CN106785700B - The collector of included built-in sensors - Google Patents

The collector of included built-in sensors Download PDF

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Publication number
CN106785700B
CN106785700B CN201611062074.3A CN201611062074A CN106785700B CN 106785700 B CN106785700 B CN 106785700B CN 201611062074 A CN201611062074 A CN 201611062074A CN 106785700 B CN106785700 B CN 106785700B
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China
Prior art keywords
module
collector
electrically connected
sensor
output end
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CN201611062074.3A
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Chinese (zh)
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CN106785700A (en
Inventor
王知非
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Jiangsu Swr Science & Technology Co Ltd
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Jiangsu Swr Science & Technology Co Ltd
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Priority to CN201611062074.3A priority Critical patent/CN106785700B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6675Structural association with built-in electrical component with built-in electronic circuit with built-in power supply
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6691Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)

Abstract

The invention discloses a kind of collectors of included built-in sensors, including shell, enclosure interior is equipped with circuit board, collector includes the MCU module of setting on circuit boards, external tapping module, ADC conversion module, communication module, power supply module and memory, external tapping module includes several external tappings for connecting external sensor, and each external tapping is electrically connected with reading circuit, reading circuit is equipped with the first output end and second output terminal, and the first output end of reading circuit is connected with the first input end of ADC conversion module, first output end of ADC conversion module and the first input end of MCU module are electrically connected.Collector of the present invention solves the problems, such as cannot be compatible when the analog sensor of collector and digital sensors access collector.

Description

The collector of included built-in sensors
Technical field
The present invention relates to a kind of electric coupler component and electric connector more particularly to a kind of electricity for cooperating circuit system mould group Connector assembly and electric connector.
Background technique
Education sector sensor generally divides analog output sensor and digital output sensor at present, and collector is all Setting analog sensor input port and digital quantity input port, the analog sensor and digital sensors of collector connect The different channels of collector are respectively connected to when entering collector, using differentiation trouble cannot be compatible, while collector It is connect with exterior terminal and is typically chosen the USB way of output, communication modes are relatively simple.
In view of this, it is necessary to the collector of existing included built-in sensors is further improved, it is above-mentioned to solve Problem.
Summary of the invention
The purpose of the present invention is to provide a kind of collectors, to solve to access when analog sensor and digital sensors Problem that cannot be compatible when collector.
To achieve the above object, the present invention provides a kind of collector of included built-in sensors, including shell, the shell Inside is equipped with circuit board, the collector include setting MCU module on circuit boards, external tapping module, ADC conversion module, Communication module, power supply module and memory, the external tapping module include several external tappings for connecting external sensor, and every One external tapping is electrically connected with reading circuit, and the reading circuit is equipped with the first output end and second output terminal, the reading First output end of circuit is connected with the first input end of the ADC conversion module, the first output end of the ADC conversion module It is electrically connected with the first input end of the MCU module, the second of the second output terminal of the reading circuit and the MCU module Input terminal is electrically connected, and the reading circuit can identify the analog signal and digital signal of external sensor, when the reading When circuit recognizes analog signal, the ADC conversion module is transmitted to by the first output end of reading circuit, is converted through ADC The MCU module is transmitted to by the first output end of ADC conversion module after module conversion, when the reading circuit recognizes number When word signal, the MCU module is transmitted to by the second output terminal of the reading circuit.
As a further improvement of the present invention, be provided in the shell pressure transducer and with the pressure transducer The pressure signal acquisition module of electric connection, the output end of the pressure signal acquisition module are defeated with the ADC conversion module Enter end to be electrically connected.
As a further improvement of the present invention, it is provided with UV sensor in the shell and is passed with the ultraviolet light The ultraviolet light signal acquisition module that sensor is electrically connected, the output end and the ADC of the ultraviolet light signal acquisition module are converted The input terminal of module is electrically connected.
As a further improvement of the present invention, be provided in the shell light intensity sensor and with the light intensity sensor The light intensity signal collection module of electric connection, the output end of the light intensity signal collection module and the MCU module are electrically connected.
As a further improvement of the present invention, it is provided with Temperature Humidity Sensor in the shell and is passed with the temperature and humidity The temperature-humidity signal acquisition module that sensor is electrically connected, the output end of the temperature-humidity signal acquisition module and the MCU module It is electrically connected.
As a further improvement of the present invention, be provided in the shell heart rate sensor and with the heart rate sensor The heart rate signal acquisition module of electric connection, the output end of the heart rate signal acquisition module and the MCU module are electrically connected.
As a further improvement of the present invention, conditioning is also serially connected between each reading circuit and the ADC conversion module Circuit, to be pre-processed to the analog signal and digital signal.
As a further improvement of the present invention, the external tapping module includes four RJ45 external tappings, each RJ45 interface If there are two ECP Extended Capabilities Ports.
As a further improvement of the present invention, the communication module includes usb communication module and the wireless communication module, The output end of the communication module and the MCU module are electrically connected, so that the collector can pass through the usb communication mould Block or the wireless communication module are communicated with exterior terminal, the system of the exterior terminal be Android, IOS, MAC and Windows。
As a further improvement of the present invention, the power supply module is powered the collector for internal battery, or Person is powered the collector by external power supply.
The beneficial effects of the present invention are: the present invention provides a kind of novel collector, including main control MCU module, external tapping Module and ADC conversion module match, and the reading circuit in the external tapping module can identify the simulation letter of external sensor Number and digital signal, when reading circuit recognizes analog signal, the first output end of reading circuit is transmitted to ADC modulus of conversion Block is transmitted to MCU module after the conversion of ADC conversion module again, when reading circuit recognizes digital signal, the of reading circuit Two output ends are transmitted to MCU module, so that super collector solves the analog sensor and digital sensors of collector Access collector when cannot be compatible problem.
Detailed description of the invention
Fig. 1 is the internal module structure chart of collector of the present invention;
Fig. 2 is the structure chart of collector external tapping module of the present invention;
Fig. 3 A is the partial circuit diagram that collector conditioning circuit of the present invention handles analog signal;
Fig. 3 B is another partial circuit diagram that collector conditioning circuit of the present invention handles analog signal;
Fig. 3 C is the partial circuit diagram that collector conditioning circuit of the present invention handles digital signal.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, right in the following with reference to the drawings and specific embodiments The present invention is described in detail.
Referring to Fig.1, a kind of super collector, including shell are proposed in the present embodiment, enclosure interior is equipped with circuit board, adopts Storage include setting main control MCU module on circuit boards, external tapping module, ADC conversion module, communication module, power supply module, Memory and it is built in the intracorporal several sensors of shell.
Referring to Fig. 2, external tapping module includes several external tappings for connecting external sensor, and each external tapping is electrically gone here and there It is connected to reading circuit, reading circuit is equipped with the first output end and second output terminal, and the first output end and ADC of reading circuit are converted The first input end of module is electrically connected, and the first output end of ADC conversion module and the first input end of main control MCU module are electrical Connection, the second output terminal of reading circuit and the second input terminal of main control MCU module are electrically connected.
Reading circuit can identify the analog signal and digital signal of external sensor, when reading circuit recognizes simulation letter Number when, ADC conversion module is transmitted to by the first output end of reading circuit, through ADC conversion module conversion after by ADC conversion First output end of module is transmitted to main control MCU module, when reading circuit recognizes digital signal, passes through the of reading circuit Two output ends are transmitted to main control MCU module.
External tapping module includes four RJ45 external tappings, and each RJ45 interface is set there are two ECP Extended Capabilities Port, and four RJ45 connect Mouth is respectively J6A, J6B, J7A and J7B, institute on RJ45 interface J6A, RJ45 interface J6B, RJ45 interface J7A and RJ45 interface J7B Corresponding port A2, A3 and A8 are mainly used for automatic identification sensor, and reading is stored in the functions such as the information of sensor internal.
For the reading circuit structure chart for reading external sensor to J6A external tapping, the information to be done to sensor is read Afterwards, digital signal and analog signal are fed through conditioning circuit respectively by the port A4 and A5 and handled by reading circuit.Outside J6A Interface includes control element, the high level VCC connecting with port A1.The port A4 and A5 is connected with main control MCU module, to receive master Control the control signal of MCU module.
Reading circuit specifically: the port A1 of RJ45 interface J6A is connected with high level VCC, and the port of RJ45 interface J6A A4 and A5 is connected with main control MCU chip U1, and the port A4 of RJ45 interface J6A is connected with drawing for resistance R92 and diode D3 Foot 3, and the other end of resistance R92 is connected with main control MCU chip U1, the pin 2 of diode D3 is connected with high level VCC, and The pin 1 of diode D3 is grounded, and the port A5 of RJ45 interface J6A is connected with the pin 3 of resistance R93 and diode D5, and resistance The other end of R93 is connected with main control MCU chip U1, and the pin 2 of diode D5 is connected with high level VCC, RJ45 interface J6A's Port A6 is connected with high level VCC, and the pin 1 of diode D5 is grounded, and the port A2 of RJ45 interface J6A is connected with resistance R51, And the other end ground connection of resistance R51, the port A3 of RJ45 interface J6A are connected with resistance R52, and the other end ground connection of resistance R52, The port A7 of RJ45 interface J6A is grounded, and the port A8 of RJ45 interface J6A is connected with the pin 2 of resistance R53 and diode D21, electricity The other end ground connection of R51 is hindered, the pin 1 of diode D21 is connected with high level VCC, and the pin 3 of diode D21 is grounded.
The port B1 of RJ45 interface J6B is connected with high level VCC, and the port B4 and B5 of RJ45 interface J6B is and master control MCU chip U1 is connected, and the port B4 of RJ45 interface J6B is connected with the pin 3 of diode D4, and the pin 2 of diode D4 connects There is a high level VCC, and the pin 1 of diode D4 is grounded, the port B5 of RJ45 interface J6B is connected with the pin 3 of diode D6, and two The pin 2 of pole pipe D6 is connected with the port B6 of high level VCC and RJ45 interface J6B, and the pin 1 of diode D6 is grounded, RJ45 The port B2 of interface J6B is connected with resistance R54, and the other end ground connection of resistance R54, the port B3 of RJ45 interface J6B are connected with Resistance R56, and the other end ground connection of resistance R56, the port B7 ground connection of RJ45 interface J6B, the port B8 connection of RJ45 interface J6B There are the pin 2 of resistance R55 and diode D22, the other end ground connection of resistance R55, the pin 1 of diode D22 is connected with high level VCC, and the pin 3 of diode D22 is grounded.
The port A1 of RJ45 interface J7A is connected with high level VCC, and the port A4 and A5 of RJ45 interface J7A is and master control MCU chip U1 is connected, and the port A4 of RJ45 interface J7A is connected with the pin 3 of diode D7, and the pin 2 of diode D7 connects There is high level VCC, and the pin 1 of diode D7 is grounded, the port A5 of RJ45 interface J7A is connected with the pin 3 of diode D10, The pin 2 of diode D10 is connected with the port A6 of high level VCC and RJ45 interface J7AB, and the pin 1 of diode D10 is grounded, The port A2 of RJ45 interface J7A is connected with resistance R59, and the other end ground connection of resistance R59, the port A3 of RJ45 interface J7A connect It is connected to resistance R60, and the other end ground connection of resistance R60, the port A7 ground connection of RJ45 interface J7A, the port A8 of RJ45 interface J7A It is connected with the pin 2 of resistance R61 and diode D20, the other end ground connection of resistance R60, the pin 1 of diode D20 is connected with height Level VCC, and the pin 3 of diode D20 is grounded.
The port B1 of RJ45 interface J7B is connected with high level VCC, and the port B4 and B5 of RJ45 interface J7B is and master control MCU chip U1 is connected, and the port B4 of RJ45 interface J7B is connected with the pin 3 of diode D8, and the pin 2 of diode D8 connects There is a high level VCC, and the pin 1 of diode D8 is grounded, the port B5 of RJ45 interface J7B is connected with the pin 3 of diode D9, and two The pin 2 of pole pipe D9 is connected with the port B6 of high level VCC and RJ45 interface J7B, and the pin 1 of diode D9 is grounded, RJ45 The port B2 of interface J7B is connected with resistance R62, and the other end ground connection of resistance R62, the port B3 of RJ45 interface J7B are connected with Resistance R63, and the other end ground connection of resistance R63, the port B7 ground connection of RJ45 interface J7B, the port B8 connection of RJ45 interface J7B There are the pin 2 of resistance R64 and diode D19, the other end ground connection of resistance R64, the pin 1 of diode D19 is connected with high level VCC, and the pin 3 of diode D19 is grounded.
Referring to Fig. 3 A ~ Fig. 3 C, it is also serially connected with conditioning circuit between each reading circuit and ADC conversion module, to simulation Signal and digital signal are pre-processed, and conditioning circuit includes element U14, element U15, element U17 and element U18, element U15, element U17 and element U18 are sent into MCU module after mainly carrying out impedance variations and filtering to the analog signal of sensor ADC channel, the digital signal input that element U14 is sent into for buffer sensor, and be used for received digital data transmission extremely Middle control MCU module.Element U14, element U15, element U17 and element U18 model be SGM8582XMS8G.
Several sensors include pressure transducer, UV sensor, light intensity sensor, heart rate sensor, temperature and humidity biography Sensor.Pressure transducer is electrically connected by a pressure signal acquisition module and ADC conversion module, pressure signal acquisition module Input terminal and pressure transducer are electrically connected, and the input terminal of output end and ADC conversion module is electrically connected.
Pressure transducer is electrically connected by a pressure signal acquisition module and ADC conversion module, and pressure signal acquires mould The input terminal and pressure transducer of block are electrically connected, and the input terminal of output end and ADC conversion module is electrically connected.
UV sensor is electrically connected by a ultraviolet light signal acquisition module and ADC conversion module, ultraviolet light signal The input terminal and UV sensor of acquisition module are electrically connected, and the input terminal of output end and ADC conversion module is electrically connected.
Light intensity sensor is electrically connected by a light intensity signal collection module and ADC conversion module, light intensity signal collection mould The input terminal and light intensity sensor of block are electrically connected, and output end and main control MCU module are electrically connected.
Temperature Humidity Sensor is electrically connected by a temperature-humidity signal acquisition module and main control MCU module, temperature-humidity signal The input terminal and Temperature Humidity Sensor of acquisition module are electrically connected, and output end and main control MCU module are electrically connected.
Heart rate sensor is electrically connected by rate signals acquisition module and main control MCU module, and heart rate signal acquires mould The input terminal and heart rate sensor of block are electrically connected, and output end and main control MCU module are electrically connected.Collector can acquire simultaneously Temperature, humidity, pressure, light intensity, ultraviolet light, heart rate signal, acquisition range is wide, can satisfy teaching demand.
Communication module includes usb communication module and wireless communication module, and the output end of communication module electrically connects with MCU module It connects, so that collector can be communicated by usb communication module or wireless communication module with exterior terminal, the system of exterior terminal It can be Android, IOS, MAC and Windows, to have stronger adaptability using the terminal device of not homologous ray.
Power supply module is that internal battery is powered collector, or is powered by external power supply to collector, The inside of power supply module is equipped with electric power management circuit, and includes element U10, element U12 and key K1, electricity in electric power management circuit Element U10 in source control module comes sensor boosting to system power supply, and the model SY77063 of element U10, member for 5V It is system power supply that part U12, which is 3.3V power supply power supply processing, and the model RT9187 of element U10, key K1 are used as switching on and shutting down Key and other operation button functions, it is main to realize long-pressing booting, the operation such as long-pressing shutdown and short-press selection function.
Working principle: pressure signal acquisition module can detect extraneous pressure by pressure transducer, ultraviolet Line signal acquisition module can detect extraneous UV signal by UV sensor, and pressure signal acquisition module The data of acquisition are transferred to ADC conversion module with ultraviolet light signal acquisition module, ADC conversion module passes the data after conversion It is defeated on main control MCU module U1, main control MCU module U1 is communicated by communication module with exterior terminal, light intensity signal collection Module can measure extraneous light intensity by light intensity sensor, and temperature-humidity signal acquisition module is passed by temperature and humidity Sensor can detect extraneous temperature and humidity, heart rate signal acquisition module by heart rate sensor can to heart rate into Row detection, and the data of acquisition are transferred to by light intensity signal collection module, temperature and humidity acquisition module, heart rate signal acquisition module In main control MCU module, main control MCU module can be communicated by communication module with exterior terminal, so that super acquisition The communication modes of device and exterior terminal multiplicity.
To sum up, the reading circuit in the external tapping module in collector of the present invention can identify the external sensing on external tapping The analog signal and digital signal of device, when reading circuit recognizes analog signal, the first output end of reading circuit is transmitted to ADC conversion module is transmitted to MCU module after the conversion of ADC conversion module again, when reading circuit recognizes digital signal, reads The second output terminal of sense circuit is transmitted to MCU module, and super collector solves the analog sensor and digital quantity of collector Sensor access collector when cannot be compatible problem;And collector has usb communication transmission and wireless communication transmissions etc. Communication mode.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair It is bright to be described in detail, those skilled in the art should understand that, it can modify to technical solution of the present invention Or equivalent replacement, without departing from the spirit and scope of the technical solution of the present invention.

Claims (10)

1. a kind of collector of included built-in sensors, including shell, the enclosure interior is equipped with circuit board, it is characterised in that: The collector includes MCU module, external tapping module, ADC conversion module, the communication module, power supply mould of setting on circuit boards Block and memory, the external tapping module includes several external tappings for connecting external sensor, and each external tapping is electrical It is connected with reading circuit, the reading circuit is equipped with the first output end and second output terminal, the first output of the reading circuit End is connected with the first input end of the ADC conversion module, the first output end of the ADC conversion module and the MCU module First input end be electrically connected, the second output terminal of the reading circuit and the second input terminal of the MCU module electrically connect It connects, the reading circuit can identify the analog signal and digital signal of external sensor, when the reading circuit recognizes mould When quasi- signal, the ADC conversion module is transmitted to by the first output end of reading circuit, is led to after the conversion of ADC conversion module The first output end for crossing ADC conversion module is transmitted to the MCU module, when the reading circuit recognizes digital signal, leads to The second output terminal for crossing the reading circuit is transmitted to the MCU module.
2. a kind of collector of included built-in sensors according to claim 1, it is characterised in that: setting in the shell The pressure signal acquisition module for having pressure transducer and being electrically connected with the pressure transducer, the pressure signal acquire mould The input terminal of the output end of block and the ADC conversion module is electrically connected.
3. a kind of collector of included built-in sensors according to claim 2, it is characterised in that: setting in the shell The ultraviolet light signal acquisition module for having UV sensor and being electrically connected with the UV sensor, the ultraviolet light letter The output end of number acquisition module and the input terminal of the ADC conversion module are electrically connected.
4. a kind of collector of included built-in sensors according to claim 3, it is characterised in that: setting in the shell The light intensity signal collection module for having light intensity sensor and being electrically connected with the light intensity sensor, the light intensity signal collection mould The output end of block and the MCU module are electrically connected.
5. a kind of collector of included built-in sensors according to claim 4, it is characterised in that: setting in the shell The temperature-humidity signal acquisition module for having Temperature Humidity Sensor and being electrically connected with the Temperature Humidity Sensor, the temperature and humidity letter The output end of number acquisition module and the MCU module are electrically connected.
6. a kind of collector of included built-in sensors according to claim 5, it is characterised in that: setting in the shell The heart rate signal acquisition module for having heart rate sensor and being electrically connected with the heart rate sensor, the heart rate signal acquire mould The output end of block and the MCU module are electrically connected.
7. a kind of collector of included built-in sensors according to claim 1-6, it is characterised in that: each reading It is also serially connected with conditioning circuit between sense circuit and the ADC conversion module, it is pre- to be carried out to the analog signal and digital signal Processing.
8. a kind of collector of included built-in sensors according to claim 7, it is characterised in that: the external tapping module Including four RJ45 external tappings, each RJ45 external tapping is set there are two ECP Extended Capabilities Port.
9. a kind of collector of included built-in sensors according to claim 1, it is characterised in that: the communication module packet Usb communication module and wireless communication module are included, the output end of the communication module and the MCU module are electrically connected, so that institute Stating collector can be communicated by the usb communication module or the wireless communication module with exterior terminal, described external whole The system at end is Android, IOS, MAC or Windows.
10. a kind of collector of included built-in sensors according to claim 1, it is characterised in that: the power supply module The collector is powered for internal battery, or the collector is powered by external power supply.
CN201611062074.3A 2016-11-28 2016-11-28 The collector of included built-in sensors Active CN106785700B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109994895B (en) * 2019-04-08 2023-06-20 沈阳仪表科学研究院有限公司 Intelligent cable for in-pipeline detector and processing method thereof
CN111402564A (en) * 2020-04-15 2020-07-10 承德市德盛达科技发展有限公司 Sensor wireless module

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CN105629806A (en) * 2014-10-28 2016-06-01 江苏绿扬电子仪器集团有限公司 Four-path data acquisition system based on single-chip microcomputer
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CN203206483U (en) * 2013-03-11 2013-09-18 江苏苏威尔科技有限公司 Sensor data forwarding device based on Internet of things
CN103860165A (en) * 2014-02-28 2014-06-18 马骁 Lead standard interface for collecting electrocardiogram signal and electrocardiograph monitoring device
CN204154895U (en) * 2014-09-16 2015-02-11 中国电子科技集团公司第三十八研究所 For the date collection system of radar sensing system
CN105629806A (en) * 2014-10-28 2016-06-01 江苏绿扬电子仪器集团有限公司 Four-path data acquisition system based on single-chip microcomputer
CN105872902A (en) * 2016-04-20 2016-08-17 乐视控股(北京)有限公司 Switching device and switching system

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Denomination of invention: Gatherer with self-contained built-in sensor

Effective date of registration: 20190621

Granted publication date: 20190308

Pledgee: Bank of China Limited by Share Ltd Nanjing City South Branch

Pledgor: Jiangsu SWR Science & Technology Co., Ltd.

Registration number: 2019320000284