CN106793460A - A kind of new ladder wiring board and preparation method thereof - Google Patents
A kind of new ladder wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN106793460A CN106793460A CN201611183841.6A CN201611183841A CN106793460A CN 106793460 A CN106793460 A CN 106793460A CN 201611183841 A CN201611183841 A CN 201611183841A CN 106793460 A CN106793460 A CN 106793460A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- plate
- wiring board
- gummosis
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of new ladder wiring board and preparation method thereof, the new ladder wiring board of one of which, including mainboard, stiffening plate, shop bolt and the not gummosis PP pieces between mainboard and stiffening plate, the shop bolt sequentially passes through stiffening plate, not gummosis PP pieces, mainboard；The stiffening plate is provided with supplementary buffer.The present invention improves the hole position precision at mainboard and reinforcement by the making of shop bolt, realizes single only not alignment issues of gummosis PP pieces；Accessory plate is set, mainboard and accessory plate are used into rivet interlacement, then carry out row's plate, solve the problems, such as to produce plate bent plate to stick up because low head high causes pressing pressure skewness.
Description
Technical field
The present invention relates to printed circuit board processing and manufacturing field, more specifically refer to a kind of new ladder wiring board and its
Preparation method.
Background technology
With the small-sized diversified development of electronic product, the fixation and installation miniaturization of wiring board part need to reduce after assembling
Overall element height, the restriction of space and security designs conventional planar can not meet many circuit boards in electronic applications
Demand, therefore the circuit board of ladder slot structure gradually dominates the market.On the one hand, ladder slot structure can be utilized to greatest extent
Space in circuit board, for electronic product diversified development provides technical support；On the other hand, client is in welding component,
Need to be overlapped or avoid other components during some, to ensure the security of electric elements, therefore just more highlight
Step trough structural advantages.In current printed circuit board stepped plate manufacturing process, it will usually use not gummosis PP pieces windowing, gong is blind
Groove, takes off the techniques similar with rigid-flexible combination making such as lid to realize the requirement of client.But, single is opened a window into for not gummosis PP
Size, it is impossible to make the contraposition with mainboard, tabula rasa etc., if not gummosis PP using rivet by the way of in edges of boards and mainboard and tabula rasa
, there is dislocation excessive glue in unit in positioning, can influence finished product aperture.And, the ladder slot structure in circuit board is formed by pressing
, at step trough often because in bonding processes PP pieces melt excessive glue under high temperature, high pressure so that ladder groove location is blocked, and
Blind hole is filled by excessive glue in step trough, causes to scrap.
Therefore, it is necessary to design a kind of new ladder wiring board and preparation method thereof, the not gummosis in single mainboard is solved
Pressing pressure buffering at the positioning of PP and drop position high, improves the problem that plate bent plate sticks up.
The content of the invention
Defect it is an object of the invention to overcome prior art, there is provided a kind of new ladder wiring board and its making side
Method.
To achieve the above object, the present invention uses following technical scheme：A kind of new ladder wiring board, including mainboard, benefit
Strong plate, shop bolt and the not gummosis PP pieces between mainboard and stiffening plate, the shop bolt sequentially pass through stiffening plate,
Not gummosis PP pieces, mainboard；The stiffening plate is provided with supplementary buffer.
A kind of preparation method of new ladder wiring board, comprises the following steps：
Step one, windowing drilling is carried out to not gummosis PP pieces；
Step 2, regioselective pin；
Step 3, setting accessory plate；
Step 4, by mainboard and accessory plate riveted；
Step 5, carry out row's plate；
Step 6, second pressing shaping；
Wherein, after pressing and forming, into subsequent handling.
Its further technical scheme is：The not gummosis PP piece opening sizes big 0.3mm-0.5mm more unilateral than hole, is mending
0.3mm-0.5mm is inside contracted at strong external form.
Its further technical scheme is：The not gummosis PP pieces opening use at the shop bolt with mainboard and reinforcement
NPTH holes it is in the same size.
Its further technical scheme is：The shop bolt diameter is than mainboard and the small 0.03mm- in contraposition aperture of stiffening plate
0.06mm, shop bolt length is than mainboard thickness of slab and the small 0.3mm-0.5mm of reinforcement thickness of slab sum.
Its further technical scheme is：The shop bolt diameter is than mainboard and the small 0.05mm in contraposition aperture of stiffening plate.
Its further technical scheme is：Part after accessory plate is shaped to list only for stiffening plate in the step 3.
Its further technical scheme is：Mainboard uses rivet interlacement with accessory plate in the step 4.
Its further technical scheme is：The step 5 includes procedure below：
Shop bolt is implanted into mainboard reinforcement area；
By list, only gummosis PP pieces are not put into；
Single reinforcing chip is put into.
Compared with the prior art, the invention has the advantages that：A kind of new ladder wiring board of the invention and its making side
Method, by the making of shop bolt, improves the hole position precision at mainboard and reinforcement, and only the contraposition of gummosis PP pieces is not asked to realize list
Topic；Accessory plate is set, mainboard and accessory plate are used into rivet interlacement, then carry out row's plate, solve because low head high causes pressure
Resultant pressure skewness and produce the problem that plate bent plate sticks up.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the sectional view of ladder circuit board pressing operation in a kind of new ladder wiring board specific embodiment of the present invention；
Fig. 2 is a kind of FB(flow block) of new ladder method for manufacturing circuit board specific embodiment pressing working procedure of the present invention；
Fig. 3 is the flow chart element that a kind of new ladder method for manufacturing circuit board specific embodiment mainboard core plate of the present invention makes
Figure；
Fig. 4 is the FB(flow block) that a kind of new ladder method for manufacturing circuit board specific embodiment stiffening plate of the present invention makes；
Fig. 5 is a kind of flow of the new ladder method for manufacturing circuit board specific embodiment mainboard of the present invention after one step press
Block diagram；
Fig. 6 is the FB(flow block) after a kind of new ladder method for manufacturing circuit board specific embodiment second pressing of the present invention.
Reference
The 10 pressing mould release membrances of steel plate 20
The shop bolt of 30 stiffening plate 40
50 not mainboards of gummosis PP pieces 60
70 supplementary buffers
Specific embodiment
In order to more fully understand technology contents of the invention, technical scheme is entered with reference to specific embodiment
One step introduction and explanation, but it is not limited to this.
Specific embodiment as shown in Figures 1 to 6, a kind of new ladder wiring board, including it is mainboard 60, stiffening plate 30, fixed
Position pin 40 and the not gummosis PP pieces 50 between mainboard 60 and stiffening plate 30, shop bolt 40 sequentially passes through stiffening plate
30th, not gummosis PP pieces 50, mainboard 60；Stiffening plate 30 is provided with supplementary buffer 70.In bonding processes, the two of ladder wiring board
Side is provided with pressing steel plate 10, and mould release membrance 20 is provided between pressing steel plate 10 and ladder wiring board.
As shown in Fig. 2 the present embodiment additionally provides a kind of preparation method of new ladder wiring board, pressing working procedure include with
Lower step：
Step one, windowing drilling is carried out to not gummosis PP pieces；
Step 2, regioselective pin；
Step 3, setting accessory plate；
Step 4, by mainboard and accessory plate riveted；
Step 5, carry out row's plate；
Step 6, second pressing shaping；
Wherein, after pressing and forming, into subsequent handling.
Wherein, not gummosis PP pieces opening size big 0.3mm-0.5mm more unilateral than hole, 0.3mm- is inside contracted at reinforcement external form
0.5mm.Not gummosis PP pieces opening at shop bolt using in the same size with NPTH holes at mainboard and reinforcement.Shop bolt
, than mainboard and the small 0.03mm-0.06mm in contraposition aperture of stiffening plate, shop bolt length is than mainboard thickness of slab and reinforcement thickness of slab for diameter
The small 0.3mm-0.5mm of sum, in the present embodiment, shop bolt diameter is than mainboard and the small 0.05mm in contraposition aperture of stiffening plate.It is fixed
Position pin plays dual parts of to support and aligns.
In the step 3 accessory plate for stiffening plate be shaped to it is single only after part, play buffering mainboard and pressed with stiffening plate
Pressure distribution outside region, improves plate bent plate caused by concentrating stress and sticks up problem.Mainboard is used with accessory plate in step 4
Rivet interlacement.Include procedure below in step 5：Shop bolt is implanted into mainboard reinforcement area；By list, only gummosis PP pieces are not put
Enter；Single reinforcing chip is put into.
Wherein, in step one, not gummosis PP Making programmes：Sawing sheet, windowing drilling, brown (in the present embodiment, this step
The brown flow of middle setting does not actually do brown, is transferred items access for convenience of operation).
Specifically, as shown in figure 3, the core plate Making programme of mainboard：Sawing sheet, drying-plate (1), inner figure, internal layer etching,
OPE punchings, internal layer AOI, brown, drying-plate (2).
Specifically, as shown in figure 4, stiffening plate Making programme：Sawing sheet, drying-plate (1), internal layer drilling, internal layer etching, shaping,
Brown, drying-plate (2).
Specifically, as shown in figure 5, flow of the mainboard after one step press：Lamination (1), outer layer drilling, drying-plate (3), outer layer
Filled in before heavy copper, electric plating of whole board (negative film), slice analysis, outer graphics, the etching of outer layer negative film, outer layer AOI, drying-plate (4), welding resistance
Test (electrical measurement runin is short-circuit) before hole, silk-screen welding resistance, silk-screen character, heavy nickel gold, drying-plate (5), shaping, gong SET external forms, V-CUT,
Bore rivet location hole (with the riveted location hole of accessory plate during as second pressing).
Flow specifically, as shown in fig. 6, second pressing after (stiffening plate+not gummosis PP+ mainboards)：Lamination (2), shaping,
FQC, FQA, packaging, shipment.
Wherein, this programme can be applied to using the single making of size high accuracy second pressing.
In sum, a kind of new ladder wiring board of the invention and preparation method thereof, by the making of shop bolt, carries
Hole position precision at mainboard high and reinforcement, realizes single only not alignment issues of gummosis PP pieces；Set accessory plate, by mainboard with it is auxiliary
Help plate to use rivet interlacement, then carry out row's plate, solve and produce plate bent because low head high causes pressing pressure skewness
The problem that plate sticks up.
It is above-mentioned that technology contents of the invention are only further illustrated with embodiment, it is easier to understand in order to reader, but not
Represent embodiments of the present invention and be only limitted to this, any technology done according to the present invention extends or recreates, by of the invention
Protection.Protection scope of the present invention is defined by claims.
Claims (9)
1. a kind of new ladder wiring board, it is characterised in that including mainboard, stiffening plate, shop bolt and located at mainboard with mend
Not gummosis PP pieces between strong plate, the shop bolt sequentially passes through stiffening plate, not gummosis PP pieces, mainboard；On the stiffening plate
It is provided with supplementary buffer.
2. a kind of preparation method of new ladder wiring board, it is characterised in that comprise the following steps：
Step one, windowing drilling is carried out to not gummosis PP pieces；
Step 2, regioselective pin；
Step 3, setting accessory plate；
Step 4, by mainboard and accessory plate riveted；
Step 5, carry out row's plate；
Step 6, second pressing shaping；
Wherein, after pressing and forming, into subsequent handling.
3. a kind of preparation method of new ladder wiring board according to claim 2, it is characterised in that the not gummosis PP
Piece opening size big 0.3mm-0.5mm more unilateral than hole, 0.3mm-0.5mm is inside contracted at reinforcement external form.
4. a kind of preparation method of new ladder wiring board according to claim 2, it is characterised in that the not gummosis PP
Piece opening is at shop bolt using in the same size with NPTH holes at mainboard and reinforcement.
5. a kind of preparation method of new ladder wiring board according to claim 2, it is characterised in that the shop bolt
, than mainboard and the small 0.03mm-0.06mm in contraposition aperture of stiffening plate, shop bolt length is than mainboard thickness of slab and reinforcement thickness of slab for diameter
The small 0.3mm-0.5mm of sum.
6. a kind of preparation method of new ladder wiring board according to claim 5, it is characterised in that the shop bolt
Diameter is than mainboard and the small 0.05mm in contraposition aperture of stiffening plate.
7. the preparation method of a kind of new ladder wiring board according to claim 2, it is characterised in that in the step 3
Accessory plate is shaped to the part after single for stiffening plate.
8. the preparation method of a kind of new ladder wiring board according to claim 2, it is characterised in that in the step 4
Mainboard uses rivet interlacement with accessory plate.
9. the preparation method of a kind of new ladder wiring board according to claim 2, it is characterised in that in the step 5
Including procedure below：
Shop bolt is implanted into mainboard reinforcement area；
By list, only gummosis PP pieces are not put into；
Single reinforcing chip is put into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183841.6A CN106793460A (en) | 2016-12-20 | 2016-12-20 | A kind of new ladder wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183841.6A CN106793460A (en) | 2016-12-20 | 2016-12-20 | A kind of new ladder wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793460A true CN106793460A (en) | 2017-05-31 |
Family
ID=58896181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611183841.6A Pending CN106793460A (en) | 2016-12-20 | 2016-12-20 | A kind of new ladder wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793460A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949155A (en) * | 2017-12-18 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Reinforcement wiring board and preparation method thereof |
| CN109219276A (en) * | 2018-10-31 | 2019-01-15 | 西安微电子技术研究所 | A method of improving multilayer printed circuit board laminating technology |
| CN109936917A (en) * | 2019-03-08 | 2019-06-25 | 广合科技（广州）有限公司 | A kind of smart home inductor wiring board and preparation method thereof |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
| CN114007332A (en) * | 2021-10-28 | 2022-02-01 | 高德（江苏）电子科技有限公司 | Processing method of multi-lamination interlayer high-alignment printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5644452A (en) * | 1994-04-18 | 1997-07-01 | Seagate Technology, Inc. | Apparatus connecting a flexible circuit to an actuator arm of a disc drive |
| CN102361537A (en) * | 2011-09-30 | 2012-02-22 | 常州市协和电路板有限公司 | Reinforced mounting jig and mounting method thereof |
| CN102917541A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for laminating reinforcing plate by using hollow accompanying plates |
| CN105282980A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Fabrication method for metallic stepped hole of printed circuit board (PCB) |
| CN205566835U (en) * | 2016-05-03 | 2016-09-07 | 伟裕(厦门)电子有限公司 | A positioning jig for flexible circuit board laminating reinforcement |
-
2016
- 2016-12-20 CN CN201611183841.6A patent/CN106793460A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5644452A (en) * | 1994-04-18 | 1997-07-01 | Seagate Technology, Inc. | Apparatus connecting a flexible circuit to an actuator arm of a disc drive |
| CN102361537A (en) * | 2011-09-30 | 2012-02-22 | 常州市协和电路板有限公司 | Reinforced mounting jig and mounting method thereof |
| CN102917541A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for laminating reinforcing plate by using hollow accompanying plates |
| CN105282980A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Fabrication method for metallic stepped hole of printed circuit board (PCB) |
| CN205566835U (en) * | 2016-05-03 | 2016-09-07 | 伟裕(厦门)电子有限公司 | A positioning jig for flexible circuit board laminating reinforcement |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949155A (en) * | 2017-12-18 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Reinforcement wiring board and preparation method thereof |
| CN109219276A (en) * | 2018-10-31 | 2019-01-15 | 西安微电子技术研究所 | A method of improving multilayer printed circuit board laminating technology |
| CN109219276B (en) * | 2018-10-31 | 2020-04-21 | 西安微电子技术研究所 | Method for improving lamination process of multilayer printed circuit board |
| CN109936917A (en) * | 2019-03-08 | 2019-06-25 | 广合科技（广州）有限公司 | A kind of smart home inductor wiring board and preparation method thereof |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
| CN114007332A (en) * | 2021-10-28 | 2022-02-01 | 高德（江苏）电子科技有限公司 | Processing method of multi-lamination interlayer high-alignment printed circuit board |
| CN114007332B (en) * | 2021-10-28 | 2024-05-24 | 高德(江苏)电子科技股份有限公司 | Processing method for multi-press-fit interlayer high-alignment printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106793460A (en) | A kind of new ladder wiring board and preparation method thereof | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN104918421B (en) | A kind of production method of PCB golden fingers | |
| CN107592735A (en) | Thick desired ladder board manufacturing method more than a kind of high accuracy | |
| CN105208790B (en) | A method of making solder mask on PCB | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN111683457A (en) | Manufacturing method of rigid-flex board | |
| US9793218B2 (en) | Method for manufacturing device embedded substrate, and device embedded substrate | |
| CN107231764A (en) | A kind of preparation method for the ladder wiring board for improving step platform precision | |
| CN102365000A (en) | Manufacturing method of single-side aluminum circuit board | |
| CN103648235A (en) | Manufacturing method of aluminum-based circuit board | |
| CN106714453B (en) | A kind of false rigid-flex combined board and preparation method thereof | |
| CN105451450A (en) | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow | |
| CN109219276A (en) | A method of improving multilayer printed circuit board laminating technology | |
| CN105555040B (en) | A kind of production method for the PCB that outer graphics and bore position precision can be improved | |
| CN105517373B (en) | A kind of production method of PCB backboards outer-layer circuit figure | |
| CN206436318U (en) | Multifunctional hardware mould is used in a kind of cutting part processing | |
| CN107172833A (en) | A kind of preparation method of high drop stepped circuit board | |
| CN105722314A (en) | Flexible and hard combination board for preventing fracture of cover plate and uncapping and slicing process thereof | |
| CN102365004A (en) | Manufacture method for high-precision bonding integrated circuit (IC) board | |
| CN107484357B (en) | A kind of production method of the more plate nesting tiled mixed-compression boards of asymmetric | |
| CN109688707A (en) | A kind of manufacturing method of communications connector module board | |
| CN108684161A (en) | It is a kind of to improve riveting method short in PCB pressings | |
| CN207711402U (en) | A kind of cold plate making mold | |
| JP3420147B2 (en) | Processing method of printed wiring board and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
|
| RJ01 | Rejection of invention patent application after publication |