106862758A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060237402A1 (en) * | 2005-04-22 | 2006-10-26 | Takahiro Nagashima | Laser welding method and laser welding apparatus |
| CN103182604A (en) * | 2013-03-12 | 2013-07-03 | 镭射谷科技(深圳)有限公司 | Laser hybrid welding method and system |
| CN105921884A (en) * | 2015-10-29 | 2016-09-07 | 福建中科光汇激光科技有限公司 | Pulse-continuous wave compound laser machining system |
| CN105397314A (en) * | 2015-12-31 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Composite pulse laser drilling method and device |
| CN106346141A (en) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | Metal cutting device based on composite laser beams |
| CN106425085A (en) * | 2016-10-13 | 2017-02-22 | 武汉市凯瑞迪激光技术有限公司 | Laser roughening machining device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719088A (en) * | 2019-01-24 | 2019-05-07 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaner |
| CN109719088B (en) * | 2019-01-24 | 2023-10-24 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaning device |
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Application publication date: 20170620 |