CN106634775B - High-temperature-resistant conductive silver adhesive - Google Patents
High-temperature-resistant conductive silver adhesive Download PDFInfo
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- CN106634775B CN106634775B CN201710014151.6A CN201710014151A CN106634775B CN 106634775 B CN106634775 B CN 106634775B CN 201710014151 A CN201710014151 A CN 201710014151A CN 106634775 B CN106634775 B CN 106634775B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a high-temperature-resistant conductive silver adhesive which is prepared from the following components in parts by weight: 80-90 parts of main resin, 50-60 parts of reactive diluent monomer, 22-35 parts of conductive filler, 5-8 parts of photoinitiator, 15-25 parts of wear-resisting agent, 10-15 parts of flatting agent, 10-15 parts of defoaming agent, 10-15 parts of thickening agent and 8-12 parts of light stabilizer. Compared with the commercially available products, the high-temperature-resistant conductive silver adhesive provided by the invention is short in curing time, low in volume resistivity, high in bonding strength and good in wear resistance. And (3) observing the sample at the high temperature of 300-400 ℃, wherein the surface of the sample is unchanged and has the characteristic of high temperature resistance. The volume resistivity and the bonding strength of the sample are basically unchanged after cold and hot impact for 300 times at the temperature of between 40 ℃ below zero and 200 ℃. The volume resistivity and the bonding strength of the sample are not substantially changed after high-temperature and high-humidity aging.
Description
Technical Field
The invention relates to a high-temperature-resistant conductive silver adhesive, and particularly belongs to the technical field of conductive adhesives.
Background
In the traditional electronic product connection process, lead solder is mainly adopted. With the deep understanding of people on the toxicity of lead and the increasing concern of people on the aspects of environmental protection and self health, the lead-containing solder is gradually replaced by the lead-free solder, but the lead-free solder also has the technical problems that the solderability of the solder is poorer, the welding temperature is higher and the like, which cannot be overcome in the industry. With the continuous development of the adhesive technology, the conductive adhesive with low connection temperature, high connection reliability and good environmental protection is more and more emphasized by people, and is expected to become a new generation of mainstream products in the electronic product connection industry.
The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and generally takes matrix resin and conductive filler, namely conductive particles as main components, and the conductive particles are combined together through the bonding action of the matrix resin to form a conductive path so as to realize the conductive connection of the bonded materials. The matrix resin of the conductive adhesive is an adhesive, so that the conductive adhesive can be bonded by selecting a proper curing temperature, and meanwhile, the conductive adhesive can be made into slurry to realize high linear resolution due to the rapid development of miniaturization and microminiaturization of electronic elements and high density and high integration of printed circuit boards. And the conductive adhesive has simple process and easy operation, and can improve the production efficiency, so the conductive adhesive is an ideal choice for replacing lead-tin welding to realize conductive connection. The conventional conductive silver adhesive is conductive silver adhesive, but the conductivity of the conventional conductive silver adhesive is unstable when the conventional conductive silver adhesive is used in a part of high-temperature environments, so that the research on the conductive silver adhesive capable of resisting high temperature is particularly necessary.
Disclosure of Invention
In order to solve the defects of the prior art, the invention aims to provide the high-temperature-resistant conductive silver adhesive which has good conductivity and high-temperature resistance.
In order to achieve the above object, the present invention adopts the following technical solutions:
the high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 80-90 parts of main resin, 50-60 parts of active diluent monomer, 22-35 parts of conductive filler, 5-8 parts of photoinitiator, 15-25 parts of wear-resisting agent, 10-15 parts of flatting agent, 10-15 parts of defoaming agent, 10-15 parts of toughening agent and 8-12 parts of light stabilizer.
Further, the high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 85-90 parts of main resin, 55-60 parts of active diluent monomer, 22-30 parts of conductive filler, 5-8 parts of photoinitiator, 15-20 parts of wear-resisting agent, 12-15 parts of flatting agent, 10-13 parts of defoaming agent, 10-13 parts of toughening agent and 8-10 parts of light stabilizer.
Preferably, the high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 86 parts of main resin, 58 parts of active diluent monomer, 25 parts of conductive filler, 6 parts of photoinitiator, 18 parts of wear-resistant agent, 14 parts of flatting agent, 12 parts of defoaming agent, 11 parts of toughening agent and 9 parts of light stabilizer.
In the high-temperature-resistant conductive silver adhesive, the main resin is phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2-3: 3-5: 1.
In the high-temperature-resistant conductive silver adhesive, the reactive diluent monomer is one or two of neopentyl glycol diglycidyl ether, allyl glycidyl ether, resorcinol diglycidyl ether or ethyl acrylate.
In the high-temperature-resistant conductive silver adhesive, the conductive filler is silver nanowires and nano silver powder in a mass ratio of 1: 2, the diameters of the silver nanowires are 65-80 nm, and the lengths of the silver nanowires are 40-50 microns; the particle size of the nano silver powder is 40 nm-50 nm.
In the high-temperature resistant conductive silver adhesive, the photoinitiator is benzoin isopropyl ether; the light stabilizer is 2-methyl-2-nitrosomethane or phenyl-N-tert-butyl nitrone.
In the high-temperature resistant conductive silver adhesive, the wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent.
In the high-temperature resistant conductive silver adhesive, the defoaming agent is polyoxypropylene glycerol ether or polyoxypropylene; the toughening agent is amino-terminated liquid nitrile rubber or liquid polyurethane.
The invention has the advantages that: compared with the commercially available products, the high-temperature-resistant conductive silver adhesive provided by the invention is short in curing time, low in volume resistivity, high in bonding strength and good in wear resistance. And (3) observing the sample at the high temperature of 300-400 ℃, wherein the surface of the sample is unchanged and has the characteristic of high temperature resistance. The volume resistivity and the bonding strength of the sample are basically unchanged after cold and hot impact for 300 times at the temperature of between 40 ℃ below zero and 200 ℃. After aging at high temperature and high humidity, the volume resistivity and the bonding strength of the sample are basically unchanged, which shows that the product has good weather resistance and can be suitable for different working environments. The conductive filler adopts the mixture of the silver nanowires and the silver nanopowder in a specific proportion, so that the volume resistivity and the bonding strength of the product are ensured to be low, and the production cost is effectively saved.
Detailed Description
The invention is further described with reference to specific examples.
Example 1
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 80 parts of main resin, 50 parts of active diluent monomer, 22 parts of conductive filler, 5 parts of photoinitiator, 15 parts of wear-resistant agent, 10 parts of flatting agent, 15 parts of defoaming agent, 10 parts of toughening agent and 8 parts of light stabilizer. The main resin is phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2: 3: 1. The reactive diluent monomer is neopentyl glycol diglycidyl ether. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameter of each silver nanowire is 65nm, and the length of each silver nanowire is 40 micrometers; the particle size of the nano silver powder is 50 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is 2-methyl-2-nitrosomethane. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene glycerol ether; the toughening agent is amino-terminated liquid nitrile rubber.
Example 2
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 90 parts of main resin, 60 parts of active diluent monomer, 35 parts of conductive filler, 8 parts of photoinitiator, 25 parts of wear-resistant agent, 15 parts of flatting agent, 10 parts of defoaming agent, 15 parts of toughening agent and 12 parts of light stabilizer. The main resin is phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 3: 5: 1. The reactive diluent monomer is allyl glycidyl ether. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameter of each silver nanowire is 80nm, and the length of each silver nanowire is 50 micrometers; the particle size of the nano silver powder is 40 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is phenyl-N-tert-butyl nitrone. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene; the toughening agent is liquid polyurethane.
Example 3
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 86 parts of main resin, 58 parts of active diluent monomer, 25 parts of conductive filler, 6 parts of photoinitiator, 18 parts of wear-resistant agent, 14 parts of flatting agent, 12 parts of defoaming agent, 11 parts of toughening agent and 9 parts of light stabilizer. The main resin comprises phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2.5: 4: 1. The reactive diluent monomer is resorcinol diglycidyl ether. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameter of each silver nanowire is 70nm, and the length of each silver nanowire is 45 micrometers; the particle size of the nano silver powder is 45 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is 2-methyl-2-nitrosomethane. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene glycerol ether; the toughening agent is amino-terminated liquid nitrile rubber.
Example 4
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 85 parts of main resin, 55 parts of active diluent monomer, 30 parts of conductive filler, 7 parts of photoinitiator, 20 parts of wear-resistant agent, 12 parts of flatting agent, 13 parts of defoaming agent, 13 parts of toughening agent and 10 parts of light stabilizer. The main resin comprises phenolic resin, polyurethane resin and acrylic resin at a mass ratio of 2: 3.5: 1. The reactive diluent monomer is ethyl acrylate. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameters of the silver nanowires are 65-68 nm, and the lengths of the silver nanowires are 40-42 mu m; the particle size of the nano silver powder is 42 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is phenyl-N-tert-butyl nitrone. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene; the toughening agent is liquid polyurethane.
Example 5
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 85-90 parts of main resin, 56 parts of reactive diluent monomer, 23 parts of conductive filler, 6 parts of photoinitiator, 16 parts of wear-resistant agent, 13 parts of flatting agent, 11 parts of defoaming agent, 12 parts of toughening agent and 9 parts of light stabilizer. The main resin comprises phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2.8: 4.5: 1. The reactive diluent monomers are neopentyl glycol diglycidyl ether and allyl glycidyl ether. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameter of each silver nanowire is 75nm, and the length of each silver nanowire is 48 mu m; the particle size of the nano silver powder is 48 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is phenyl-N-tert-butyl nitrone. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene; the toughening agent is amino-terminated liquid nitrile rubber.
Example 6
The high-temperature-resistant conductive silver adhesive is prepared from the following components in parts by weight: 85-90 parts of main resin, 57 parts of active diluent monomer, 28 parts of conductive filler, 5 parts of photoinitiator, 17 parts of wear-resistant agent, 15 parts of flatting agent, 13 parts of defoaming agent, 11 parts of toughening agent and 8 parts of light stabilizer. The main resin comprises phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2.2: 4.3: 1. The reactive diluent monomers are allyl glycidyl ether and resorcinol diglycidyl ether at a mass ratio of 1: 2. The conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameter of each silver nanowire is 70nm, and the length of each silver nanowire is 40 micrometers; the particle size of the nano silver powder is 46 nm. The photoinitiator is benzoin isopropyl ether; the light stabilizer is 2-methyl-2-nitrosomethane. The wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent. The defoaming agent is polyoxypropylene glycerol ether; the toughening agent is liquid polyurethane.
In examples 1 to 6, the reactive diluent monomer is one or two of neopentyl glycol diglycidyl ether, allyl glycidyl ether, resorcinol diglycidyl ether, and ethyl acrylate.
The high-temperature-resistant conductive silver adhesive in the embodiments 1 to 6 is prepared by the following method: the main resin, the active dilution monomer, the photoinitiator, the wear-resisting agent, the flatting agent, the defoaming agent, the toughening agent and the light stabilizer are weighed according to the weight and are dispersed at a high speed, and after the materials are uniformly stirred, the conductive filler is added, and the materials are uniformly mixed by a three-roll mill to obtain the high-performance high-density polyethylene.
In order to ensure the science, the reasonability and the effectiveness of the technical scheme of the invention, the inventor carries out a series of experimental researches.
The performance test was carried out by the following method using the conductive silver paste of examples 1 to 6, the commercial product and comparative examples 1 to 2. Wherein the content of the first and second substances,
comparative example 1: the difference from example 3 is that: the conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 1, the diameter of each silver nanowire is 50nm, and the length of each silver nanowire is 30 micrometers; the particle size of the nano silver powder is 30 nm.
Comparative example 2: the difference from example 3 is that: the conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 3, the diameter of each silver nanowire is 85nm, and the length of each silver nanowire is 55 micrometers; the particle size of the nano silver powder is 60 nm.
1. Test method
1.1, volume resistivity: the prepared sample is uniformly coated between two glass sheets on an organic glass plate wiped by absolute ethyl alcohol, and the mixture is cured at room temperature. And testing by adopting a four-electrode resistance testing method.
1.2, bonding strength test: the bonding strength sample takes conductive silver adhesive as a bonding agent, an aluminum sheet as a substrate and a single-side lap joint test piece as a sample. The bonding strength test is carried out on a microcomputer controlled electronic universal testing machine.
1.3, curing time: and testing the time for the volume resistivity and the bonding strength of the conductive silver adhesive to reach stability.
1.4, abrasiveness: the films were not abraded as tested in GB/T15036.2-2001.
1.5, high temperature resistance: and (3) observing the sample at the high temperature of 300-400 ℃.
1.6, cold and hot impact experiment: the experimental temperature is-40-200 ℃, the cold and hot impact frequency is 300 times, and the volume resistivity and the bonding strength of the sample are tested.
1.7, high-temperature and high-humidity aging experiment: the experimental temperature is 90 ℃, the humidity is 90% RH, the aging time is 200h, and the volume resistivity and the bonding strength of the test sample are tested.
2. Test results
2.1, and examples 1 to 6, the results of the performance test are shown in tables 1 and 2.
TABLE 1
TABLE 2
As can be seen from tables 1 and 2, compared with the commercial products, the high temperature resistant conductive silver paste of the present invention has the advantages of short curing time, low volume resistivity, high bonding strength and good wear resistance. And (3) observing the sample at the high temperature of 300-400 ℃, wherein the surface of the sample is unchanged. The volume resistivity and the bonding strength of the system are not basically influenced by cold and hot impact. The volume resistivity and the bonding strength of the sample are not substantially changed after high-temperature and high-humidity aging.
2.2 comparative example test results, as shown in table 3.
TABLE 3
| Sample (I) | Volume resistivity (10)-4Ω/cm) | Adhesive Strength (MPa) |
| Comparative example 1 | 1.3 | 25.8 |
| Comparative example 2 | 2.1 | 26.9 |
| Example 3 | 0.21 | 35.2 |
As can be seen from table 2, the conductive paste obtained by using the conductive particles of the present invention has excellent properties. The conductive particles are combined with other raw materials to achieve the optimal adaptation effect, and the obtained product has low volume resistivity and high bonding strength.
Claims (7)
1. The high-temperature-resistant conductive silver adhesive is characterized in that: the composition is prepared from the following components in parts by weight:
85-90 parts of main resin, 55-60 parts of active diluent monomer, 22-30 parts of conductive filler, 5-8 parts of photoinitiator, 15-20 parts of wear-resisting agent, 12-15 parts of flatting agent, 10-13 parts of defoaming agent, 10-13 parts of toughening agent and 8-10 parts of light stabilizer; the conductive filler is silver nanowires and nano silver powder according to the mass ratio of 1: 2, the diameters of the silver nanowires are 65-80 nm, and the lengths of the silver nanowires are 40-50 mu m; the particle size of the nano silver powder is 40 nm-50 nm.
2. The high-temperature-resistant conductive silver paste according to claim 1, wherein: the composition is prepared from the following components in parts by weight: 86 parts of main resin, 58 parts of active diluent monomer, 25 parts of conductive filler, 6 parts of photoinitiator, 18 parts of wear-resistant agent, 14 parts of flatting agent, 12 parts of defoaming agent, 11 parts of toughening agent and 9 parts of light stabilizer.
3. The high-temperature-resistant conductive silver paste according to any one of claims 1 to 2, wherein: the main resin is phenolic resin, polyurethane resin and acrylic resin with the mass ratio of 2-3: 3-5: 1.
4. The high-temperature-resistant conductive silver paste according to any one of claims 1 to 2, wherein: the reactive diluent monomer is one or two of neopentyl glycol diglycidyl ether, allyl glycidyl ether, resorcinol diglycidyl ether or ethyl acrylate.
5. The high-temperature-resistant conductive silver paste according to any one of claims 1 to 2, wherein: the photoinitiator is benzoin isopropyl ether; the light stabilizer is 2-methyl-2-nitrosomethane or phenyl-N-tert-butyl nitrone.
6. The high-temperature-resistant conductive silver paste according to any one of claims 1 to 2, wherein: the wear-resisting agent is nano silicon dioxide; the leveling agent is a phosphate modified acrylic acid leveling agent.
7. The high-temperature-resistant conductive silver paste according to any one of claims 1 to 2, wherein: the defoaming agent is polyoxypropylene glycerol ether or polyoxypropylene; the toughening agent is amino-terminated liquid nitrile rubber or liquid polyurethane.
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| CN110534230A (en) * | 2019-09-03 | 2019-12-03 | 北京氦舶科技有限责任公司 | A kind of circuit printing low-temperature cured conductive silver paste and preparation method thereof |
| CN113372844B (en) * | 2021-06-08 | 2022-10-14 | 北京中天鹏宇科技发展有限公司 | High-temperature-resistant epoxy resin conductive adhesive and preparation method thereof |
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| US4959178A (en) * | 1987-01-27 | 1990-09-25 | Advanced Products Inc. | Actinic radiation-curable conductive polymer thick film compositions and their use thereof |
| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
| CN104017529A (en) * | 2014-04-14 | 2014-09-03 | 江苏嘉娜泰有机硅有限公司 | Single-component epoxy resin conductive silver adhesive composition and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959178A (en) * | 1987-01-27 | 1990-09-25 | Advanced Products Inc. | Actinic radiation-curable conductive polymer thick film compositions and their use thereof |
| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
| CN104017529A (en) * | 2014-04-14 | 2014-09-03 | 江苏嘉娜泰有机硅有限公司 | Single-component epoxy resin conductive silver adhesive composition and preparation method thereof |
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