CN106802734A - Touch sensible element and preparation method thereof - Google Patents
Touch sensible element and preparation method thereof Download PDFInfo
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- CN106802734A CN106802734A CN201510847149.8A CN201510847149A CN106802734A CN 106802734 A CN106802734 A CN 106802734A CN 201510847149 A CN201510847149 A CN 201510847149A CN 106802734 A CN106802734 A CN 106802734A
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- insulating layer
- photosensitive
- lead
- touch sensible
- sensible element
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- 238000011161 development Methods 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000003595 mist Substances 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The present invention relates to a kind of touch sensible element and preparation method thereof.The touch sensible element, including：Substrate, including middle part visible area and the marginal zone on the outside of visible area, substrate has relative first surface and second surface；Nesa coating, on first surface, and on visible area, for determining to touch point coordinates；Lead, on first surface, and on marginal zone, and electrically connects with nesa coating；Photosensitive insulating layer, on first surface, and on marginal zone, and is covered on lead.Touch sensible element can be prevented effectively from wire conducting.
Description
Technical field
The present invention relates to technical field of touch control, more particularly to a kind of touch sensible element and preparation method thereof.
Background technology
When the touch sensible element of touch-screen is formed, generally first ITO is formed on a surface of the substrate for providing
Conductive layer, wherein, substrate includes the visible area at middle part and the marginal zone positioned at visible area outer periphery.Again
ITO conductive layer is processed, the nesa coating with default conductive pattern is formed in the visible area of substrate.
Then the non-visible area in substrate forms the silver paste wire electrically connected with nesa coating.In test process,
It was found that adjacent two silver paste wires separately are easy to turn on, insulation is caused to decline or even short circuit, and then influence
The performance of product.
The content of the invention
Based on this, it is necessary to provide a kind of touch sensible element that can be prevented effectively from wire conducting and its making side
Method.
A kind of touch sensible element, including：
Substrate, including middle part visible area and the marginal zone on the outside of the visible area, substrate tool
There is relative first surface and second surface；
Nesa coating, on the first surface, and on the visible area, for determining to touch
Point coordinates；
Lead, on the first surface, and on the marginal zone, and with the nesa coating
Electrical connection；And
Photosensitive insulating layer, on the first surface, and on the marginal zone, and is covered in described
On lead.
In above-mentioned touch sensible element, by setting up photosensitive insulating layer on the first surface to cover lead,
So as to be avoided that steam is penetrated into lead, and then lead can be preferably protected, so as to avoid adjacent two leads
Conducting, and then improve the production yield of touch-screen.And the material of formation photosensitive insulating layer has photonasty
Can, such that it is able to by using mask plate and photoresistance by certain pattern transfer to photosensitive layer, then logical exposure
And development treatment, you can to obtain photosensitive insulating layer.Whole making technology is simple, and suitable volume production is turned into industry.
Wherein in one embodiment, the photosensitive insulating layer is photosensitive heat-insulating layer.
Wherein in one embodiment, the photosensitive insulating layer is transparent photosensitive heat-insulating layer.
Wherein in one embodiment, the photosensitive insulating layer is the transparent photosensitive heat-insulating layer of alkalescence.
Wherein in one embodiment, the light transmittance of the photosensitive insulating layer is more than 91%, and mist degree is less than 5%,
Reflectivity is less than 5%.
Wherein in one embodiment, the lead is photosensitive silver paste line.
Wherein in one embodiment, the thickness of the thickness more than the lead of the photosensitive insulating layer is described
The thickness of lead is 0.003~0.005 millimeter, and the thickness of the photosensitive insulating layer is 0.005~0.015 millimeter.
Wherein in one embodiment, the thickness of the photosensitive insulating layer is 0.008 millimeter.
Wherein in one embodiment, the first surface has binding portion and a function part, the binding portion and
The function part is respectively positioned on the marginal zone；
The nesa coating includes a plurality of touch control electrode being intervally arranged, and the number of the lead is touched with described
The number for controlling electrode is identical, and one end of each lead electrically connects with a touch control electrode, and the other end is collected to institute
State binding portion；
The photosensitive insulating layer is on the function part, and the shape of the photosensitive insulating layer is described with a plurality of
The shape of the figure that the part that lead is located on the function part determines is similar.
A kind of preparation method of touch sensible element, comprises the following steps：
Workpiece to be added is provided, the workpiece to be added includes substrate, nesa coating and lead, the substrate bag
The visible area at middle part and the marginal zone on the outside of the visible area are included, the substrate has relative first
Surface and second surface, the first surface have binding portion and function part on the marginal zone；Institute
Nesa coating is stated to be located on the first surface, and on the visible area；The lead is located at described
On function part, and one end electrically connects with the nesa coating, and the other end is collected to the binding portion；
In the workpiece to be added there is the side of the nesa coating and the lead to form photosensitive insulation base
Matter, the photosensitive dielectric substrate covers the first surface；And
The photosensitive dielectric substrate is exposed and development treatment successively, photosensitive insulating layer, the sense is obtained
Light insulating barrier is located on the function part, and the shape of the photosensitive insulating layer is located at the work(with the lead
The shape of the figure that the part in energy portion determines is similar.
Brief description of the drawings
Fig. 1 is the structural representation of the touch sensible element of an implementation method；
Fig. 2 is the structural representation when touch sensible element in Fig. 1 is without photosensitive insulating layer；
Fig. 3 is the profile set up on Fig. 2 after photosensitive dielectric substrate；
Fig. 4 is the profile of Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment is carried out furtherly to touch sensible element and preparation method thereof
It is bright.
As shown in Figures 1 and 2, the touch sensible element 10 of an implementation method.The touch sensible element 10 is wrapped
Include substrate 100, nesa coating 200, lead 300 and photosensitive insulating layer 400.
Substrate 100 includes the visible area 110 at middle part and the marginal zone 120 positioned at the outside of visible area 110.Base
Bottom 100 has relative first surface 130 and second surface (not shown).Wherein, first surface 130 has
There are binding portion 132 and function part 134, binding portion 132 and function part 134 are respectively positioned on marginal zone 120.Tool
Body, in the present embodiment, substrate 100 is polyethylene terephthalate (polyethylene
Terephthalate, PET) film.In other embodiments, substrate 100 can be glass plate.
Nesa coating 200 is used to determine the coordinate of touch point.Nesa coating 200 is located at first surface 130
On, and on visible area 110.Specifically, in the present embodiment, nesa coating 200 includes many
The touch control electrode 210 that bar is intervally arranged.Nesa coating 200 is tin indium oxide (Indium tin oxide, ITO)
Film.
Lead 300 on the first surface 130, and on marginal zone 120, and with nesa coating 200
Electrical connection.Specifically, in the present embodiment, the number of lead 300 is a plurality of, and with touch control electrode 210
Number it is identical, a plurality of leads 300 is spaced.One end of each lead 300 and a touch control electrode 210
Electrical connection, the other end is collected to binding portion 132.Such that it is able at binding portion 132 by flexible PCB with
External circuit is connected.
Photosensitive insulating layer 400 and on marginal zone 120, and is covered in and drawn on the first surface 130
On line 300.It should be noted that photosensitive insulating layer 400 refers to it and there are insulating properties and formed photosensitive
The material of insulating barrier 400 has photosensitive property.
Specifically, in the present embodiment, photosensitive insulating layer 400 is on function part 134 and photosensitive exhausted
The shape phase of the figure that the part that the shape of edge layer 400 is located on function part 134 with a plurality of leads 300 determines
Seemingly.Namely lead 300 of 400 coverings of photosensitive insulating layer on function part 134, without covering transparent leading
Electrolemma 200, the lead 300 in binding portion 132 and the function part 134 without lead 300.
The figure that the part that the shape of photosensitive insulating layer 400 is located on function part 134 with a plurality of leads 300 determines
The shape of shape is similar, and whole function part 134, namely photosensitive insulating layer are covered rather than photosensitive insulating layer 400 is made
400 area less than function part 134 area, so as to ensure that photosensitive insulating layer 400 can cover lead 300
While usable floor area photosensitive insulating layer 400 as small as possible, such that it is able to reduce on marginal zone 120
The influence of the optical effect of the whole touch sensible element 10 of photosensitive insulating layer 400 pairs.It is appreciated that at other
In implementation method, photosensitive insulating layer 400 can also cover whole function part 134.
In the every test before being dispatched from the factory to traditional touch-screen, adjacent two silver pastes separately are found
Wire is easy to turn on, and causes insulation to decline or even short circuit.Trace it to its cause discovery, lead 300 is usually silver paste
Line, there is silver-colored transport phenomena in it.Wherein, silver-colored transport phenomena refers to the presence of the moist ring of Direct-current voltage gradient
In border, hydrone penetrates into and contains silver conductor surface, causes hydrone to be electrolysed to form hydrogen ion and hydroxide ion,
Silver is dissociated in the presence of electric field and hydroxide ion and produces silver ion, and produces a series of reversible reactions, silver
The migration of ion forms bypass between causing the conductor without electrical connection, causes insulation to decline or even short circuit.
In above-mentioned touch sensible element 10, by set up on first surface 130 photosensitive insulating layer 400 with
Covering lead 300, so as to be avoided that steam is penetrated into lead 300, and then can preferably protect lead 300,
So as to avoid adjacent two leads 300 from turning on, and then improve the production yield of touch-screen.And form sense
The material of light insulating barrier 400 has photosensitive property, such that it is able to will be certain by using mask plate and photoresistance
Figure (in the present embodiment, the figure is similar to the figure that lead 300 determines) is transferred on photosensitive layer,
Lead to exposed and developed treatment again, you can to obtain photosensitive insulating layer 400.Whole making technology is simple, suitable amount
Product is turned into industry.
Further, in the present embodiment, photosensitive insulating layer 400 is photosensitive heat-insulating layer.Need explanation
, photosensitive heat-insulating layer refers to that it has heat-proof quality (its heat-proof quality ensures touch sensible element 10
Burn-in test before by dispatching from the factory), insulating properties, and formed photosensitive insulating layer 400 material have
Photosensitive property.Photosensitive insulating layer 400 has heat-insulating property, photosensitive such that it is able to avoid in degradation
The problem that insulating barrier 400 being heated and failing by long-time, so that with service life more long.
Further, in the present embodiment, photosensitive insulating layer 400 is transparent photosensitive heat-insulating layer.Need
Illustrate, transparent photosensitive heat-insulating layer refers to that it has translucency.Relative to being formed on lead 300
Ink layer (light tight), it can further reduce photosensitive insulating layer 400 on marginal zone 120 to whole
The influence of the optical effect of individual touch sensible element 10.
Further, in the present embodiment, photosensitive insulating layer 400 is the transparent photosensitive heat-insulating layer of alkalescence.
It should be noted that transparent photosensitive heat-insulating layer refers to form the material of photosensitive insulating layer 400 in alkalescence.
So as to when photosensitive insulating layer 400 is formed by the way of exposure imaging, alkaline-based developer can be used.
The light transmittance of photosensitive insulating layer 400 is more than 91%, and mist degree is less than 5%, and reflectivity is less than 5%.Namely
Photosensitive insulating layer 400 has the advantages that high light transmittance, low haze and low reflection, so that above-mentioned touch sense
Answering element 10 has more preferable optical effect.
Specifically, in the present embodiment, photosensitive insulating layer 400 is the machinable transparent photographic film of alkalescence
(Transparent Photosensitive Film, TPF).The supplier of TPF is that Hitachi is melted into (Hitachi
Chemical Co., Ltd.s), article No. is Raycast MS-5532series.
Further, as shown in Figures 3 and 4, in the present embodiment, the thickness d of photosensitive insulating layer 400
More than the thickness of lead 300.The thickness of lead 300 is 0.003~0.005 millimeter, photosensitive insulating layer 400
Thickness d is 0.005~0.015 millimeter.Preferably, the thickness d of photosensitive insulating layer 400 is 0.008 millimeter.
It should be noted that in the present embodiment, the thickness d of photosensitive insulating layer 400 refers to first surface 130
The thickness between side with photosensitive insulating layer 400 away from first surface 130.
Due to there is gap between adjacent two lead 300, part photosensitive insulating layer 400 is directly and first surface
130 contacts, so as to be sandwiched between adjacent two lead 300.Namely photosensitive insulating layer 400 coordinates with substrate 100
Lead 300 is wrapped up.
Further, in the present embodiment, lead 300 is photosensitive silver paste line.It should be noted that being formed
The material of lead 300 has photosensitive property.Such that it is able to by using mask plate and photoresistance by certain figure
It is transferred on photosensitive silver lumps, then passes sequentially through exposed and developed treatment, you can obtains lead 300.Entirely
Making technology is simple, and suitable volume production is turned into industry.It is appreciated that in other embodiments, forming lead 300
Material can also not have photonasty, now can form lead by way of the others such as silk-screen printing
300。
In the present embodiment, a kind of preparation method of touch sensible element is also provided, is comprised the following steps：
Step S510, there is provided substrate, the visible area of substrate including middle part and the side on the outside of visible area
Edge area, substrate has relative first surface and second surface, and first surface has tying up on marginal zone
Determine portion and function part.
Step S520, forms transparency conducting layer, and carry out pattern to transparency conducting layer in the first surface of substrate
Change is processed, and being formed in visible area has the nesa coating of default conductive pattern.
In the present embodiment, ITO layer is formed in substrate by the way of magnetron sputtering, by mask plate
And be transferred to default conductive pattern in ITO layer by photoresistance, then by passing sequentially through exposed and developed treatment, obtain
To the nesa coating with default conductive pattern.
Specifically, coating minus photoresistance on the ito layer；Make light identical with default conductive pattern through having
Mask plate and minus photoresistance is carried out illumination (part that minus photoresistance is irradiated by light will not the removal of developed liquid,
The part not being irradiated by light can be dissolved in developer solution)；Using weakly alkaline developer solution (such as solution of potassium carbonate)
Development treatment is carried out to minus photoresistance, the part that minus photoresistance is not irradiated by light is removed；Using acid etching
Liquid (such as hydrochloric acid solution) is etched to ITO layer, the ITO that removing is not covered by minus photoresistance；Adopt again
The part that minus photoresistance is irradiated by light is removed with alkaline stripper (such as potassium hydroxide solution), so as to be had
There is the nesa coating of default conductive pattern.
When eurymeric photoresistance is coated on the ito layer, light is set to be covered through with complementary with default conductive pattern
Template and eurymeric photoresistance is carried out illumination (part that eurymeric photoresistance is irradiated by light can the removal of developed liquid, do not have
The part being irradiated by light will not be dissolved in developer solution), then entered using developer solution, etching solution and stripper successively
Row development, etching and lift-off processing.
Step S530, lead, and lead one end and electrically conducting transparent are formed in the function part of the first surface of substrate
Film is electrically connected, and the other end is collected to binding portion.
Specifically, in the present embodiment, photosensitive silver bullion is formed in the marginal zone of the first surface of substrate, then
Pass sequentially through exposed and developed, obtain photosensitive silver paste line.In other embodiments, silk-screen printing can be used
Mode form silver paste line.The exposure in exposed and developed handling principle and step S520 in step S530
And development treatment principle is identical, no longer introduces here.
After step S510, step S520 and step S530 is completed, workpiece to be added, namely Fig. 2 institutes are obtained
Show product.Namely in the present embodiment, produce workpiece to be added.It is appreciated that in other embodiments,
Workpiece to be added can be directly bought, now step S510, step S520 and step S530 can be omitted.
Step S540, in substrate there is the side of nesa coating and lead to form photosensitive dielectric substrate, photosensitive
Dielectric substrate covers first surface, and photosensitive dielectric substrate is exposed and development treatment successively, is felt
Light insulating barrier, wherein, photosensitive insulating layer is located on function part, and the shape of photosensitive insulating layer is located at lead
The shape of the figure that the part on function part determines is similar.
It should be noted that photosensitive dielectric substrate covers whole first surface, namely the covering of photosensitive dielectric substrate
Visible area and marginal zone.
Specifically, in the present embodiment, the photosensitive dielectric substrate of film-form is located at by the way of impressing
On first surface.In other embodiments, it would however also be possible to employ the mode of coating forms sense on the first surface
Light dielectric substrate.It is exposed and developed in exposed and developed handling principle in step S540 and step S520
Handling principle is identical, no longer introduces here.
Each technical characteristic of embodiment described above can be combined arbitrarily, not right to make description succinct
The all possible combination of each technical characteristic in above-described embodiment is all described, as long as however, these skills
The combination of art feature does not exist contradiction, is all considered to be the scope of this specification record.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that for this area
For those of ordinary skill, without departing from the inventive concept of the premise, some deformations can also be made and changed
Enter, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be defined.
Claims (10)
1. a kind of touch sensible element, it is characterised in that including：
Substrate, including middle part visible area and the marginal zone on the outside of the visible area, substrate tool
There is relative first surface and second surface；
Nesa coating, on the first surface, and on the visible area, for determining to touch
Point coordinates；
Lead, on the first surface, and on the marginal zone, and with the nesa coating
Electrical connection；And
Photosensitive insulating layer, on the first surface, and on the marginal zone, and is covered in described
On lead.
2. touch sensible element according to claim 1, it is characterised in that the photosensitive insulating layer is
Photosensitive heat-insulating layer.
3. touch sensible element according to claim 2, it is characterised in that the photosensitive insulating layer is
Transparent photosensitive heat-insulating layer.
4. touch sensible element according to claim 3, it is characterised in that the photosensitive insulating layer is
The transparent photosensitive heat-insulating layer of alkalescence.
5. touch sensible element according to claim 4, it is characterised in that the photosensitive insulating layer
Light transmittance is more than 91%, and mist degree is less than 5%, and reflectivity is less than 5%.
6. touch sensible element according to claim 1, it is characterised in that the lead is photosensitive silver
Slurry line.
7. touch sensible element according to claim 1, it is characterised in that the photosensitive insulating layer
More than the thickness of the lead, the thickness of the lead is 0.003~0.005 millimeter, the photosensitive insulation to thickness
The thickness of layer is 0.005~0.015 millimeter.
8. touch sensible element according to claim 1, it is characterised in that the photosensitive insulating layer
Thickness is 0.008 millimeter.
9. touch sensible element according to claim 1, it is characterised in that the first surface has
Binding portion and function part, the binding portion and the function part are respectively positioned on the marginal zone；
The nesa coating includes a plurality of touch control electrode being intervally arranged, and the number of the lead is touched with described
The number for controlling electrode is identical, and one end of each lead electrically connects with a touch control electrode, and the other end is collected to institute
State binding portion；
The photosensitive insulating layer is on the function part, and the shape of the photosensitive insulating layer is described with a plurality of
The shape of the figure that the part that lead is located on the function part determines is similar.
10. a kind of preparation method of touch sensible element, it is characterised in that comprise the following steps：
Workpiece to be added is provided, the workpiece to be added includes substrate, nesa coating and lead, the substrate bag
The visible area at middle part and the marginal zone on the outside of the visible area are included, the substrate has relative first
Surface and second surface, the first surface have binding portion and function part on the marginal zone；Institute
Nesa coating is stated to be located on the first surface, and on the visible area；The lead is located at described
On function part, and one end electrically connects with the nesa coating, and the other end is collected to the binding portion；
In the workpiece to be added there is the side of the nesa coating and the lead to form photosensitive insulation base
Matter, the photosensitive dielectric substrate covers the first surface；And
The photosensitive dielectric substrate is exposed and development treatment successively, photosensitive insulating layer, the sense is obtained
Light insulating barrier is located on the function part, and the shape of the photosensitive insulating layer is located at the work(with the lead
The shape of the figure that the part in energy portion determines is similar.
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| CN201510847149.8A CN106802734A (en) | 2015-11-26 | 2015-11-26 | Touch sensible element and preparation method thereof |
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| CN108170210A (en) * | 2017-12-25 | 2018-06-15 | 业成科技（成都）有限公司 | Electronic device |
| CN114390423A (en) * | 2021-09-02 | 2022-04-22 | 苏州清听声学科技有限公司 | Method for manufacturing insulation layer of directional sound screen by impressing |
| CN114390423B (en) * | 2021-09-02 | 2023-09-26 | 苏州清听声学科技有限公司 | Insulation layer printing method for directional sound production screen |
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