CN106799496B - 一种石墨和铝硅合金复合电子封装材料及其制备方法 - Google Patents
一种石墨和铝硅合金复合电子封装材料及其制备方法 Download PDFInfo
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- CN106799496B CN106799496B CN201611176552.3A CN201611176552A CN106799496B CN 106799496 B CN106799496 B CN 106799496B CN 201611176552 A CN201611176552 A CN 201611176552A CN 106799496 B CN106799496 B CN 106799496B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201611176552.3A CN106799496B (zh) | 2016-12-19 | 2016-12-19 | 一种石墨和铝硅合金复合电子封装材料及其制备方法 |
Applications Claiming Priority (1)
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CN201611176552.3A CN106799496B (zh) | 2016-12-19 | 2016-12-19 | 一种石墨和铝硅合金复合电子封装材料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN106799496A CN106799496A (zh) | 2017-06-06 |
CN106799496B true CN106799496B (zh) | 2018-11-30 |
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CN201611176552.3A Active CN106799496B (zh) | 2016-12-19 | 2016-12-19 | 一种石墨和铝硅合金复合电子封装材料及其制备方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106987743A (zh) * | 2017-03-01 | 2017-07-28 | 东莞市联洲知识产权运营管理有限公司 | 一种基于鳞片石墨的铝硅合金的复合电子封装梯度材料的制备方法 |
CN109401073A (zh) * | 2018-02-05 | 2019-03-01 | 合肥华盖光伏科技有限公司 | 一种高强度的太阳能光伏电池封装材料及制备方法 |
CN108994301B (zh) * | 2018-07-03 | 2021-03-26 | 中国科学院金属研究所 | 以纳米碳材料增强的金属基仿生复合材料及其制备方法 |
CN109434124A (zh) * | 2018-11-20 | 2019-03-08 | 许文强 | 一种基于石墨烯改性的低膨胀金属基电子封装材料的制备方法 |
CN111804919B (zh) * | 2019-04-10 | 2022-06-17 | 中国科学院宁波材料技术与工程研究所 | 高导热石墨-金属复合材料及其制备方法 |
CN111570807B (zh) * | 2020-04-26 | 2022-09-30 | 浙江长盛滑动轴承股份有限公司 | 一种蠕虫式石墨填充结构耐磨板的制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102114719A (zh) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | 一种包铝颗粒增强铝基复合材料及其制备方法 |
CN103343265B (zh) * | 2013-07-24 | 2015-12-02 | 上海交通大学 | 石墨/硅混杂增强高导热低膨胀铝基复合材料 |
CN103924119B (zh) * | 2014-04-23 | 2016-01-20 | 北京科技大学 | 一种超高导热石墨鳞片/铜复合材料及其制备方法 |
WO2016149533A1 (en) * | 2015-03-17 | 2016-09-22 | Materion Corporation | Metal matrix composite |
CN105603265B (zh) * | 2016-03-21 | 2017-10-31 | 中南大学 | 泡沫石墨烯骨架增强铝基复合材料及其制备方法 |
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2016
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Effective date of registration: 20190830 Address after: 101407 Beijing city Huairou District Yanqi Economic Development Zone Branch Hing Street No. 11 Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: General Research Institute for Nonferrous Metals |
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Effective date of registration: 20210825 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Youyan metal composite technology Co.,Ltd. Address before: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee before: YOUYAN ENGINEERING TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |