CN106783672A - A kind of standard film for verifying Overlay board precision, preparation method and verification method - Google Patents
A kind of standard film for verifying Overlay board precision, preparation method and verification method Download PDFInfo
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- CN106783672A CN106783672A CN201611085250.5A CN201611085250A CN106783672A CN 106783672 A CN106783672 A CN 106783672A CN 201611085250 A CN201611085250 A CN 201611085250A CN 106783672 A CN106783672 A CN 106783672A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention relates to a kind of standard film for verifying Over lay board precision, preparation method and verification method, its standard film includes being arranged on a series of while the measurement mark comprising innner and outer layer, the center of the innner and outer layer for measuring mark is corresponding to carry out overlay arrangement according to default series of standards difference in X, Y-coordinate on carrier.The present invention is a kind of for verifying that the standard film of Over lay board precision is identified by a series of measurement of X, Y standard deviations, for rapidly and accurately verifying that board measures precision, and for regular monitoring, the change of the precision that board is measured is monitored in time, pinpoint the problems in time, reduce yield loss.
Description
Technical field
Field is measured the present invention relates to a kind of Overlay boards, and in particular to one kind is for verifying Overlay board precision
Standard film, preparation method and verification method.
Background technology
Overlay boards are alignment overlay measurement board, during semiconductor manufacturing, it will usually to Overlay machines
The measurement of platform is verified that the golden wafer (standard film) of existing QE monitor (quality monitoring) can only ensure
The stability that Overlay boards are measured, repeatability, it is impossible to verify accuracy, such as repeatedly measured to same wafer,
All should be essentially the same between each measuring value, stabilization is just calculated, but the value for measuring is that can not accurately judge, can so be led
Causing the precision of board can not monitor in time after running away, and cause production yield to decline；And tested today mainly by X-SEM (section)
Demonstrate,prove the accuracy of Overlay board measurements, the complicated inconvenience of this verification mode.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of standard film, system for verifying Overlay board precision
Make method and verification method, can easily and fast verify the precision of Overlay boards.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of mark for verifying Overlay board precision
Quasi- piece, including a series of on carrier are arranged on while the measurement mark comprising innner and outer layer, the center of mark is measured described in nexine
It is corresponding with the center that outer layer measures mark to carry out overlay arrangement according to default series of standards in X, Y-coordinate is poor.
The beneficial effects of the invention are as follows：The present invention is a kind of for verifying that the standard film of Overlay board precision is by one
The measurement mark of row X, Y standard deviation (theoretical value), for rapidly and accurately verifying that board measures precision, and for periodically prison
Control, monitors the change of the precision that board is measured in time, pinpoints the problems in time, reduces yield loss.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the mark that measures is with wafer as carrier.
Further, the mark that measures is by light shield exposure imaging to wafer.
Based on a kind of above-mentioned standard film for verifying Overlay board precision, the present invention also provides a kind of for verifying
The preparation method of the standard film of Overlay board precision.
A kind of preparation method for verifying the standard film of Overlay board precision, is used to test to one kind described above
The standard film for demonstrate,proving Overlay board precision is made, and is comprised the following steps,
S1, designs a series of while the measurement mark comprising innner and outer layer；
S2, the center that nexine is measured into mark is corresponding according to default in X, Y-coordinate with the center that outer layer measures mark
Series of standards difference carries out overlay arrangement；
S3, the measurement mark that overlay is arranged is transferred on carrier, forms standard film.
The beneficial effects of the invention are as follows：A kind of making side for verifying the standard film of Overlay board precision of the invention
Method is simple, and the standard film for producing can easily and fast, accurately verify the precision of Overlay boards.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the S3 is specially：
S31, the measurement mark that overlay is arranged is placed on light shield；
S32, photoresistance is coated with wafer and is developed in the case where the light shield for measuring mark is provided with, and forms etching pattern；
S33, performs etching according to etching pattern to wafer, forms standard film.
Beneficial effect using above-mentioned further scheme is：Because the standard deviation (theoretical value) for measuring mark is placed on same
On block light shield, the absolute accuracy of theoretical value is can guarantee that.
Based on a kind of above-mentioned standard film for verifying Overlay board precision, the present invention also provides a kind of checking
The method of Overlay board precision
A kind of method of checking Overlay board precision, is used to verify Overlay boards essence using one kind described above
The standard film of degree verified, comprised the following steps,
Step one, Overlay boards are measured to the center of the measurement mark of innner and outer layer on standard film, are drawn
The measuring value of Overlay boards；
Step 2, by the mark between the center of the measurement mark of innner and outer layer on the measuring value and standard film of Overlay boards
Quasi- difference is contrasted, and verifies the precision of Overlay boards.
The beneficial effects of the invention are as follows：A kind of method of checking Overlay board precision of the present invention is marked by a series of X, Y
The measurement mark of accurate poor (theoretical value), for rapidly and accurately verifying board measurement precision, and for regular monitoring, in time
The change of the precision that monitoring board is measured, pinpoints the problems in time, reduces yield loss.
Brief description of the drawings
Fig. 1 is that a kind of structure of outer layer measurement mark for verifying the standard film of Overlay board precision of the present invention is shown
It is intended to；
Fig. 2 is that a kind of structure of nexine measurement mark for verifying the standard film of Overlay board precision of the present invention is shown
It is intended to；
Fig. 3 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
The first structural representation；
Fig. 4 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
Second structural representation；
Fig. 5 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
The third structural representation；
Fig. 6 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
4th kind of structural representation；
Fig. 7 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
5th kind of structural representation；
Fig. 8 is a kind of flow chart for verifying the preparation method of the standard film of Overlay board precision of the invention；
Fig. 9 is a kind of flow chart of the method for checking Overlay board precision of the present invention.
Specific embodiment
Principle of the invention and feature are described below in conjunction with accompanying drawing, example is served only for explaining the present invention, and
It is non-for limiting the scope of the present invention.
As shown in Figures 1 to 7, a kind of standard film for verifying Overlay board precision, including as shown in Figure 1 set
Put a series of measurement mark (overlay mark) of the outer layers on carrier and be arranged on as shown in Figure 2 a series of on carrier
The measurement of nexine identifies (overlay mark), and the center that the center and outer layer that mark is measured described in nexine measure mark is corresponding
Carry out overlay arrangement according to default series of standards poor (shift) in X, Y-coordinate, for example, standard deviation be followed successively by 0,10,20,
30、40、……100nm。
Fig. 3 is that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark overlay
The first structural representation, the center that mark is measured described in nexine measures the center superposition of mark with outer layer, and standard deviation is 0, then
Referred to as accurate overlay.
Fig. 4 and Fig. 5 are that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark
Second and the third structural representation of overlay, the center and outer layer that mark is measured described in nexine measure to identify deposits in Y-coordinate
In the standard deviation of predeterminable range.
Fig. 6 and Fig. 7 are that a kind of innner and outer layer for verifying the standard film of Overlay board precision of the present invention measures mark
4th and the 5th kind of structural representation of overlay, the center and outer layer that mark is measured described in nexine measure mark and are deposited in X-coordinate
In the standard deviation of predeterminable range.
The mark that measures is with wafer as carrier.The mark that measures is by light shield exposure imaging to wafer.
By taking AIM mark as an example, solid box is identified for the measurement of outer layer；Xout and Yout can be obtained, dotted line frame is internal layer
Measurement mark, Xin and Yin can be obtained.Standard deviation so in X-coordinate (transverse direction) is Xshift=Xout-Xin, Y-coordinate
Standard deviation on (vertical) is Yshift=Yout-Yin.
A kind of standard film for verifying Overlay board precision of the invention is by a series of X, Y standard deviations (theoretical value)
Measurement mark, for rapidly and accurately verifying that board measures precision, and for regular monitoring, board is monitored in time and is measured
Precision change, pinpoint the problems in time, reduce yield loss.
Based on a kind of above-mentioned standard film for verifying Overlay board precision, the present invention also provides a kind of for verifying
The preparation method of the standard film of Overlay board precision.
As shown in figure 8, a kind of preparation method for verifying the standard film of Overlay board precision, to described above
It is a kind of to be comprised the following steps for verifying that the standard film of Overlay board precision is made,
S1, designs a series of while the measurement mark of the overlay comprising innner and outer layer；
S2, the center of the innner and outer layer that measurement is identified is corresponding to be carried out according to default series of standards difference in X, Y-coordinate
Overlay is arranged；
S3, the measurement mark that overlay is arranged is transferred on carrier, forms standard film.
The S3 is specially：
S31, the measurement mark that overlay is arranged is placed on light shield；
S32, photoresistance is coated with wafer and is developed in the case where the light shield for measuring mark is provided with, and forms etching pattern；
S33, performs etching according to etching pattern to wafer, forms standard film.
Because the standard deviation (theoretical value) for measuring mark is placed on same light shield, the absolute accurate of theoretical value is can guarantee that
Property.
The beneficial effects of the invention are as follows：A kind of making side for verifying the standard film of Overlay board precision of the invention
Method is simple, and the standard film for producing can easily and fast, accurately verify the precision of Overlay boards.
Based on a kind of above-mentioned standard film for verifying Overlay board precision, the present invention also provides a kind of checking
The method of Overlay board precision
As shown in figure 9, a kind of method of checking Overlay board precision, is used to verify using one kind described above
The standard film of Overlay board precision verified, comprised the following steps,
Step one, Overlay boards are measured to the center of the measurement mark of innner and outer layer on standard film, are drawn
The measuring value of Overlay boards；
Step 2, by the mark between the center of the measurement mark of innner and outer layer on the measuring value and standard film of Overlay boards
Quasi- difference is contrasted, and verifies the precision of Overlay boards.
Standard between the center that the measuring value of Overlay boards is identified closer to the measurement of innner and outer layer on standard film
Difference (theoretical value), then the accuracy in measurement of Overlay boards is more accurate.
A series of measurement that a kind of method of checking Overlay board precision of the present invention passes through X, Y standard deviations (theoretical value)
Mark, for rapidly and accurately verifying that board measures precision, and for regular monitoring, monitors the accurate of board measurement in time
The change of degree, pinpoints the problems in time, reduces yield loss.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (6)
1. a kind of standard film for verifying Overlay board precision, it is characterised in that:It is a series of on carrier including being arranged on
While the measurement comprising innner and outer layer is identified, the center that the center and outer layer measurement that mark is measured described in nexine identify is corresponding to press
Overlay arrangement is carried out according to default series of standards difference in X, Y-coordinate.
2. a kind of standard film for verifying Overlay board precision according to claim 1, it is characterised in that:It is described
Mark is measured with wafer as carrier.
3. a kind of standard film for verifying Overlay board precision according to claim 2, it is characterised in that:It is described
Mark is measured by light shield exposure imaging to wafer.
4. a kind of preparation method for verifying the standard film of Overlay board precision, it is characterised in that：To the claims
A kind of described in 1 to 3 any one comprises the following steps for verifying that the standard film of Overlay board precision is made,
S1, designs a series of while the measurement mark comprising innner and outer layer；
The center of S2, the center that nexine measurement is identified and outer layer measurement mark is corresponding to be according in X, Y-coordinate default one
Row standard deviation carries out overlay arrangement；
S3, the measurement mark that overlay is arranged is transferred on carrier, forms standard film.
5. a kind of preparation method for verifying the standard film of Overlay board precision according to claim 4, its feature
It is：The S3 is specially：
S31, the measurement mark that overlay is arranged is placed on light shield；
S32, photoresistance is coated with wafer and is developed in the case where the light shield for measuring mark is provided with, and forms etching pattern；
S33, performs etching according to etching pattern to wafer, forms standard film.
6. a kind of method of checking Overlay board precision, it is characterised in that：Using described in any one of the claims 1 to 3
It is a kind of comprised the following steps for verifying that the standard film of Overlay board precision is verified,
Step one, Overlay boards are measured to the center of the measurement mark of innner and outer layer on standard film, draw Overlay machines
The measuring value of platform；
Step 2, by the standard deviation between the center of the measurement mark of innner and outer layer on the measuring value and standard film of Overlay boards
Contrasted, verified the precision of Overlay boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611085250.5A CN106783672A (en) | 2016-11-30 | 2016-11-30 | A kind of standard film for verifying Overlay board precision, preparation method and verification method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611085250.5A CN106783672A (en) | 2016-11-30 | 2016-11-30 | A kind of standard film for verifying Overlay board precision, preparation method and verification method |
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| Publication Number | Publication Date |
|---|---|
| CN106783672A true CN106783672A (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611085250.5A Pending CN106783672A (en) | 2016-11-30 | 2016-11-30 | A kind of standard film for verifying Overlay board precision, preparation method and verification method |
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| CN (1) | CN106783672A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109188331A (en) * | 2018-09-07 | 2019-01-11 | 德淮半导体有限公司 | The method of calibration of test framework calculates equipment and check system |
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| CN101278237A (en) * | 2005-09-30 | 2008-10-01 | 先进微装置公司 | Structure and method for simultaneously determining an overlay accuracy and pattern placement error |
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| CN203720532U (en) * | 2014-01-13 | 2014-07-16 | 中芯国际集成电路制造(北京)有限公司 | Photoetching marking structure |
| US8796048B1 (en) * | 2011-05-11 | 2014-08-05 | Suvolta, Inc. | Monitoring and measurement of thin film layers |
| CN104347443A (en) * | 2013-08-07 | 2015-02-11 | 无锡华润上华科技有限公司 | Testing method for sudden change in horizontal direction of wafer alignment |
| CN104635440A (en) * | 2013-11-14 | 2015-05-20 | 中芯国际集成电路制造(上海)有限公司 | Overlay alignment mark and measurement method thereof |
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2016
- 2016-11-30 CN CN201611085250.5A patent/CN106783672A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1421898A (en) * | 2001-11-30 | 2003-06-04 | 联华电子股份有限公司 | Superposed mark and its usage |
| CN1445819A (en) * | 2002-03-17 | 2003-10-01 | 联华电子股份有限公司 | Folded vernier pattern and measurement method for measuring alignment accuracy rating between overlapped multiple layers |
| CN101278237A (en) * | 2005-09-30 | 2008-10-01 | 先进微装置公司 | Structure and method for simultaneously determining an overlay accuracy and pattern placement error |
| CN201740972U (en) * | 2010-06-30 | 2011-02-09 | 上海集成电路研发中心有限公司 | Measurement structure for measuring registering precision |
| US8796048B1 (en) * | 2011-05-11 | 2014-08-05 | Suvolta, Inc. | Monitoring and measurement of thin film layers |
| CN104347443A (en) * | 2013-08-07 | 2015-02-11 | 无锡华润上华科技有限公司 | Testing method for sudden change in horizontal direction of wafer alignment |
| CN104635440A (en) * | 2013-11-14 | 2015-05-20 | 中芯国际集成电路制造(上海)有限公司 | Overlay alignment mark and measurement method thereof |
| CN203720532U (en) * | 2014-01-13 | 2014-07-16 | 中芯国际集成电路制造(北京)有限公司 | Photoetching marking structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109188331A (en) * | 2018-09-07 | 2019-01-11 | 德淮半导体有限公司 | The method of calibration of test framework calculates equipment and check system |
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Application publication date: 20170531 |
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