CN110534230A - A kind of circuit printing low-temperature cured conductive silver paste and preparation method thereof - Google Patents
A kind of circuit printing low-temperature cured conductive silver paste and preparation method thereof Download PDFInfo
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- CN110534230A CN110534230A CN201910828654.6A CN201910828654A CN110534230A CN 110534230 A CN110534230 A CN 110534230A CN 201910828654 A CN201910828654 A CN 201910828654A CN 110534230 A CN110534230 A CN 110534230A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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Abstract
The present invention relates to a kind of circuit printing low-temperature cured conductive silver pastes and preparation method thereof, the circuit printing low-temperature cured conductive silver paste, including following parts by weight component: 8-20 parts of high-temperature-resistant epoxy resin, 2-5 parts of high temperature resistant curing agent, 10-20 parts of powder stuffing, 5-10 parts of diluent, 0.5-1.5 parts of coupling agent, 70-80 parts of conductive silver powder.The circuit printing can be realized with low-temperature cured conductive silver paste in 130 DEG C of -150 DEG C of solidifications, and have hardness high, adhesive force is strong, good conductivity and can be for a long time in the characteristic of 300 DEG C or more of applied at elevated temperature, the circuit printing that can be used for electronic component is especially suitable for the circuit printing of the electronic components such as Electric radiant Heating Film, floor heating, intelligent mural painting, smart home, circuit board.
Description
Technical field
The present invention relates to printed electronics fields more particularly to a kind of printing of circuit with low-temperature cured conductive silver paste and its
Preparation method.
Background technique
Electrocondution slurry is as a kind of functional print material because its good physical property obtains extensively in electronics and IT products
Application, as electronic product develops to lighter, thinner, functional more powerful and more environmentally friendly direction, to its performance it is also proposed that
Higher requirement.Wherein low-temperature conductive silver paste is because of its excellent electric conductivity, thermal conductivity and practicability, be widely used in Electric radiant Heating Film,
The circuits of the electronic components such as heating film, circuit board prints, usually by silver powder, macromolecule organic polymer systems, organic
Solvent and additive composition, mix the above components evenly and are configured to sticky slurry, be made up accordingly of silk-screen printing technique
After circuitous pattern, solidified (generally below 160 DEG C) at low ambient temperatures, obtains adhering to good line conductor with substrate.
Existing low-temperature conductive silver paste has following defects that the limiting temperature that can bear often at 200 DEG C or less；When long
Between high temperature can make high molecular material accelerated ageing in silver paste, shorten the working life；When serious, TRANSIENT HIGH TEMPERATURE meeting scaling loss silver paste is made
Conducting wire cause disabler.
Summary of the invention
Based on the above issues, an object of the present invention be to provide a kind of circuit printing low-temperature cured conductive silver paste and its
Preparation method, which can be realized with low-temperature cured conductive silver paste in 130 DEG C of -150 DEG C of solidifications, and have hardness height,
Adhesive force is strong, good conductivity and can be used for the electricity of electronic component for a long time in the characteristic of 300 DEG C or more of applied at elevated temperature
Road printing is especially suitable for the circuit printing of the electronic components such as Electric radiant Heating Film, floor heating, intelligent mural painting, smart home, circuit board.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
8-20 parts of resin, 10-20 parts of powder stuffing, 5-10 parts of diluent, 0.5-1.5 parts of coupling agent, is led at 2-5 parts of high temperature resistant curing agent
Electric silver powder 70-80 parts.
Preferably, the high-temperature-resistant epoxy resin be ammonia phenolic group trifunctional epoxy resin, amino tetrafunctional epoxy resin or
Any one or a few in cycloaliphatc glycidyl rouge trifunctional epoxy resin.
Preferably, the high temperature resistant curing agent is any in amino curing agent, phenyl curing agent or sulfonyl curing agent
It is one or more of.
Preferably, the powder stuffing is high temperature resistant powder stuffing.
Preferably, the high temperature resistant powder stuffing be aluminium nitride micro mist, it is nano aluminium oxide, any one in silicon carbide powder
Kind is several.
Preferably, the diluent is ether solvent.
Preferably, the ether solvent is preferably 2- toluene glycidol ether, phenyl glycidyl ether or to tert-butyl benzene
Any one or a few in base 1- (2,3- epoxy) propyl ether.
Preferably, the coupling agent is organosiloxane coupling agent.
Preferably, the organosiloxane coupling agent is preferably γ-aminopropyl triethoxysilane (KH-550), γ-
(the third oxygen of 2,3- epoxy) propyl trimethoxy silicane (KH-560) or γ-methacryloxypropyl trimethoxy silane
(KH-570) any one or a few in.
Preferably, the partial size of the conductive silver powder is 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Compared with prior art, the invention has the following beneficial effects:
Circuit printing low-temperature cured conductive silver paste of the invention, high-temperature-resistant epoxy resin collocation high temperature resistant curing agent are formed
Heat curing type system, the product after solidification are three-dimensional net structure, are high temperature resistance, adhesive property and the mechanical property of conductive silver paste
Guarantee can be provided.It can be realized 130-150 DEG C of low-temperature setting, be not necessarily to high temperature sintering, while having hardness high, adhesive force is strong,
Printing is good, good conductivity and, in the characteristic of 300 DEG C or more of applied at elevated temperature, can be used for electronic component for a long time
Circuit printing is especially suitable for the electricity of the electronic components such as especially suitable Electric radiant Heating Film, floor heating, intelligent mural painting, smart home, circuit board
Road printing.
Specific embodiment
Detailed description of the preferred embodiments below.
A kind of circuit printing low-temperature cured conductive silver paste, including following each component of the invention: based on parts by weight, resistance to
8-20 parts of High temperature epoxy resins, 2-5 parts of high temperature resistant curing agent, 10-20 parts of powder stuffing, 5-10 parts of diluent, coupling agent 0.5-
1.5 parts, 70-80 parts of conductive silver powder.
Above-mentioned high-temperature-resistant epoxy resin is the epoxy resin with multifunctional group resistant to high temperature, preferably three official of ammonia phenolic group
Can epoxy resin, in amino tetrafunctional epoxy resin or cycloaliphatc glycidyl rouge trifunctional epoxy resin any one or it is several
Kind.Commercially available high-temperature-resistant epoxy resin for use in the present invention has, JD939, AFG90, AG80, JD929, TDE-85, TDE-86.
Above-mentioned high temperature resistant curing agent is the curing agent with active group resistant to high temperature, preferably amino curing agent, phenyl
Any one or a few in curing agent or sulfonyl curing agent.Commercially available high temperature resistant curing agent for use in the present invention has, SH-
200, one or more of 4,4- diaminodiphenylsulfone, 3,3- diethyl 4,4- diaminodiphenyl-methane.
Above-mentioned powder stuffing is preferably high temperature resistant powder stuffing, the high temperature resistant powder stuffing be preferably aluminium nitride micro mist,
Any one or a few in nano aluminium oxide, silicon carbide powder.Conductive silver paste is further increased using high temperature resistant powder filler
High temperature resistance.
Above-mentioned diluent is preferably ether solvent, and the ether solvent is preferably 2- toluene glycidol ether, phenyl glycidyl
Glycerin ether, to any one or a few in tert-butyl-phenyl 1- (2,3- epoxy) propyl ether.
Above-mentioned coupling agent is preferably organosiloxane coupling agent, and the organosiloxane coupling agent is preferably γ-aminopropyl
Triethoxysilane (KH-550), γ-(the third oxygen of 2,3- epoxy) propyl trimethoxy silicane (KH-560), γ-metering system
Any one or a few in acryloxypropylethoxysilane trimethoxy silane (KH-570).
The tap density of above-mentioned conductive silver powder is 4-6g/cm3, and partial size is 0.5-2 μm.
Circuit printing of the invention can realize crosslinking curing, nothing with low-temperature cured conductive silver paste under 130-150 DEG C of low temperature
Need high temperature sintering, while hardness is high, adhesive force is strong, and printing is good, good conductivity and can be for a long time in 300 DEG C or more of height
The characteristic that temperature uses can be used for the circuit printing of electronic component, be especially suitable for especially suitable Electric radiant Heating Film, floor heating, intelligent mural painting,
The circuit of the electronic components such as smart home, circuit board prints.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
The present invention will be described in detail by way of examples below, these embodiments are retouched to typical case of the invention
It states, but protection scope of the present invention is not limited to that.
Embodiment 1
A kind of circuit printing low-temperature cured conductive silver paste, the component including following parts by weight: high-temperature-resistant epoxy resin 8
Part, 2 parts of high temperature resistant curing agent, 10 parts of powder stuffing, 5 parts of diluent, 0.5 part of coupling agent, 70 parts of conductive silver powder.Wherein, resistance to height
Temperature epoxy resin is JD939, and high temperature resistant curing agent is SH-200, and powder stuffing is aluminium nitride micro mist, and diluent is the contracting of 2- toluene
Water glycerin ether, coupling agent KH-550, the partial size of conductive silver powder are 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 1 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness up to 3H with
On.
Embodiment 2
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
11 parts of resin, 3 parts of high temperature resistant curing agent, 15 parts of powder stuffing, 7 parts of diluent, 0.5 part of coupling agent, 70 parts of conductive silver powder.Its
In, high-temperature-resistant epoxy resin AFG90, high temperature resistant curing agent is 4,4- diaminodiphenylsulfone, and powder stuffing is nano aluminium oxide,
Diluent is phenyl glycidyl ether, and coupling agent KH-560, the partial size of conductive silver powder is 0.5-2 μm, tap density 4-6g/
cm3。
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 2 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance or so of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness is up to 3H
More than.
Embodiment 3
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
13 parts of resin, 3 parts of high temperature resistant curing agent, 15 parts of powder stuffing, 7 parts of diluent, 1 part of coupling agent, 70 parts of conductive silver powder.Wherein,
High-temperature-resistant epoxy resin is AG80, and high temperature resistant curing agent is 3,3- diethyl 4,4- diaminodiphenyl-methane, and powder stuffing is
Silicon carbide powder, diluent are to tert-butyl-phenyl 1- (2,3- epoxy) propyl ether, coupling agent KH-570, the grain of conductive silver powder
Diameter is 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 3 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance or so of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness is up to 3H
More than.
Embodiment 4
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
15 parts of resin, 3 parts of high temperature resistant curing agent, 18 parts of powder stuffing, 8 parts of diluent, 1 part of coupling agent, 70 parts of conductive silver powder.Wherein,
High-temperature-resistant epoxy resin is JD929, and high temperature resistant curing agent is SH-200, and powder stuffing is nano aluminium oxide, and diluent is phenyl
Glycidol ether, coupling agent KH-550, the partial size of conductive silver powder are 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 4 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance or so of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness is up to 3H
More than.
Embodiment 5
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
18 parts of resin, 4 parts of high temperature resistant curing agent, 18 parts of powder stuffing, 8 parts of diluent, 1 part of coupling agent, 75 parts of conductive silver powder.Wherein,
High-temperature-resistant epoxy resin is TDE-85, and high temperature resistant curing agent is SH-200, and powder stuffing is nano aluminium oxide, and diluent is phenyl
Glycidol ether, coupling agent KH-550, the partial size of conductive silver powder are 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 5 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance or so of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness is up to 3H
More than.
Embodiment 6
A kind of circuit printing low-temperature cured conductive silver paste, including following each component: based on parts by weight, fire resistant epoxy
20 parts of resin, 5 parts of high temperature resistant curing agent, 10 parts of diluent, 1.5 parts of coupling agent, 20 parts of powder stuffing, 80 parts of conductive silver powder.Its
In, high-temperature-resistant epoxy resin TDE-86, high temperature resistant curing agent is SH-200, and powder stuffing is nano aluminium oxide, and diluent is
Phenyl glycidyl ether, coupling agent KH-550, the partial size of conductive silver powder are 0.5-2 μm, tap density 4-6g/cm3.
The foregoing circuit printing preparation method of low-temperature cured conductive silver paste, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder of uniform dissolution in step (1)
Filler is put into agitating device, is mixed, and the material mixed is put into grinder and is ground, and grinding is until fineness drops
Down to 5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2),
Fineness is ground to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
Conductive silver paste made from embodiment 6 is printed for the lines of long * wide * thickness=100mm*1mm*5um size, 150
DEG C solidification 60min, evaluation result is as follows: 1, by 300 DEG C high temperature 10hs, resistance variations < ± 5%, and indeformable, non yellowing, no
Picking, illustrates product of the present invention under 300 DEG C of high temperature, performance change is minimum, can satisfy use of the conductive silver paste at 300 DEG C
It is required that；2, good, 6 Ω of resistance or so of conduction；3, adhesive force is good, draws hundred lattice, 3M adhesive tape test is up to 5B；4, surface hardness is up to 3H
More than.
Circuit printing of the invention is able to bear 300 DEG C or more of high temperature, high temperature resistance with low-temperature cured conductive silver paste
It is good, it conducts electricity very well simultaneously, good with substrate adhesive force, hardness is high, and printing is good.It can be used for the circuit printing of electronic component,
It is especially suitable for the circuit printing of the electronic components such as especially suitable Electric radiant Heating Film, floor heating, intelligent mural painting, smart home, circuit board.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of circuit printing low-temperature cured conductive silver paste, which is characterized in that including following each component: based on parts by weight,
8-20 parts of high-temperature-resistant epoxy resin, 2-5 parts of high temperature resistant curing agent, 10-20 parts of powder stuffing, 5-10 parts of diluent, coupling agent
0.5-1.5 parts, 70-80 parts of conductive silver powder.
2. circuit printing low-temperature cured conductive silver paste according to claim 1, which is characterized in that the fire resistant epoxy
Resin is ammonia phenolic group trifunctional epoxy resin, amino tetrafunctional epoxy resin or cycloaliphatc glycidyl rouge trifunctional epoxy resin
In any one or a few.
3. circuit printing low-temperature cured conductive silver paste according to claim 1, which is characterized in that the high temperature resistant solidification
Agent is any one or a few in amino curing agent, phenyl curing agent or sulfonyl curing agent.
4. circuit according to claim 1 printing low-temperature cured conductive silver paste, which is characterized in that the powder stuffing is
High temperature resistant powder stuffing.
5. circuit printing low-temperature cured conductive silver paste according to claim 4, which is characterized in that the high temperature resistant powder
Filler is aluminium nitride micro mist, nano aluminium oxide, any one or a few in silicon carbide powder.
6. circuit printing low-temperature cured conductive silver paste according to claim 1, which is characterized in that the diluent is ether
Class solvent, the ether solvent are preferably 2- toluene glycidol ether, phenyl glycidyl ether or to tert-butyl-phenyl 1- (2,3-
Epoxy) any one or a few in propyl ether.
7. circuit printing low-temperature cured conductive silver paste according to claim 1, which is characterized in that the coupling agent is to have
Organic siloxane coupling agent.
8. circuit printing low-temperature cured conductive silver paste according to claim 7, which is characterized in that the organosiloxane
Coupling agent is γ-aminopropyl triethoxysilane, γ-(the third oxygen of 2,3- epoxy) propyl trimethoxy silicane or γ-methyl-prop
Any one or a few in alkene acryloxypropylethoxysilane trimethoxy silane.
9. circuit printing low-temperature cured conductive silver paste according to claim 1, which is characterized in that the conductive silver powder
Partial size is 0.5-2 μm, tap density 4-6g/cm3.
10. the printing of circuit described in -9 any one preparation method of low-temperature cured conductive silver paste according to claim 1, special
Sign is, comprising the following steps:
(1) fire resistant resin and diluent are cooled to room temperature in 20 DEG C -50 DEG C of at a temperature of stirring and dissolving 8-10h；
(2) by the resin Yu diluent and high temperature resistant curing agent, coupling agent and powder stuffing of uniform dissolution in step (1)
It is put into agitating device, is mixed, the material mixed is put into grinder and is ground, grinding is until fineness is reduced to
5 μm or less；
(3) conductive silver powder is added in material ground in step (2), repeats the mixing and grinding steps of step (2), grinding
To fineness to 15um hereinafter, obtaining circuit printing low-temperature cured conductive silver paste.
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| CN106634775A (en) * | 2017-01-09 | 2017-05-10 | 成都科愿慧希科技有限公司 | High-temperature-resistant conductive silver colloid |
| CN106753133A (en) * | 2016-12-30 | 2017-05-31 | 中国科学院深圳先进技术研究院 | A kind of conductive silver glue and its production and use |
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- 2019-09-03 CN CN201910828654.6A patent/CN110534230A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN106753133A (en) * | 2016-12-30 | 2017-05-31 | 中国科学院深圳先进技术研究院 | A kind of conductive silver glue and its production and use |
| CN106634775A (en) * | 2017-01-09 | 2017-05-10 | 成都科愿慧希科技有限公司 | High-temperature-resistant conductive silver colloid |
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