CN106711313B - A kind of packaging method of flourescent sheet and a kind of LED packaging - Google Patents
A kind of packaging method of flourescent sheet and a kind of LED packaging Download PDFInfo
- Publication number
- CN106711313B CN106711313B CN201611245949.3A CN201611245949A CN106711313B CN 106711313 B CN106711313 B CN 106711313B CN 201611245949 A CN201611245949 A CN 201611245949A CN 106711313 B CN106711313 B CN 106711313B
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- China
- Prior art keywords
- flourescent sheet
- led chip
- packaging method
- substrate
- led
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a kind of packaging method of flourescent sheet and a kind of LED packagings, packaging method is to utilize voltage generation electrostatic force by flourescent sheet together with the substrate of LED chip without medium direct secure fit, it is bonded close and firm, it does not fall out, and because there is no conventional organic gels between flourescent sheet and LED chip, it also avoids that the flourescent sheet of secure fit and LED chip are inverted on substrate, LED encapsulation structure can be obtained because organic gel discoloration, glue are split and led to the problem of.
Description
Technical field
The present invention relates to lighting technical fields, and in particular to a kind of packaging method of flourescent sheet and a kind of LED packaging.
Background technique
In LED high-end applications, for example, automobile front, daytime running lamps, projector, stage lighting etc., the function of LED chip
Rate density and heat flow density are very high, and the requirement to chip perimeter material is also very high, it is necessary to can bear high fever and height for a long time
Energy radiation changes without physical property.Current commercialized white light LEDs, the excitation of producing method, mainly blue chip are glimmering
Light powder, and before fluorescent powder coating, need the Organic adhesives such as elder generation and silica gel to mix, the Organic adhesives such as silica gel are high for a long time
Under temperature radiation and low band illumination, easy discoloration, glue are split etc., it in turn results in the photochromic of LED component and changes, or even is dead
Lamp.It, generally can be preforming by the inorganic material such as fluorescent powder and glass, ceramics to avoid these problems in above-mentioned high-end applications
Together, it is made into glass flourescent sheet or ceramic fluorescent piece, flourescent sheet is then bonded in LED chip surface.How by fluorescence
Piece is encapsulated in LED chip, currently, only a kind of packaged type, i.e., be bonded in LED chip for flourescent sheet using Organic adhesive
On, because still having used Organic adhesive, however it remains under long-time hyperthermia radiation and low band illumination, organic gel becomes
The problem of color, glue are split.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of packaging method of flourescent sheet and a kind of LED packagings.
The technical solution used in the present invention is:
A kind of packaging method of flourescent sheet, including the use of voltage generate electrostatic force by flourescent sheet and the substrate of LED chip without
Medium directly secure fit together the step of.
In some preferred embodiments, described to be fitted closely the substrate of flourescent sheet and LED chip using electrostatic force
Specific steps together include:
S1: LED chip is upside down on a conductive carrier, flourescent sheet is placed in LED chip, one is placed on flourescent sheet
Conducting pad；
S2: the conductive carrier is connected with positive pole, and the conducting pad is connected with power cathode, is powered one section
Time；
S3: removing the conductive carrier and the conducting pad, obtains the flourescent sheet and LED chip of secure fit.
In the preferred embodiment of above scheme, galvanization described in the S2 is to realize in a heated condition
's.
In the further preferred embodiment of above scheme, galvanization described in the S2 is at 200-800 DEG C
Under conditions of realize.
In the preferred embodiment of above scheme, the substrate of the LED chip is Sapphire Substrate, silicon carbide lining
Any one of bottom, silicon substrate.
In the preferred embodiment of above scheme, voltage >=200V of the power supply.
In the preferred embodiment of above scheme, conduction time is≤5 minutes.
In the preferred embodiment of above scheme, the flourescent sheet is glass flourescent sheet or ceramic fluorescent piece.
The present invention also provides a kind of LED packagings, including substrate, further include the packaging method of flourescent sheet as described above
The flourescent sheet and LED chip for the secure fit being prepared, the LED chip upside-down mounting is on the substrate.
The beneficial effects of the present invention are:
The present invention provides a kind of packaging method of flourescent sheet and a kind of LED packagings, generate electrostatic force using voltage
By flourescent sheet together with the substrate of LED chip without medium direct secure fit, it is bonded close and firm, is not fallen out, and because
There is no conventional organic gel between flourescent sheet and LED chip, also avoid because organic gel changes colour, glue is split and what is generated asks
Topic, the flourescent sheet of secure fit and LED chip are inverted on substrate, LED encapsulation structure can be obtained.
Detailed description of the invention
Fig. 1 is the encapsulation process schematic diagram of embodiment 1.
Fig. 2 is the encapsulation process schematic diagram of embodiment 2.
Specific embodiment
Embodiment 1:
Referring to Fig.1, LED chip 1 is upside down on a conductive carrier 2, flourescent sheet 3 is placed in LED chip 1, in fluorescence
A conducting pad 4 is placed on piece 3；The conductive carrier 2 is connected with positive pole, by the conducting pad 4 and power cathode
It is connected, the voltage of power supply is 200V, is powered 1 minute, conduction time can also be appropriately extended, but no more than 5 minutes, not damage
LED chip；The conductive carrier 2 and the conducting pad 4 are removed, the flourescent sheet 3 and LED chip 1 of secure fit are obtained.
The flourescent sheet 3 is glass flourescent sheet, contains alkali metal ion, such as Na in glass substrate material+、K+Deng in high temperature and dispatch from foreign news agency
When field action, float to negative electrode, close to LED chip 1 side, formed alkali metal ion exhaust and containing only O2-Ion is born
Charge area, with O2-It is corresponding, image charge is generated on 1 surface of LED chip contacted, generates the electrostatic gradually increased
, last inside and outside potential reaches balance, disconnects extrinsic current.Charge O on flourescent sheet 32-With the mirror image of 1 Surface Creation of LED chip
Charge forms very strong electrostatic field, generates powerful electrostatic force.Electrostatic force generates flourescent sheet 3 and the contact surface of LED chip 1 all
Micro-strain makes the fitting of the surface of the two gradually tightly, forms seal interface, flourescent sheet 3 and LED chip 1 are bonded securely
Together.The flourescent sheet 3 of secure fit and LED chip 1 are inverted on substrate, LED encapsulation structure can be obtained.
Embodiment 2:
Referring to Fig. 2, LED chip 1 is upside down on a conductive carrier 2, flourescent sheet 3 is placed in LED chip 1, in fluorescence
A conducting pad 4 is placed on piece 3；The above-mentioned material being well placed is put into heating container 5, adjusting heating 5 temperature of container is 500
DEG C, otherwise temperature can damage LED chip 1 not above 800 DEG C, the conductive carrier 2 is connected with positive pole, will be described
Conducting pad 4 is connected with power cathode, and the voltage of power supply is 200V, is powered half a minute；It removes the conductive carrier 2 and described leads
Voltage part 4 obtains the flourescent sheet 3 and LED chip 1 of secure fit.The flourescent sheet 3 is ceramic fluorescent piece, substrate of glass material
Contain alkali metal ion, such as Na in material+、K+Deng in high temperature and External Electrical Field, negative electrode being floated to, close to LED chip 1
Side, formed alkali metal ion exhaust and containing only O2-The negative electrical charge region of ion, with O2-It is corresponding, in the LED contacted
Chip generates image charge on 1 surface, generates the electrostatic field gradually increased, and last inside and outside potential reaches balance, disconnects extrinsic current.
Charge O on flourescent sheet 32-Very strong electrostatic field is formed with the image charge of 1 Surface Creation of LED chip, generates powerful electrostatic
Power.Electrostatic force makes flourescent sheet 3 and the contact surface of LED chip 1 all generate micro-strain, makes the patch of the surface of the two gradually tightly
It closes, forms seal interface, flourescent sheet 3 and LED chip 1 fit together securely.The substrate of the LED chip 1 is to contain Si
Sill, such as any one of Sapphire Substrate, silicon carbide substrates, silicon substrate, under high temperature environment, O2-With 1 surface of LED chip
Si chemically react, generate firm chemical bond, can further reinforce the fitting of flourescent sheet 3 and LED chip 1.Entirely
Bonding process is completed in moment, and on-load voltage and temperature be not it is very high, to too macrolesion will not be caused to LED chip 1.
Embodiment 3:
The present embodiment is substantially the same manner as Example 2, the difference is that, temperature is 200 DEG C in the heating container 5, is led to
The electric time is 10 seconds.
Claims (8)
1. a kind of packaging method of flourescent sheet, which is characterized in that generate electrostatic force for flourescent sheet and LED chip including the use of voltage
Substrate without medium directly secure fit together the step of, specific steps include:
S1: LED chip being upside down on a conductive carrier, flourescent sheet is placed in LED chip, and it is conductive that one is placed on flourescent sheet
Casting die；
S2: the conductive carrier is connected with positive pole, and the conducting pad is connected with power cathode, be powered one section when
Between；
S3: removing the conductive carrier and the conducting pad, obtains the flourescent sheet and LED chip of secure fit.
2. the packaging method of flourescent sheet according to claim 1, which is characterized in that galvanization described in the S2 be
It is realized under heating condition.
3. the packaging method of flourescent sheet according to claim 2, which is characterized in that galvanization described in the S2 be
It is realized under conditions of 200-800 DEG C.
4. the packaging method of flourescent sheet according to claim 1, which is characterized in that the substrate of the LED chip is blue precious
Any one of stone lining bottom, silicon carbide substrates, silicon substrate.
5. the packaging method of flourescent sheet according to claim 1, which is characterized in that voltage >=200V of the power supply.
6. the packaging method of flourescent sheet according to claim 1, which is characterized in that conduction time is≤5 minutes.
7. the packaging method of flourescent sheet according to claim 1, which is characterized in that the flourescent sheet be glass flourescent sheet or
Ceramic fluorescent piece.
8. a kind of LED packaging, including substrate, which is characterized in that further include by any one of the claim 1-7 flourescent sheet
The packaging method flourescent sheet and LED chip of the secure fit that are prepared, the LED chip upside-down mounting is on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245949.3A CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245949.3A CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711313A CN106711313A (en) | 2017-05-24 |
| CN106711313B true CN106711313B (en) | 2019-05-14 |
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Family Applications (1)
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| CN201611245949.3A Active CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022322A (en) * | 2011-09-26 | 2013-04-03 | 东芝照明技术株式会社 | Manufacturing method of light-emitting device |
| CN105140376A (en) * | 2011-06-27 | 2015-12-09 | 深圳市绎立锐光科技开发有限公司 | Phosphor layer and device and corresponding light source and projection system and corresponding manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100123386A1 (en) * | 2008-11-13 | 2010-05-20 | Maven Optronics Corp. | Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices |
-
2016
- 2016-12-29 CN CN201611245949.3A patent/CN106711313B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140376A (en) * | 2011-06-27 | 2015-12-09 | 深圳市绎立锐光科技开发有限公司 | Phosphor layer and device and corresponding light source and projection system and corresponding manufacturing method |
| CN103022322A (en) * | 2011-09-26 | 2013-04-03 | 东芝照明技术株式会社 | Manufacturing method of light-emitting device |
Also Published As
| Publication number | Publication date |
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| CN106711313A (en) | 2017-05-24 |
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| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A packaging method of fluorescent sheet and an LED packaging device Effective date of registration: 20211206 Granted publication date: 20190514 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |
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Date of cancellation: 20230807 Granted publication date: 20190514 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |
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