CN201797648U - PCB board favorable for improving impedance control of PCB - Google Patents
PCB board favorable for improving impedance control of PCB Download PDFInfo
- Publication number
- CN201797648U CN201797648U CN2010205404028U CN201020540402U CN201797648U CN 201797648 U CN201797648 U CN 201797648U CN 2010205404028 U CN2010205404028 U CN 2010205404028U CN 201020540402 U CN201020540402 U CN 201020540402U CN 201797648 U CN201797648 U CN 201797648U
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- pcb
- pcb board
- dielectric layer
- impedance control
- utility
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Abstract
The utility model provides a printed circuit board (PCB) favorable for improving impedance control of the PCB. The PCB board comprises a dielectric layer and copper foils which cover the two sides of the dielectric layer, wherein the dielectric layer is a bonding sheet made of glass fiber paper. In the PCB board favorable for improving the impedance control of the PCB of the utility model, the dielectric layer is made of the glass fiber paper with high resin adsorbing capacity, so that the dielectric constant of the PCB board can be effectively reduced, and the impedance control of the PCB is improved; and compared with the PCB board which is made of the conventional glass fiber cloth and has the structure of the same thickness, the PCB board has lower dielectric constant.
Description
Technical field
The utility model relates to the printed circuit board technology field, relates in particular to a kind of pcb board that helps improving the PCB impedance Control.
Background technology
The printed circuit board material therefor mainly adopts glass fabric (being called for short glass cloth) as reinforcing material in the industry at present, as shown in Figure 3, this kind glass cloth has longitude and latitude gauze lattice structure, big at warp and weft interweaving point and centre position, space glass fiber content difference, resin content is lower and inhomogeneous when making coated with resins, and cause the dielectric constant of sheet material dielectric layer higher from the structural issue of glass fabric self, printed circuit board is as accomplishing lower dielectric constant under same media thickness, then need to use thinner glass cloth bonding sheet, yet the shortcoming of its existence is the cost height, is unfavorable for lamination process.
Along with the transmission frequency of the present signal of telecommunication is more and more higher, lower to the requirement of the dielectric constant of sheet material, but, still can't satisfy the requirement of the signal transmission rate and the signal integrity of present high frequency bottom line because basic variation does not take place this body structure of glass cloth.
The utility model content
The purpose of this utility model is, a kind of pcb board that helps improving the PCB impedance Control is provided, and can effectively reduce the dielectric constant of pcb board, improves the PCB impedance Control.
To achieve these goals, the utility model provides a kind of pcb board that helps improving the PCB impedance Control, and it comprises: dielectric layer and be laminated with Copper Foil in its both sides, the bonding sheet of this dielectric layer for adopting glass paper to make.
Described glass paper is 25～105g/m
2Glass paper.
The resin content of this dielectric layer is 75～95%.
The beneficial effects of the utility model: the pcb board that helps improving the PCB impedance Control of the present utility model, adopt glass paper to make its dielectric layer with good adsorption resin ability, can effectively reduce the dielectric constant of the pcb board that uses it, improve the PCB impedance Control; And the pcb board compared to the use of same thickness structure tradition glass cloth has lower dielectric constant.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effect apparent by embodiment of the present utility model is described in detail.
In the accompanying drawing,
Fig. 1 helps improving the structural representation of the pcb board of PCB impedance Control for the utility model;
Fig. 2 is the part plan structural representation of glass paper in the utility model;
Fig. 3 is the part plan structural representation of the existing glass cloth that uses.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, the pcb board that helps improving the PCB impedance Control of the present utility model, it comprises: dielectric layer 20 and be laminated with the Copper Foil 10 of its both sides, the bonding sheet of this dielectric layer 20 for adopting glass paper to make.
Described glass paper as its reinforcing material, preferably adopts 25～105g/m in dielectric layer
2Glass paper.As shown in Figure 2, described glass paper is spongelike structure loose, porous, has the ability of good adsorption resin, and can make that resin is easier to be soaked into wherein, and compared to the glass cloth that tradition adopts, its resin content that can apply is higher.When described dielectric layer 20 is made, by photoresist coating process with resin-coating on glass paper, through the later half bonding sheet that solidify to form of high-temperature baking, be described dielectric layer 20.The resin content of this dielectric layer 20 is 75～95%.The dielectric layer that uses this glass paper to make is applied in the pcb board, can reduce the dielectric constant of pcb board, helps to improve the impedance Control of PCB.
Use the pcb board of a 4mil live width of material/2mil distance between centers of tracks of certain DicyCure, requiring the differential impedance of differential lines is 100 ± 5 Ω, thickness of dielectric layers wherein is 0.20mm, copper thickness is 1.2mil, conventional 1*7628 of selection or 2*2313/3313 glass cloth are the dielectric layer that reinforcing material is made, and the dielectric layer that uses glass paper to make, its corresponding D k value is as shown in table 1.
Table 1
Can find out by table 1 data, adopt glass paper to make and the conventional dielectric layer of selecting the same thickness that glass cloth makes, wherein use the Dk value of dielectric layer of glass paper lower, thereby impedance better be controlled.
In sum, the pcb board that helps improving the PCB impedance Control of the present utility model adopts the glass paper with good adsorption resin ability to make its dielectric layer, can effectively reduce the dielectric constant of the pcb board that uses it, improves the PCB impedance Control; And the pcb board compared to the use of same thickness structure tradition glass cloth has lower dielectric constant.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection range of the utility model claim.
Claims (3)
1. pcb board that helps improving the PCB impedance Control is characterized in that it comprises: dielectric layer and be laminated with the Copper Foil of its both sides, the bonding sheet of this dielectric layer for adopting glass paper to make.
2. the pcb board that helps improving the PCB impedance Control as claimed in claim 1 is characterized in that, described glass paper is 25～105g/m
2Glass paper.
3. the pcb board that helps improving the PCB impedance Control as claimed in claim 1 is characterized in that, the resin content of this dielectric layer is 75～95%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205404028U CN201797648U (en) | 2010-09-21 | 2010-09-21 | PCB board favorable for improving impedance control of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205404028U CN201797648U (en) | 2010-09-21 | 2010-09-21 | PCB board favorable for improving impedance control of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201797648U true CN201797648U (en) | 2011-04-13 |
Family
ID=43852544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205404028U Expired - Lifetime CN201797648U (en) | 2010-09-21 | 2010-09-21 | PCB board favorable for improving impedance control of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201797648U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416728A (en) * | 2011-09-25 | 2012-04-18 | 顾根山 | Polytetrafluoroethylene glass fiber paper copper clad laminate |
| CN102442029A (en) * | 2011-09-25 | 2012-05-09 | 顾根山 | Preparation method of polyfluortetraethylene glass fiber paper copper clad laminate |
| CN106793481A (en) * | 2016-11-12 | 2017-05-31 | 广东科翔电子科技有限公司 | A kind of multilayer impedance FPC of high evenness and preparation method thereof |
| CN114987011A (en) * | 2022-07-11 | 2022-09-02 | 陕西生益科技有限公司 | Copper-clad plate, printed circuit board comprising same and application thereof |
-
2010
- 2010-09-21 CN CN2010205404028U patent/CN201797648U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416728A (en) * | 2011-09-25 | 2012-04-18 | 顾根山 | Polytetrafluoroethylene glass fiber paper copper clad laminate |
| CN102442029A (en) * | 2011-09-25 | 2012-05-09 | 顾根山 | Preparation method of polyfluortetraethylene glass fiber paper copper clad laminate |
| CN106793481A (en) * | 2016-11-12 | 2017-05-31 | 广东科翔电子科技有限公司 | A kind of multilayer impedance FPC of high evenness and preparation method thereof |
| CN114987011A (en) * | 2022-07-11 | 2022-09-02 | 陕西生益科技有限公司 | Copper-clad plate, printed circuit board comprising same and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110413 |