CN106738392A - Turn to multi-line cutting method and equipment - Google Patents

Turn to multi-line cutting method and equipment Download PDF

Info

Publication number
CN106738392A
CN106738392A CN201611089672.XA CN201611089672A CN106738392A CN 106738392 A CN106738392 A CN 106738392A CN 201611089672 A CN201611089672 A CN 201611089672A CN 106738392 A CN106738392 A CN 106738392A
Authority
CN
China
Prior art keywords
wire saw
line cutting
line
cut
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611089672.XA
Other languages
Chinese (zh)
Other versions
CN106738392B (en
Inventor
张泽清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jingci Material Technology Co Ltd
Original Assignee
Jingci Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jingci Material Technology Co Ltd filed Critical Jingci Material Technology Co Ltd
Priority to CN201611089672.XA priority Critical patent/CN106738392B/en
Publication of CN106738392A publication Critical patent/CN106738392A/en
Application granted granted Critical
Publication of CN106738392B publication Critical patent/CN106738392B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Multi-line cutting method and equipment are turned to the invention discloses one kind, the equipment is multi-line cutting machine, including square multi-wire saw substrate and workbench, cutting is combined by 2 or 2 above-described multi-line cutting machines, compared with common multi-line cutting method and equipment, fly-cutting is capable of achieving, the time of auxiliary link in the middle of saving, shorten the material cycling time on the whole, and reduce bad, the improve product quality being likely to result in during material cycling.

Description

Turn to multi-line cutting method and equipment
Technical field
The invention belongs to field of machining, more particularly to a kind of steering multi-line cutting method and equipment.
Background technology
At present, multi-line cutting machine has been widely used for optical glass, quartz crystal, semi-conducting material, special cermacis, indigo plant Hard crisp and precious materials the processing such as jewel, rare metal and alloy, compared with traditional inside and outside diameter slicer, because it has Material less investment, surface damage is small, operating cost is low, it is high in machining efficiency the advantages of, at nearly 1 year, also progressively in magnetic material Processing industry is carried out.
The initial blank of magnetic material is generally square, and workpiece is bonded in one by using 502 glue or other bonding agents Rise be processed, need to carry out removing glue oil removing to workpiece in pyrosol after machining, therefore, magnetic material it is processed Journey is generally:1 → removing glue of section oil removing 1 → grinding, 1 → section, 2 → removing glue oil removing 2 → grinding, 2 → section, 3 → removing glue oil removing 3 → Grinding 3.The time that removing glue oil removal process needs is more long, and this results in the increase of material cycling time, meanwhile, because of magnetic material, Especially NdFeB magnetic materials, with hard crisp physical characteristic, repeatedly flow between section, grinding, three operations of removing glue oil removing Turn, cause to collapse, the probability of the bad order such as broken is greatly increased.
Therefore, needing offer one kind badly can both shorten the material cycling time, avoid material repeatedly to circulate so as to improve product again The method of quality.
The content of the invention
It is an object of the invention to solve at least the above, and provide the advantage that at least will be described later.
Multi-line cutting method is turned to the invention provides one kind, it is comprised the following steps:
Step one provides a square multi-wire saw substrate, and bonding one is buffered on the square multi-wire saw substrate Material plate;
The obtained square multi-wire saw substrate for being bonded with buffering material plate of step one is carried out first laterally by step 2 Being rotated by 90 ° after multi-wire saw carries out first longitudinal direction multi-wire saw, and the described first horizontal multi-wire saw depth, the first longitudinal direction are more Thickness of the wire cutting depth no more than the buffering material plate;
Step 3 is bonded with buffering material plate by what the workpiece to be processed was bonded in that step 2 obtains by cutting On square multi-wire saw substrate, and be rotated by 90 ° after the second horizontal multi-wire saw carrying out second longitudinal direction multi-wire saw, wherein Described second horizontal multi-wire saw uses the first multi-line cutting machine with the described first horizontal multi-wire saw, and the second longitudinal direction is more Wire cutting uses the second multi-line cutting machine with the first longitudinal direction multi-wire saw.
Preferably, in described steering multi-line cutting method, between the line of cut of first multi-line cutting machine away from From the one of editing objective size equal to the workpiece to be processed;Between the line of cut of second multi-line cutting machine away from From the other in which editing objective size equal to the workpiece to be processed.
Preferably, in described steering multi-line cutting method, by one of editing objective size and another processing Being bonded with by cutting that the cut surface to be diverted of the workpiece to be processed where target size is obtained with the step 2 Buffer the square multi-wire saw substrate bonding of material plate.
Preferably, in described steering multi-line cutting method, in the step 3, the workpiece to be processed is in step 2 What is obtained is bonded with rectangular array distribution on the square multi-wire saw substrate of buffering material plate by cutting.
Preferably, in described steering multi-line cutting method, the thickness of the workpiece to be processed is 2mm-20mm.
Preferably, in described steering multi-line cutting method, the described first horizontal multi-wire saw, second transverse direction are more Wire cutting, the first longitudinal direction multi-wire saw, the cutting speed of the second longitudinal direction multi-wire saw are 10mm/h-50mm/h.
Preferably, described steering multi-line cutting method also includes step 4, the preliminary working workpiece that step 3 is obtained Be bonded on a multi-wire saw substrate after removing glue oil removing carrying out multi-wire saw again, secondary removing glue is carried out afterwards and is removed Oil obtains finished product.
Preferably, in described steering multi-line cutting method, the workpiece to be processed is neodymium iron boron magnetic body, monocrystalline silicon One kind in rod, monocrystal silicon, polycrystalline silicon rod, polycrystal silicon ingot.
Preferably, in described steering multi-line cutting method,
The obtained square multi-wire saw substrate for being bonded with buffering material plate of step one is placed in the step 2 The operating position of the first multi-line cutting machine be placed on transmission device after the first horizontal multi-wire saw making it be rotated by 90 ° and turn The operating position for being transported to the second multi-line cutting machine carries out first longitudinal direction multi-wire saw;
The square multi-wire saw substrate that workpiece to be processed will be bonded with the step 3 obtained in step 3 is placed on The operating position of the first multi-line cutting machine be placed on transmission device after the second horizontal multi-wire saw making it be rotated by 90 ° and turn The operating position for being transported to the second multi-line cutting machine carries out second longitudinal direction multi-wire saw;
The transmission device includes two conveyer belts being arranged in a mutually vertical manner, and is separately positioned on two heads of conveyer belt The square multi-wire saw substrate is placed on institute by the grasping mechanism at end, the grasping mechanism from after the crawl of the first multi-line cutting machine State on conveyer belt, when the head end of another conveyer belt is sent to, another grasping mechanism is captured to the second multi-line cutting machine.
The present invention also provides a kind of steering multi-wire saw equipment, and it includes at least one multi-line cutting machine, the multi-wire cutting Cutting mill includes:
It is wrapped in the parallel cut on sheave;
Workbench below the line of cut, its be used to fixing the square multi-wire saw substrate and drive its to Upper motion carries out multi-wire saw;
Leakage box above the parallel cut, it is multi-thread more than the square that its bottom is provided with multiple length The leakage seam of cutting substrate;
Leakage pipe above the leakage box, it is used to spray leakage, and the leakage is stitched by the leakage and flowed to On the parallel cut.
Preferably, in described steering multi-wire saw equipment, a diameter of 0.1mm-0.3mm of the parallel cut, The leakage pipe is 2-3 roots;
The parallel cut is steel wire, and the leakage is suspension mortar;Or the parallel cut is coated with for surface The steel wire of diamond particles, the leakage is coolant.
Beneficial effects of the present invention:
The multi-line cutting method and multi-line cutting machine of the steering combination cutting that the present invention is provided, using square workbench and Working plate, square workpiece is bonded on working plate, first processes the length direction of square workpiece, after the completion of length direction cutting, Directly square working plate is turned to, the width of square workpiece is reprocessed, so, so that it may save in conventional cutting method The removing glue oil removal process after length direction has been cut, the material cycling time saved during these, and reduce at these During the bad probability that is caused to material, so as to realize shortening material cycling time, improve product quality.
Further advantage of the invention, target and feature embody part by following explanation, and part will also be by this The research and practice of invention and be understood by the person skilled in the art.
Brief description of the drawings
Workpiece to be processed, buffering material plate in the steering multi-line cutting method that Fig. 1 is provided for the present invention, square are multi-thread Position relationship schematic diagram between cutting substrate and workbench;
The multi-line cutting machine schematic diagram turned in multi-line cutting method that Fig. 2 is provided for the present invention;
Workpiece to be processed is multi-thread in square in the one embodiment for the steering multi-line cutting method that Fig. 3 is provided for the present invention Schematic diagram on cutting substrate;
Workpiece to be processed is more in square in another embodiment for the steering multi-line cutting method that Fig. 4 is provided for the present invention Schematic diagram on wire cutting substrate.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings, to make those skilled in the art with reference to specification text Word can be implemented according to this.
It should be appreciated that it is used herein such as " have ", "comprising" and " including " term do not allot one or many The presence or addition of individual other elements or its combination.
As shown in figure 1, the present invention provides a kind of steering multi-line cutting method, it is parallel using many be wound on sheave Cutting wire cutting workpiece to be processed 1, workpiece to be processed 1 is located at line of cut lower section.The workpiece to be processed 1 is adhered to buffering On material plate 2, it is to avoid line of cut switches to square multi-wire saw substrate 3 so that multi-wire saw substrate 3 is reusable.It is described Buffering material plate 2 is adhered on square multi-wire saw substrate 3, and the square multi-wire saw substrate 3 is positioned over workbench 4 On.
Above-mentioned steering multi-line cutting method, the workpiece is NdFeB magnet pieces or silicon single crystal rod (ingot), polycrystalline silicon rod (ingot).
Above-mentioned steering multi-line cutting method, workpiece rectangular array arrangement, the cutting thickness of the workpiece for 2mm~ 20mm。
Above-mentioned steering multi-line cutting method, the buffering material plate is glass or asbestos board etc., and size is suitable with working plate.
Above-mentioned steering multi-line cutting method, the multi-wire saw substrate shape for square, material be metal, plastics or its His material.
Above-mentioned steering multi-line cutting method, the cutting speed in cutting process keeps constant, and the cutting speed scope exists 10mm/h~50mm/h.
Above-mentioned steering multi-line cutting method is, it is necessary to 1 or more than 1 multi-line cutting machine combination realization cutting.
What is used in the multi-line cutting method that cutting is combined another object of the present invention is to provide a kind of above-mentioned steering is more Wire cutting machine.
The technical scheme that the present invention is provided is as follows:
As shown in Fig. 2 the multi-line cutting machine, including:The parallel cut 6 on sheave 5 is wound in, positioned at the line of cut The workbench of lower section, the leakage box 7 above the line of cut, the leakage pipe 8 above the leakage box.
Above-mentioned multi-line cutting machine, the sheave quantity is 3, and each sheave surface is polyurethane coating, the polyurethane Multiple slot pitches are outputed on coating uniformly for the V-groove of line of cut motion.
Above-mentioned multi-line cutting machine, the steel wire that the line of cut is coated with diamond particles for steel wire or surface is (hereinafter referred to as golden Firm line), a diameter of 0.1mm~0.3mm.
Above-mentioned multi-line cutting machine, the leakage pipe quantity 2~3, the leakage pipe can spray suspension mortar, coordinate steel wire Use, or spraying cooling liquid, coordinate diamond wire to use.
There are multiple length in above-mentioned multi-line cutting machine, the leakage cassette bottom portion more than the gap 9 of the working plate width, makes institute Flow on line of cut with stating mortar or coolant continuous uniform.
Above-mentioned multi-line cutting machine, the workbench need to agree with square multi-wire saw substrate, and move from bottom to top.
Embodiment 1
Multi-line cutting machine includes three sheaves, and several lines of cut arranged in parallel are wound on sheave, positioned at line of cut lower section Workbench, the leakage pipe above line of cut.
Wherein, the surface of each sheave is coated with polyurethane coating, and the uniform V of multiple slot pitches is outputed on polyurethane coating Type groove.The drive devices such as another guide wheel, swing rod, take-up pulley, actinobacillus wheel equipped with for line of cut motion.
Workbench is driven by screw mandrel and servomechanism installation, can from bottom to top be moved by the speed of setting.
Drawing liquid pump provides power, mortar or coolant is sprayed from leakage pipe, in flowing to leakage box, then by leakage box Gap is flowed uniformly on line of cut.
Dimensional units as described below are mm, and multi-wire saw substrate size is 260*260*15, the size of square workpiece a with As a example by 46*43*38, correspondingly-sized is 22*10*5 after cutting, and the present invention realizes that the multi-line cutting method for turning to combination cutting is specific Implement as follows:1st, buffering material plate is bonded on multi-wire saw substrate, the use of cutting thickness is respectively the two of 22mm and 10mm Platform multi-line cutting machine, the cut channel that depth is 1~2mm is cut out on buffering material plate;2nd, square workpiece a is glued according to Fig. 3 modes It is connected on buffering material plate;3rd, by bonding workpiece, it is placed on the multi-wire saw working bench that cutting thickness is 22mm;4、 Cutting parameter is set, including when cutting-height, linear velocity, the new line amount of feeding, the workbench rate of climb, cutting line tension, extinguishing arc Between etc.;5th, start multi-line cutting machine, workbench is moved upwards, until cutting is completed;6th, the workpiece for having cut 22 directions is taken out And multi-wire saw substrate entirety, multi-wire saw substrate is turned to, unnecessary part before and after removing, such as Fig. 2 is placed on cutting thickness On the multi-wire saw working bench of 10mm, to be cut according to step 4,5, until cutting is completed;7th, above-mentioned cutting is completed Workpiece take out, carry out removing glue oil removing, grinding;8th, it is the above-mentioned workpiece of 22*10*38 by size, it is 5mm's to be placed on cutting thickness On multi-wire saw working bench, 5 are cut into by 38, then removing glue oil removing, grinding.
Above example 1 completes three cuttings of direction size, it is necessary to three multi-line cutting machines.Above example 1 can be with Any two of which direction size is first cut, then cuts last direction size.
Following table is that 15 block sizes are 46*43*38 squares work piece cut into 840 pieces of each operations of 22*10*5 by embodiment 1 Process time contrasts, it is known that embodiment 1 can time-consuming about 24%:
Embodiment 2
Embodiment 2 is essentially identical with the multi-line cutting method and multi-line cutting machine of embodiment 1, its difference such as Fig. 4 institutes Show, the square two of which direction size after cutting is identical, as a example by the size 46*46*38 of square workpiece b, correspondence chi after cutting Very little is 22*22*5, first cuts 22 and 22 direction sizes, then cut 5 direction sizes.
Above example 2 completes three cuttings of direction size, it is only necessary to two multi-line cutting machines.
Following table is that 9 block sizes are 46*46*38 squares work piece cut into 252 pieces of each operations of 22*22*5 by embodiment 2 Process time contrasts, it is known that embodiment 2 can time-consuming about 24%:
Embodiment 3
Embodiment 3 is essentially identical with the multi-line cutting method and multi-line cutting machine of embodiment 1, and its difference is:Side One of direction size of block workpiece need not cut, and by taking 46*43*15 as an example, correspondingly-sized is 22*10*15 after cutting, only Need to cut 22 and 10 direction sizes.
Above example 3 completes the cutting of both direction size, it is only necessary to two multi-line cutting machines.
Following table is that 15 block sizes are 46*43*15 squares work piece cut into 120 pieces of each operations of 22*10*15 by embodiment 3 Process time contrast, it is known that embodiment 3 can time-consuming about 33%:
Embodiment 4
Embodiment 4 is essentially identical with the multi-line cutting method and multi-line cutting machine of embodiment 2, and its difference is:Side One of direction size of block workpiece need not cut, and by taking 46*46*15 as an example, correspondingly-sized is 22*22*15 after cutting, only Need to cut 22 and 22 direction sizes.
Above example 4 completes the cutting of both direction size, it is only necessary to a multi-line cutting machine.
Following table is that 9 block sizes are 46*46*15 squares work piece cut into 36 pieces of each operations of 22*22*15 by embodiment 4 Process time contrasts, it is known that embodiment 4 can time-consuming about 33%:
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and implementation method With, it can be applied to various suitable the field of the invention completely, for those skilled in the art, can be easily Other modification is realized, therefore under the universal limited without departing substantially from claim and equivalency range, the present invention is not limited In specific details and shown here as the legend with description.

Claims (10)

1. multi-line cutting method is turned to, it is characterised in that comprised the following steps:
Step one provides a square multi-wire saw substrate, and bonding one buffers material on the square multi-wire saw substrate Plate;
It is laterally multi-thread that the obtained square multi-wire saw substrate for being bonded with buffering material plate of step one is carried out first by step 2 Being rotated by 90 ° after cutting carries out first longitudinal direction multi-wire saw, the described first horizontal multi-wire saw depth, the first longitudinal direction multi-wire cutting Cut thickness of the depth no more than the buffering material plate;
The workpiece to be processed is bonded in the pros for being bonded with buffering material plate by cutting that step 2 is obtained by step 3 On shape multi-wire saw substrate, and be rotated by 90 ° after the second horizontal multi-wire saw carrying out second longitudinal direction multi-wire saw, wherein described Second horizontal multi-wire saw uses the first multi-line cutting machine, the second longitudinal direction multi-wire cutting with the described first horizontal multi-wire saw Cut and use the second multi-line cutting machine with the first longitudinal direction multi-wire saw.
2. it is as claimed in claim 1 to turn to multi-line cutting method, it is characterised in that the line of cut of first multi-line cutting machine The distance between equal to the workpiece to be processed one of editing objective size;The line of cut of second multi-line cutting machine The distance between equal to the workpiece to be processed other in which editing objective size.
3. it is as claimed in claim 2 to turn to multi-line cutting method, it is characterised in that by one of editing objective size and separately The process cutting that the cut surface to be diverted of the workpiece to be processed where one editing objective size is obtained with the step 2 Be bonded with buffering material plate square multi-wire saw substrate bonding.
4. multi-line cutting method is turned to as claimed in claim 2 or claim 3, it is characterised in that described to be processed in the step 3 Workpiece is bonded with rectangular array on the square multi-wire saw substrate of buffering material plate what step 2 was obtained by cutting Distribution.
5. it is as claimed in claim 4 to turn to multi-line cutting method, it is characterised in that the thickness of the workpiece to be processed is 2mm- 20mm。
6. it is as claimed in claim 5 to turn to multi-line cutting method, it is characterised in that the described first horizontal multi-wire saw, described Second horizontal multi-wire saw, the first longitudinal direction multi-wire saw, the cutting speed of the second longitudinal direction multi-wire saw are 10mm/h- 50mm/h。
7. it is as claimed in claim 6 to turn to multi-line cutting method, it is characterised in that also including step 4, step 3 to be obtained Preliminary working workpiece be bonded on a multi-wire saw substrate after removing glue oil removing carrying out multi-wire saw again, it is laggard The secondary removing glue oil removing of row obtains finished product.
8. it is as claimed in claim 7 to turn to multi-line cutting method, it is characterised in that the workpiece to be processed is neodymium-iron-boron One kind in body, silicon single crystal rod, monocrystal silicon, polycrystalline silicon rod, polycrystal silicon ingot.
It is 9. as claimed in claim 8 to turn to multi-line cutting method, it is characterised in that
The obtained square multi-wire saw substrate for being bonded with buffering material plate of step one is placed on first in the step 2 The operating position of multi-line cutting machine be placed on transmission device after the first horizontal multi-wire saw making it be rotated by 90 ° and be transported to The operating position of the second multi-line cutting machine carries out first longitudinal direction multi-wire saw;
The square multi-wire saw substrate that workpiece to be processed will be bonded with the step 3 obtained in step 3 is placed on first The operating position of multi-line cutting machine be placed on transmission device after the second horizontal multi-wire saw making it be rotated by 90 ° and be transported to The operating position of the second multi-line cutting machine carries out second longitudinal direction multi-wire saw;
The transmission device includes two conveyer belts being arranged in a mutually vertical manner, and is separately positioned on two head ends of conveyer belt The square multi-wire saw substrate is placed on the biography by grasping mechanism, the grasping mechanism from after the crawl of the first multi-line cutting machine Send and take, when the head end of another conveyer belt is sent to, another grasping mechanism is captured to the second multi-line cutting machine.
10. multi-wire saw equipment is turned to, it is characterised in that
Including at least one multi-line cutting machine, the multi-line cutting machine includes:
It is wrapped in the parallel cut on sheave;
Workbench below the line of cut, it is used to fix the square multi-wire saw substrate and drives its upward fortune It is dynamic to carry out multi-wire saw;
Leakage box above the parallel cut, its bottom is provided with multiple length more than the square multi-wire saw The leakage seam of substrate;
Leakage pipe above the leakage box, it is used to spray leakage, and the leakage is flowed to described by leakage seam On parallel cut;
Wherein, a diameter of 0.1mm-0.3mm of the parallel cut, the leakage pipe is 2-3 roots;
The parallel cut is steel wire, and the leakage is suspension mortar;Or the parallel cut is coated with Buddha's warrior attendant for surface The steel wire of stone particle, the leakage is coolant.
CN201611089672.XA 2016-12-01 2016-12-01 Turn to multi-line cutting method and equipment Active CN106738392B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611089672.XA CN106738392B (en) 2016-12-01 2016-12-01 Turn to multi-line cutting method and equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611089672.XA CN106738392B (en) 2016-12-01 2016-12-01 Turn to multi-line cutting method and equipment

Publications (2)

Publication Number Publication Date
CN106738392A true CN106738392A (en) 2017-05-31
CN106738392B CN106738392B (en) 2019-02-19

Family

ID=58914290

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611089672.XA Active CN106738392B (en) 2016-12-01 2016-12-01 Turn to multi-line cutting method and equipment

Country Status (1)

Country Link
CN (1) CN106738392B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108098550A (en) * 2017-12-18 2018-06-01 沈阳中北真空技术有限公司 A kind of cutting method of diamond wire saw process equipment and neodymium iron boron magnetic body
CN108335817A (en) * 2018-03-30 2018-07-27 廊坊京磁精密材料有限公司 The processing method of sintered NdFeB
CN109176929A (en) * 2018-09-14 2019-01-11 中国航空工业集团公司北京长城航空测控技术研究所 A method of segmentation chip being miniaturized using diamond wire saw machine
CN113698083A (en) * 2021-09-26 2021-11-26 浙江美迪凯光学半导体有限公司 Thick glass accurate positioning cutting process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
CN102126261A (en) * 2010-06-10 2011-07-20 常州天合光能有限公司 Wire saw with cutting function
CN104908165B (en) * 2014-03-11 2017-06-20 晶科能源有限公司 A kind of line cuts open machine and its mortar pad
CN204019765U (en) * 2014-07-22 2014-12-17 上海日进机床有限公司 Multi-wire saw equipment
CN105150397B (en) * 2015-10-27 2017-06-06 天津英利新能源有限公司 It is a kind of to reduce glass and technique for sticking that silico briquette cuts chipping

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108098550A (en) * 2017-12-18 2018-06-01 沈阳中北真空技术有限公司 A kind of cutting method of diamond wire saw process equipment and neodymium iron boron magnetic body
CN108098550B (en) * 2017-12-18 2020-06-23 沈阳中北真空技术有限公司 Diamond wire cutting machining equipment and cutting method of neodymium iron boron magnet
CN108335817A (en) * 2018-03-30 2018-07-27 廊坊京磁精密材料有限公司 The processing method of sintered NdFeB
CN109176929A (en) * 2018-09-14 2019-01-11 中国航空工业集团公司北京长城航空测控技术研究所 A method of segmentation chip being miniaturized using diamond wire saw machine
CN109176929B (en) * 2018-09-14 2020-08-07 中国航空工业集团公司北京长城航空测控技术研究所 Method for micro-dividing wafer by using diamond wire cutting machine
CN113698083A (en) * 2021-09-26 2021-11-26 浙江美迪凯光学半导体有限公司 Thick glass accurate positioning cutting process

Also Published As

Publication number Publication date
CN106738392B (en) 2019-02-19

Similar Documents

Publication Publication Date Title
CN106738392A (en) Turn to multi-line cutting method and equipment
TWI413558B (en) Cutting method and wire saw using wire saw
TWI541103B (en) Edge finishing apparatus
JP2007237628A (en) Cutting method of single crystal sapphire substrate and cutting device therefor
CN103659477A (en) Belt sander
TW201240757A (en) Method for cutting workpiece with wire saw
WO2012139498A1 (en) Three roller multi-wire saw
WO2013094117A1 (en) Method for cutting work piece
CN104842251B (en) Numerical control wire grinding and cutting machining center
WO2018173693A1 (en) Ingot cutting method
CN107081648A (en) Rectangular magnetic chamfering work piece device
CN102990792A (en) Eight-inch single crystal silicon wafer multi-wire sawing machine and sawing method thereof
CN108202420B (en) Save the multi-line cutting method of material
CN113226640B (en) Method for cutting workpiece and wire saw
CN204076541U (en) A kind of polysilicon block cutting equipment
CN112548780A (en) Slotting device for milling cutter production
KR20160088865A (en) Workpiece cutting method
CN104741978B (en) Polishing method of polishing device capable of freely adjusting polishing pressure
JP2003159642A (en) Work cutting method and multi-wire saw system
US5799644A (en) Semiconductor single crystal ingot cutting jig
CN110026743A (en) A kind of aluminum pipe milling process
CN105252660B (en) Silicon wafer cutting treatment method
KR101697635B1 (en) Processing device of stone
JP2004291157A (en) Surface grinding apparatus and machining method using the same
CN106426587A (en) Adjustable non-metallic inorganic capillary center hole rounded hole grinding machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant