CN106736588A - A kind of topping machanism for Mo wafer - Google Patents
A kind of topping machanism for Mo wafer Download PDFInfo
- Publication number
- CN106736588A CN106736588A CN201710031929.4A CN201710031929A CN106736588A CN 106736588 A CN106736588 A CN 106736588A CN 201710031929 A CN201710031929 A CN 201710031929A CN 106736588 A CN106736588 A CN 106736588A
- Authority
- CN
- China
- Prior art keywords
- grinding disc
- bar
- wafer
- bite
- expansion link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of topping machanism for Mo wafer, including fixed plate, baffle plate, fixing groove, grinding disc, under casing, start button, control button, control panel, tuning bar, mobile bar, nut bore, fixed block, runner, motion bar, bite, expansion link and motor.The beneficial effects of the invention are as follows：Baffle plate is set by the fixed plate both sides of device so that device can effectively prevent Mo wafer chip from sputtering when Mo wafer is cut.By installing several grinding disc inside device, so that Mo wafer can continue to be polished using grinding disc after the completion of cutting, make the Mo wafer surface after processing smooth, and grinding disc both sides installation activity bar, cutter are installed between motion bar so that motion bar can drive bite to adjust cutting direction, bite is arranged on inside expansion link, so that bite can be collapsed into inside expansion link when not in use, and it is polished piece and blocks so that device is safer when in use.
Description
Technical field
The present invention relates to a kind of topping machanism, specially a kind of topping machanism for Mo wafer belongs to industrial processes and sets
Standby field.
Background technology
Molybdenum is a kind of metallic element, and molybdenum has resistant to elevated temperatures characteristic, adds molybdenum element to improve metal in steel alloy
Elastic limit, corrosion resistance and keep permanent magnetism etc., therefore, be mainly used in steel and iron industry, major part therein
It is, to be directly used in steel-making or cast iron after industrial molybdenum oxide briquetting, and to be smelted into after molybdenum-iron, molybdenum foil and be used further to steel-making, few portion
Divide the production for being also employed for semiconductor power electronic device.Wherein, the encapsulation of super high power IGCT, using pressure eliminant work
Skill, high voltage, the chip of big current semiconductor device support the use alloy Mo wafer, and the technology connect using total head, envelope
In ceramic cartridge.Therefore using preceding needing to carry out a series of working process to Mo wafer, including to Mo wafer
Machining.
But, the existing device for Mo wafer machining still suffers from certain defect when in use, and device is used
Security performance is not high, there is chip sputtering during cutting, and bite fails to deposit when not using, and there is certain danger, and
And due to after the completion of cutting otch it is unsmooth, in addition it is also necessary to equipment in addition carries out grinding process, more wastes time and energy.Therefore, pin
A kind of topping machanism for Mo wafer is proposed to above mentioned problem.
The content of the invention
The purpose of the present invention is that and provide a kind of topping machanism for Mo wafer in order to solve the above problems.
The present invention is achieved through the following technical solutions above-mentioned purpose, a kind of topping machanism for Mo wafer, including bottom
Case, the under casing side sets control panel, and the control panel side sets start button, and the start button lower section sets
Several control buttons are put, motor is installed in the under casing bottom, and several grinding disc, the polishing are installed under casing inside
It is fixedly connected by runner between piece, the grinding disc both sides set tuning bar, described tuning bar one end connects motion bar, and institute
State and install between motion bar expansion link, bite is installed in the expansion link inside, the tuning bar side sets mobile bar, and institute
State mobile bar and fixed plate is fixedly connected by fixed block, fixing groove is set in the fixed plate.
Preferably, in order that Mo wafer in the fixed plate chip in cutting cannot be sputtered away, using more pacifying
Entirely, the fixed plate both sides are respectively mounted baffle plate.
Preferably, in order that connection more stable between the fixed plate and the fixed block, the fixed block and institute
State and be fixedly connected by nut bore between fixed plate.
Preferably, in order that there are enough power sources during plant running, the motor and the control panel, described cut
Sharpener, the expansion link, the grinding disc, the tuning bar, the mobile bar, the runner are electrically connected.
Preferably, in order that the bite can be by the movement of tuning bar as Mo wafer is moved so as to change together
Cut direction, the bite is movably connected by the expansion link with the grinding disc.
Preferably, in order that the fixed plate can by the stretching of the mobile bar, wave the mobile Mo wafer position of regulation
Put, convenient cutting, polishing, the fixed plate are movably connected by the mobile bar with the grinding disc.
The beneficial effects of the invention are as follows：Baffle plate is set by the fixed plate both sides of device so that device is in cutting molybdenum circle
Can effectively prevent Mo wafer chip from sputtering during piece.By installing several grinding disc inside device so that Mo wafer is being cut
Can continue to be polished using grinding disc after the completion of cutting, make the Mo wafer surface after processing smooth, and grinding disc both sides are installed and are lived
Lever, cutter are installed between motion bar so that motion bar can drive bite to adjust cutting direction, and bite is arranged on
Inside expansion link so that bite can be collapsed into inside expansion link when not in use, and it is polished piece and blocks so that device exists
It is safer when using.Device has the characteristics of security performance performance is higher, and practicality is stronger.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present invention.
Fig. 2 is internal structure schematic diagram of the present invention.
Fig. 3 is grinding disc structural representation of the present invention.
In figure：1st, fixed plate, 2, baffle plate, 3, fixing groove, 4, grinding disc, 5, under casing, 6, start button, 7, control button,
8th, control panel, 9, tuning bar, 10, mobile bar, 11, nut bore, 12, fixed block, 13, runner, 14, motion bar, 15, cutting
Knife, 16, expansion link, 17, motor.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Refer to shown in Fig. 1-3, a kind of topping machanism for Mo wafer, including under casing 5, the side of under casing 5 sets control
Panel 8, and the side of control panel 8 sets start button 6, the lower section of start button 6 sets several control buttons 7, the bottom of under casing 5
Motor 17 is installed, and several grinding disc 4 are installed in the inside of under casing 5, are fixedly connected by runner 13 between grinding disc 4, grinding disc 4
Both sides set tuning bar 9, and the one end of tuning bar 9 connects installs expansion link 16 between motion bar 14, and motion bar 14, in expansion link 16
Bite 15 is installed in portion, and the side of tuning bar 9 sets mobile bar 10, and mobile bar 10 is fixedly connected fixed plate 1 by fixed block 12,
Fixing groove 3 is set in fixed plate 1.
Used as a kind of technical optimization scheme of the invention, the both sides of fixed plate 1 are respectively mounted baffle plate 2.
Fixed by nut bore 11 as a kind of technical optimization scheme of the invention, between fixed block 12 and fixed plate 1 and connected
Connect.
As a kind of technical optimization scheme of the invention, motor 17 and control panel 8, bite 15, expansion link 16, polishing
Piece 4, tuning bar 9, mobile bar 10, runner 13 are electrically connected.
Used as a kind of technical optimization scheme of the invention, bite 15 is movably connected by expansion link 16 with grinding disc 4.
Used as a kind of technical optimization scheme of the invention, fixed plate 1 is movably connected by mobile bar 10 with grinding disc 4.
The present invention when in use, first, device is fixedly mounted, then Mo wafer is fixedly mounted on inside fixing groove 3, and
Fixed plate 1 is fixedly connected with mobile bar 10, secondly, by the starter of start button 6, expansion link 16 is flexible to take bite out of
15, runner 13 drives grinding disc 4 to rotate, so that drive bite 15 to cut Mo wafer, and mobile bar 10 can be by flexible pendulum
Dynamic regulation cutting direction, finally, mobile bar 10 is shunk after the completion of cutting so that Mo wafer is contacted with grinding disc 4, using polishing
The rotation of piece 4, grinding process is carried out to otch, and after the completion for the treatment of, expansion link 16 shrinks and withdraws bite 15, now, passes through
The shutoff device of start button 6.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires to be limited rather than described above, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as the claim involved by limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined
May be appreciated other embodiment.
Claims (6)
1. a kind of topping machanism for Mo wafer, including under casing（5）, it is characterised in that：The under casing（5）Side sets control
Panel（8）, and the control panel（8）Side sets start button（6）, the start button（6）Lower section sets several controls
Button processed（7）, the under casing（5）Bottom is installed by motor（17）, and the under casing（5）Inside is installed by several grinding disc（4）, institute
State grinding disc（4）Between pass through runner（13）It is fixedly connected, the grinding disc（4）Both sides set tuning bar（9）, the tuning bar
（9）One end connects motion bar（14）, and the motion bar（14）Between expansion link is installed（16）, the expansion link（16）Inside peace
Dress bite（15）, the tuning bar（9）Side sets mobile bar（10）, and the mobile bar（10）By fixed block（12）Gu
Surely be connected plate（1）, the fixed plate（1）Upper setting fixing groove（3）.
2. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The fixed plate（1）Two
Side is respectively mounted baffle plate（2）.
3. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The fixed block（12）With
The fixed plate（1）Between pass through nut bore（11）It is fixedly connected.
4. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The motor（17）With institute
State control panel（8）, the bite（15）, the expansion link（16）, the grinding disc（4）, the tuning bar（9）, it is described
Mobile bar（10）, the runner（13）Electrically connect.
5. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The bite（15）It is logical
Cross the expansion link（16）With the grinding disc（4）It is movably connected.
6. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The fixed plate（1）It is logical
Cross the mobile bar（10）With the grinding disc（4）It is movably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031929.4A CN106736588A (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031929.4A CN106736588A (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106736588A true CN106736588A (en) | 2017-05-31 |
Family
ID=58947123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710031929.4A Pending CN106736588A (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106736588A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234290A (en) * | 2017-06-14 | 2017-10-10 | 无锡贺邦汽车配件有限公司 | A kind of automobile board topping machanism |
| CN107620473A (en) * | 2017-10-25 | 2018-01-23 | 浙江坤鸿新材料有限公司 | One kind pretreatment floor installation equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100242247A1 (en) * | 2009-03-31 | 2010-09-30 | Ge-Hitachi Nuclear Energy Americas Llc | Telescoping tool assembly and method for refurbishing welds of a core shroud of a nuclear reactor vessel |
| CN105690097A (en) * | 2016-03-21 | 2016-06-22 | 株洲坦谱科技有限公司 | Automatic cutting and grinding all-in-one machine |
| CN105945576A (en) * | 2016-06-30 | 2016-09-21 | 青岛艾特尔机械电子科技有限公司 | Portable multi-purpose metalworking machine |
| CN205765538U (en) * | 2016-06-29 | 2016-12-07 | 衡阳市中科光电子有限公司 | A kind of convenience is to the corner pressure grinding machine of abrasive sheet water filling |
| CN206415886U (en) * | 2017-01-17 | 2017-08-18 | 宜兴市科兴合金材料有限公司 | A kind of topping machanism for Mo wafer |
-
2017
- 2017-01-17 CN CN201710031929.4A patent/CN106736588A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100242247A1 (en) * | 2009-03-31 | 2010-09-30 | Ge-Hitachi Nuclear Energy Americas Llc | Telescoping tool assembly and method for refurbishing welds of a core shroud of a nuclear reactor vessel |
| CN105690097A (en) * | 2016-03-21 | 2016-06-22 | 株洲坦谱科技有限公司 | Automatic cutting and grinding all-in-one machine |
| CN205765538U (en) * | 2016-06-29 | 2016-12-07 | 衡阳市中科光电子有限公司 | A kind of convenience is to the corner pressure grinding machine of abrasive sheet water filling |
| CN105945576A (en) * | 2016-06-30 | 2016-09-21 | 青岛艾特尔机械电子科技有限公司 | Portable multi-purpose metalworking machine |
| CN206415886U (en) * | 2017-01-17 | 2017-08-18 | 宜兴市科兴合金材料有限公司 | A kind of topping machanism for Mo wafer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234290A (en) * | 2017-06-14 | 2017-10-10 | 无锡贺邦汽车配件有限公司 | A kind of automobile board topping machanism |
| CN107234290B (en) * | 2017-06-14 | 2019-03-22 | 无锡贺邦汽车配件有限公司 | A kind of automobile board cutting apparatus |
| CN107620473A (en) * | 2017-10-25 | 2018-01-23 | 浙江坤鸿新材料有限公司 | One kind pretreatment floor installation equipment |
| CN107620473B (en) * | 2017-10-25 | 2023-05-09 | 蒋康艳 | Pretreatment floor mounting equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |