CN105280536A - Automatic angle-switching taking and putting machine for chips - Google Patents
Automatic angle-switching taking and putting machine for chips Download PDFInfo
- Publication number
- CN105280536A CN105280536A CN201510595602.0A CN201510595602A CN105280536A CN 105280536 A CN105280536 A CN 105280536A CN 201510595602 A CN201510595602 A CN 201510595602A CN 105280536 A CN105280536 A CN 105280536A
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- chip
- rotating disk
- full
- disk mechanism
- suction nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention relates to an automatic angle-switching taking and putting machine for chips. The machine includes a full-substrate loading line and an empty-substrate loading line which are in parallel and in a reverse direction. A rotating disk mechanism is arranged between the full-substrate loading line and the empty-substrate loading line. Each station on the rotating disk mechanism is provided with a sorption head mechanism for adsorbing the chips. After the full-substrate reaches the station corresponding to the rotating disk mechanism along a loading direction, a main pressing-down motor presses down. A blocking ring is in contact with a lateral compression face of a blocking member. The compression face is blocked by the blocking ring and forced to rotate a certain angle in the driving of the rotation of the rotating disk mechanism. And then the main pressing-down motor continues pressing down to enable a suction nozzle to suck the chips. Later the main pressing-down motor uplifts. The blocking ring is separated from the blocking member. The blocking member and the suction nozzle are reset due to angles of internal magnetic mechanisms. Meanwhile the chips are sucked away from the substrate, and are rotated by a certain angle. The sucked chips are rotated to the station corresponding to the empty-substrate loading line along with the rotating disk mechanism. After the chips move in place under the effect of an auxiliary pressing-down motor, the suction nozzle releases the chips, and the empty-substrate is packed with the chips.
Description
Technical field
The present invention relates to a kind of equipment also switching storing angle for chip loading and unloading, specifically, be that a kind of chip full-automatic angle switches pick-and-place machine, belong to chip mounting technology field.
Background technology
Reaching its maturity of the automated production of assembling along with chip, increasing packing chip is for adapting to actual production line concrete condition, need, along streamline direction, there is certain angles, putting for this chip in prior art, substantially all adopt and manually chip is taken out, again sabot, easily cause the scuffing of chip surface, the inefficiency simultaneously manually picked and placeed, in addition because the human cost of China in recent years improves constantly, then continue to adopt the words of manual work significantly will certainly improve the human cost of enterprise.
Summary of the invention
The technical issues that need to address of the present invention are: for needing putting of the chip of inclination certain angle in prior art, substantially all adopt and taken out by chip manually, sabot again, easily causes the scuffing of chip surface, the inefficiency simultaneously manually picked and placeed, human cost is higher simultaneously.
The present invention takes following technical scheme:
A kind of chip full-automatic angle switches pick-and-place machine, comprises parallel reverse full substrate feeding line and space base plate feeding line, is provided with rotating disk mechanism between the two; Described rotating disk mechanism is positioned at full substrate feeding line side and is provided with and main presses down motor 5, and described master presses down motor 5 and the shelves ring 11 below it can be driven to move up and down; On described rotating disk mechanism, each station is equipped with the sorption head mechanism 4 for adsorbing chip, described sorption head mechanism 4 comprises rotating shaft 4c, suction nozzle 4a, block piece 4b, described block piece 4b and suction nozzle 4a are fixedly connected with up and down and can rotate along described rotating shaft 4c simultaneously, and described rotating shaft 4c has rotation reset response power to block piece 4b and suction nozzle 4a; After full substrate arrives at station corresponding to rotating disk mechanism along its material loading direction, master presses down motor 5 and presses down, shelves ring 11 contacts the compression face 4b1 of block piece 4b side direction, under the rotation of rotating disk mechanism drives, the stop that compression face 4b1 is subject to grade ring 11 is forced to turn an angle, then master presses down motor 5 and continues to press down, suction nozzle 4c is made to be drawn onto chip, master presses down motor 5 and lifts afterwards, shelves ring 11 is separated with block piece 4b, block piece 4b and suction nozzle 4a resets due to the magnetic mechanism angle of inside, and now chip is sucked from substrate, also have rotated certain angle simultaneously; Described rotating disk mechanism is positioned at space base plate feeding line side and is provided with pair and presses down motor 9, station corresponding on space base plate feeding line is turned to rotating disk mechanism by the chip picked up, move down under pair presses down motor 9 effect and put in place, suction nozzle 4a decontrols chip, carries out the sabot of space base plate.
The main feature of the technical program is, have employed the sorption head mechanism 4 of band spinfunction, and leading, pair is shelves ring 11 moving up and down under pressing down the drive of motor, shelves ring can limit the block piece 4b in sorption head mechanism 4, when rotating disk mechanism rotates, block piece 4b is forced to rotate, the suction nozzle 4a below it is driven to turn an angle, now master presses down driven by motor sorption head mechanism 4 and continues to press down, until chip picks up by suction nozzle 4a, after this master presses down motor and upwards resets, also carry out rotation under block piece 4b magnetic action power therein to reset, thus make to be have rotated specific angle by the chip adsorbed, by 180 ° of rotations of rotating disk mechanism, the ad-hoc location of space base plate feeding line over there implements blanking by identical principle.
Further, described compression face 4b1 is plane or curved surface, and its curvature rotational angle needed for chip sets.
Further, the specific station of described full-automatic angle switching pick-and-place machine on rotating disk mechanism is also provided with camera arrangement, and described camera arrangement carries out scratch detection to each chip, and monitoring result is implemented to feed back to Surveillance center.
Further, described full substrate feeding line and space base plate feeding line are positioned at sustained height.
Further, the angle that described suction nozzle 4a rotates is 90 °.
Beneficial effect of the present invention is:
1) make use of the special construction of sorption head mechanism 4 cleverly, utilize the rotational power of rotating disk mechanism and the magnetic resetting active force of sorption head mechanism 4 inside, coordinate and major and minorly press down in good time the pressing down of motor, complete turning to of the certain angle of chip.
2) without extra power source, reliability is high.
3) structure is simple, and it is convenient to implement.
4) achieve the automation mechanized operation that chip turns to rotating disk, greatly reduce labour intensity, save human cost.
5) improve chip sabot quality, cut during sabot can be avoided to produce.
6) automatic monitoring and the monitoring of chip cut is achieved.
7) there are the market prospects of wide popularization and application.
8) manually pick and place compared with chip with present, it is high that automation equipment has efficiency, do not produce cut, can operate continuously for 7*24 hour, and can only arrange 1 operative employee to carry out corresponding whole equipment after use automation equipment, greatly reduce the human cost of enterprise.
Accompanying drawing explanation
Fig. 1 is the stereogram that chip full-automatic angle of the present invention switches pick-and-place machine.
Fig. 2 is the partial enlarged drawing of Fig. 1.
Fig. 3 is the rearview that chip full-automatic angle of the present invention switches pick-and-place machine.
Fig. 4 is the three-dimensional structure diagram of sorption head mechanism.
Fig. 5 is the main isostructural schematic perspective view of shelves ring pressing down motor and bottom thereof.
In figure, 1. full substrate feed mechanism, 2. main workbench, 3. space base plate cutting agency, 4. sorption head mechanism, 5. master presses down motor, 6. fully loaded substrate cutting agency, 7. subtask platform, 8. space base plate feed mechanism, and 9. pair presses down motor, 11. grades of rings.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
See Fig. 1-Fig. 5, a kind of chip full-automatic angle switches pick-and-place machine, comprises parallel reverse full substrate feeding line and space base plate feeding line, is provided with rotating disk mechanism between the two; Described rotating disk mechanism is positioned at full substrate feeding line side and is provided with and main presses down motor 5, and described master presses down motor 5 and the shelves ring 11 below it can be driven to move up and down; On described rotating disk mechanism, each station is equipped with the sorption head mechanism 4 for adsorbing chip, described sorption head mechanism 4 comprises rotating shaft 4c, suction nozzle 4a, block piece 4b, described block piece 4b and suction nozzle 4a are fixedly connected with up and down and can rotate along described rotating shaft 4c simultaneously, and described rotating shaft 4c has rotation reset response power to block piece 4b and suction nozzle 4a; After full substrate arrives at station corresponding to rotating disk mechanism along its material loading direction, master presses down motor 5 and presses down, shelves ring 11 contacts the compression face 4b1 of block piece 4b side direction, under the rotation of rotating disk mechanism drives, the stop that compression face 4b1 is subject to grade ring 11 is forced to turn an angle, then master presses down motor 5 and continues to press down, suction nozzle 4c is made to be drawn onto chip, master presses down motor 5 and lifts afterwards, shelves ring 11 is separated with block piece 4b, block piece 4b and suction nozzle 4a resets due to the magnetic mechanism angle of inside, and now chip is sucked from substrate, also have rotated certain angle simultaneously; Described rotating disk mechanism is positioned at space base plate feeding line side and is provided with pair and presses down motor 9, station corresponding on space base plate feeding line is turned to rotating disk mechanism by the chip picked up, move down under pair presses down motor 9 effect and put in place, suction nozzle 4a decontrols chip, carries out the sabot of space base plate.
Described compression face 4b1 is plane or curved surface, and its curvature rotational angle needed for chip sets.
The specific station of described full-automatic angle switching pick-and-place machine on rotating disk mechanism is also provided with camera arrangement, and described camera arrangement carries out scratch detection to each chip, and monitoring result is implemented to feed back to Surveillance center.
Described full substrate feeding line and space base plate feeding line are positioned at sustained height.
The angle that described suction nozzle 4a rotates is 90 °.
Concrete course of action: first the substrate being placed with chip is put into full substrate feed mechanism 1 place by operative employee, and then by cylinder, substrate is pushed into main workbench 2, locates afterwards and clamp, motor drives whole platform movement to operation starting position.Master presses down motor 5 and drives shelves ring 11 to start toward pressing down afterwards.The head of sorption simultaneously mechanism 4 starts to rotate.When shelves ring 11 contacts with the compression face 4b1 of block piece 4b, due to the compressing of shelves ring 11, swivel head entirety meeting 90-degree rotation, then master presses down motor 5 and continues to press down, and makes the suction nozzle 4a on swivel head be drawn onto chip, and master presses down motor 5 and lifts afterwards, shelves ring 11 is separated with rotation sorption head, swivel head resets due to the magnetic mechanism angle of inside, and now chip is sucked from substrate, also have rotated 90 degree simultaneously.Action before continuing afterwards to repeat, by the chip after next swivel head sorption.When first swivel head forward to pair press down motor 9 place time, pair presses down motor 9 and starts to press down, and is placed into by the chip on first swivel head in the substrate groove on subtask platform 7, final vacuum release, motor lifts, and swivel head and chip depart from, and chip falls into substrate groove.Platform movement, starts to lay next chip.After chip piled by substrate, this substrate is shifted onto 6 fully loaded substrate cutting agency 6 places by cylinder, is put away, then puts empty substrate at space base plate feed mechanism 8 place, then be pushed into subtask platform by cylinder, continue blowing by operative employee.
The present invention make use of the special construction of sorption head mechanism 4 cleverly, utilizes the rotational power of rotating disk mechanism and the magnetic resetting active force of sorption head mechanism 4 inside, coordinates major and minorly to press down in good time the pressing down of motor, completes turning to of the certain angle of chip; Without extra power source, reliability is high; Structure is simple, and it is convenient to implement; Achieve the automation mechanized operation that chip turns to rotating disk, greatly reduce labour intensity, save human cost; Improve chip sabot quality, cut during sabot can be avoided to produce; Achieve automatic monitoring and the monitoring of chip cut; There are the market prospects of wide popularization and application.
Claims (5)
1. chip full-automatic angle switches a pick-and-place machine, it is characterized in that:
Comprise parallel reverse full substrate feeding line and space base plate feeding line, be provided with rotating disk mechanism between the two;
Described rotating disk mechanism is positioned at full substrate feeding line side and is provided with and main presses down motor (5), and described master presses down motor (5) and the shelves ring (11) below it can be driven to move up and down;
On described rotating disk mechanism, each station is equipped with the sorption head mechanism (4) for adsorbing chip, described sorption head mechanism (4) comprises rotating shaft (4c), suction nozzle (4a), block piece (4b), described block piece (4b) and suction nozzle (4a) are fixedly connected with up and down and can rotate along described rotating shaft (4c) simultaneously, and described rotating shaft (4c) has block piece (4b) and suction nozzle (4a) rotates reset response power;
After full substrate arrives at station corresponding to rotating disk mechanism along its material loading direction, master presses down motor (5) and presses down, the compression face (4b1) of shelves ring (11) contact block piece (4b) side direction, under the rotation of rotating disk mechanism drives, the stop that compression face (4b1) is subject to a grade ring (11) is forced to turn an angle, then master presses down motor (5) and continues to press down, suction nozzle (4c) is made to be drawn onto chip, master presses down motor (5) and lifts afterwards, shelves ring (11) are separated with block piece (4b), block piece (4b) and suction nozzle (4a) reset due to the magnetic mechanism angle of inside, now chip is sucked from substrate, also have rotated certain angle simultaneously,
Described rotating disk mechanism is positioned at space base plate feeding line side and is provided with pair and presses down motor (9), station corresponding on space base plate feeding line is turned to rotating disk mechanism by the chip picked up, move down under pair presses down motor (9) effect and put in place, suction nozzle (4a) decontrols chip, carries out the sabot of space base plate.
2. chip full-automatic angle as claimed in claim 1 switches pick-and-place machine, and it is characterized in that: described compression face (4b1) is plane or curved surface, its curvature rotational angle needed for chip sets.
3. chip full-automatic angle as claimed in claim 1 switches pick-and-place machine, it is characterized in that: the specific station of described full-automatic angle switching pick-and-place machine on rotating disk mechanism is also provided with camera arrangement, described camera arrangement carries out scratch detection to each chip, and monitoring result is implemented to feed back to Surveillance center.
4. chip full-automatic angle as claimed in claim 1 switches pick-and-place machine, it is characterized in that: described full substrate feeding line and space base plate feeding line are positioned at sustained height.
5. chip full-automatic angle as claimed in claim 1 switches pick-and-place machine, it is characterized in that: the angle that described suction nozzle (4a) rotates is 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510595602.0A CN105280536B (en) | 2015-09-18 | 2015-09-18 | A kind of chip full-automatic angle switches pick-and-place machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510595602.0A CN105280536B (en) | 2015-09-18 | 2015-09-18 | A kind of chip full-automatic angle switches pick-and-place machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105280536A true CN105280536A (en) | 2016-01-27 |
| CN105280536B CN105280536B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510595602.0A Expired - Fee Related CN105280536B (en) | 2015-09-18 | 2015-09-18 | A kind of chip full-automatic angle switches pick-and-place machine |
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| Country | Link |
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| CN (1) | CN105280536B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN107170699A (en) * | 2017-06-05 | 2017-09-15 | 深圳格兰达智能装备股份有限公司 | A kind of full-automatic chip stripping machine and its method of work |
| CN110223946A (en) * | 2018-03-02 | 2019-09-10 | 台湾爱司帝科技股份有限公司 | Chip fetching device and chip pick-and-place and detection system |
| CN116313910A (en) * | 2023-03-16 | 2023-06-23 | 珠海市硅酷科技有限公司 | Force control laminating head based on air bearing |
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| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| CN104701421A (en) * | 2015-03-20 | 2015-06-10 | 无锡奥特维科技有限公司 | Double discharge mechanism for photovoltaic cell strings |
| CN205004313U (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Machine of putting of getting is switched to full -automatic angle of chip |
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2015
- 2015-09-18 CN CN201510595602.0A patent/CN105280536B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| CN104701421A (en) * | 2015-03-20 | 2015-06-10 | 无锡奥特维科技有限公司 | Double discharge mechanism for photovoltaic cell strings |
| CN205004313U (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Machine of putting of getting is switched to full -automatic angle of chip |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN106711079B (en) * | 2017-02-24 | 2020-06-26 | 爱立发自动化设备（上海）有限公司 | Taking and placing device |
| CN107170699A (en) * | 2017-06-05 | 2017-09-15 | 深圳格兰达智能装备股份有限公司 | A kind of full-automatic chip stripping machine and its method of work |
| CN107170699B (en) * | 2017-06-05 | 2019-07-16 | 深圳格兰达智能装备股份有限公司 | A kind of full-automatic chip stripping machine and its working method |
| CN110223946A (en) * | 2018-03-02 | 2019-09-10 | 台湾爱司帝科技股份有限公司 | Chip fetching device and chip pick-and-place and detection system |
| CN110223946B (en) * | 2018-03-02 | 2022-02-15 | 台湾爱司帝科技股份有限公司 | Wafer taking and placing device and wafer taking and placing and detecting system |
| CN116313910A (en) * | 2023-03-16 | 2023-06-23 | 珠海市硅酷科技有限公司 | Force control laminating head based on air bearing |
| CN116313910B (en) * | 2023-03-16 | 2024-03-26 | 珠海市硅酷科技有限公司 | Force control laminating head based on air bearing |
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| Publication number | Publication date |
|---|---|
| CN105280536B (en) | 2017-10-03 |
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Granted publication date: 20171003 Termination date: 20210918 |