CN106787948A - 一种耐高温半导体温差发电器件及制作方法 - Google Patents
一种耐高温半导体温差发电器件及制作方法 Download PDFInfo
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- CN106787948A CN106787948A CN201510814291.2A CN201510814291A CN106787948A CN 106787948 A CN106787948 A CN 106787948A CN 201510814291 A CN201510814291 A CN 201510814291A CN 106787948 A CN106787948 A CN 106787948A
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- ceramic wafer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000010146 3D printing Methods 0.000 claims abstract description 13
- 239000004411 aluminium Substances 0.000 claims description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 17
- 235000012149 noodles Nutrition 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910021389 graphene Inorganic materials 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 claims description 3
- -1 skutterudite Chemical compound 0.000 claims description 3
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 36
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000010248 power generation Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052573 porcelain Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 210000000031 electric organ Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910000648 terne Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510814291.2A CN106787948B (zh) | 2015-11-23 | 2015-11-23 | 一种耐高温半导体温差发电器件及制作方法 |
Applications Claiming Priority (1)
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CN201510814291.2A CN106787948B (zh) | 2015-11-23 | 2015-11-23 | 一种耐高温半导体温差发电器件及制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN106787948A true CN106787948A (zh) | 2017-05-31 |
CN106787948B CN106787948B (zh) | 2018-08-10 |
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CN201510814291.2A Active CN106787948B (zh) | 2015-11-23 | 2015-11-23 | 一种耐高温半导体温差发电器件及制作方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108461618A (zh) * | 2018-03-19 | 2018-08-28 | 清华大学深圳研究生院 | 3d打印技术制造热电器件的方法 |
CN109521349A (zh) * | 2018-11-19 | 2019-03-26 | 河北科技大学 | 半导体发电模块最大输出功率的测量方法及*** |
CN112701212A (zh) * | 2020-12-28 | 2021-04-23 | 中国电子科技集团公司第十八研究所 | 一种温差电温度传感器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008127017A1 (en) * | 2007-04-17 | 2008-10-23 | Korea Institute Of Machinery & Materials | A thermoelectric module |
CN101409324A (zh) * | 2008-07-24 | 2009-04-15 | 中国科学院上海硅酸盐研究所 | 一种碲化铋基热电发电器件及其制造方法 |
US20120042921A1 (en) * | 2010-08-18 | 2012-02-23 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same |
CN104752530A (zh) * | 2013-12-30 | 2015-07-01 | 上海神舟新能源发展有限公司 | 一种3d打印制作太阳能电池电极 |
CN104810467A (zh) * | 2015-04-21 | 2015-07-29 | 胡增荣 | 一种多材料、多功能3d打印加工装置 |
-
2015
- 2015-11-23 CN CN201510814291.2A patent/CN106787948B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008127017A1 (en) * | 2007-04-17 | 2008-10-23 | Korea Institute Of Machinery & Materials | A thermoelectric module |
CN101409324A (zh) * | 2008-07-24 | 2009-04-15 | 中国科学院上海硅酸盐研究所 | 一种碲化铋基热电发电器件及其制造方法 |
US20120042921A1 (en) * | 2010-08-18 | 2012-02-23 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same |
CN104752530A (zh) * | 2013-12-30 | 2015-07-01 | 上海神舟新能源发展有限公司 | 一种3d打印制作太阳能电池电极 |
CN104810467A (zh) * | 2015-04-21 | 2015-07-29 | 胡增荣 | 一种多材料、多功能3d打印加工装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108461618A (zh) * | 2018-03-19 | 2018-08-28 | 清华大学深圳研究生院 | 3d打印技术制造热电器件的方法 |
CN109521349A (zh) * | 2018-11-19 | 2019-03-26 | 河北科技大学 | 半导体发电模块最大输出功率的测量方法及*** |
CN109521349B (zh) * | 2018-11-19 | 2020-11-24 | 河北科技大学 | 半导体发电模块最大输出功率的测量方法及*** |
CN112701212A (zh) * | 2020-12-28 | 2021-04-23 | 中国电子科技集团公司第十八研究所 | 一种温差电温度传感器 |
Also Published As
Publication number | Publication date |
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CN106787948B (zh) | 2018-08-10 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: High temperature resistant semiconductor thermoelectric generator and its manufacturing method Effective date of registration: 20221008 Granted publication date: 20180810 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180810 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |