CN106601382B - A kind of preparation method of flexible transparent conducting film - Google Patents

A kind of preparation method of flexible transparent conducting film Download PDF

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CN106601382B
CN106601382B CN201611157354.2A CN201611157354A CN106601382B CN 106601382 B CN106601382 B CN 106601382B CN 201611157354 A CN201611157354 A CN 201611157354A CN 106601382 B CN106601382 B CN 106601382B
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layer
preparation
flexible
solution
conducting film
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CN106601382A (en
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徐苗
阮崇鹏
王磊
李民
邹建华
陶洪
彭俊彪
许志平
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South China University of Technology SCUT
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/32Filling or coating with impervious material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Abstract

The invention discloses a kind of preparation methods of flexible transparent conductive film, are prepared including preparing composite conductive layers, water oxygen barrier layer deposition, flexible substrate are bonded and dissociation process.The invention also discloses flexible transparent conductive films, include flexible substrate, gluing layer, water oxygen barrier layer, composite conductive layers successively from the bottom to top;The composite conductive layers include transparent polymer support layer and electrically conducting transparent network from the bottom to top.The present invention realizes the preparation of the transparent conductive film with high conductivity and flat surface, and obtained flexible transparent conducting film has bend resistance.

Description

A kind of preparation method of flexible transparent conducting film
Technical field
The present invention relates to flexible electronic field, more particularly to a kind of preparation method of flexible transparent conducting film.
Background technology
It is required for using transparent electrode material in film photovoltaic cell, FPD, touch screen field, and at present using most Extensive transparent electrode material is tin indium oxide (ITO), by indium oxide and tin oxide two oxides material under different proportion Deposition obtains.Its visible light transmittance more than 90% requirement under, can still realize relatively low square resistance (10-100 Ω/ ), thus with very superior electrical conductivity energy.But indium metal belongs to scarce resource, only 50,000 tons of indium reserves are estimated in the whole world, because , with continuing to develop in opto-electronics, the price of ITO can rapidly rise with the rapid exploitation of indium for this.Although ITO exists It is had excellent performance on tablet, but its film is more crisp, its performance can decline to a great extent after bending on flexible substrates, thus ITO is uncomfortable It closes and makes flexible device.
In today that flexible electronic device is greatly developed, it would be desirable to develop a flexibility cheap, that production is easy and lead Electric material as the replacement for substituting ITO simultaneously, is applied in flexible electronic field.
The approach for preparing transparent conductive film at present has:Transparent conductive oxide film, metallic mesh structural membrane, ultra-thin gold Belong to film, inorganic/organic transparent conductive material film (such as nano silver wire, carbon nanotube, graphene, PEDOT:PSS).Wherein oxygen Compound scheme all suffers from being not suitable for flexible the problem of using;Metallic mesh structure surface roughness is larger, and complex steps, photoetching Cost is higher;Super thin metal film light transmittance can not get both with electric conductivity.And in photoelectric device, in OPV and OLED device, bottom The surface smoothness of electrode is by extreme influence device performance, therefore, it is intended that the transparent electrode surface prepared is smooth enough Smooth.Therefore we finally select inorganic/organic transparent conductive material as conductive layer, and by increasing polymer support Layer package conductive layer, by the levelability of liquid polymer solution, obtains a smooth conductive surface after the dissociation, wherein Conductive layer has been embedded to polymer superficial face, realizes the film with high conductivity and flat surface.
Invention content
In order to overcome the disadvantages mentioned above of the prior art, the purpose of the present invention is to provide a kind of flexible and transparent conductives with insufficient The preparation method of film realizes the preparation of the transparent conductive film with high conductivity and flat surface.
The purpose of the present invention is achieved through the following technical solutions:
A kind of preparation method of flexible transparent conducting film, includes the following steps:
(1) electrically conducting transparent network and transparent polymer support are coated successively by Solution processing techniques on temporary substrates Layer, is heating and curing, obtains composite conductive layers;
The thickness of the polymeric support layer is 10nm~1000nm;
(2) the connate water oxygen barrier layer on transparent polymer support layer;
(3) flexible substrate is covered on water oxygen barrier layer;The visible light transmittance of the flexible substrate is more than 85%;
(4) flexible substrate, water oxygen barrier layer and composite conductive layers entirety from temporary substrates are removed, obtains flexible and transparent Conductive film.
Preferably, the preparation method of the flexible transparent conducting film, it is further comprising the steps of:In temporary substrates and transparent Release layer is deposited between conductive network.
Preferably, the release layer is prepared using physical sputtering, chemical vapor deposition or Solution processing techniques;It uses Material is silicon nitride, and silica, molybdenum, aluminium is silver-colored, titanium, fluororesin solution, silicon resin solution, polyimide solution, poly- methyl-prop One or more of e pioic acid methyl ester solution, polystyrene solution, polyvinylpyrrolidonesolution solution, poly-vinyl alcohol solution;
Preferably, prepared by the release layer or use following methods:
It is reacted using coupling agent, surfactant with temporary substrates surface, generates surface molecular decorative layer.
Preferably, the preparation method of the flexible transparent conducting film, it is further comprising the steps of:In water oxygen barrier layer and soft Gluing layer is coated between property substrate.
Preferably, the Solution processing techniques described in step (1) be rotary coating, blade coating, slot coated, lifting apply Cloth, letterpress, intaglio printing, silk-screen printing is roll-to-roll, one kind in inkjet printing.
Preferably, step (1) the transparent polymer support layer is by epoxy resin, fluororesin, silicon rubber, silicones, gathers Any one in propylene, polyethylene or makrolon or polystyrene or polymethyl methacrylate is prepared;Or Mixture or copolymer are formed by two or more in more than material or laminate is prepared.
Preferably, step (1) the electrically conducting transparent network be carbon nano tube dispersion liquid, graphene dispersing solution, silver paste, metal Nano wire, the one or more in nano dot dispersion liquid.
Preferably, the water oxygen barrier layer described in step (2) is single-layer or multi-layer inorganic thin film;
The inorganic thin film thickness is 10nm~1000nm, by Al2O3, Si3N4, SiO2, TiO2, MgO, ZrO2, in ZnO More than one materials are prepared by plasma activated chemical vapour deposition or physical vapour deposition (PVD);
Water oxygen barrier layer water vapor transmittance is less than 5x10-5g/m2Day, OTR oxygen transmission rate are less than 1x10-3cm3/m2· day。
Preferably, the gluing layer pastes method using dry film or solution processing method is prepared;The material used for PSA or OCA。
Preferably, step (3) described flexible substrate is by polyethylene terephthalate, cyclic olefin polymer, polyamides Imines, makrolon, polyolefin, polyether-ketone, fluororesin, a kind of material preparation in silicones form;Or by more than material Two or more formation mixture or copolymer or laminate be prepared;
Preferably, step (1) the temporary substrates thickness is 0.3mm~2.5mm, is glass, stainless steel, the silicon of hard Piece, plastic plate.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) present invention uses supporting layer of the ultra-thin polymer material as composite conductive layers.Simultaneously ultra-thin compound Water oxygen barrier layer is introduced on conductive layer, the composite conductive layers of surfacing can be obtained, facilitates subsequent thin film photoelectric device It prepares;Meanwhile conductive layer has been embedded to polymer superficial face, realizes the film with high conductivity and flat surface.
(2) after the present invention makes barrier layer on composite conductive layers, while the steam oxygen of blocking front diffusion, by In the very thin thickness (only hundreds of nm magnitudes) of composite conductive layers, the expansion of lateral water oxygen molecule can be greatly prolonged or is breaking at Channel is dissipated, obtains better water oxygen barriering effect.
(3) flexible transparent conducting film of the invention can protect the water oxygen from substrate to corrode, and extend organic electronic device Service life makes flexible conductive film have more practicability.
(4) present invention process is simple, uses the solution processing technology of low cost.
Description of the drawings
Fig. 1 is the schematic diagram of the preparation method step (1) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 2 is the schematic diagram of the preparation method step (2) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 3 is the schematic diagram of the preparation method step (3) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 4 is the schematic diagram of the preparation method step (4) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 5 is the schematic diagram of the preparation method step (5) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 6 is the schematic diagram of the preparation method step (6) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 7 is the schematic diagram of the preparation method step (7) of the flexible transparent conducting film of the embodiment of the present invention 1.
Fig. 8 is the schematic diagram of the preparation method step (8) of the flexible transparent conducting film of the embodiment of the present invention 1.
Specific embodiment
With reference to embodiment, the present invention is described in further detail, but the implementation of the present invention is not limited to this.
Embodiment 1
The preparation method of the flexible transparent conducting film of the present embodiment, includes the following steps:
(1) on cleaned glass substrate 00, depositing a layer thickness with the mode of chemical vapor deposition (CVD) first is The SiN of 100nmXInorganic thin film is as release layer 01, as shown in Figure 1;
(2) spin coating nano silver wire dispersion liquid on the release layer 01 prepared in step (1), obtains one layer of uniform nano silver wire Conductive layer 02, as shown in Figure 2;
(3) on nano silver wire conductive layer, by the use of the method for spin coating prepare a layer thickness be 20 μm PDMS coatings as Polymeric support layer 03, and 1h is stood in room temperature environment, 1h is then toasted in 120 DEG C of baking oven, as shown in Figure 3;
(4) on PDMS film the Al that a layer thickness is 100nm is deposited with the mode of atomic layer deposition (ALD)2O3Film is made For water oxygen barrier layer 04, as shown in Figure 4;
(5) the PSA laminating layers 05 that a layer thickness is 50um are bonded on water oxygen barrier layer 04, as shown in Figure 5;
(6) it is bonded the PET film that a layer thickness is 120um again by PSA and is used as flexible substrate layer 06, as shown in Figure 6;
(7) it is flexible substrate layer, water oxygen barrier layer, polymeric support layer, nano silver wire conductive layer is whole slowly from glass Substrate dissociates, as shown in Figure 7;
(8) preparation process for coming to complete flexible transparent conducting film, obtained flexible transparent conducting film are inverted after dissociating As shown in Figure 8.Include flexible substrate layer 06, PSA laminating layers 05, Al successively from the bottom to top2O3Film 04, composite conductive layers;It is described Composite conductive layers include polymeric support layer 03 and nano silver wire conductive layer 02 from the bottom to top.
Nanowire Quality percentage is 0.1-5% in step (1) the nano silver wire dispersion liquid, and the length of nano silver wire exists Between 1-100 μm, the diameter of nano silver wire is in 10-150nm.
The visible ray mean transmissivity of final transparent conductive film is more than 85%, and sheet resistance is 50 Ω/, and membrane stress is less than 50MPa, under 25 DEG C of -40% humidity environment, water oxygen transmitance is less than 5x10-5g/m2·day。
Embodiment 2
The preparation method of the flexible transparent conducting film of the present embodiment, includes the following steps:
(1) on cleaned glass substrate, first by the method for slot coated, a strata imide membrane is prepared, as Release layer;
(2) on release layer, one layer of copper nano-wire conductive layer is prepared using the mode of blade coating;
(3) then on copper nano-wire, spin coating a layer thickness be the CYTOP coatings of 10um as polymeric support layer, And toast 2h in 80 DEG C of baking ovens;
(4) and then on CYTOP films the mode of ALD is used, prepares the Al that a layer thickness is 100nm2O3/ MgO layer is folded thin Film is as water oxygen barrier layer, wherein Al2O3With MgO film alternating deposit, Al2O3It is 50 ratios with the ratio between the deposition cycle number of MgO 10;
(5) then in Al2O3Coating thickness is the PSA laminating layers of 50um on film;
(6) the PEN films that a layer thickness is 100um are bonded on water oxygen barrier layer by PSA again and are used as flexible substrate layer;
(7) PEN films are slowly dissociated from glass substrate;
(8) preparation for coming to complete flexible transparent conducting film is inverted after dissociating;Include flexible substrate successively from the bottom to top Layer, PSA laminating layers, water oxygen barrier layer, composite conductive layers;The composite conductive layers include CYTOP supporting layers and copper from the bottom to top Nano wire conductive layer.
The diameter range of step (2) described copper nano-wire is in 10-200nm.The mass percent of copper nano-wire solution is 0.1%-10%, diameter range is in 10-500nm.
The visible ray mean transmissivity of final transparent conductive film is more than 85%, and sheet resistance is 30 Ω/, and membrane stress is less than 50MPa, under 25 DEG C of -40% humidity environment, water oxygen transmitance is less than 5x10-5g/m2·day。
The release layer of the present embodiment can also use physical sputtering, chemical vapor deposition or other Solution processing techniques systems It is standby;The material used mainly includes:Silicon nitride, silica, molybdenum, aluminium, silver, titanium, fluororesin solution, silicon resin solution, polyamides Imide liquor, polymethyl methacrylate solution, polystyrene solution, polyvinylpyrrolidonesolution solution, in poly-vinyl alcohol solution More than one.The release layer can also use following methods to prepare:Use coupling agent, surfactant and temporary substrates table Face is reacted, and generates surface molecular decorative layer.
The processing method of the composite conductive layers of the present embodiment can also be blade coating, and slot coated lifts coating, relief printing plate print Brush, intaglio printing, silk-screen printing is roll-to-roll, one kind in inkjet printing.The transparent polymer support layer of the present embodiment is by epoxy Resin, fluororesin, silicon rubber, silicones, polypropylene, polyethylene or makrolon or polystyrene or polymethylacrylic acid Any one in methyl esters is prepared;Or form mixture or copolymer or lamination by two or more in more than material Object is prepared.
The transparent polymer support layer of the present embodiment can also be by epoxy resin, fluororesin, silicon rubber, silicones, and poly- third Any one in alkene, polyethylene or makrolon or polystyrene or polymethyl methacrylate is prepared;Or by Two or more formation mixtures or copolymer or laminate in more than material are prepared.
The electrically conducting transparent network of the present embodiment is carbon nanotube (CNT) dispersion liquid, and graphene (Graphene) dispersion liquid is silver-colored One or more of slurry, metal nanometer line, nano dot dispersion liquid.The major metal material of metal nanometer line or nano dot for silver, Copper, aluminium composition simple substance or account for the alloy material of main component.
The water oxygen barrier layer of the present embodiment can be single-layer or multi-layer inorganic thin film;The inorganic thin film thickness for 10nm~ 1000nm, can be by Al2O3, Si3N4, SiO2, TiO2, MgO, ZrO2, one or more of ZnO material passes through plasma chemistry gas Mutually deposition or physical vapour deposition (PVD) are prepared.
The gluing layer can be used that dry film pastes method or solution processing method is prepared;The material used for PSA or OCA。
The flexible substrate of the present embodiment is can also be by polyethylene terephthalate, cyclic olefin polymer, polyamides Asia Amine, makrolon, polyolefin, polyether-ketone, fluororesin, a kind of material preparation in silicones form;Or by more than material The mixture or copolymer or laminate of two or more formation are prepared, it is seen that light transmission rate is more than 85%.
The temporary substrates thickness of the present embodiment can be 0.3mm~2.5mm, can also be stainless steel, silicon chip, plastic plate.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by the embodiment Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification, Equivalent substitute mode is should be, is included within protection scope of the present invention.

Claims (8)

1. a kind of preparation method of flexible transparent conducting film, which is characterized in that include the following steps:
(1) electrically conducting transparent network and transparent polymer support layer are coated successively by Solution processing techniques on temporary substrates, is added Heat cure obtains composite conductive layers;
The thickness of the polymeric support layer is 10nm~1000nm;
(2) the connate water oxygen barrier layer on transparent polymer support layer;
(3) flexible substrate is covered on water oxygen barrier layer;The visible light transmittance of the flexible substrate is more than 85%;
(4) flexible substrate, water oxygen barrier layer and composite conductive layers entirety from temporary substrates are removed, obtains flexible and transparent conductive Film;
The preparation method of the flexible transparent conducting film is further comprising the steps of:Between temporary substrates and electrically conducting transparent network Deposit release layer;Gluing layer is coated between water oxygen barrier layer and flexible substrate;
The water oxygen barrier layer water vapor transmittance is less than 5x10-5g/m2Day, OTR oxygen transmission rate are less than 1x10-3cm3/m2· day。
2. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that the release layer uses object It is prepared by reason sputtering, chemical vapor deposition or Solution processing techniques;The material used is silicon nitride, and silica, molybdenum, aluminium is silver-colored, Titanium, fluororesin solution, silicon resin solution, polyimide solution, polymethyl methacrylate solution, polystyrene solution, poly- second One or more of alkene pyrrolidone solution, poly-vinyl alcohol solution;
The release layer is prepared using following methods:
It is reacted using coupling agent, surfactant with temporary substrates surface, generates surface molecular decorative layer.
3. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that molten described in step (1) Liquid processing method be rotary coating, blade coating, slot coated, lifting coating, letterpress, intaglio printing, silk-screen printing, volume To rolling up, one kind in inkjet printing.
4. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that step (1) is described transparent Polymeric support layer is by epoxy resin, fluororesin, silicon rubber, silicones, polypropylene, polyethylene or makrolon or polyphenyl second Any one in alkene or polymethyl methacrylate is prepared;Or it is mixed by two or more being formed in more than material It closes object or copolymer or laminate is prepared.
5. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that step (1) is described transparent Conductive network is carbon nano tube dispersion liquid, graphene dispersing solution, the one or more in silver paste and metal nanometer line.
6. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that the water described in step (2) Oxygen barrier layer is single-layer or multi-layer inorganic thin film;
The inorganic thin film thickness is 10nm~1000nm, by Al2O3, Si3N4, SiO2, TiO2, MgO, ZrO2, one kind in ZnO More than material is prepared by plasma activated chemical vapour deposition or physical vapour deposition (PVD).
7. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that the gluing layer is using dry Film pastes method or solution processing method is prepared;The material used is PSA or OCA.
8. the preparation method of flexible transparent conducting film according to claim 1, which is characterized in that step (3) described flexibility Substrate is by polyethylene terephthalate, cyclic olefin polymer, polyimides, makrolon, polyolefin, polyether-ketone, fluorine Resin, a kind of material preparation in silicones form;Or the two or more mixtures or copolymer formed by more than material Or laminate is prepared;
Step (1) the temporary substrates thickness is 0.3mm~2.5mm, is glass, stainless steel, silicon chip, the plastic plate of hard.
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