CN106793480A - A kind of pcb board for improving impedance - Google Patents
A kind of pcb board for improving impedance Download PDFInfo
- Publication number
- CN106793480A CN106793480A CN201610996077.8A CN201610996077A CN106793480A CN 106793480 A CN106793480 A CN 106793480A CN 201610996077 A CN201610996077 A CN 201610996077A CN 106793480 A CN106793480 A CN 106793480A
- Authority
- CN
- China
- Prior art keywords
- impedance
- pcb board
- basic unit
- parts
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Glass Compositions (AREA)
Abstract
The present invention provides a kind of pcb board for improving impedance, can effectively be reduced using basic unit of the invention and use the dielectric constant of its PCB plates, improve PCB plate impedance controls, with reference to the resistive layer material that the present invention is provided, acted on by the compound synergic of each component, can be compared to the PCB plates using traditional glass-fiber-fabric of same thickness structure, with lower dielectric constant.
Description
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of pcb board of improvement impedance.
Background technology
With electronic product diversified development, the circuit board for being related to linear impedance control gradually increases, and linear impedance is
The resistance value at simple wire two ends, related to conductor length, copper thickness, line width, wherein conductor thickness is crucial effect factor.
Printed circuit board material therefor is mainly using glass fabric (abbreviation glass-fiber-fabric) as increasing in current industry
Strong material, this kind of glass-fiber-fabric has longitude and latitude yarn network structure, in warp and weft interweaving point and space centre position glass fiber content difference
Greatly so that resin content is relatively low and uneven during coated with resins, the structural issue and from glass fabric itself causes sheet material
The dielectric constant of dielectric layer is higher, and printed circuit board is then needed if desired for lower dielectric constant is accomplished under same media thickness
Thinner glass-fiber-fabric bonding sheet is used, but it has the drawback that high cost, is unfavorable for lamination process.With current electricity
The transmission frequency more and more higher of signal, the requirement to the dielectric constant of sheet material is lower, but due to glass-fiber-fabric this body structure not
There is basic change, cannot still meet the requirement of the signal transmission rate and signal integrity of current high frequency bottom line.
The content of the invention
In view of this, the present invention provides a kind of pcb board for improving impedance, can effectively reduce the dielectric constant of PCB plates,
Improve PCB plate impedance controls.
The technical scheme is that：A kind of pcb board for improving impedance, it is characterised in that including basic unit, laminating in described
Basic unit both sides impedance layer, the composition metal layers of foil of the laminating impedance layer outer surface in described in both sides, described basic unit is
Ceramics or flexible material in any one.
Further, the flexible material is made up of following weight meter raw material：PVP 37.4, poly- two
Methyl-monosilane 16.8, polyimides 13.4, polyethylene 21.1, Kynoar 12.4, BeO 2.9, Al2O3 4.2nd, tricresyl phosphate
Butyl ester 5.4, diethylene glycol diacetate 3.5, lauroylamidopropyl betaine 12.5, the oxidation of babassu oil amido propyl amine
Thing 3.2, m- tetrahydroxy phenyl chlorin 4.7.‘’
Further, the composition metal layers of foil is that mass ratio is 2：1 copper and tin composite bed.
Further, the impedance layer is made up of following parts by weight meter raw material：Fe2O3 3.4、MnO 5.2、ZnO 2.7、
CuO 2.1、Ta2O3 1.5、CaCO30.6th, 12.7 parts of CoO 0.3, SiO, 7.1 parts of ZnO, BeO 12.1, MoO3 2.9、MgO
11.3。
The advantages of the present invention are：Can effectively be reduced using its PCB plates using basic unit of the invention
Dielectric constant, improve PCB plate impedance controls, with reference to the resistive layer material that the present invention is provided, increased by the compounding of each component
Effect is acted on, can be compared to the PCB plates using traditional glass-fiber-fabric of same thickness structure, with lower dielectric constant.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of embodiment of the invention, rather than whole embodiments.
A kind of pcb board for improving impedance, it is characterised in that including basic unit, laminating impedance layer in described basic unit both sides,
The composition metal layers of foil of the laminating impedance layer outer surface in described in both sides, described basic unit be ceramics or flexible material in
Any one.
Further, the flexible material is made up of following weight meter raw material：PVP 37.4, poly- two
Methyl-monosilane 16.8, polyimides 13.4, polyethylene 21.1, Kynoar 12.4, BeO 2.9, Al2O3 4.2nd, tricresyl phosphate
Butyl ester 5.4, diethylene glycol diacetate 3.5, lauroylamidopropyl betaine 12.5, the oxidation of babassu oil amido propyl amine
Thing 3.2, m- tetrahydroxy phenyl chlorin 4.7.‘’
Further, the composition metal layers of foil is that mass ratio is 2：1 copper and tin composite bed.
Further, the impedance layer is made up of following parts by weight meter raw material：Fe2O3 3.4、MnO 5.2、ZnO 2.7、
CuO 2.1、Ta2O3 1.5、CaCO30.6th, 12.7 parts of CoO 0.3, SiO, 7.1 parts of ZnO, BeO 12.1, MoO3 2.9、MgO
11.3。
The advantages of the present invention are：Can effectively be reduced using its PCB plates using basic unit of the invention
Dielectric constant, improve PCB plate impedance controls, with reference to the resistive layer material that the present invention is provided, increased by the compounding of each component
Effect is acted on, can be compared to the PCB plates using traditional glass-fiber-fabric of same thickness structure, with lower dielectric constant.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires to be limited rather than described above, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined
May be appreciated other embodiment.The ins and outs not described in detail in the present invention, can be by any in this area
Prior art is realized.Particularly, all technical characterstics not described in detail can be realized by any prior art in the present invention.
Claims (4)
1. a kind of pcb board for improving impedance, it is characterised in that including basic unit, laminating impedance layer in described basic unit both sides, cover
Together in the composition metal layers of foil of the impedance layer outer surface described in both sides, described basic unit be ceramics or flexible material in appoint
It is a kind of.
2. it is according to claim 1 improve impedance pcb board, it is characterised in that the flexible material is by following weight meter
Raw material is constituted：It is PVP 37.4, polydimethylsiloxane 16.8, polyimides 13.4, polyethylene 21.1, poly- inclined
PVF 12.4, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, diethylene glycol diacetate 3.5, dodecanamide propyl
Glycine betaine 12.5, babassu oil amido propyl amine oxide 3.2, m- tetrahydroxy phenyl chlorin 4.7.
3. it is according to claim 1 improve impedance pcb board, it is characterised in that the composition metal layers of foil is mass ratio
It is 2：1 copper and tin composite bed.
4. it is according to claim 1 improve impedance pcb board, it is characterised in that the impedance layer is by following parts by weight
Meter raw material composition：Fe2O3 3.4、MnO 5.2、ZnO 2.7、CuO 2.1、Ta2O3 1.5、CaCO3 0.6、CoO 0.3、SiO
12.7 parts, 7.1 parts of ZnO, BeO 12.1, MoO3 2.9、MgO 11.3。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996077.8A CN106793480A (en) | 2016-11-12 | 2016-11-12 | A kind of pcb board for improving impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996077.8A CN106793480A (en) | 2016-11-12 | 2016-11-12 | A kind of pcb board for improving impedance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793480A true CN106793480A (en) | 2017-05-31 |
Family
ID=58973236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996077.8A Withdrawn CN106793480A (en) | 2016-11-12 | 2016-11-12 | A kind of pcb board for improving impedance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793480A (en) |
-
2016
- 2016-11-12 CN CN201610996077.8A patent/CN106793480A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170531 |
|
| WW01 | Invention patent application withdrawn after publication |