CN106711079A - Picking and placing device - Google Patents
Picking and placing device Download PDFInfo
- Publication number
- CN106711079A CN106711079A CN201710104313.5A CN201710104313A CN106711079A CN 106711079 A CN106711079 A CN 106711079A CN 201710104313 A CN201710104313 A CN 201710104313A CN 106711079 A CN106711079 A CN 106711079A
- Authority
- CN
- China
- Prior art keywords
- component
- magnetic patch
- fetching device
- fixed
- axle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Specific Conveyance Elements (AREA)
- Dynamo-Electric Clutches, Dynamo-Electric Brakes (AREA)
Abstract
The invention discloses a picking and placing device. The device comprises a turntable, wherein a plurality of vertical driving mechanisms are fixed on the turntable in a circular array state; a rotation mechanism is fixed on each vertical driving mechanism, and comprises a first part and a second part; each first part is coaxially arranged above the respective second part, each first part and the respective second part can rotate relatively, the lower end face of each first part and the upper end face of the respective second part are opposite and spaced, and upper magnets are arranged at the lower end face of each first part in a circular array state; lower magnets are arranged at the upper end face of each second part in a circular array state; two stoppers are alternately distributed on each first part; and a bulge part is positioned between the two stoppers on each second part and can be alternately stopped by the two stoppers. No force application entity, such as a motor or a spring, is arranged between the first parts and the second parts of the rotation mechanisms, the picking and placing device has the advantages of small size and simple structure.
Description
Technical field
The invention belongs to mechanical automation equipment technical field, more particularly to a kind of fetching device.
Background technology
In various automation equipment industries, particularly in the manufacturing equipment industry such as electronics, semiconductor, to structure, right
There are strict requirements and limitation in space.Driver part traditional in the past and driven member are carried out by the means of various contacts
Drive and transmission (such as motor or spring), structural volume is big, composition is complicated, and comparing has limitation, and it is right to be directly applied to
Structure, space have in some electronics, the semiconductor manufacturing facility be strict with and limit.
For example, it is necessary to chip is sent to rotating disk by fetching device after grab chips in existing chip fetching device
Each station of surrounding, one of which station needs for chip to carry out 90 ° of rotations, after processing chip, in addition it is also necessary to will
Chip is returned to original angle, and this is accomplished by setting rotating mechanism driving sucker to rotate, and in such a device, space limit
System is driven, it is impossible to realize than larger according to the motor or spring of transmission.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of rotating mechanism small volume, the fetching device of simple structure,
To overcome the shortcomings of that prior art is present.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of fetching device, including rotating disk, circumference array are fixed on the multiple upright driving mechanisms on rotating disk, and each is vertical
A rotating mechanism is fixed with drive mechanism, rotating mechanism lower section is connected with sucker, it is characterised in that：The rotating mechanism bag
First component and second component are included, the first component is co-axially located at second component top and the two can be turned toward each other
It is dynamic, there is interval, under the first component between the lower surface of first component relative to each other and the upper surface of second component
End face circumferential array has upper magnetic patch；The upper surface circumferential array of second component has lower magnetic patch, and adjacent upper magnetic patch is located at the same face
Opposite polarity, adjacent lower magnetic patch is located at the polarity of the same face also conversely, the first component is provided with two for being spaced apart only
Block piece, has between two stop parts on the second component, can be replaced the projections of backstop by two stop parts
Part, the upper end of the axle of the second component is connected with the forced section above the first component, the side of the forced section
With arc-shaped recess portion, the lower surface of the second component is connected with sucker, and the top of the one of station of rotating disk is also solid
Surely the lower end position for having a pin, the pin is placed exactly on the motion path in arc-shaped recess portion.
The upper magnetic patch is identical with the quantity of the lower magnetic patch, and circumference is on second component upper surface where the upper magnetic patch
Projection overlaps with circumference where the lower magnetic patch.
The upper magnetic patch is embedded in the first component, the lower surface of the upper magnetic patch and the lower surface of the first component
Flush, the lower magnetic patch is embedded in the second component, and the upper surface of the lower magnetic patch is neat with the upper surface of the second component
It is flat.
In the present invention has implementation method, the first component center has axis hole, and bearing is provided with the axis hole,
Second component upper surface center has the axle for upwardly extending, and the axle is arranged in the bearing.
The side of the first component has a fixed plate, and the fixed plate is provided with mounting hole, the fixed plate by
The mounting hole sets screw and is fixed in the vertical lifting mechanism.
In the preferred embodiment of the present invention, the lower end of the pin is provided with catch bearing..
Using above-mentioned technical proposal, there is no motor or bullet between rotating mechanism first component of the invention and second component
The force entity of spring etc, has the advantages that small volume, simple structure.
Brief description of the drawings
The present invention is described in detail with reference to the accompanying drawings and detailed description：
Fig. 1 is the structural representation of invention；
Fig. 2 is the invention dimensional structure diagram of rotating mechanism；
Fig. 3 is the elevational schematic view of invention rotating mechanism, and N and S represents the polarity of magnetic patch, and N ' and S ' represents lower magnetic patch
Polarity.
Specific embodiment
As shown in figure 1, fetching device of the invention includes rotating disk 10, the multiple that circumference array is fixed on rotating disk 10 is vertical
Drive mechanism 20, sets a rotating mechanism on each upright driving mechanism 20, rotating mechanism lower section is respectively connected with a sucker.
As shown in Figures 2 and 3, invention rotating mechanism includes first component 100 and second component 200.
The center of first component 100 has the vertical axis hole through first component, and bearing, first component are provided with axis hole
100 sidepiece also has installing plate 102, has mounting hole 103 on the installing plate 102.
The upper surface of second component 200 has the axle for upwardly extending, and axle is arranged in the bearing of first component axis hole, goes forward side by side
And cause that first component 100 and second component 200 are coaxially disposed, and first component 100 is located at the top of second component 200,
There is interval, first component 100 and second component 200 between the lower surface of first component 100 and the upper surface of second component 200
Can be toward each other around central axis.
Be embedded with magnetic patch 301 in the lower surface circumferential array of first component 100, the lower surface of upper magnetic patch 301 with first
The lower surface of part 100 flushes, and adjacent upper magnetic patch is located at the opposite polarity of the same face.In the upper surface circumference battle array of second component 200
Row are embedded with lower magnetic patch 302, and the upper surface of lower magnetic patch 302 flushes with the upper surface of second component 200, and adjacent lower magnetic patch is located at same
The polarity in face is also opposite.In the present embodiment, upper magnetic patch 301 is equal with the quantity of lower magnetic patch 302, is 6 pieces.Also, at this
In embodiment, projection of the place circumference of upper magnetic patch 301 on the upper surface of second component 200 and the place circumference weight of lower magnetic patch 302
Close.
The upper end of the axle of second component 200 is connected with the forced section 110 positioned at the top of the first component 100, the stress
Portion 110 is cylindrical structure, has two symmetrically arranged arc-shaped recess portions 111 on circumference side.
In addition, two backstop cylinders 104 of setting are also interval with as stop part in the upper surface of first component 100,
Protruding column 112 also is provided with as projection piece in the circumference side of the forced section 110 of second component 200, and protruding column 112 is located at
Between two backstop cylinders 104, in the relative rotational motion of 100 relative thereto of second component 100, can be by this two only
Gear cylinder 104 replaces backstop, and rotary spacing is carried out to second component 200 so as to play.
Invent above-mentioned rotating mechanism be mutually repelled according to magnet same polarity, antipolar phase attract principle, by applying in advance
Power make 200 relative thereto of second component 100 rotate an angle, in this angle, the lower magnetic patch of second component 200 and
At this moment the upper magnetic patch of first component 100 has not on same level location point between first component 100 and second component 200
Attracted each other the suction of rotation, if removing advance force, second component 200 can be replied and be rotated back to initial position.Invention
Again as shown in figure 1, in fetching device of the invention, the installing plate 102 of first component 100 is fixed by screw
On upright driving mechanism 20, in the lower surface connecting sucker 21 of second component 200.
The fetching device passes through the rotation of rotating disk 10 and coordinates the lifting action of upright driving mechanism 20, can be from initial work
Position is taken a part, and parts transfer then is carried out into corresponding operating treatment to other stations of the surrounding of rotating disk 10.
A pin 30 is further fixed on above a station wherein, the lower end of the pin 30 is provided with catch bearing 31,
The position of the catch bearing 31 is placed exactly on the motion path in the arc-shaped recess portion 111 in outside.
When initial, when fetching device moves to 31 position of catch bearing, at this moment catch bearing 31 can enter arc-shaped recess
Portion 111, with being rotated further for rotating disk 10, because the backstop of catch bearing 31 can oppress the cambered surface in arc-shaped recess portion 111, forces
Second component 200 is rotated so as to change the line of production (such as rotating 90 °) that the bottom chuck of second component 200 holds, when with
Rotating disk 10 is rotated further, and after catch bearing 31 departs from arc-shaped recess portion 111, second component 200 loses resistance, in magnetic force
Under effect, start angle position can be turned back to again.Wherein, two backstop cylinders 104 on first component 100 play limitation second
The effect of the rotational angle of part 200.
By foregoing detailed description as can be seen that rotating mechanism in the present invention with pass through motor or spring in the prior art
Driving force is provided or external driver part provides driving force and compares, do not have between the first component and second component of invention rotating mechanism
There is the connection of force entity, smaller, structure is simpler in volume.
But, those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to explanation originally
Invention, and be not used as being limitation of the invention, as long as in spirit of the invention, to embodiment described above
Change, modification will all fall in the range of claims of the present invention.
Claims (6)
1. a kind of fetching device, including rotating disk, circumference array is fixed on the multiple upright driving mechanisms on rotating disk, each vertical drive
A rotating mechanism is fixed with motivation structure, rotating mechanism lower section is connected with sucker, it is characterised in that：The rotating mechanism includes
First component and second component, the first component are co-axially located at second component top and the two and can relatively rotate with respect to each other,
There is interval, the lower surface of the first component between the lower surface of first component relative to each other and the upper surface of second component
Circumferential array has upper magnetic patch；The upper surface circumferential array of second component has lower magnetic patch, and adjacent upper magnetic patch is located at the polarity of the same face
Conversely, adjacent lower magnetic patch is located at the polarity of the same face also conversely, the first component is provided with two stop parts being spaced apart,
Have between two stop parts on the second component, the projection pieces of backstop, institute can be replaced by two stop parts
The upper end for stating the axle of second component is connected with forced section above the first component, and the side of the forced section has arc
Shape depressed part, the lower surface of the second component is connected with sucker, and one is further fixed on above the one of station of rotating disk
Root pin, the lower end position of the pin is placed exactly on the motion path in arc-shaped recess portion.
2. fetching device according to claim 1, it is characterised in that：The quantity phase of the upper magnetic patch and the lower magnetic patch
Together, circumference where the upper magnetic patch is projected on second component upper surface and overlapped with circumference where the lower magnetic patch.
3. fetching device according to claim 1, it is characterised in that：The upper magnetic patch is embedded in the first component, institute
The lower surface for stating magnetic patch is flushed with the lower surface of the first component, and the lower magnetic patch is embedded in the second component, described
The upper surface of lower magnetic patch flushes with the upper surface of the second component.
4. fetching device according to claim 1, it is characterised in that：The first component center has axis hole, the axle
Bearing is provided with hole, second component upper surface center has the axle for upwardly extending, and the axle is arranged in the bearing.
5. fetching device according to claim 1, it is characterised in that：The side of the first component has fixed plate, institute
State fixed plate and be provided with mounting hole, the fixed plate is fixed on the vertical lifting mechanism by setting screw in the mounting hole
On.
6. fetching device according to claim 1, it is characterised in that the lower end of the pin is provided with catch bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710104313.5A CN106711079B (en) | 2017-02-24 | 2017-02-24 | Taking and placing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710104313.5A CN106711079B (en) | 2017-02-24 | 2017-02-24 | Taking and placing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711079A true CN106711079A (en) | 2017-05-24 |
| CN106711079B CN106711079B (en) | 2020-06-26 |
Family
ID=58911884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710104313.5A Expired - Fee Related CN106711079B (en) | 2017-02-24 | 2017-02-24 | Taking and placing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106711079B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344647A (en) * | 2005-06-07 | 2006-12-21 | Uinzu:Kk | Part conveyance apparatus and method of housing the same |
| CN101106897A (en) * | 2006-09-27 | 2008-01-16 | 深圳市翠涛自动化设备有限公司 | High-speed picker applying multi-header turning tower structure |
| CN201174380Y (en) * | 2007-11-20 | 2008-12-31 | 七忆科技国际股份有限公司 | Wafer placing and fetching construction |
| CN103457591A (en) * | 2013-08-29 | 2013-12-18 | 青岛歌尔声学科技有限公司 | Rotating reset type adjusting button |
| CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
| US20140212246A1 (en) * | 2013-01-25 | 2014-07-31 | Exis Tech Sdn Bhd | Apparatus for picking, placing and pressing semiconductor components |
| CN104476543A (en) * | 2014-10-30 | 2015-04-01 | 歌尔声学股份有限公司 | Magnet attraction rotation picking and placing device |
| CN104600015A (en) * | 2015-02-11 | 2015-05-06 | 北京中电科电子装备有限公司 | Chip conveying device |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN205011016U (en) * | 2015-09-29 | 2016-02-03 | 广东长盈精密技术有限公司 | Blowing device is got to rotation type |
-
2017
- 2017-02-24 CN CN201710104313.5A patent/CN106711079B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344647A (en) * | 2005-06-07 | 2006-12-21 | Uinzu:Kk | Part conveyance apparatus and method of housing the same |
| CN101106897A (en) * | 2006-09-27 | 2008-01-16 | 深圳市翠涛自动化设备有限公司 | High-speed picker applying multi-header turning tower structure |
| CN201174380Y (en) * | 2007-11-20 | 2008-12-31 | 七忆科技国际股份有限公司 | Wafer placing and fetching construction |
| US20140212246A1 (en) * | 2013-01-25 | 2014-07-31 | Exis Tech Sdn Bhd | Apparatus for picking, placing and pressing semiconductor components |
| CN103457591A (en) * | 2013-08-29 | 2013-12-18 | 青岛歌尔声学科技有限公司 | Rotating reset type adjusting button |
| CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
| CN104476543A (en) * | 2014-10-30 | 2015-04-01 | 歌尔声学股份有限公司 | Magnet attraction rotation picking and placing device |
| CN104600015A (en) * | 2015-02-11 | 2015-05-06 | 北京中电科电子装备有限公司 | Chip conveying device |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN205011016U (en) * | 2015-09-29 | 2016-02-03 | 广东长盈精密技术有限公司 | Blowing device is got to rotation type |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106711079B (en) | 2020-06-26 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200626 Termination date: 20210224 |