CN106674911A - 一种半导体封装用高粘接环氧塑封料 - Google Patents
一种半导体封装用高粘接环氧塑封料 Download PDFInfo
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- CN106674911A CN106674911A CN201611252886.4A CN201611252886A CN106674911A CN 106674911 A CN106674911 A CN 106674911A CN 201611252886 A CN201611252886 A CN 201611252886A CN 106674911 A CN106674911 A CN 106674911A
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- epoxy
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- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
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CN201611252886.4A CN106674911B (zh) | 2016-12-30 | 2016-12-30 | 一种半导体封装用高粘接环氧塑封料 |
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CN201611252886.4A CN106674911B (zh) | 2016-12-30 | 2016-12-30 | 一种半导体封装用高粘接环氧塑封料 |
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CN106674911A true CN106674911A (zh) | 2017-05-17 |
CN106674911B CN106674911B (zh) | 2019-06-07 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108192285A (zh) * | 2017-12-23 | 2018-06-22 | 汕头市骏码凯撒有限公司 | 一种光学led封装用高粘结环氧塑封料及其制备方法 |
CN109111686A (zh) * | 2017-06-26 | 2019-01-01 | 美的智慧家居科技有限公司 | 封装用塑料组合物及其应用 |
CN109535612A (zh) * | 2018-12-06 | 2019-03-29 | 南阳医学高等专科学校 | 一种计算机用芯片封装材料及其制备方法 |
CN109825170A (zh) * | 2019-02-22 | 2019-05-31 | 天津凯华绝缘材料股份有限公司 | 一种耐高温环氧粉末组合物及其制备方法 |
CN112724603A (zh) * | 2020-12-29 | 2021-04-30 | 江苏科化新材料科技有限公司 | 一种半导体封装用高可靠性环氧塑封料 |
CN114456755A (zh) * | 2021-12-30 | 2022-05-10 | 江苏科化新材料科技有限公司 | 环氧树脂组合物及其制备方法和应用 |
CN115260954A (zh) * | 2022-05-24 | 2022-11-01 | 江苏华海诚科新材料股份有限公司 | 适用于半导体封装的无硫环氧树脂组合物与用途 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101851386A (zh) * | 2009-04-01 | 2010-10-06 | 汉高(中国)投资有限公司 | 一种环氧树脂组合物 |
CN103421272A (zh) * | 2012-05-22 | 2013-12-04 | 汉高华威电子有限公司 | 一种电子封装用环氧树脂组合物及其制备方法 |
WO2016103836A1 (ja) * | 2014-12-24 | 2016-06-30 | 信越化学工業株式会社 | イソシアネート基含有有機ケイ素化合物、その製造方法、接着剤、粘着剤およびコーティング剤 |
CN105732987A (zh) * | 2014-12-24 | 2016-07-06 | 信越化学工业株式会社 | 含有异氰酸酯基的有机聚硅氧烷化合物、其制造方法、粘接剂、压敏粘合剂和涂布剂 |
-
2016
- 2016-12-30 CN CN201611252886.4A patent/CN106674911B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101851386A (zh) * | 2009-04-01 | 2010-10-06 | 汉高(中国)投资有限公司 | 一种环氧树脂组合物 |
CN103421272A (zh) * | 2012-05-22 | 2013-12-04 | 汉高华威电子有限公司 | 一种电子封装用环氧树脂组合物及其制备方法 |
WO2016103836A1 (ja) * | 2014-12-24 | 2016-06-30 | 信越化学工業株式会社 | イソシアネート基含有有機ケイ素化合物、その製造方法、接着剤、粘着剤およびコーティング剤 |
CN105732987A (zh) * | 2014-12-24 | 2016-07-06 | 信越化学工业株式会社 | 含有异氰酸酯基的有机聚硅氧烷化合物、其制造方法、粘接剂、压敏粘合剂和涂布剂 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109111686A (zh) * | 2017-06-26 | 2019-01-01 | 美的智慧家居科技有限公司 | 封装用塑料组合物及其应用 |
CN109111686B (zh) * | 2017-06-26 | 2020-09-15 | 美的智慧家居科技有限公司 | 封装用塑料组合物及其应用 |
CN108192285A (zh) * | 2017-12-23 | 2018-06-22 | 汕头市骏码凯撒有限公司 | 一种光学led封装用高粘结环氧塑封料及其制备方法 |
CN109535612A (zh) * | 2018-12-06 | 2019-03-29 | 南阳医学高等专科学校 | 一种计算机用芯片封装材料及其制备方法 |
CN109825170A (zh) * | 2019-02-22 | 2019-05-31 | 天津凯华绝缘材料股份有限公司 | 一种耐高温环氧粉末组合物及其制备方法 |
CN112724603A (zh) * | 2020-12-29 | 2021-04-30 | 江苏科化新材料科技有限公司 | 一种半导体封装用高可靠性环氧塑封料 |
CN114456755A (zh) * | 2021-12-30 | 2022-05-10 | 江苏科化新材料科技有限公司 | 环氧树脂组合物及其制备方法和应用 |
CN114456755B (zh) * | 2021-12-30 | 2024-03-12 | 江苏中科科化新材料股份有限公司 | 环氧树脂组合物及其制备方法和应用 |
CN115260954A (zh) * | 2022-05-24 | 2022-11-01 | 江苏华海诚科新材料股份有限公司 | 适用于半导体封装的无硫环氧树脂组合物与用途 |
CN115260954B (zh) * | 2022-05-24 | 2024-05-28 | 江苏华海诚科新材料股份有限公司 | 适用于半导体封装的无硫环氧树脂组合物与用途 |
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CN106674911B (zh) | 2019-06-07 |
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Address after: No.70, Meilan East Road, hailing Industrial Park, Taizhou City, Jiangsu Province Patentee after: Jiangsu Kehua New Material Technology Co.,Ltd. Address before: 225300, No. 76, Meilan East Road, Hailing District, Jiangsu, Taizhou Patentee before: KEHUA NEW MATERIALS TAIZHOU Co.,Ltd. |
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Address after: No.70, Meilan East Road, hailing Industrial Park, Taizhou City, Jiangsu Province 225300 Patentee after: Jiangsu Sinopec New Materials Co.,Ltd. Address before: No.70, Meilan East Road, hailing Industrial Park, Taizhou City, Jiangsu Province 225300 Patentee before: Jiangsu Kehua New Material Technology Co.,Ltd. |
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