CN106675037A - Aging-resistant and heat-conducting silicone material for computer processor and preparation method of silica gel material - Google Patents
Aging-resistant and heat-conducting silicone material for computer processor and preparation method of silica gel material Download PDFInfo
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- CN106675037A CN106675037A CN201710009329.8A CN201710009329A CN106675037A CN 106675037 A CN106675037 A CN 106675037A CN 201710009329 A CN201710009329 A CN 201710009329A CN 106675037 A CN106675037 A CN 106675037A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention discloses an aging-resistant and heat-conducting silicone material for a computer processor. The silicone material is prepared from raw materials in parts by weight as follows: 45-52 parts of divinyl silicone oil, 4-8 parts of vinyl trimethoxysilane, 5-9 parts of aluminum powder, 12-17 parts of copper powder, 2-5 parts of magnesium oxide, 1-3 parts of sodium sulfate, 7-10 parts of polymethylhydrosiloxane, 3-7 parts of titanium dioxide, 6-10 parts of dipyrrolidone silane, 5-9 parts of pentaerythritol, 1-3 parts of a vulcanizing agent and 1-2 parts of chloroplatinic acid. The invention further discloses a preparation method of the aging-resistant and heat-conducting silicone material for the computer processor. The prepared heat-conducting silicone material has a good heat conducting property, has excellent aging resistance, cannot age easily when used in the high-temperature environment for a long time, and guarantees normal heat dissipation of the computer processor.
Description
Technical field
The present invention relates to heat conductive silica gel technical field, specifically a kind of computer processor is with ageing-resistant heat conductive silica gel material
And preparation method thereof.
Background technology
Computer processor is to explain the functional unit with execute instruction, also referred to as central processing unit or cpu, and it is to calculate
The equipment for being referred to as peripheral hardware around the central nervous system of machine, with processor and internal memory is contrasted, such as keyboard, display, magnetic
Disk, magnetic tape controller etc. are all peripheral hardwares.Each processor has the operational order of a set of uniqueness, can be described as the instruction set of processor,
Such as store, call in or the like is all operational order.
Computer processor can generate heat in a large number at work, if cooling measure is improper component temperature can be made too high, cause it
Service behaviour declines even to be damaged.Accordingly, it would be desirable to install heat abstractor, such as radiator fan or copper billet on a computer processor
Deng, heat conductive silica gel would generally be filled between heat abstractor and computer processor, fill for promoting computer processor and radiating
Heat transfer between putting.There are catabiosis during life-time service, easily in existing heat conductive silica gel, causes heat conductivility
Decline, affect the proper heat reduction of computer processor.
The content of the invention
It is an object of the invention to provide a kind of computer processor ageing-resistant heat conductive silica gel material and preparation method thereof,
Propose in solve the problems, such as above-mentioned background technology.
For achieving the above object, the present invention provides following technical scheme:
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
Thiazolinyl silicone oil 45-52 parts, vinyltrimethoxy silane 4-8 parts, aluminium powder 5-9 parts, copper powder 12-17 parts, magnesium oxide 2-5 parts, sulfur
Sour sodium 1-3 parts, polymethyl hydrogen siloxane 7-10 parts, titanium dioxide 3-7 parts, double ketopyrrolidine silane 6-10 parts, tetramethylolmethane 5-9
Part, vulcanizing agent 1-3 parts, chloroplatinic acid 1-2 parts.
As further scheme of the invention:It is made up of the following raw material according to weight portion:Divinyl silicone oil 46-51
Part, vinyltrimethoxy silane 5-7 parts, aluminium powder 6-8 parts, copper powder 13-16 parts, magnesium oxide 3-4 parts, sodium sulfate 1.2-2.8 parts,
Polymethyl hydrogen siloxane 8-9 parts, titanium dioxide 4-6 parts, double ketopyrrolidine silane 7-9 parts, tetramethylolmethane 6-8 parts, vulcanizing agent 1.3-
2.7 parts, chloroplatinic acid 1.2-1.7 parts.
As further scheme of the invention:It is made up of the following raw material according to weight portion:49 parts of divinyl silicone oil,
6 parts of vinyltrimethoxy silane, 7 parts of aluminium powder, 15 parts of copper powder, 3.5 parts of magnesium oxide, 1.9 parts of sodium sulfate, polymethyl hydrogen siloxane
8.6 parts, 5 parts of titanium dioxide, 8 parts of double ketopyrrolidine silane, 7 parts of tetramethylolmethane, 2.1 parts of vulcanizing agent, 1.4 parts of chloroplatinic acid.
The computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 2-5h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stirred at 80-85 DEG C
Mixing 20-30min, obtains compound A;
3) banbury is cooled to into 72-75 DEG C, ball milling material is added into banbury, mixing process 20-30min, obtained
Compound B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
10-15min is continued with 65-70 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, at 60-63 DEG C 20-30min is continued with, mixed
Close material D;
6) it is compound D is thin logical 4-6 time, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 25-30min at 105-110 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
Compared with prior art, the invention has the beneficial effects as follows:
The ageing-resistant heat conductive silica gel material of computer processor prepared by the present invention not only has good heat conductivility, and
And with excellent ageing-resistant performance, in high temperature environments during life-time service, it is less prone to catabiosis, it is ensured that heat conduction
Performance, also ensure that the proper heat reduction of computer processor.The ageing-resistant heat conductive silica gel of computer processor prepared by the present invention
Material has a good market prospect, and can large-scale production, be easy to promote the use of on a large scale.
Specific embodiment
Technical scheme is described in more detail with reference to specific embodiment.
Embodiment 1
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
45 parts of thiazolinyl silicone oil, 4 parts of vinyltrimethoxy silane, 5 parts of aluminium powder, 12 parts of copper powder, 2 parts of magnesium oxide, 1 part of sodium sulfate, poly- first
7 parts of base hydrogen siloxane, 3 parts of titanium dioxide, 6 parts of double ketopyrrolidine silane, 5 parts of tetramethylolmethane, 1 part of vulcanizing agent, 1 part of chloroplatinic acid.
In the present embodiment, the computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 2h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stir mixed at 80 DEG C
20min is closed, compound A is obtained;
3) banbury is cooled to into 72 DEG C, ball milling material is added into banbury, mixing process 20min, obtain compound
B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
10min is continued with 65 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 20min is continued with 60 DEG C, obtain compound D;
6) it is compound D is thin logical 4 times, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 25min at 105 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
Embodiment 2
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
It is 46 parts of thiazolinyl silicone oil, 5 parts of vinyltrimethoxy silane, 6 parts of aluminium powder, 16 parts of copper powder, 4 parts of magnesium oxide, 2.8 parts of sodium sulfate, poly-
8 parts of methyl hydrogen siloxane, 4 parts of titanium dioxide, 9 parts of double ketopyrrolidine silane, 8 parts of tetramethylolmethane, 1.3 parts of vulcanizing agent, chloroplatinic acid 1.7
Part.
In the present embodiment, the computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 2.5h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stir mixed at 81 DEG C
22min is closed, compound A is obtained;
3) banbury is cooled to into 73 DEG C, ball milling material is added into banbury, mixing process 25min, obtain compound
B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
10min is continued with 67 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 23min is continued with 60 DEG C, obtain compound D;
6) it is compound D is thin logical 5 times, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 28min at 107 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
Embodiment 3
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
49 parts of thiazolinyl silicone oil, 6 parts of vinyltrimethoxy silane, 7 parts of aluminium powder, 15 parts of copper powder, 3.5 parts of magnesium oxide, 1.9 parts of sodium sulfate,
8.6 parts of polymethyl hydrogen siloxane, 5 parts of titanium dioxide, 8 parts of double ketopyrrolidine silane, 7 parts of tetramethylolmethane, 2.1 parts of vulcanizing agent, chlorine platinum
1.4 parts of acid.
In the present embodiment, the computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 3.5h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stir mixed at 83 DEG C
25min is closed, compound A is obtained;
3) banbury is cooled to into 74 DEG C, ball milling material is added into banbury, mixing process 25min, obtain compound
B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
12min is continued with 68 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 25min is continued with 62 DEG C, obtain compound D;
6) it is compound D is thin logical 5 times, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 28min at 107 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
Embodiment 4
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
It is 51 parts of thiazolinyl silicone oil, 7 parts of vinyltrimethoxy silane, 8 parts of aluminium powder, 13 parts of copper powder, 3 parts of magnesium oxide, 1.2 parts of sodium sulfate, poly-
9 parts of methyl hydrogen siloxane, 6 parts of titanium dioxide, 7 parts of double ketopyrrolidine silane, 6 parts of tetramethylolmethane, 2.7 parts of vulcanizing agent, chloroplatinic acid 1.2
Part.
In the present embodiment, the computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 4h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stir mixed at 85 DEG C
27min is closed, compound A is obtained;
3) banbury is cooled to into 75 DEG C, ball milling material is added into banbury, mixing process 25min, obtain compound
B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
15min is continued with 65 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 27min is continued with 60 DEG C, obtain compound D;
6) it is compound D is thin logical 6 times, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 30min at 108 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
Embodiment 5
A kind of computer processor is made up with ageing-resistant heat conductive silica gel material of the following raw material according to weight portion:Diethyl
52 parts of thiazolinyl silicone oil, 8 parts of vinyltrimethoxy silane, 9 parts of aluminium powder, 17 parts of copper powder, 5 parts of magnesium oxide, 3 parts of sodium sulfate, poly- first
10 parts of base hydrogen siloxane, 7 parts of titanium dioxide, 10 parts of double ketopyrrolidine silane, 9 parts of tetramethylolmethane, 3 parts of vulcanizing agent, 2 parts of chloroplatinic acid.
In the present embodiment, the computer processor preparation method of ageing-resistant heat conductive silica gel material, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 5h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, stir mixed at 85 DEG C
30min is closed, compound A is obtained;
3) banbury is cooled to into 75 DEG C, ball milling material is added into banbury, mixing process 30min, obtain compound
B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, are added into banbury,
15min is continued with 70 DEG C, compound C is obtained;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 30min is continued with 63 DEG C, obtain compound D;
6) it is compound D is thin logical 6 times, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 30min at 110 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
The heat conductive silica gel material prepared using the present invention carries out performance test, measures its material property parameter as follows:Thermal conductivity
Rate 5.3W/m.K, the average rate of decrease of artificial accelerated aging (90 DEG C, 120 days) Tensile strength is 4.3%, elongation at break
Average rate of decrease is 3.5%.
The ageing-resistant heat conductive silica gel material of computer processor prepared by the present invention not only has good heat conductivility, and
And with excellent ageing-resistant performance, in high temperature environments during life-time service, it is less prone to catabiosis, it is ensured that heat conduction
Performance, also ensure that the proper heat reduction of computer processor.The ageing-resistant heat conductive silica gel of computer processor prepared by the present invention
Material has a good market prospect, and can large-scale production, be easy to promote the use of on a large scale.
The better embodiment of the present invention is explained in detail above, but the present invention is not limited to above-mentioned embodiment party
Formula, in the ken that one skilled in the relevant art possesses, can be with the premise of without departing from present inventive concept
Various changes can be made.
Claims (4)
1. a kind of computer processor is with ageing-resistant heat conductive silica gel material, it is characterised in that by the following raw material according to weight portion
Make:Divinyl silicone oil 45-52 parts, vinyltrimethoxy silane 4-8 parts, aluminium powder 5-9 parts, copper powder 12-17 parts, magnesium oxide
2-5 parts, sodium sulfate 1-3 parts, polymethyl hydrogen siloxane 7-10 parts, titanium dioxide 3-7 parts, double ketopyrrolidine silane 6-10 parts, season penta
Tetrol 5-9 parts, vulcanizing agent 1-3 parts, chloroplatinic acid 1-2 parts.
2. computer processor according to claim 1 is with ageing-resistant heat conductive silica gel material, it is characterised in that pressed by following
Make according to the raw material of weight portion:Divinyl silicone oil 46-51 parts, vinyltrimethoxy silane 5-7 parts, aluminium powder 6-8 parts, copper powder
13-16 parts, magnesium oxide 3-4 parts, sodium sulfate 1.2-2.8 parts, polymethyl hydrogen siloxane 8-9 parts, titanium dioxide 4-6 parts, double pyrrolidines
Ketone silane 7-9 parts, tetramethylolmethane 6-8 parts, vulcanizing agent 1.3-2.7 parts, chloroplatinic acid 1.2-1.7 parts.
3. computer processor according to claim 2 is with ageing-resistant heat conductive silica gel material, it is characterised in that pressed by following
Make according to the raw material of weight portion:49 parts of divinyl silicone oil, 6 parts of vinyltrimethoxy silane, 7 parts of aluminium powder, 15 parts of copper powder, oxygen
Change 3.5 parts of magnesium, 1.9 parts of sodium sulfate, 8.6 parts of polymethyl hydrogen siloxane, 5 parts of titanium dioxide, 8 parts of double ketopyrrolidine silane, Ji Wusi
7 parts of alcohol, 2.1 parts of vulcanizing agent, 1.4 parts of chloroplatinic acid.
4. a kind of computer processor as described in claim 1-3 is arbitrary preparation method of ageing-resistant heat conductive silica gel material,
Characterized in that, step is as follows:
1) aluminium powder, copper powder, magnesium oxide, titanium dioxide are weighed, after merging, ball milling mixing 2-5h obtains ball milling material;
2) divinyl silicone oil and vinyltrimethoxy silane are weighed, is added into banbury, the stirring mixing at 80-85 DEG C
20-30min, obtains compound A;
3) banbury is cooled to into 72-75 DEG C, ball milling material is added into banbury, mixing process 20-30min is mixed
Material B;
4) polymethyl hydrogen siloxane, double ketopyrrolidine silane, tetramethylolmethane and chloroplatinic acid are weighed, is added into banbury, in 65-
70 DEG C continue with 10-15min, obtain compound C;
5) sodium sulfate and vulcanizing agent are weighed, is added into banbury, 20-30min is continued with 60-63 DEG C, obtain compound
D;
6) it is compound D is thin logical 4-6 time, obtain compound E;
7) compound E is sent in vulcanizer, vulcanizing treatment 25-30min at 105-110 DEG C, obtains sulfuration material;
8) sulfuration material is sent in mould and is solidified, after the demoulding, you can.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107236236A (en) * | 2017-08-02 | 2017-10-10 | 合肥东恒锐电子科技有限公司 | A kind of preparation method of Novel anti-ageing material for computer processor |
CN108587184A (en) * | 2018-04-16 | 2018-09-28 | 合肥民众亿兴软件开发有限公司 | A kind of computer processor ageing-resistant heat conductive silica gel material and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101985519A (en) * | 2010-11-03 | 2011-03-16 | 烟台德邦电子材料有限公司 | Moulded-in-place high molecular thermal conductive composite material and preparation method thereof |
CN105315414A (en) * | 2015-10-28 | 2016-02-10 | 苏州天脉导热科技有限公司 | Preparation method for phase-change heat conduction silicon sheet |
CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
-
2017
- 2017-01-06 CN CN201710009329.8A patent/CN106675037A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101985519A (en) * | 2010-11-03 | 2011-03-16 | 烟台德邦电子材料有限公司 | Moulded-in-place high molecular thermal conductive composite material and preparation method thereof |
CN105315414A (en) * | 2015-10-28 | 2016-02-10 | 苏州天脉导热科技有限公司 | Preparation method for phase-change heat conduction silicon sheet |
CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107236236A (en) * | 2017-08-02 | 2017-10-10 | 合肥东恒锐电子科技有限公司 | A kind of preparation method of Novel anti-ageing material for computer processor |
CN108587184A (en) * | 2018-04-16 | 2018-09-28 | 合肥民众亿兴软件开发有限公司 | A kind of computer processor ageing-resistant heat conductive silica gel material and preparation method thereof |
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