CN106585046A - 超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 - Google Patents
超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 Download PDFInfo
- Publication number
- CN106585046A CN106585046A CN201611068334.8A CN201611068334A CN106585046A CN 106585046 A CN106585046 A CN 106585046A CN 201611068334 A CN201611068334 A CN 201611068334A CN 106585046 A CN106585046 A CN 106585046A
- Authority
- CN
- China
- Prior art keywords
- ultra micro
- copper
- thin copper
- thin
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611068334.8A CN106585046B (zh) | 2016-11-28 | 2016-11-28 | 超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611068334.8A CN106585046B (zh) | 2016-11-28 | 2016-11-28 | 超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106585046A true CN106585046A (zh) | 2017-04-26 |
CN106585046B CN106585046B (zh) | 2019-08-23 |
Family
ID=58595262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611068334.8A Active CN106585046B (zh) | 2016-11-28 | 2016-11-28 | 超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106585046B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113386417A (zh) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | 一种覆铜板及其制备方法 |
CN113386416A (zh) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
CN114228169A (zh) * | 2021-12-21 | 2022-03-25 | 苏州东福来机电科技有限公司 | 一种高频柔性覆铜板的生产方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316386A (ja) * | 2001-04-20 | 2002-10-29 | Kanegafuchi Chem Ind Co Ltd | 銅張積層体およびその製造方法 |
CN101374388A (zh) * | 2008-03-28 | 2009-02-25 | 苏陟 | 一种高剥离强度的细线路挠性电路板的制作方法 |
US20120196144A1 (en) * | 2011-01-31 | 2012-08-02 | Ming Jen Tzou | Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method |
CN105398135A (zh) * | 2014-09-16 | 2016-03-16 | 昆山雅森电子材料科技有限公司 | Pi型超薄双面铜箔基板及其制造方法 |
-
2016
- 2016-11-28 CN CN201611068334.8A patent/CN106585046B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316386A (ja) * | 2001-04-20 | 2002-10-29 | Kanegafuchi Chem Ind Co Ltd | 銅張積層体およびその製造方法 |
CN101374388A (zh) * | 2008-03-28 | 2009-02-25 | 苏陟 | 一种高剥离强度的细线路挠性电路板的制作方法 |
US20120196144A1 (en) * | 2011-01-31 | 2012-08-02 | Ming Jen Tzou | Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method |
CN105398135A (zh) * | 2014-09-16 | 2016-03-16 | 昆山雅森电子材料科技有限公司 | Pi型超薄双面铜箔基板及其制造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113386417A (zh) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | 一种覆铜板及其制备方法 |
CN113386416A (zh) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
CN114228169A (zh) * | 2021-12-21 | 2022-03-25 | 苏州东福来机电科技有限公司 | 一种高频柔性覆铜板的生产方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106585046B (zh) | 2019-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI406619B (zh) | 多層印刷配線板及其製造方法 | |
CN101296562A (zh) | 铜箔基板以及利用该铜箔基板制作软性印刷电路板的方法 | |
CN104394643B (zh) | 非分层刚挠板及其制作方法 | |
CN206932462U (zh) | 复合式lcp高频高速frcc基材 | |
CN206840863U (zh) | 复合式lcp高频高速双面铜箔基板 | |
CN106585046B (zh) | 超微薄铜覆铜板制作工艺及配合其使用的五轴压合机 | |
CN102794962A (zh) | 复合式双面铜箔基板及其制造方法 | |
CN107018621A (zh) | 一种在印制电路板中埋铜块的方法 | |
CN209982810U (zh) | 一种软硬结合板 | |
CN218163021U (zh) | 一种基于不锈钢金属的复合式柔性电路基板 | |
CN204674123U (zh) | 一种双层介质无胶挠性覆铜板 | |
CN102365006A (zh) | 多层电路板加工方法 | |
CN102427679B (zh) | 具有嵌入式凸块互连结构的柔性印刷电路板及其制作方法 | |
CN104010436A (zh) | 一种具有电磁屏蔽效果的柔性覆金属基板及制造工艺 | |
CN203126052U (zh) | 复合式双面铜箔基板 | |
CN208128661U (zh) | 基于高频frcc与高频双面板的fpc多层板 | |
JPH11251703A (ja) | 回路基板、両面回路基板、多層回路基板及び回路基板の製造方法 | |
CN103029375B (zh) | 复合式双面铜箔基板及其制造方法 | |
CN202782009U (zh) | 复合式双面铜箔基板 | |
CN202310269U (zh) | 多层电路板 | |
CN103057208B (zh) | 复合式覆盖膜 | |
TWI437943B (zh) | 柔性多層電路板之製作方法 | |
CN205946355U (zh) | 一种受热可流动聚酰亚胺功能膜 | |
WO2019155948A1 (ja) | フレキシブルプリント基板の製造方法 | |
CN216860887U (zh) | 增厚型金属箔积层板制造设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing process of ultra-micro-thin copper-coated copper plate and five-axis pressing machine used for manufacturing process Effective date of registration: 20191012 Granted publication date: 20190823 Pledgee: Huang Mingan Pledgor: Zhuhai Yatai Electronic Technology Co., Ltd. Registration number: 2018440000254 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201214 Address after: 519000 Zone E, 1st floor, 2nd floor, phase II plant, No. 23, Jinfeng West Road, hi tech Zone, Zhuhai City, Guangdong Province Patentee after: Wuxi Youtai New Material Technology Co., Ltd. Zhuhai branch Address before: Area a and B on the first floor and area B on the second floor of No.23 Jinfeng West Road, Jinding Science and Technology Industrial Park, Zhuhai City, Guangdong Province Patentee before: ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220223 Address after: 330899 south of Yong'an Avenue and west of Youxun Road, Gao'an hi tech Industrial Park, Yichun City, Jiangxi Province Patentee after: Jiangxi Youti New Material Technology Co.,Ltd. Address before: 519000 Zone E, 1st floor, 2nd floor, phase II plant, No. 23, Jinfeng West Road, hi tech Zone, Zhuhai City, Guangdong Province Patentee before: Wuxi Youtai New Material Technology Co.,Ltd. Zhuhai branch |
|
TR01 | Transfer of patent right |