CN104347610B - Embedded LED device and preparation method thereof and luminaire - Google Patents
Embedded LED device and preparation method thereof and luminaire Download PDFInfo
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- CN104347610B CN104347610B CN201310312325.9A CN201310312325A CN104347610B CN 104347610 B CN104347610 B CN 104347610B CN 201310312325 A CN201310312325 A CN 201310312325A CN 104347610 B CN104347610 B CN 104347610B
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Abstract
The present invention is applied to LED technology field, there is provided a kind of embedded LED device, including LED chip, the LED chip has exiting surface and electrode, the electrode is on the another side relative with the exiting surface on the LED chip, also include transparent light-emitting plate and substrate, the one side of the substrate is provided with circuit layer, the land being connected with the LED core plate electrode is provided with the circuit layer, the exiting surface of the LED chip is pasted on position corresponding with land on the substrate in the transparent light-emitting plate, the electrode of the LED chip is fixed on the land.Compared with prior art, the encapsulation link in conventional middle reaches is eliminated, so as to simplify industrial chain, resource is saved, improving production efficiency saves material, and reduces cost shortens heat transfer heat dissipation path, improves LED chip radiating efficiency, extends service life.The invention also discloses a kind of embedded LED device manufacture method and the luminaire using above-mentioned embedded LED device.
Description
Technical field
The invention belongs to LED technology field, more particularly to a kind of embedded LED device, the making of the embedded LED device
Method and the luminaire using the embedded LED device.
Background technology
Current LED light source component mainly using being realized by the way of encapsulation, i.e., the LED chip for producing commercialization of upstream and
With the support that calorifics, optics, mechanical support are acted on.The LED chip has exiting surface and electrode, and electrode is located at and exiting surface phase
To another side on.Support is provided with pin.Middle reaches by LED chip by way of die bond and bonding wire by LED chip and support
Connection, makes the electrode of LED chip be connected with the pin of support, is then coated with being mixed with the fluid sealant of fluorescent material, is packaged into LED
Pearl（This packaged LED lamp bead is also referred to as LED chip at present, but LED chip as referred to herein refer both to it is unencapsulated before
LED chip）.Mixed fluorescent powder is mainly the light for making LED lamp bead send different colours in fluid sealant.Middle reaches will using bonder,
The equipment such as bonding equipment, light-splitting color-separating machine.Downstream is then welded in LED lamp bead on substrate, then with optics suite, drive system etc.
It is assembled into terminal luminaire.Industrial chain upper, middle and lower reaches the division of labor clearly, industrial chain it is long, be related to excessive setting
Standby, process procedure and material, process are complicated, cause high cost, inefficiency.
The content of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of embedded LED device, this is embedded
The preparation method of LED component and the luminaire using the embedded LED device, it is intended to solve the product of current production LED product
Industry chain is more long, and process is complicated, causes high cost, the problem of inefficiency.
The present invention is achieved in that a kind of embedded LED device, including LED chip, and the LED chips have light extraction
Face and electrode, the electrode are located on the another side relative with the exiting surface on the LED chip, also including transparent light extraction
Plate and substrate, the one side of the substrate are provided with circuit layer, and the knot being connected with the LED core plate electrode is provided with the circuit layer
Area is closed, the exiting surface of the LED chip is pasted on position corresponding with land on the substrate in the transparent light-emitting plate,
The electrode of the LED chip is fixed on the land.
Further, it is formed around the LED core in the LED chip between the substrate and the transparent light-emitting plate
The reflective membrane that the light that piece sends reflects to the transparent light-emitting plate.
Specifically, the reflective membrane is in emitting shape, and the LED chip is in the bottom of the emitting shape reflective membrane.
Further, it is filled with the space of the LED chip surrounding between the substrate and the transparent light-emitting plate
Protect the transparent adhesive tape of the LED chip.
Another object of the present invention is to provide a kind of embedded LED device manufacture method, is comprised the following steps：
Making sheet：Circuit layer is made in the one side of substrate, and is set in the circuit layer for solid with LED core plate electrode
Fixed connected land；
Patch chip：The exiting surface of the LED chip is pasted in transparent light-emitting plate and the land phase on the substrate
Corresponding position；
Connecting substrate：The electrode of the LED chip is fixed on the land of the substrate, the electricity of the LED chip
Pole is located on another side relative with its exiting surface on the LED chip.
Further, between the patch chip step and the connecting substrate step, it is additionally included in the LED chip four
The step of week prepares reflective membrane.
Further, it is described to include the step of prepare reflective membrane：
（1）Coat photoresist in the LED chip surrounding, and make the thickness of the photoresist from the LED chip to
It is gradually thinning away from the LED chip direction；
（2）Reflective membrane is deposited with out on the photoresist；
（3）The photoresist is removed, the light that the LED chip can be sent is obtained to the anti-of the transparent light-emitting plate reflection
Light film.
Further, after the connecting substrate step, also including filling glue step：In the substrate and described transparent
In the transparent adhesive tape of the LED chip surrounding filling protection LED chip between light-emitting plate.
Further, also including coating fluorescent material step：The one side of the LED chip is pasted in the transparent light-emitting plate
Fluorescent material is coated on relative another side.
Another object of the present invention is to provide a kind of luminaire, including heat abstractor and drive device, also including as above
Described embedded LED device, the substrate of the embedded LED device is fixed on heat abstractor, the circuit on the substrate
It is connected with the drive device.
The present invention provides a kind of embedded LED device, the preparation method of the embedded LED device and uses this embedded
The luminaire of LED component.Directly it is connected with transparent light-emitting plate and substrate by by LED chip, forms embedded LED device.
Compared with prior art, LED lamp bead is encapsulated as without by LED chip, simplifies industrial chain, save resource, lifting production effect
Rate, saves material, reduces cost.Meanwhile, LED component is directly fixed on substrate, the heat for producing LED component directly leads to
Cross substrate to give out, shorten heat transfer heat dissipation path, improve LED chip radiating efficiency, such that it is able to extend making for LED chip
With the life-span, can also ensure that LED chip is used under bigger electric current, its overall brightness is lifted.
Brief description of the drawings
A kind of cross-sectional view of embedded LED device provided in an embodiment of the present invention in Fig. 1.
In Fig. 2 in Fig. 1 LED chip structural representation.
Fig. 3 to Figure 10 is embedded LED device fabrication processes schematic diagram provided in an embodiment of the present invention.Wherein：
Fig. 3 is the semi-finished product structure schematic diagram after gluing in transparent light-emitting plate.
Fig. 4 is the semi-finished product cross-sectional view after LED chip is bonded in Fig. 3 in transparent light-emitting plate.
Fig. 5 is that LED chip surrounding coats the semi-finished product cross-sectional view after photoresist in fig. 4.
Fig. 6 is to be deposited with the semi-finished product cross-sectional view after reflective membrane on photoresist in Figure 5.
Fig. 7 is to remove the semi-finished product cross-sectional view in Fig. 6 after photoresist.
Fig. 8 is that the semi-finished product cross-section structure being fixed on substrate after being inverted LED chip in Fig. 7 and transparent light-emitting plate is illustrated
Figure.
Fig. 9 is the semi-finished product cross-sectional view for coating fluorescent material in transparent light-emitting plate in fig. 8.
Figure 10 is the cross-sectional view that LED chip surrounding fills the finished product obtained after transparent adhesive tape in fig .9.
Figure 11 is a kind of structural representation of luminaire provided in an embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Refer to Fig. 1 and Fig. 2, a kind of embedded LED device 1 disclosed in the embodiment of the present invention, including LED chip 13, thoroughly
Bright light-emitting plate 11 and substrate 16.LED chip 13 has exiting surface 131 and electrode 132, and electrode 132 is located on LED chip 13 and goes out
On the relative another side of smooth surface 131.The one side of substrate 16 is provided with circuit layer（Not shown in figure）, circuit layer be provided with for
The connected land 161 of the electrode 132 of LED chip 13.The exiting surface 131 of LED chip 13 is pasted in transparent light-emitting plate 11, its
Position is corresponding with the position of land 161 on substrate.The electrode 132 of LED chip 13 is fixed on land 161 on substrate 16
On, so that the circuit in circuit layer on substrate is electrically connected with the electrode 132 of LED chip 13.
Directly it is connected with transparent light-emitting plate 11 and substrate 16 by by LED chip 13, forms embedded LED device 1.With it is existing
There is technology to compare, it is not necessary to LED chip 13 is encapsulated as into LED lamp bead, industrial chain is simplified, save resource, lifting production effect
Rate, saves material, reduces cost.Meanwhile, LED component is directly fixed on substrate 16, the heat for producing LED component is direct
Given out by substrate 16, shorten heat transfer heat dissipation path, the radiating efficiency of LED chip 13 is improved, such that it is able to extend LED core
The service life of piece 13.Because LED chip 13 works under high current, its brightness can be made to get a promotion, but can also make LED chip
The 13 big raising of caloric value, if the temperature of LED chip 13 is too high to have a strong impact on its service life, therefore dissipates in LED chip 13
In the case that the thermal efficiency is lifted, the operating current of LED chip 13 can be accordingly improved, it is ensured that LED chip 13 is in bigger electric current
Under use, its overall brightness is lifted.The exiting surface 131 of LED chip 13 is directly affixed in transparent light-emitting plate 11, is improve
Light emission rate.The exiting surface 131 of LED chip 13 is directly adhered in transparent light-emitting plate 11, while its electrode 132 is directly fixed
In on substrate 16, the thickness of the embedded LED device 1 can be reduced, obtain ultra-thin embedded LED device 1.LED chip 13
One or more can be set to, be two in the present embodiment.The embedded LED device 1 can be applied show in LED, LED is carried on the back
In the equipment of the occasions such as light, LED illumination.
Further, reflective membrane 14 is additionally provided between substrate 16 and transparent light-emitting plate 11, reflective membrane 14 is located at LED chip 13
Surrounding.By setting reflective membrane 14, the light that LED chip 13 is sent reflects to transparent light-emitting plate 11, particularly the side of LED chip 13
While the light that the light for exposing and transparent light-emitting plate 11 are reflected back, transparent light-emitting plate 11 is reflected towards by reflective membrane 14, through it is transparent go out
Tabula rasa 11 sends, and improves the light extraction efficiency of LED chip 13 and the uniformity of light-out effect.Compared with prior art, can remove from
Need to install the external stent with specific reflection cup in conventional encapsulation improve LED lamp bead go out light consistency encapsulation step and
Material, reduces cost.
Specifically, reflective membrane 14 is in emitting shape, and LED chip 13 is located at the bottom of the emitting shape reflective membrane 14.I.e.：Make reflective
Film 14 is more than one end of its close substrate 16 from LED chip 13 near one end of transparent light-emitting plate 11 with a distance from LED chip 13
Distance.So that the light for being irradiated to the surface of reflective membrane 14 is reflected to the direction of transparent light-emitting plate 11.In the present embodiment, reflective membrane
The cross section of 14 sides is in circular arc, and LED chip 13 is two, then the reflective membrane 14 between two LED chips 13 is connected into
Integrally, its cross section is in semicircular arc.And for each LED chip 13, its reflective membrane 14 is still in emitting shape.
Further, it is filled with protection LED chip 13 in the surrounding of LED chip 13 between substrate 16 and transparent light-emitting plate 11
Transparent adhesive tape 15.Transparent adhesive tape 15 is filled in the space of the surrounding of LED chip 13, to protect LED chip 13.In addition when setting reflective membrane
After 14, transparent adhesive tape 15 may also operate as protecting the effect of reflective membrane 14, prevent introduced contaminants from entering substrate 16 and transparent light-emitting plate
Between 11, LED chip 13 and reflective membrane 14 are damaged.
Glue line 12 is additionally provided between transparent light-emitting plate 11 and the exiting surface 131 of LED chip 13, will by glue line 12
The exiting surface 131 of LED chip 13 is pasted in transparent light-emitting plate 11.When making, one first can be coated in transparent light-emitting plate 11
The micro adhesive glue of layer, forms glue line 12, then paste LED chip 13.In other embodiment, also can be in LED chip 13
Adhesive glue is coated on exiting surface 131, is then bonded in transparent light-emitting plate 11.
Phosphor powder layer 17 can also be coated in the one side of transparent light-emitting plate 11, the light sent by LED chip 13 is excited
Fluorescent material obtains the light of different colours, such as white light, gold-tinted or feux rouges etc..Phosphor powder layer 17 can be located at transparent light-emitting plate 11
On the upper another side relative with the one side of stickup LED chip 13, will phosphor powder layer 17 and LED chip 13 be respectively arranged on it is transparent go out
On the two sides of tabula rasa 11.Because traditional LED lamp pearl is the mixed fluorescent powder in its fluid sealant, the light of LED lamp bead side excites effect
Rate is low, and light can occur light absorbs, reflection in fluid sealant, there is waste and more reduces launching efficiency.And by phosphor powder layer 17
On the another side of transparent light-emitting plate 11, do not touched directly with LED chip 13, it is possible to achieve remote excitation, launching efficiency is higher,
Photochromic uniformity can be made more preferable.Fluorescent material can be directly coated in transparent light-emitting plate 11, phosphor powder layer 17 is formed, it is also possible to make
Formation phosphor powder layer 17 in transparent light-emitting plate 11 is coated on the fluorescent glue of fluorescent material is mixed with.
Transparent light-emitting plate 11 can be plastic plate, glass plate etc..Preferably use glass plate, due to glass plate refractive index compared with
Height, can be with improving extraction efficiency, while glass plate also has a clear superiority at heat-resisting, the resistance to aspect such as ultraviolet than traditional material, it is ensured that
Photochromic stability.The different occasions that can also be applied according to the embedded LED device 1, the different terminals being fabricated to light
Equipment, designs different circuits on substrate 16, realizes the arrangement of multiple LED chips 13, and its connection in series-parallel, flexible design.
The electrode 132 of LED chip 13 can be fixed on substrate 16 by way of binding agent or eutectic are welded, and installed easy to make.
Fig. 3 to Figure 10 is referred to, and also referring to Fig. 2, is made the invention also discloses a kind of embedded LED device 1
Method, comprises the following steps：
Making sheet：Circuit layer is made in the one side of substrate 16（Not shown in figure）, and setting is used for and LED in circuit layer
The land 161 that the electrode 132 of chip 13 is fixedly linked；
Referring again to Fig. 3 to Fig. 4, chip is pasted：By the exiting surface 131 of LED chip 13 be pasted in transparent light-emitting plate 11 with
The corresponding position in land 161 on substrate 16；
Refer to Fig. 7 to Fig. 8, connecting substrate：The electrode 132 of LED chip 13 is fixed on the land 161 of substrate 16
On, electrode 132 is located on another side relative with exiting surface 131 on LED chip 13.
By pasting chip and connecting substrate step, you can by LED chip 13 be embedded into transparent light-emitting plate 11 and substrate 16 it
Between, the exiting surface 131 of LED chip 13 is directly adhered in transparent light-emitting plate 11, the electrode 132 of LED chip 13 is directly fixed
In on substrate 16, embedded LED device 1 is formed.
Compared with prior art, the conventional link that LED chip 13 is encapsulated as LED lamp bead is eliminated, so as to simplify
Industrial chain, saves resource, and improving production efficiency saves material, reduces cost.Meanwhile, LED component is directly fixed on substrate
On 16, so that the heat that LED component is produced directly is given out by substrate 16, heat transfer heat dissipation path is shortened, improve LED
The radiating efficiency of chip 13, such that it is able to extend the service life of LED chip 13, can also ensure LED chip 13 in bigger electric current
Under use, its overall brightness is lifted.The exiting surface 131 of LED chip 13 is directly affixed in transparent light-emitting plate 11, is improved
Light emission rate.The exiting surface 131 of LED chip 13 is directly adhered in transparent light-emitting plate 11, while its electrode 132 is directly solid
Due on substrate 16, the thickness of the embedded LED device 1 can be reduced, obtain ultra-thin embedded LED device 1.
Transparent light-emitting plate 11 can be plastic plate, glass plate etc..Preferably use glass plate, due to glass plate refractive index compared with
Height, can be with improving extraction efficiency, while glass plate also has a clear superiority at heat-resisting, the resistance to aspect such as ultraviolet than traditional material, it is ensured that
Photochromic stability.
The different occasions that can also be applied according to the embedded LED device 1, the different terminals luminaire being fabricated to,
Different circuits are designed in circuit layer on substrate 16, the arrangement of multiple LED chips 13, and its connection in series-parallel, design spirit is realized
It is living.Circuit layer first generally is designed and produced in the one side that fix LED chip 13 on substrate 16, has been set in circuit layer
For the land 161 being fixedly linked with the electrode 132 of LED chip 13, so when the electrode 132 of LED chip 13 is fixed on land
When 161, its electrode 132 is electrically connected with circuit in circuit layer on substrate 16.After setting the circuit layer on substrate 16, according to substrate
The land 161 set on 16 will paste the position of LED chip 13 to position in transparent light-emitting plate 11, then by LED chip 13
Exiting surface 131 is pasted on the relevant position of transparent light-emitting plate 11.It is of course also possible to LED chip 13 first is pasted on into transparent light extraction
On plate 11, it is pasted on the position in transparent light-emitting plate 11 further according to LED chip 13 to set the circuit layer on substrate 16, and in electricity
In the floor of road the land 161 that is connected with the electrode 132 of LED chip 13 of setting, i.e. making sheet step can before patch chip step,
Can also be carried out after chip step is pasted.The electrode 132 of LED chip 13 can be consolidated by way of binding agent or eutectic are welded
It is scheduled on substrate 16, installs easy to make.
Because substrate 16 is general opaque, thus when the electrode 132 of LED chip 13 is fixed on substrate 16, can be with
The transparent light-emitting plate 11 that LED chip 13 first is will be bonded with inverted, and facilitates through the position that transparent light-emitting plate 11 observes LED chip 13
Put, be easy to navigate to LED chip 13 on the relevant position on substrate 16 exactly.
In chip step is pasted, referring again to Fig. 3 to Fig. 4, the exiting surface 131 of the LED chip 13 can be by following step
Suddenly it is pasted in transparent light-emitting plate 11：Adhesive glue is first coated in the one side of the transparent light-emitting plate 11, glue line 12 is formed,
Then the exiting surface 131 of LED chip 13 is fitted on glue line 12.Certainly can also directly in the light extraction of LED chip 13
Adhesive glue is coated on face 131, is then pasted in transparent light-emitting plate 11.Can also directly by glue line 12 fit in it is transparent go out
In the one side of tabula rasa 11, then the exiting surface 131 of LED chip 13 is fitted on glue line 12.
Fig. 4 to Fig. 7 is referred to, further, between patch chip step and connecting substrate step, LED core is additionally included in
The step of surrounding of piece 13 prepares reflective membrane 14.By setting the step, reflective membrane 14 is set in the surrounding of LED chip 13, can be by
The light that LED chip 13 sends reflects to transparent light-emitting plate 11, light and transparent light-emitting plate that particularly the side of LED chip 13 is exposed
11 light being reflected back, transparent light-emitting plate 11 is reflected towards by reflective membrane 14, is sent through transparent light-emitting plate 11, improves LED chip
13 light extraction efficiency and the uniformity of light-out effect.Compared with prior art, can remove from during routine is encapsulated needing to install and there is spy
Determine the external stent of reflector to improve encapsulation step and material that LED lamp bead goes out light consistency, reduces cost.
Referring again to Fig. 5 to Fig. 7, specifically, the step of prepare reflective membrane 14 include：
（1）Coat photoresist 18 in the surrounding of LED chip 13, and make the thickness of photoresist 18 from LED chip 13 to away from
The direction of LED chip 13 is gradually thinning；
（2）Reflective membrane 14 is deposited with out on photoresist 18；
（3）Photoresist 18 is removed, the reflective membrane that light reflects to transparent light-emitting plate 11 that LED chip 13 can be sent is obtained
14。
By first coating photoresist 18, to shape so that the reflective membrane 14 being deposited with out its have specific shape.Make light
The thickness of photoresist 18 from LED chip 13 to gradually thinning away from the direction of LED chip 13 so that the reflective membrane 14 being deposited with out
It is in horn-like in reflective membrane, LED chip 13 is located at the bottom of the loudspeaker.So that the light for being irradiated to the surface of reflective membrane 14 is reflected
To the direction of transparent light-emitting plate 11.Because photoresist 18 generally there are color, can stop on the arrival reflective membrane 14 of light, thus steam
After plating reflective membrane 14, photoresist 18 is removed.It is, of course, also possible to according to the layout and size of LED chip 13, first prepare reflective
Film 14, then reflective membrane 14 is affixed directly to the surrounding of LED chip 13；The reflector of respective shapes, reflector can also be prepared
On plate reflective membrane 14, the surrounding of LED chip 13 is then fixed on together.
Figure 10 is referred to, further, after connecting substrate step, also including filling glue step：In substrate 16 and thoroughly
The transparent adhesive tape 15 of protection LED chip 13 is filled between bright light-emitting plate 11 in the space of the surrounding of LED chip 13.Transparent adhesive tape 15 is filled
In the surrounding of LED chip 13, to protect LED chip 13.In addition after reflective membrane 14 are set, transparent adhesive tape 15 can also wrap up reflective membrane
14, so as to may also operate as protecting the effect of reflective membrane 14, prevent introduced contaminants from entering between substrate 16 and transparent light-emitting plate 11,
Damage LED chip 13 and reflective membrane 14.
Fig. 9 is referred to, further, also including coating fluorescent material step：LED chip 13 is pasted in transparent light-emitting plate 11
The relative another side of one side on coat fluorescent material, form phosphor powder layer 17, will phosphor powder layer 17 and LED chip 13 set respectively
In on the two sides of transparent light-emitting plate 11.The light excitated fluorescent powder sent by LED chip 13 obtains the light of different colours, such as white
Light, gold-tinted or feux rouges etc..By phosphor powder layer 17 on the another side of transparent light-emitting plate 11, do not touched directly with LED chip 13, can
To realize remote excitation, launching efficiency is higher, and photochromic uniformity can be made more preferable.Directly can be coated in transparent light-emitting plate 11 glimmering
Light powder, forms phosphor powder layer 17, it is also possible to form glimmering using being mixed with the fluorescent glue of fluorescent material and being coated in transparent light-emitting plate 11
Light bisque 17.Coating fluorescent material step can be before or after paste chip step, it is also possible to before the step of connecting substrate 16
Or afterwards.
Figure 11 is referred to, the invention also discloses a kind of luminaire, including heat abstractor 2, drive device and above-mentioned
Embedded LED device 1, the substrate 16 of embedded LED device 1 is fixed on heat abstractor 2, and the circuit on substrate 16 is filled with driving
Put connected.The luminaire production efficiency is high, reduces cost.Meanwhile, its light emission rate of LED chip 13 is high, radiating efficiency is high, can be with
Extend the service life of LED chip 13, can also ensure that LED chip 13 is used under bigger electric current, enables its overall brightness
Lifting, so that the long service life of the luminaire, brightness are high.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (8)
1. a kind of embedded LED device, including LED chip, the LED chip has exiting surface and electrode, and the electrode is located at
On the another side relative with the exiting surface on the LED chip, it is characterised in that also including transparent light-emitting plate and substrate,
The one side of the substrate is provided with circuit layer, and the land being connected with the LED core plate electrode is provided with the circuit layer, described
The exiting surface of LED chip is pasted on position corresponding with land on the substrate in the transparent light-emitting plate, the LED core
The electrode of piece is fixed on the land；In the sky of the LED chip surrounding between the substrate and the transparent light-emitting plate
Filled with the transparent adhesive tape of the protection LED chip in gap；Also set between the transparent light-emitting plate and the exiting surface of the LED chip
There is glue line, the exiting surface of the LED chip is pasted in the transparent light-emitting plate by the glue line.
2. embedded LED device as claimed in claim 1, it is characterised in that between the substrate and the transparent light-emitting plate
In the reflective membrane that light reflects to the transparent light-emitting plate that the LED chip is formed around sending the LED chip.
3. embedded LED device as claimed in claim 2, it is characterised in that the reflective membrane is in emitting shape, the LED core
Piece is located at the bottom of the emitting shape reflective membrane.
4. a kind of embedded LED device manufacture method, it is characterised in that comprise the following steps：
Making sheet：Circuit layer is made in the one side of substrate, and setting is used for and LED core plate electrode fixing phase in the circuit layer
Land even；
Patch chip：The exiting surface of the LED chip is pasted on corresponding with the land on the substrate in transparent light-emitting plate
Position；
Connecting substrate：The electrode of the LED chip is fixed on the land of the substrate, the electrode position of the LED chip
In on another side relative with its exiting surface on the LED chip；
After the connecting substrate step, also including filling glue step：Between the substrate and the transparent light-emitting plate in
The transparent adhesive tape of the LED chip surrounding filling protection LED chip.
5. embedded LED device manufacture method as claimed in claim 4, it is characterised in that in patch chip step and the institute
State between connecting substrate step, the step of being additionally included in the LED chip surrounding and prepare reflective membrane.
6. embedded LED device manufacture method as claimed in claim 5, it is characterised in that described the step of prepare reflective membrane
Including：
(1) coat photoresist in the LED chip surrounding, and make the thickness of the photoresist from the LED chip to away from
The LED chip direction is gradually thinning；
(2) it is deposited with out reflective membrane on the photoresist；
(3) photoresist is removed, the light that the LED chip can be sent is obtained to the reflective of the transparent light-emitting plate reflection
Film.
7. the embedded LED device manufacture method as described in claim any one of 4-6, it is characterised in that also glimmering including coating
Light powder step：Pasted in the transparent light-emitting plate and coat fluorescent material on the relative another side of one side of the LED chip.
8. a kind of luminaire, including heat abstractor and drive device, it is characterised in that also any including such as claim 1-3
Embedded LED device described in, the substrate of the embedded LED device is fixed on heat abstractor, the electricity on the substrate
Road is connected with the drive device.
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10439111B2 (en) | 2014-05-14 | 2019-10-08 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
| US9997676B2 (en) | 2014-05-14 | 2018-06-12 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
| TWI557952B (en) | 2014-06-12 | 2016-11-11 | 新世紀光電股份有限公司 | Light emitting component |
| CN111223975A (en) | 2015-09-18 | 2020-06-02 | 新世纪光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN107731996A (en) * | 2017-09-28 | 2018-02-23 | 惠州市华瑞光源科技有限公司 | Led lamp bead and preparation method thereof |
| TW201919261A (en) | 2017-11-05 | 2019-05-16 | 新世紀光電股份有限公司 | Light emitting device |
| TW202249306A (en) | 2017-11-05 | 2022-12-16 | 新世紀光電股份有限公司 | Light emitting apparatus |
| CN110957312B (en) * | 2019-11-29 | 2022-11-22 | 深圳极光王科技股份有限公司 | Four-pin LED lamp bead with built-in chip and LED display module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201373272Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | White-light LED light source module adopting COB technology and array interconnection |
| EP2337073A1 (en) * | 2009-12-21 | 2011-06-22 | Aussmak Optoelectronic Corp. | Light transmissible display apparatus |
| CN102354721A (en) * | 2011-11-04 | 2012-02-15 | 祝进田 | Manufacturing method of LED (light-emitting diode) chip with inverted structure |
| CN102769087A (en) * | 2012-07-09 | 2012-11-07 | 上海大学 | LED (light-emitting diode) based on via packaging technique and manufacturing technology of LED |
| CN203415577U (en) * | 2013-07-23 | 2014-01-29 | 深圳市瑞丰光电子股份有限公司 | Embedded LED device and light-emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI318013B (en) * | 2006-09-05 | 2009-12-01 | Epistar Corp | A light emitting device and the manufacture method thereof |
-
2013
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201373272Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | White-light LED light source module adopting COB technology and array interconnection |
| EP2337073A1 (en) * | 2009-12-21 | 2011-06-22 | Aussmak Optoelectronic Corp. | Light transmissible display apparatus |
| CN102354721A (en) * | 2011-11-04 | 2012-02-15 | 祝进田 | Manufacturing method of LED (light-emitting diode) chip with inverted structure |
| CN102769087A (en) * | 2012-07-09 | 2012-11-07 | 上海大学 | LED (light-emitting diode) based on via packaging technique and manufacturing technology of LED |
| CN203415577U (en) * | 2013-07-23 | 2014-01-29 | 深圳市瑞丰光电子股份有限公司 | Embedded LED device and light-emitting device |
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