CN106624246B - The light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering - Google Patents
The light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering Download PDFInfo
- Publication number
- CN106624246B CN106624246B CN201611155351.5A CN201611155351A CN106624246B CN 106624246 B CN106624246 B CN 106624246B CN 201611155351 A CN201611155351 A CN 201611155351A CN 106624246 B CN106624246 B CN 106624246B
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- Prior art keywords
- silicon steel
- steel block
- cover
- cover bowl
- bowl
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to the light shields of the analysis of spectrum solder joint and imaging after a kind of wave-soldering.Screw socket is passed sequentially through on the light shield cylinder and is socketed with cover bowl a, cover bowl b, cover bowl c, and covers and closedtop decorative cover is fixed with by shank of bolt on bowl a;It is placed with the outer silicon steel block of a circle in the cover bowl a, cover bowl b, outer cylinder composed by cover bowl c three, and is fixed linking with pivot pin between every two pieces of outer silicon steel block;Pass through the mutual drawknot of connector between outer silicon steel block and interior silicon steel block;It is mutually fixed between the outer silicon steel block and cover bowl b by pin;Product solder joint auto-mending identification function of the present invention after Wave soldering furnace, it can be achieved that the type of repairing have: company's tin of product solder joint adds tin, and Xi Dong etc. is bad;Product after being detected by light shield with carrier enters equipment spraying mechanism, and spray painting control part automatically grabs flame, accurately puts spray rosin to bad solder joint, product enters the repairing stage.
Description
Technical field
The present invention relates to the light shields of the analysis of spectrum solder joint and imaging after a kind of wave-soldering.
Background technique
Wave-soldering is to allow the welding surface of card directly to contact with high-temperature liquid state tin to reach welding purpose, high-temperature liquid state tin
An inclined-plane is kept, and so that liquid tin is formed the phenomenon that a lot of is similar to wave by special device, so being " wave-soldering ", is led
Wanting material is soldering tin bar.Wave-soldering refers to the solder (terne metal) of fusing, through electrodynamic pump or electromagnetic pump jet flow at setting
Desired solder wave is counted, can also be formed by injecting nitrogen to solder pot, pass through the printed board for being pre-loaded with component
Solder wave realizes component welding end or pin and the room machine of printed board pad and the solder of electrical connection.Wave-soldering stream
Journey: element is inserted into corresponding component hole → pre-coated soldering flux → preheating (90-100 DEG C of temperature, length 1-1.2m) → wave crest
Weld the extra plug-in unit foot → inspection of (220-240 DEG C) cooling → excision.Reflow soldering process is to allocate print in advance by refuse
Paste solder on making sheet pad realizes the room machine and electricity of surface-assembled component welding end or pin and printed board pad
The solder of gas connection.Wave-soldering has new welding procedure to the enhancing of environmental protection consciousness with people.Pervious is to adopt
With leypewter, but lead is that heavy metal has very big injury to human body.Then growth-promoting lead-free process, using Tin Silver Copper Alloy
With special scaling powder, and the higher preheating temperature of requirement of welding temperature.Miniaturization and powerful is not needed most of
Still perforation (TH) or mixing technical route plate, such as television set, family's audio and video equipment and teaching machine top are being used on product
Box etc., still all with punctured element, it is therefore desirable to use wave-soldering.From technological angle, wave soldering machines can only be provided
Seldom any most basic equipment operating parameter adjustment.After wiring board enters crest welder by conveyer belt, some can be passed through
The scaling powder applying device of form, scaling powder is coated on wiring board using wave crest, foaming or the method for injection herein.Due to
Most of scaling powders have to reach in welding and keep an activation temperature to guarantee the complete wetting of solder joint, therefore route
Plate will first pass through a preheating zone before entering wave crest slot.Preheating after scaling powder coating can gradually promote the temperature of PCB
And scaling powder is activated, this process can also reduce assembly and enter the thermal shock generated when wave crest.It can also be used to evaporate
Fall all possible moisture absorbed or dilute the carrier solvent of scaling powder, if these things are not removed, they can be
It boils when crossing wave crest and scolding tin is caused to sputter, or generate steam and stay in the solder joint or sand holes that formation is hollow inside scolding tin.In addition,
Since dual platen and multiple-plate thermal capacity are larger, they need higher preheating temperature than single sided board.
Summary of the invention
The object of the present invention is to provide the light shields of the analysis of spectrum solder joint and imaging after a kind of wave-soldering.
The present invention solves its above-mentioned technical problem institute, and the following technical solution is employed: spectrum solder joint point after a kind of wave-soldering
The light shield of analysis and imaging, be mainly configured with: closedtop decorative cover, cover bowl a, cover bowl b, cover bowl c, light shield cylinder, underseal decorative cover, rubber are close
Seal a, neodymium magnetic steel ring, clamping ring, rubber seal b, neodymium magnetopause circle, camera lens installation point, guide rail bracket fixed disk, metal sealing
Circle, sealing ring pedestal, gas bar rod piece, guide rail bar, rail bar slot, electronic gas bar, pin, interior silicon steel block, connector, outer silicon steel block,
Pivot pin, block pin pass sequentially through screw socket on the light shield cylinder and are socketed with cover bowl a, cover bowl b, cover bowl c, and cover and pass through spiral shell on bowl a
Tightening latch is fixed with closedtop decorative cover;
The outer silicon steel block of a circle, and every two pieces are placed in the cover bowl a, cover bowl b, outer cylinder composed by cover bowl c three
Outer silicon steel block between with pivot pin be fixed linking;Pass through the mutual drawknot of connector between outer silicon steel block and interior silicon steel block;It is described
Outer silicon steel block and cover bowl b between mutually fixed by pin;The interior silicon steel block is mutually drawn with outer silicon steel block bottom by block pin
Knot;
The outer silicon steel block bottom twist-on has a clamping ring, and rubber seal b is coated at neodymium magnetopause circle periphery, clamping ring with
Neodymium magnetopause circle phase magnetic;Neodymium magnetopause snare enters in light shield cylinder, and light shield cylinder bottom is sealed by underseal decorative cover;
The interior silicon steel block arranges to form the inner cylinder of round shape, and magnetic has neodymium magnetic steel ring on inner cylinder inner wall;The neodymium
Magnetic steel ring top twist-on has metal o-ring, and lower part twist-on has sealing ring pedestal, forms neodymium magnet steel ring support;The neodymium magnetic steel ring
Seat and guide rail bracket fixed disk phase screw thread twisting;
The guide rail bracket fixed disk inner core is through with guide rail bar, and the two sides of electronic gas bar are fixed at guide rail bar one end end
On, and guide rail bar is erected in rail bar slot, is fixed with camera lens installation point at guide rail bar other end end;The gas of the electronic gas bar
Bar rod piece end is mutually fixed with camera lens installation dot center;Notch is milled on the inside of the interior silicon steel block, outer silicon steel block;Described
Rail bar slot is mutually fixed with guide rail bracket fixed disk inner core;Rubber seal a is covered on the clamping ring;The neodymium magnetic steel ring with
The diameter ratio of inner cylinder is 1:2.5 between 1:4.7.
Further, the camera lens installation point is equipped with light spectrum image-forming device.
Further, magnetic induction loop is arranged in the notch of the interior silicon steel block, outer silicon steel block.
Beneficial effects of the present invention: product solder joint auto-mending identification function after Wave soldering furnace, it can be achieved that repairing
Type have: company's tin of product solder joint adds tin, and Xi Dong etc. is bad;Product after being detected by light shield with carrier enters equipment spray
Mechanism is applied, spray painting control part automatically grabs flame, accurately puts spray rosin to bad solder joint, product enters repairing rank
Section.
Detailed description of the invention
Fig. 1 is the light shield overall structure figure of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
Fig. 2 is the light shield detonation configuration figure of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
Fig. 3 is the light shield core members detonation configuration figure of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
Fig. 4 is the light shield core members structure chart of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
Fig. 5 is silicon steel block structural diagram inside and outside the light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
Fig. 6 is silicon steel detonation configuration figure inside and outside the light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering of the present invention.
1- closedtop decorative cover in figure, 2- cover bowl a, 3- cover bowl b, 4- cover bowl c, 5- light shield cylinder, 6- underseal decorative cover, 7- rubber are close
Seal a, 8- neodymium magnetic steel ring, 9- clamping ring, 10- rubber seal b, 11- neodymium magnetopause circle, 12- camera lens installation point, 13- guide rail bracket
Fixed disk, 14- metal o-ring, 15- sealing ring pedestal, 16- gas bar rod piece, 17- guide rail bar, 18- rail bar slot, the electronic gas of 19-
Bar, 20- pin, silicon steel block in 21-, 22- connector, the outer silicon steel block of 23-, 24- pivot pin, 25- block pin.
Specific embodiment
1-6 makes a detailed explanation a specific embodiment of the invention with reference to the accompanying drawing.
Embodiment: the light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering is mainly configured with: closedtop decorative cover 1, cover
Bowl a2, cover bowl b3, cover bowl c4, light shield cylinder 5, underseal decorative cover 6, rubber seal a7, neodymium magnetic steel ring 8, clamping ring 9, rubber seal
Enclose b10, neodymium magnetopause circle 11, camera lens installation point 12, guide rail bracket fixed disk 13, metal o-ring 14, sealing ring pedestal 15, gas bar bar
Part 16, guide rail bar 17, rail bar slot 18, electronic gas bar 19, pin 20, interior silicon steel block 21, connector 22, outer silicon steel block 23, pivot pin
24, block pin 25 passes sequentially through screw socket on the light shield cylinder 5 and is socketed with cover bowl a2, cover bowl b3, cover bowl c4, and covers on bowl a2
Closedtop decorative cover 1 is fixed with by shank of bolt;
It is placed with the outer silicon steel block 23 of a circle in the cover bowl a2, cover bowl b3, outer cylinder composed by cover bowl c4 three, and every
It is connected between two pieces of outer silicon steel block 23 with pivot pin 24 to be fixed;Pass through connector 22 between outer silicon steel block 23 and interior silicon steel block 21
Mutual drawknot;It is fixed between the outer silicon steel block 23 and cover bowl b3 by 20 phase of pin;The interior silicon steel block 21 and outer silicon
23 bottom of bloom passes through 25 phase drawknot of block pin;
The 23 bottom twist-on of outer silicon steel block has clamping ring 9, and rubber seal b10 is coated at 11 periphery of neodymium magnetopause circle,
Clamping ring 9 and 11 phase magnetic of neodymium magnetopause circle;Neodymium magnetopause circle 11 is inserted in light shield cylinder 5, and 5 bottom of light shield cylinder is close by 6 institute of underseal decorative cover
Envelope;
Interior silicon steel block 21 arrangement forms the inner cylinder of round shape, and magnetic has neodymium magnetic steel ring 8 on inner cylinder inner wall;Described
8 top twist-on of neodymium magnetic steel ring has metal o-ring 14, and lower part twist-on has sealing ring pedestal 15, forms neodymium magnet steel ring support;Described
Neodymium magnet steel ring support and 13 phase screw thread twisting of guide rail bracket fixed disk;
13 inner core of guide rail bracket fixed disk is through with guide rail bar 17, and electronic gas bar 19 is fixed at 17 one end end of guide rail bar
Two sides on, and guide rail bar 17 erect in rail bar slot 18, be fixed with camera lens installation point 12 at 17 other end end of guide rail bar;Institute
16 end of gas bar rod piece and 12 center of camera lens installation point for the electronic gas bar 19 stated mutually are fixed;
The rail bar slot 18 is mutually fixed with 13 inner core of guide rail bracket fixed disk;The interior silicon steel block 21, outer silicon steel block 23
Inside is milled with notch;Rubber seal a7 is covered on the clamping ring 9;The diameter ratio of the neodymium magnetic steel ring 8 and inner cylinder
It is 1:2.5 between 1:4.7.
The camera lens installation point 12 is equipped with light spectrum image-forming device.
Magnetic induction loop is arranged in the notch of the interior silicon steel block 21, outer silicon steel block 23.
Core of the invention is: neodymium magnetic steel ring 8 and interior 21 inner cylinder of silicon steel block are formed by " off-centre operation rolling ", in interior silicon steel
Block 21, outer silicon steel block 23 notch in arrange magnetic induction loop effect under, can control neodymium magnetic steel ring 8 in interior silicon steel block 21
Inner cylinder makes the positioning between the center of circle and the center of circle, so as to allowed on the space of plane camera lens installation point 12 install spectrum at
As device is positioned;
It is then to be positioned by the gas bar rod piece 16 of electronic gas bar 19, by electronic in three-dimensional space orientation
16 stroke of gas bar rod piece of gas bar 19 controls, and camera lens installation point 12 may be implemented in the movement in vertical orientation, in mobile process
Middle guide rail bar 17 starts steady, auxiliary instrument effect.
The main innovation of present device is in the positioning of plane, due to having between neodymium magnetic steel ring 8 and interior silicon steel block 21
There is very efficient control force, this control force is maglev, therefore is zero in the spoilage of abrasion, therefore in theoretical design
It is permanent on service life.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. the light shield of the analysis of spectrum solder joint and imaging, is mainly configured with: closedtop decorative cover (1), cover bowl a(2 after a kind of wave-soldering),
Cover bowl b(3), cover bowl c(4), light shield cylinder (5), underseal decorative cover (6), rubber seal a(7), neodymium magnetic steel ring (8), clamping ring (9),
Rubber seal b(10), neodymium magnetopause circle (11), camera lens installation point (12), guide rail bracket fixed disk (13), metal o-ring (14),
Sealing ring pedestal (15), gas bar rod piece (16), guide rail bar (17), rail bar slot (18), electronic gas bar (19), pin (20), interior silicon
Bloom (21), connector (22), outer silicon steel block (23), pivot pin (24), block pin (25), it is characterised in that: on light shield cylinder (5) successively
Be socketed with cover bowl a(2 by screw socket), cover bowl b(3), cover bowl c(4), and cover a bowl a(2) on closedtop lid is fixed with by shank of bolt
It encloses (1);
The cover bowl a(2), cover bowl b(3), cover bowl c(4) be placed with the outer silicon steel block (23) of a circle in outer cylinder composed by three,
And it is connected between every two pieces of outer silicon steel block (23) with pivot pin (24) to be fixed;Between outer silicon steel block (23) and interior silicon steel block (21)
Pass through connector (22) mutual drawknot;It is mutually fixed between the outer silicon steel block (23) and cover bowl b(3) by pin (20);Institute
The interior silicon steel block (21) and outer silicon steel block (23) bottom stated pass through block pin (25) Xiang Lajie;
Outer silicon steel block (23) the bottom twist-on has clamping ring (9), rubber seal b(10) it is coated at neodymium magnetopause circle (11) outside
It encloses, clamping ring (9) and neodymium magnetopause circle (11) phase magnetic;Neodymium magnetopause circle (11) is inserted in light shield cylinder (5), light shield cylinder (5) bottom quilt
Underseal decorative cover (6) is sealed;
Interior silicon steel block (21) arrangement forms the inner cylinder of round shape, and magnetic has neodymium magnetic steel ring (8) on inner cylinder inner wall;Described
Neodymium magnetic steel ring (8) top twist-on has metal o-ring (14), and lower part twist-on has sealing ring pedestal (15), forms neodymium magnet steel ring support;
The neodymium magnet steel ring support and guide rail bracket fixed disk (13) phase screw thread twisting;
Described guide rail bracket fixed disk (13) inner core is through with guide rail bar (17), and electronic gas bar is fixed at guide rail bar (17) one end end
(19) on two sides, and guide rail bar (17) erects in rail bar slot (18), is fixed with camera lens at guide rail bar (17) other end end
Installation point (12);Gas bar rod piece (16) end of the electronic gas bar (19) is mutually fixed with camera lens installation point (12) center;
The rail bar slot (18) is mutually fixed with guide rail bracket fixed disk (13) inner core;The interior silicon steel block (21), outer silicon steel block
(23) inside is milled with notch;Rubber seal a(7 is covered on the clamping ring (9));The neodymium magnetic steel ring (8) with it is interior
The diameter ratio of cylinder is 1:2.5 between 1:4.7.
2. the light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering according to claim 1, it is characterised in that described
Camera lens installation point (12) light spectrum image-forming device is installed.
3. the light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering according to claim 1, it is characterised in that described
Interior silicon steel block (21), outer silicon steel block (23) notch in be arranged with magnetic induction loop.
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CN201611155351.5A CN106624246B (en) | 2016-12-14 | 2016-12-14 | The light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering |
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CN201611155351.5A CN106624246B (en) | 2016-12-14 | 2016-12-14 | The light shield of the analysis of spectrum solder joint and imaging after a kind of wave-soldering |
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CN106624246A CN106624246A (en) | 2017-05-10 |
CN106624246B true CN106624246B (en) | 2019-04-02 |
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WO2018188062A1 (en) * | 2017-04-14 | 2018-10-18 | 深圳市方鹏科技有限公司 | Robotic imaging system based on virtual reality technology |
CN110022649B (en) * | 2018-01-09 | 2021-08-13 | 佛山市顺德区顺达电脑厂有限公司 | Mainboard plug-in component maintenance method |
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WO2007116451A1 (en) * | 2006-03-30 | 2007-10-18 | Fujitsu Limited | Process for producing solder-joined product, solder joining apparatus, method of discriminating soldering condition, reflow apparatus and method of solder joining |
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CN1805816A (en) * | 2004-01-30 | 2006-07-19 | 三菱电机株式会社 | Welder for metal member having permanent magnet material and its welding method, and rotating electric machine |
CN101553339A (en) * | 2006-11-04 | 2009-10-07 | 通快机床两合公司 | Method and device for process monitoring during the working of a material |
CN103157883A (en) * | 2011-12-16 | 2013-06-19 | 西安中科麦特电子技术设备有限公司 | Crest welder guide rail support assembly |
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