CN106800803A - A kind of preparation method of the modified Nano silver powder in the elargol for LED - Google Patents
A kind of preparation method of the modified Nano silver powder in the elargol for LED Download PDFInfo
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- CN106800803A CN106800803A CN201611145518.XA CN201611145518A CN106800803A CN 106800803 A CN106800803 A CN 106800803A CN 201611145518 A CN201611145518 A CN 201611145518A CN 106800803 A CN106800803 A CN 106800803A
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- Prior art keywords
- silver powder
- elargol
- led
- modified nano
- nano silver
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention discloses a kind of preparation method of the modified Nano silver powder in elargol for LED, first nano-silver powder is carried out by the modified use anions and canons surfactant of unrighted acid to nano-silver powder twice-modified.Modified Nano silver powder in LED elargol of the invention is easy to be combined with epoxy resin, while the requirement in can reducing LED elargol to silver powder content is reduced to 60% by the 70% of minimum requirements, improving the content of auxiliary agent in LED elargol increases the special efficacy of LED elargol.
Description
Technical field
The present invention relates to a kind of preparation method of the modified Nano silver powder in elargol for LED.
Background technology
LED elargol is combined together conducting particles by the bonding effect of matrix resin, forms conductive path,
Realize being conductively connected by viscous material;Conducting resinl is extremely important and crucial composition in LED encapsulation process.LED conducting resinls
It is the adhesive with certain conductive capability, major function is bonding, conductive and heat conduction;It can be by LED chips and base
Plate is strongly adhered to together, and the part of new connection is formed electric path.With the emerging LED industries of strategy in China
Fast development, LED conducting resinls also become one of study hotspot of current academia and industrial circle.
The content of the invention
The purpose of the present invention is that and provide that a kind of silver powder that improves is combined with epoxy resin in order to solve the above problems
Requirement in conjunction rate, reduction LED elargol to silver powder content is by the modified Nano silver in a kind of elargol for LED of minimum requirements
The preparation method of powder.
To achieve these goals, the present invention is achieved by the following technical solutions:In a kind of elargol for LED
The preparation method of modified Nano silver powder, it is characterised in that:
1)Nano-silver powder is modified by unrighted acid;
2)By in anions and canons surfactant, unsaturated organic acid, coupling agent addition ethanol, ultrasonic wave is recycled to produce it
Raw cavitation effect, obtains organic solvent;
3)By step 2)In stand 1-2h after the organic solvent stirring that obtains, add step 1) in modified nano-silver powder stirring
Reaction 2-3h, is centrifugally separating to obtain modified Nano silver powder.
Further, the unrighted acid is a kind of rear various mixing groups in oleic acid, linoleic acid and leukotrienes
Into.
Further, the anions and canons surfactant, unsaturated organic acid, coupling agent are according to following raw material
Parts by weight are constituted:Cationic surfactant 10-50 parts, anion surfactant 10-50 parts, unsaturated organic acid 10-
20 parts, coupling agent 1-5 parts.
Further, the organic solvent is with the ratio of weight and number of nano-silver powder:6-9:5-6.
A kind of LED elargol containing for the modified Nano silver powder in LED elargol, according to the parts by weight of following raw material
Than:Modified Nano silver powder 50-60%, modified epoxy 10-20% and auxiliary agent 20-40%.
In sum the invention has the advantages that:Modified Nano silver powder in LED elargol of the invention is easy to
Combined with epoxy resin, while the requirement in can reducing LED elargol to silver powder content is reduced to 60% by the 70% of minimum requirements, carried
The content of auxiliary agent increases the special efficacy of LED elargol in LED elargol high.
Specific embodiment
Specific embodiment 1:A kind of preparation method of the modified Nano silver powder in the elargol for LED, it is characterised in that:
1)Nano-silver powder is modified by oleic acid and linoleic mixing unrighted acid;
2)By 10 parts of anion surfactant, 10 parts of cationic surfactant, 10 parts of unsaturated organic acid, 1 part of coupling agent
Add in ethanol, recycle ultrasonic wave to produce cavitation effect to it, obtain organic solvent;
3)By step 2)In stand 1h after the organic solvent stirring that obtains, add step 1) in modified nano-silver powder stirring it is anti-
2h is answered, modified Nano silver powder is centrifugally separating to obtain;Organic solvent is with the ratio of weight and number of nano-silver powder:6:5.
Specific embodiment 2:A kind of preparation method of the modified Nano silver powder in the elargol for LED, it is characterised in that:
1)Nano-silver powder is modified by oleic acid and linolenic mixing unrighted acid;
2)By 30 parts of anion surfactant, 30 parts of cationic surfactant, 15 parts of unsaturated organic acid, 3 parts of coupling agent
Add in ethanol, recycle ultrasonic wave to produce cavitation effect to it, obtain organic solvent;
3)By step 2)In stand 1.5h after the organic solvent stirring that obtains, add step 1) in modified nano-silver powder stirring
Reaction 2.5h, is centrifugally separating to obtain modified Nano silver powder;Organic solvent is with the ratio of weight and number of nano-silver powder:16:11.
Specific embodiment 3:A kind of preparation method of the modified Nano silver powder in the elargol for LED, it is characterised in that:
1) nano-silver powder is modified by the mixing unrighted acid of linoleic acid plus linolenic acid;
2) by 50 parts of anion surfactant, 50 parts of cationic surfactant, 20 parts of unsaturated organic acid, 5 parts of coupling agent
Add in ethanol, recycle ultrasonic wave to produce cavitation effect to it, obtain organic solvent;
3) by step 2)In stand 2h after the organic solvent stirring that obtains, add step 1) in modified nano-silver powder stirring it is anti-
3h is answered, modified Nano silver powder is centrifugally separating to obtain;Organic solvent is with the ratio of weight and number of nano-silver powder:3:2.
Embodiment provided above is better embodiment of the invention, only for the convenient explanation present invention, not to this hair
It is bright to make any formal limitation, any those of ordinary skill in the art, if putting forward skill the present invention is not departed from
In the range of art feature, using the Equivalent embodiments for locally being changed done by disclosed technology contents or modify, and
Without departing from technical characteristic content of the invention, still fall within the range of the technology of the present invention feature.
Claims (5)
1. the preparation method of the modified Nano silver powder in a kind of elargol for LED, it is characterised in that:
Nano-silver powder is modified by unrighted acid;
By in anions and canons surfactant, unsaturated organic acid, coupling agent addition ethanol, ultrasonic wave is recycled to produce it
Cavitation effect, obtains organic solvent;
By step 2)In stand 1-2h after the organic solvent stirring that obtains, add step 1) in modified nano-silver powder stirring it is anti-
2-3h is answered, modified Nano silver powder is centrifugally separating to obtain.
2. the preparation method of the modified Nano silver powder in a kind of elargol for LED according to claim 1, its feature
It is:The unrighted acid is a kind of rear various mixing compositions in oleic acid, linoleic acid and leukotrienes.
3. the preparation method of the modified Nano silver powder in a kind of elargol for LED according to claim 1, its feature
It is:The anions and canons surfactant, unsaturated organic acid, coupling agent are constituted according to the parts by weight of following raw material:Sun
Ionic surface active agent 10-50 parts, anion surfactant 10-50 parts, unsaturated organic acid 10-20 parts, coupling agent 1-5
Part.
4. the preparation method of the modified Nano silver powder in a kind of elargol for LED according to claim 1, its feature
It is:The organic solvent is with the ratio of weight and number of nano-silver powder:6-9:5-6.
5. a kind of LED elargol containing any modified Nano silver powder in LED elargol of Claims 1-4,
It is characterized in that:According to the ratio of weight and number of following raw material:Modified Nano silver powder 50-60%, modified epoxy 10-20% and
Auxiliary agent 20-40%.
Priority Applications (1)
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CN201611145518.XA CN106800803A (en) | 2016-12-13 | 2016-12-13 | A kind of preparation method of the modified Nano silver powder in the elargol for LED |
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CN201611145518.XA CN106800803A (en) | 2016-12-13 | 2016-12-13 | A kind of preparation method of the modified Nano silver powder in the elargol for LED |
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CN106800803A true CN106800803A (en) | 2017-06-06 |
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CN201611145518.XA Withdrawn CN106800803A (en) | 2016-12-13 | 2016-12-13 | A kind of preparation method of the modified Nano silver powder in the elargol for LED |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109054664A (en) * | 2018-07-05 | 2018-12-21 | 胡果青 | A kind of preparation method of hot melt adhesive |
CN111621226A (en) * | 2020-05-12 | 2020-09-04 | 常州市利多合金材料有限公司 | Conductive silver paste, preparation method and application of conductive silver paste in conductive film |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102653668A (en) * | 2012-04-25 | 2012-09-05 | 华中科技大学 | Silver conductive adhesive for LED (Light Emitting Diode) encapsulation and preparation method thereof |
CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
CN105462533A (en) * | 2016-01-25 | 2016-04-06 | 南阳理工学院 | Conductive silver adhesive for high-power LED package and preparation method thereof |
CN106190008A (en) * | 2016-08-11 | 2016-12-07 | 安徽波浪岛游乐设备有限公司 | A kind of preparation technology of LED high heat conductance conducting resinl |
-
2016
- 2016-12-13 CN CN201611145518.XA patent/CN106800803A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102653668A (en) * | 2012-04-25 | 2012-09-05 | 华中科技大学 | Silver conductive adhesive for LED (Light Emitting Diode) encapsulation and preparation method thereof |
CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
CN105462533A (en) * | 2016-01-25 | 2016-04-06 | 南阳理工学院 | Conductive silver adhesive for high-power LED package and preparation method thereof |
CN106190008A (en) * | 2016-08-11 | 2016-12-07 | 安徽波浪岛游乐设备有限公司 | A kind of preparation technology of LED high heat conductance conducting resinl |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109054664A (en) * | 2018-07-05 | 2018-12-21 | 胡果青 | A kind of preparation method of hot melt adhesive |
CN111621226A (en) * | 2020-05-12 | 2020-09-04 | 常州市利多合金材料有限公司 | Conductive silver paste, preparation method and application of conductive silver paste in conductive film |
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