CN106601614A - 一种刻蚀非晶硅太阳能电池铝膜的方法 - Google Patents
一种刻蚀非晶硅太阳能电池铝膜的方法 Download PDFInfo
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- 238000005530 etching Methods 0.000 title claims abstract description 48
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910021417 amorphous silicon Inorganic materials 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000008367 deionised water Substances 0.000 claims abstract description 12
- 239000004202 carbamide Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000004411 aluminium Substances 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 235000013877 carbamide Nutrition 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 8
- 239000013530 defoamer Substances 0.000 claims description 4
- 238000001802 infusion Methods 0.000 claims 1
- 210000002700 urine Anatomy 0.000 claims 1
- 238000003756 stirring Methods 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- DEPDDPLQZYCHOH-UHFFFAOYSA-N 1h-imidazol-2-amine Chemical compound NC1=NC=CN1 DEPDDPLQZYCHOH-UHFFFAOYSA-N 0.000 abstract 2
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 239000004088 foaming agent Substances 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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Abstract
本发明属于非晶硅太阳能电池生产领域,特别涉及一种刻蚀非晶硅太阳能电池铝膜的方法:向去离子水中加入2‑氨基咪唑、尿素、水性流平剂和消泡剂,搅拌均匀;将刻蚀液通过丝网漏印到非晶硅太阳能电池板的铝膜上,丝印后的电池板室温下水平放置后,用清水对铝膜表面充分冲洗,烘干,完成刻蚀。
Description
技术领域
本发明属于非晶硅太阳能电池生产领域,特别涉及一种刻蚀非晶硅太阳能电池铝膜的方法。
背景技术
非晶硅太阳能电池的结构大致可以描述为:首先在玻璃板上沉积了一层导电膜(如SnO2或ITO),再经化学气相沉积在导电膜上沉积一层非晶硅,然后在非晶硅上沉积背电极铝膜。为防止单元电池周边短路,需要对铝膜进行刻蚀形成隔离槽。
刻蚀工艺中既要确保刻蚀充分,还要避免基体不受侵蚀。现有的一些刻蚀剂容易在刻蚀铝的同时对基体板材产生腐蚀,还有些刻蚀剂在消除铝膜之后还会残留在基材上不易除去,这些都是非晶硅太阳能电池铝膜刻蚀领域所需要改进的方向。
发明内容
本发明针对上述问题,提供了一种刻蚀非晶硅太阳能电池铝膜的方法:
(1)配制刻蚀液
常温(25℃,下同)下,向去离子水中加入2-氨基咪唑、尿素、水性流平剂和消泡剂,搅拌均匀,
其中,2-氨基咪唑在去离子水中的加入量为100~400g/L,尿素在去离子水中的加入量为150~300g/L,水性流平剂在去离子水中的加入量为18~30g/L,消泡剂在去离子水中的加入量为10~15g/L;
(2)将步骤(1)配制的刻蚀液通过丝网漏印到非晶硅太阳能电池板的铝膜上,丝印后的电池板室温下水平放置后,用清水对铝膜表面充分冲洗,烘干,完成刻蚀,
其中,丝网可根据需要设计成不同的图案,
丝印后的电池板室温下水平放置的时间为60~120分钟,烘干温度为70℃。
本发明的有益效果在于:本发明发现2-氨基咪唑分子结构上的氨基结合尿素分子上的两个氨基能够在常温下协同对铝颗粒起到强烈的络合作用,相当于是2-氨基咪唑分子上的两个氨基和尿素分子上的两个氨基同时对一个细小的铝颗粒进行包围,将铝材质逐步分解并带离铝膜,最终完成刻蚀。
并且该刻蚀成分不会对电池板的其他材质造成腐蚀,水溶性良好、容易洗除,不影响电池板的后续加工。
具体实施方式
实施例1
(1)配制刻蚀液
常温(25℃,下同)下,向去离子水中加入200g/L的2-氨基咪唑、220g/L的尿素、23g/L的水性流平剂和12g/L的消泡剂,搅拌均匀;
(2)将步骤(1)配制的刻蚀液通过丝网漏印到非晶硅太阳能电池板的铝膜上,丝印后的电池板室温下水平放置100分钟后,用清水对铝膜表面充分冲洗,被冲洗后的非晶硅太阳能电池板于70℃烘干,完成刻蚀。观察刻蚀后的非晶硅太阳能电池板,刻蚀槽规则、平整。
对步骤(2)中冲洗用的清水及冲洗下来的刻蚀液进行收集,对收集到的混合液体在加热的条件下加入过量的盐酸,一方面酸可以促进尿素充分水解从而导致被包围的铝重新被释放出来,另一方面加酸过程中发现有持续的可燃性气体氢气产生,这也说明本实施例中确实将铝刻蚀了下来,根据生成氢气的量可以换算出刻蚀铝的总量;对加酸反应后的混合液进一步检测,无硅的成分,说明该刻蚀液对基体无影响。
对比例1
未向刻蚀液中加入任何2-氨基咪唑,刻蚀液其余成分及刻蚀操作、检测手段与实施例1相同:
对步骤(2)中冲洗用的清水及冲洗下来的刻蚀液进行收集,对收集到的混合液体在加热的条件下加入过量的盐酸,无可燃性气体生成,说明该刻蚀液成分未能对铝产生包围、刻蚀效果;观察刻蚀后的非晶硅太阳能电池板,也无明显被刻蚀的迹象。
对比例2
未向刻蚀液中加入任何尿素,刻蚀液其余成分及刻蚀操作、检测手段与实施例1相同:
对步骤(2)中冲洗用的清水及冲洗下来的刻蚀液进行收集,对收集到的混合液体在加热的条件下加入过量的盐酸,无气体生成,说明该刻蚀液成分未能对铝产生包围、刻蚀效果;观察刻蚀后的非晶硅太阳能电池板,也无明显被刻蚀的迹象。
Claims (7)
1.一种刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:所述的方法为,
(1)配制刻蚀液
常温下,向去离子水中加入2-氨基咪唑、尿素、水性流平剂和消泡剂,搅拌均匀;
(2)将步骤(1)配制的刻蚀液通过丝网漏印到非晶硅太阳能电池板的铝膜上,丝印后的电池板室温下水平放置后,用清水对铝膜表面充分冲洗,烘干,完成刻蚀。
2.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(1)中,2-氨基咪唑在去离子水中的加入量为100~400g/L。
3.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(1)中,尿素在去离子水中的加入量为150~300g/L。
4.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(1)中,水性流平剂在去离子水中的加入量为18~30g/L。
5.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(1)中,消泡剂在去离子水中的加入量为10~15g/L。
6.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(2)中,丝印后的电池板室温下水平放置的时间为60~120分钟。
7.如权利要求1所述的刻蚀非晶硅太阳能电池铝膜的方法,其特征在于:步骤(2)中,烘干温度为70℃。
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JP2003295473A (ja) * | 2002-03-29 | 2003-10-15 | Mitsubishi Paper Mills Ltd | 平版印刷版の処理方法 |
CN101192627A (zh) * | 2006-11-23 | 2008-06-04 | 李毅 | 一种硅薄膜光电池的电极图案及蚀刻方法 |
CN105970223A (zh) * | 2015-03-12 | 2016-09-28 | 东友精细化工有限公司 | 蚀刻剂组合物和制作用于液晶显示器的阵列基板的方法 |
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GB614672A (en) * | 1944-03-13 | 1948-12-20 | Aluminum Co Of America | Improvements in or relating to the etching of aluminium surfaces |
US5688366A (en) * | 1994-04-28 | 1997-11-18 | Canon Kabushiki Kaisha | Etching method, method of producing a semiconductor device, and etchant therefor |
JP2005206903A (ja) * | 2004-01-23 | 2005-08-04 | Kanto Chem Co Inc | エッチング液組成物 |
CN101276789B (zh) * | 2008-05-07 | 2011-08-17 | 李毅 | 一种非晶硅太阳能电池铝膜蚀刻方法及蚀刻油墨 |
KR20140084417A (ko) * | 2012-12-26 | 2014-07-07 | 동우 화인켐 주식회사 | 박막 트랜지스터의 채널 형성용 식각액 조성물 및 채널 형성 방법 |
CN104167461B (zh) * | 2013-05-17 | 2016-06-01 | 昱晶能源科技股份有限公司 | 太阳能电池的制作方法 |
JP6494254B2 (ja) * | 2014-11-18 | 2019-04-03 | 関東化學株式会社 | 銅、モリブデン金属積層膜エッチング液組成物、該組成物を用いたエッチング方法および該組成物の寿命を延ばす方法 |
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JP2003295473A (ja) * | 2002-03-29 | 2003-10-15 | Mitsubishi Paper Mills Ltd | 平版印刷版の処理方法 |
CN101192627A (zh) * | 2006-11-23 | 2008-06-04 | 李毅 | 一种硅薄膜光电池的电极图案及蚀刻方法 |
CN105970223A (zh) * | 2015-03-12 | 2016-09-28 | 东友精细化工有限公司 | 蚀刻剂组合物和制作用于液晶显示器的阵列基板的方法 |
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