CN106852098A - Ultra-thin conductive radiating foam and preparation method - Google Patents
Ultra-thin conductive radiating foam and preparation method Download PDFInfo
- Publication number
- CN106852098A CN106852098A CN201610907358.1A CN201610907358A CN106852098A CN 106852098 A CN106852098 A CN 106852098A CN 201610907358 A CN201610907358 A CN 201610907358A CN 106852098 A CN106852098 A CN 106852098A
- Authority
- CN
- China
- Prior art keywords
- inner core
- foam
- core foam
- ultra
- thin conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses ultra-thin conductive radiating foam and preparation method, it mainly includes inner core foam, the inner core foam side is provided with conducting resinl, the conducting resinl is provided with release layer away from inner core foam side, the inner core foam outer layer is provided with outer covering material, the outer covering material axially enters the side parcel of Line Continuity 66% 75% to inner core foam, the side that the inner core foam is not contacted with outer covering material completely is the adjacent edge with side residing for conducting resinl, the present invention is not used full package structure in inner core foam outer layer, so that in compression process is made, enable that gas of the inner core foam in compression process is discharged from the non-bound edge side of inner core foam, so that inner core foam reaches ultra-thin effect, can equally realize turning on up and down simultaneously, shielding, radiating, buffering and other effects.
Description
Technical field
The present invention relates to a kind of conducting foam, more particularly to ultra-thin conductive radiating foam and preparation method.
Background technology
Conductive sponge or foam category in the market is very more, but is substantially based on conductive shield buffering
Demand is wanted, so the product of in the market is full package structure when foam is wrapped up, it cannot adapt to some needs and solve heat drop
Low, outward appearance is ultra-thin and occasion of conductie buffer simultaneously, take into account simultaneously in the market the characteristics such as conductive shield buffering radiating and
The material that below 0.1mm can be compressed to is deficient.
The content of the invention
Present invention solves the technical problem that being to provide, a kind of outward appearance is ultra-thin and ultra-thin conductive with conductive radiator effect dissipates
Thermal cotton.
The technical solution adopted for the present invention to solve the technical problems is：Ultra-thin conductive radiating foam, including inner core foam,
The inner core foam side is provided with conducting resinl, and the conducting resinl is provided with release layer, the inner core away from inner core foam side
Foam outer layer is circumferentially provided with outer covering material, the outer covering material along inner core foam circumferentially continuous setting, and by inner core
The circumferential area covering 66%-75% of foam.
It is further：The outer covering material is conductive fabric glue or Heat dissipation adhesive tape.
It is further：The inner core foam is in the different high molecular polymer foaming bodies such as PE, PU, PP or EVA
Plant or various, the thickness of the inner core foam is 0.15~10mm.
The invention also discloses ultra-thin conductive radiating foam preparation method, including：According to according to required product size, by outside
Parcel material and inner core and conducting resinl are cut out to required specification, then above-mentioned material is placed into cotton bluging formation machine specified location, into having set
Gum is bonded in the mould counted through high-temperature laminating to form.
The beneficial effects of the invention are as follows：The present invention is not used full package structure in inner core foam outer layer so that pressed making
In compression process so that gas of the inner core foam in compression process can be discharged from the non-bound edge side of inner core foam so that inner core
Foam reaches ultra-thin effect, while can equally realize turning on up and down, shield, radiate, buffering and other effects.
Brief description of the drawings
Ultra-thin conductive radiating foam when Fig. 1 is outer covering material covering 66%.
Ultra-thin conductive radiating foam when Fig. 2 is outer covering material covering 75%.
Fig. 3 is ultra-thin conductive radiating foam when outer covering material is wrapped up entirely.
Reference：Outer covering material 1, inner core foam 2, conducting resinl 3, release layer 4.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and detailed description.
Ultra-thin conductive radiating foam as shown in Figure 1 to Figure 2, including inner core foam 2, the side of inner core foam 2 is set
There is conducting resinl 3, the conducting resinl 3 is provided with release layer 4 away from the side of inner core foam 2, and the outer layer of inner core foam 2 is circumferentially disposed
Have an outer covering material 1, the outer covering material 1 along inner core foam 2 circumferentially continuous setting, and by the circumferential area of inner core foam
Covering 66%-75%, the side that the inner core foam 2 is not contacted with outer covering material 1 completely is and side residing for conducting resinl 3
Adjacent edge；When 66% side is wrapped up, outer covering material 1 contacts side with conducting resinl 3 and realizes that half wraps up, concrete structure such as Fig. 1
Shown, the outer covering material 1 realizes that 75% side package structure is as shown in Figure 2.Ultra-thin conductive radiating foam each group of the invention
Conjunction produced step by step, finally through mould wrap up shape by die-cutting, the outer covering material 1 be conductive fabric glue or Heat dissipation adhesive tape,
The inner core foam 2 is one or more in the different high molecular polymer foaming bodies such as PE, PU, PP or EVA, the inner core bubble
The thickness of cotton 2 is 0.15~10mm.Original product is full parcel form, and concrete structure is as shown in Figure 3 so that in inner core foam
Gas is outsourced to be wrapped up in material blocks and lives, it is impossible to discharged so that foam cannot realize ultra-slim features by compression, this structure it is ultra-thin
Under compression, the gas in inner core foam 2 can be discharged conductive radiator foam through the non-bound edge side of inner core foam 2 so that
Inner core foam 2 is minimum to be depressed into below 0.1mm, and the present invention can equally realize turning on up and down, shield, radiate, buffer it is equivalent
Really, its shield effectiveness up to more than 60dB, when copper is selected in outer covering material, imitate by the radiating foam highest shielding of this ultra-thin conductive
Can be up to more than 100dB, its resistance is minimum can<0.01ohms, up to 400W/mK, its compressibility is up to 25% for its thermal conductivity factor
~75%.
The invention also discloses ultra-thin conductive radiating foam preparation method, including：According to according to required product size, by outside
Parcel material and inner core and conducting resinl are cut out to required specification, then above-mentioned material is placed into cotton bluging formation machine specified location, into having set
Gum is bonded in the mould counted through high-temperature laminating to form.
Particular embodiments described above, has been carried out further in detail to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail bright, should be understood that and the foregoing is only specific embodiment of the invention, be not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., should be included in guarantor of the invention
Within the scope of shield.
Claims (4)
1. ultra-thin conductive radiating foam, including inner core foam (2), inner core foam (2) side is provided with conducting resinl (3), institute
State conducting resinl (3) and inner core foam (2) side is provided with release layer (4), inner core foam (2) outer layer is circumferentially provided with outer
Lapping (1), it is characterised in that：The outer covering material (1) along inner core foam (2) circumferentially continuous setting, and by inner core
The circumferential area covering 66%-75% of foam.
2. ultra-thin conductive as claimed in claim 1 radiating foam, it is characterised in that：The outer covering material (1) is conductive fabric
Glue or Heat dissipation adhesive tape.
3. ultra-thin conductive as claimed in claim 1 radiating foam, it is characterised in that：The inner core foam (2) is PE, PU, PP
Or one or more in the different high molecular polymer foaming bodies such as EVA, the thickness of the inner core foam (2) for 0.15~
10mm。
4. ultra-thin conductive radiating foam preparation method, including：According to according to required product size, by outer wrapping material and inner core and lead
Electric glue is cut out to required specification, then above-mentioned material is placed into cotton bluging formation machine specified location, into the mould for having designed through height
Warm pipe sensitive adhesion gum is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610907358.1A CN106852098A (en) | 2016-10-19 | 2016-10-19 | Ultra-thin conductive radiating foam and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610907358.1A CN106852098A (en) | 2016-10-19 | 2016-10-19 | Ultra-thin conductive radiating foam and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106852098A true CN106852098A (en) | 2017-06-13 |
Family
ID=59146367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610907358.1A Pending CN106852098A (en) | 2016-10-19 | 2016-10-19 | Ultra-thin conductive radiating foam and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106852098A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107978385A (en) * | 2017-12-20 | 2018-05-01 | 苏州益邦电子材料有限公司 | A kind of multi-functional coated conductive spacer |
| CN108040456A (en) * | 2017-12-25 | 2018-05-15 | 昆山汉品电子有限公司 | Fingerprint recognition conducting foam |
| CN109348695A (en) * | 2018-09-29 | 2019-02-15 | 华为技术有限公司 | A kind of foam and terminal |
| CN110337233A (en) * | 2019-07-02 | 2019-10-15 | 深圳市卓汉材料技术有限公司 | A kind of packaging type conductive high temperature resistance elastomer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201623958U (en) * | 2010-01-29 | 2010-11-03 | 隆扬电子（昆山）有限公司 | Shielding complex |
| CN202697129U (en) * | 2012-07-05 | 2013-01-23 | 苏州沛德导热材料有限公司 | Graphite heat conducting foam |
| CN203301939U (en) * | 2013-06-20 | 2013-11-20 | 苏州艾达仕电子科技有限公司 | Semicircular conductive foam |
| CN103921522A (en) * | 2014-04-16 | 2014-07-16 | 隆扬电子（昆山）有限公司 | Production process for automatically positioning conductive foams on local backs of conductive fabrics |
| CN203934275U (en) * | 2014-06-27 | 2014-11-05 | 福建联迪商用设备有限公司 | A kind of board antistatic and earthing device |
-
2016
- 2016-10-19 CN CN201610907358.1A patent/CN106852098A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201623958U (en) * | 2010-01-29 | 2010-11-03 | 隆扬电子（昆山）有限公司 | Shielding complex |
| CN202697129U (en) * | 2012-07-05 | 2013-01-23 | 苏州沛德导热材料有限公司 | Graphite heat conducting foam |
| CN203301939U (en) * | 2013-06-20 | 2013-11-20 | 苏州艾达仕电子科技有限公司 | Semicircular conductive foam |
| CN103921522A (en) * | 2014-04-16 | 2014-07-16 | 隆扬电子（昆山）有限公司 | Production process for automatically positioning conductive foams on local backs of conductive fabrics |
| CN203934275U (en) * | 2014-06-27 | 2014-11-05 | 福建联迪商用设备有限公司 | A kind of board antistatic and earthing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107978385A (en) * | 2017-12-20 | 2018-05-01 | 苏州益邦电子材料有限公司 | A kind of multi-functional coated conductive spacer |
| CN108040456A (en) * | 2017-12-25 | 2018-05-15 | 昆山汉品电子有限公司 | Fingerprint recognition conducting foam |
| CN109348695A (en) * | 2018-09-29 | 2019-02-15 | 华为技术有限公司 | A kind of foam and terminal |
| CN110337233A (en) * | 2019-07-02 | 2019-10-15 | 深圳市卓汉材料技术有限公司 | A kind of packaging type conductive high temperature resistance elastomer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106852098A (en) | Ultra-thin conductive radiating foam and preparation method | |
| CN104320954B (en) | Heat-conducting liner including hot-melting heat-conducting film and preparation device thereof | |
| CN103906418A (en) | Cooling fin and manufacturing method thereof | |
| US10448541B2 (en) | Densified foam for thermal insulation in electronic devices | |
| CN103331957A (en) | Easy-cold-punch-molding soft packaging composite material, and preparation method and molding method thereof | |
| CN107920452A (en) | Composite heat-conducting component | |
| CN103167791A (en) | Conducting foam | |
| CN103231554B (en) | Cascade type high heat conduction graphite film structure | |
| CN203185771U (en) | Edge covering type high-heat-conductivity graphite diaphragm | |
| CN203185770U (en) | Laminated high-heat-conductivity graphite film structure | |
| CN204999844U (en) | Heat dissipation sticky tape | |
| CN205124208U (en) | A thermal -insulated membrane and thermal -insulated structure for electronic components | |
| CN104053344A (en) | Combined type shading cooling fin | |
| CN101221833B (en) | Composite insulating material and its processing method | |
| CN204994196U (en) | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components | |
| CN204589064U (en) | Acetate fabric adhesive tape | |
| CN204929528U (en) | Heat conduction bubble is cotton | |
| CN104443741B (en) | Functional bottle mouth sealing pad intermediate and manufacture method | |
| KR101322844B1 (en) | The aluminum radiation gasket | |
| CN113939149A (en) | Heat dissipation membrane and heat dissipation adhesive film for portable terminal | |
| CN107379699A (en) | Uvioresistant pallet-free is packed for freezing mask | |
| CN203884122U (en) | radiating fin structure and radiating shell | |
| CN204130728U (en) | Wire and cable connector | |
| CN207652899U (en) | Fingerprint recognition conducting foam | |
| CN206353302U (en) | A kind of insulation system of touch-screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |