CN106575538A - Electro-conductive paste - Google Patents
Electro-conductive paste Download PDFInfo
- Publication number
- CN106575538A CN106575538A CN201580037113.1A CN201580037113A CN106575538A CN 106575538 A CN106575538 A CN 106575538A CN 201580037113 A CN201580037113 A CN 201580037113A CN 106575538 A CN106575538 A CN 106575538A
- Authority
- CN
- China
- Prior art keywords
- resin binder
- conductive paste
- paste composition
- less
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011347 resin Substances 0.000 claims abstract description 75
- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011230 binding agent Substances 0.000 claims abstract description 60
- 238000007639 printing Methods 0.000 claims abstract description 38
- 239000000843 powder Substances 0.000 claims abstract description 35
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 14
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 14
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 14
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 10
- 238000009835 boiling Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- -1 also Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 5
- 238000007645 offset printing Methods 0.000 abstract 1
- 239000002002 slurry Substances 0.000 description 39
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 27
- 239000002904 solvent Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 10
- 239000000428 dust Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001459 lithography Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 229920002379 silicone rubber Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical class CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DBUMQODMPXCGAY-UHFFFAOYSA-N 2-(2-butan-2-yloxypropoxy)propan-1-ol Chemical class CCC(C)OC(C)COC(C)CO DBUMQODMPXCGAY-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical class CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RFQLTXOJXDPLFL-UHFFFAOYSA-N C(CCC)OCC(=S)OCCO Chemical compound C(CCC)OCC(=S)OCCO RFQLTXOJXDPLFL-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 241000521257 Hydrops Species 0.000 description 1
- 206010030113 Oedema Diseases 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- GTYLEVMOSBBKCQ-UHFFFAOYSA-N acetic acid;2-(2-ethoxyethoxy)ethanol Chemical class CC(O)=O.CCOCCOCCO GTYLEVMOSBBKCQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- OCUJLLGVOUDECM-UHFFFAOYSA-N dipivefrin Chemical compound CNCC(O)C1=CC=C(OC(=O)C(C)(C)C)C(OC(=O)C(C)(C)C)=C1 OCUJLLGVOUDECM-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229940035423 ethyl ether Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
- C08L1/26—Cellulose ethers
- C08L1/28—Alkyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Abstract
[Problem] To provide an electro-conductive paste having performance in regard to being transferred from an intermediate transfer body to a print material that is superior to that of the prior art when a solar cell electrode is formed using intaglio offset printing, the print material being a material to be printed upon. Using the electro-conductive paste, it is possible to form, on a substrate surface, an electrode having a smaller width and thickness than the prior art, the electro-conductive paste furthermore having a substrate that is not susceptible to damage during printing. [Solution] An electro-conductive paste composition containing at least a resin binder (A) and a resin binder (B) that have mutually different resins, an electro-conductive powder (C), an inorganic binder (D), and an organic solvent (E), wherein the electro-conductive paste composition is characterized in that the resin binder (A) comprises ethyl cellulose, the resin binder (B) comprises polyvinyl butyral, and the weight ratio of the resin binder (A) and resin binder (B) is 2:8-8:2.
Description
Technical field
The present invention relates to be particularly well-suited to print the Novel conductive paste of fine pattern by lithography, and use
The forming method of the fine conductive pattern of the electrocondution slurry.Further to be suitable for by intaglio plate lithographic printing formed the sun
The solar battery cell electrode of the colelctor electrode formed on the surface of energy battery unit forms slurry.
Background technology
Because environmental problem in recent years is projected, solaode is attracted attention, but, the light surface side of the solaode
On, it is provided with the colelctor electrode of wire.Because the colelctor electrode has the electric current for producing inside solar energy battery output to outside work
With, it is desirable to resistance is relatively low, additionally, in order to send into sunlight to the inside of solaode as far as possible more, it is also desirable to electrode width
Degree is narrower.Therefore, it is intended that colelctor electrode reduction width, while height is improved, increasing section product.Such colelctor electrode, can lead in the past
The method for crossing silk screen print method etc. is formed, but in recent years, it is desirable to colelctor electrode of the electrode width below 80 μm is formed, and uses silk screen
The colelctor electrode that print process forms such width is more difficult.Method accordingly, as the narrower colelctor electrode of electrode width is formed,
Lithography is discussed, wherein, especially discuss intaglio plate lithography.
Intaglio plate lithography is to imbed electrocondution slurry in the ditch being formed on intaglio plate, from intaglio plate to organosilicon printing blanket
Middle transfer bodies such as (Silicone blanket) so as to temporarily receive electrocondution slurry, then transferred to printed thing, in quilt
The method that the electrode pattern formed by the electrocondution slurry of designated shape is formed on printed article.Researched and proposed in such intaglio plate
In lithography, improve from the Receptive technology of the electrocondution slurry of intaglio plate to middle transfer body (for example, referring to patent documentation
1), or improve from middle transfer body to the electrocondution slurry of printed thing transferability technology (for example, patent documentation 2).
Patent Document 1 discloses to improve the transferring rate of the first transfer, as the solvent of electrocondution slurry, by using
High boiling solvent (diethylene glycol monobutyl ehter acetass) and 2 kinds with more lower boiling low boiling point solvent (butoxy ethanol)
Solvent, so as to expect to improve the technology from the transferring rate of intaglio plate to middle transfer body.This is due to by entering in the ditch of intaglio plate
Row drying, the low boiling point solvent evaporation among 2 kinds of solvents contained in electrocondution slurry, so as to improve the solidifying of the electrocondution slurry in ditch
Poly- power.Additionally, by the way that high boiling solvent is mixed in low boiling point solvent with appropriate ratio, can prevent to middle transfer body
Transfer after it is over-drying, and then prevent the follow-up accumulation to being printed when thing is transferred.
Additionally, the transferring rate to guarantee to be transferred by middle transfer body is Patent Document 2 discloses, by electrocondution slurry
It is 1 that addition makes ethyl cellulose and acrylic resin weight ratio:9～9:1 binding agent, and then prevent the technology piled up.This is special
In sharp document 2, using the relatively low organic silicon rubber of surface potential energy as middle transfer body electrocondution slurry transfer surface, as conduction
The adhering resin of slurry, the quilt constituted with the higher ethyl cellulose of organic silicon rubber affinity and with glass substrate by combination
The higher acrylic resin of printed article affinity, so as to obtain by the acceptance of intaglio plate to middle transfer body and from intermediate transfer
The balance of body to the transferability of printed thing.
Additionally, in patent documentation 3, by turning that the bonding resin of combination ethyl cellulose etc., acrylic resin are formed
Print resin, at 20 DEG C vapour pressure be 0.1mmHg low voc solvent and 20 DEG C at vapour pressure be that the height of 0.5～5mmHg is waved
The property sent out solvent, can improve the productivity ratio for electrode narrow and with thickness compared with the past.
But, in the electrode formation electrocondution slurry of the solaode for being necessary to reduce specific insulation as far as possible, it is
Obtain the electrode with good electrical characteristics, it is necessary to improve the volume ratio of the conductive filler in electrocondution slurry, inhibition of sintering
Film loss before and after knot.Therefore, because the inorganic constituentss in electrocondution slurry become many, there is problems with point in the invention：Lack
Cohesiveness, on middle transfer body will not film forming, produce residual packing on middle transfer body after the second transfer.Further, deposit
In problems with point：In order to well transfer to printed thing from middle transfer body, it is necessary to improve the centre to being printed thing and turn
The pressure of print body, but can damage that intensity as the Si substrates that solaode is used is relatively low, easy damaged printed thing.Root
In fact it is impossible based on the lithographic fine rule printing to solar cell substrate of intaglio plate according to these problem points.
【Background technology document】
【Patent documentation】
【Patent documentation 1】Japanese Patent Laid-Open 2008-293904 publication
【Patent documentation 2】No. 4801855 publications of Japanese Patent No.
【Patent documentation 3】Japanese Patent Laid-Open 2011-103356 publication
The content of the invention
【The invention problem to be solved】
The present invention is with the problem of the prior art as background.That is, it is an object of the invention to provide a kind of electrocondution slurry, its
It is compared with the past when the electrode of solaode is formed by intaglio plate lithography, from middle transfer body to printed thing
Transferability it is good, substrate surface is compared with the past to form electrode narrow and with thickness, and then substrate is difficult in printing
With breakage.
【Means for solving the problems】
The result that the present inventors concentrates on studies finds, by means shown below, it is possible to resolve above-mentioned problem, reaches this
Invention.That is, the present invention includes following composition.
1. a kind of conductive paste composition, it is characterised in that be at least containing the resin binder for being respectively different resins
(A) and resin binder (B), and conductive powder (C), inorganic bond (D) and organic solvent (E) electrocondution slurry combination
Thing, resin binder (A) contains ethyl cellulose, and resin binder (B) contains polyvinyl butyral resin, also, the resin is viscous
The weight ratio of mixture (A) and the resin binder (B) is 2:8～8:2.
2. according to 1 conductive paste composition recorded, it is characterised in that the weight average molecular weight (Mw of resin binder (A)
(A)) and resin binder (B) weight average molecular weight (Mw (B)) ratio Mw (A)/Mw (B) be less than more than 1 10.
3. according to 1 or 2 conductive paste compositions recorded, it is characterised in that the weight average molecular weight of resin binder (B) is
10000～60000.
4. according to any one of 1～3 conductive paste composition recorded, it is characterised in that the weight of resin binder (A) is equal
Molecular weight is 10000～500000.
5. according to any one of 1～4 conductive paste composition recorded, it is characterised in that the boiling point of organic solvent (E) exists
Less than more than 200 DEG C 300 DEG C, and solubility parameter (SP values) is less than more than 8 11.
6. according to any one of 1～5 conductive paste composition recorded, it is characterised in that conductive powder (C) is average grain
Footpath D50 is less than more than 0.05 μm 10.0 μm, and tap density is the silver and/or copper of more than 2.0g/cm3 below 7.0g/cm3.
7. according to any one of 1～6 conductive paste composition recorded, it is characterised in that relative to conductive powder (C) and
The total weight parts of 100 parts of the total weight parts of inorganic bond (D), resin binder (A) and resin binder (B) are more than 1.0
8.0 it is following.
8. according to any one of 1～7 conductive paste composition recorded, it is characterised in that inorganic bond (D) is average
Particle diameter D50 is more than 0.1 μm～less than 10.0 μm of inorganic particulate, and softening point is less than more than 350 DEG C 600 DEG C.
9. according to 6 conductive paste compositions recorded, it is characterised in that further, relative to the total of conductive powder (C)
100 parts of weight portion, is constituted containing less than 10 parts from Al, Zn, Pb, Bi, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe and Cr
Group in select at least one more than metal powder.
10. according to any one of 1～9 conductive paste composition recorded, it is characterised in that in intaglio plate lithographic printing
The middle operation for forming electrode.
11. according to any one of 1～10 conductive paste composition recorded, it is characterised in that for forming solar-electricity
Pool unit electrode.
【The effect of invention】
It is compared with the past according to the present invention, it is good to the transferability of printed thing from middle transfer body, substrate surface with
Toward comparing, electrode narrow and with thickness can be formed, i.e. the conduction of the photoelectric transformation efficiency for improving solaode can be provided
Slurry.
Specific embodiment
Hereinafter, the present invention is described in detail in detail.The present invention electrocondution slurry be a kind of conductive paste composition, it is characterised in that be to
Less containing the resin binder (A) and resin binder (B) for being respectively different resins, and conductive powder (C), inorganic bond
(D) and organic solvent (E) conductive paste composition, resin binder (A) contains ethyl cellulose, and resin binder (B) contains
There is polyvinyl butyral resin, also, the weight ratio of the resin binder (A) and the resin binder (B) is 2:8～8:2.
For resin binder, there is following requirement：It is necessary to burn after the sintering of printed patterns, and to as centre
The organic silicon rubber of transfer article has good acceptance, and can all transfer the printed patterns for temporarily receiving.Make
For the combination of the resin, based on the viewpoint of the acceptance to middle transfer body and viscosity adjustment etc., resin binder (A) needs are
Ethyl cellulose, based on the viewpoint of the transferability from middle transfer body, resin binder (B) is necessary for polyvinyl alcohol contracting fourth
Aldehyde.
Resin binder (A) embodies the Receptive effect from intaglio plate to transfer article for improving printed patterns, and resin glues
Mixture (B) embody improve printed patterns from transfer article to the effect of the transferability of printed thing.Resin binder (A) and tree
The weight ratio of fat binding agent (B) is 2:8～8:2.Weight than deviateing the scope in the less side of resin binder (A) conductive paste
Material, it is impossible to obtain raising effect of the printed patterns from the transferability of intaglio plate to transfer article that the resin binder (A) brings.This
Outward, on the contrary, weight compares A:B deviations compare 8:2nd, the electrocondution slurry of the less side of resin binder (B), it is impossible to obtain the resin
The effect for improving transferability of the printed patterns from transfer article to transferred object that binding agent (B) brings.Therefore, its any one situation
In, cannot all form good conductive pattern.
The weight average molecular weight (Mw (A)) of resin binder (A) and the weight average molecular weight (Mw (B)) of resin binder (B)
Than Mw (A)/Mw (B) preferably less than more than 1 10.Mw (A)/Mw (B) is if less than 1, it is possible to produce printed patterns from intaglio plate to
The problem that the acceptance of transfer article deteriorates, conversely, Mw (A)/Mw (B) is if more than 10, it is possible to produce from transfer article to printed
The problem that the transferability of thing deteriorates, in any one situation, is likely to that good conductive pattern cannot be formed.
Weight average molecular weight (Mw (B)) for resin binder (B), weight average molecular weight preferably 10000～60000.Weight is equal
If molecular weight is less than 10000, it is possible to raising will not be fully demonstrated from transfer article to the effect of the transferability of printed thing.Instead
It, when weight average molecular weight is more than 60000, it is possible to produce the viscosity of electrocondution slurry is uprised, the acceptance from intaglio plate to transfer article
The problem of deterioration, and the problem that resin binder (B) is insoluble in organic solvent (E).
Weight average molecular weight (Mw (A)) for resin binder (A), weight average molecular weight preferably 10000～500000.Weight is equal
If molecular weight is less than 10000, it is possible to acceptance of the raising of resin binder (A) from intaglio plate to transfer article will not be fully demonstrated
The effect of property.Conversely, when weight average molecular weight is more than 500000, the viscosity of electrocondution slurry is uprised, it is also possible to producing from intaglio plate
To the problem that the acceptance of transfer article deteriorates, it is also possible to produce that resin binder (A) is insoluble in organic solvent (E) to ask
Topic.
Contained organic solvent (E) in slurry, preferred boiling point is less than 300 DEG C more than 200 DEG C, and SP values are more than 8.0,
Less than 11.0, relative to 100 parts of the total weight parts of conductive powder (C) and inorganic bond (D), the preferred of organic solvent (E) mixes
Resultant is less than more than 5.0 25.0.Organic solvent (E) can be a kind, it is also possible to use two or more.It is excellent during using two or more
It is more than 70 weight % that organic solvent of the choosing with the boiling point in above range and SP values is accounted in the full solvent of slurry.Organic solvent
(E) boiling point is easily dried less than 200 DEG C when then printing, and produces sometimes and easily cause the time dependent problem of electrocondution slurry,
If conversely, more than 300 DEG C, being dried for conductive pattern becomes difficult, it is possible to can produce conduction when slurry to be continuously repeated printing
Pattern broadens.Further, during continuous printing, due to being necessary to make the solvent of immersion organosilicon pad volatilize as early as possible, as institute
Solvent is stated, solvent of the boiling point below 300 DEG C is preferably used.
Intaglio plate lithography is to imbed electrocondution slurry in the ditch being formed on intaglio plate, from intaglio plate to organosilicon printing blanket
Middle transfer bodies such as (Silicone blanket) so as to temporarily receive electrocondution slurry, then transferred to printed thing, in quilt
The method that the electrode pattern formed by the electrocondution slurry of designated shape is formed on printed article.In order to reach from printing initial stage
During to the service life of organosilicon printing blanket, moderately good printing, solvent is necessary appropriateness immersion organosilicon print
Brush pad, accordingly, as solvent, it is necessary to using solvent of the solubility parameter (SP values) more than 8.0 in less than 11.0 scope.
That is, from the beginning of printing initial stage, solvent is immersed quickly organosilicon printing blanket, accordingly, the surface of organosilicon printing blanket is in
Appropriate swelling state, particularly in the operation for transferring again, if considering to prevent that transfer is bad, the number of times of preparation printing is tried one's best
If reduction, then as solvent, it is necessary to using the solvent that solubility parameter (SP values) is less than 11.0.If additionally, SP values are super
11.0 are crossed, then produces problems with：The swelling rate of organic silicon rubber is less, causes by the organic silicon rubber as middle transfer body
Slurry transferability deteriorate, cannot get good conductive pattern.On the other hand, when the SP values of solvent are less than 8.0, then produce following
Problem：Solvent swelling as the organic silicon rubber of middle transfer body is excessive, and the transferability to being printed thing deteriorates.
As solubility parameter (SP values) less than 11.0 more than 8.0, boiling point less than 300 DEG C of solvent more than 200 DEG C,
Ethyleneglycol monophenylether, ethylene glycol bisthioglycolate butyl ether, ethylene glycol mono hexyl ether, 1,3 butylene glycol diacetate esters, diethylene glycol can be enumerated
Single ethylether, diethylene glycol list propyl ether, diethylene glycol monobutyl ether, diethylene glycol-n- hexyl ethers, diethylene glycol -2- hexyls
Ether, diethylene glycol dibutyl ether, diethylene glycol monoethyl ether acetic acid esters, butyl carbitol acetate, DPE,
Dipropylene glycol monopropyl ether, Dipropylene glycol mono-n-butyl Ether, dipropylene glycol methyl-n- propyl ethers, dipropylene glycol methyl ether acetass, 3 the third two
The positive fourth of alcohol monomethyl ether, triethylene glycol, triethylene glycol monomethyl ether, Triethylene glycol ethyl ether, triethylene glycol butyl ether, tripropylene glycol
Ether, 2- ethyl -1,3- hexanediol, 1,3 butylene glycol diacetate esters, 1,6-HD diacetate esters, gamma-butyrolacton, terpineol,
Dihydroterpineol, terpinenyl aceatae, glyceryl triacetate.
If while the printing adaptability of intaglio plate lithographic printing electrocondution slurry is improved, it is considered in improving electrode pattern
Filling rate, electric conductivity of the raising electrode pattern etc., preferably 0.05～10 μm of 50% mean diameter D50 of conductive powder (C),
Particularly preferred 0.1～5.0 μm.Further, since be obtained good electrical characteristics after sintering, preferred conductive powder is shaped as ball
Shape.As the material of conductive powder, good, the more cheap silver of electric conductivity or copper can be used.Tap density is 2.0g/cm3More than
7.0g/cm3Hereinafter, preferred 4.0g/cm3Above 6.0g/cm3Below.Less than 2.0g/cm3When, can produce due to conductive powder
Density is reduced, the problem of the resistance value raising of electrode.If conversely, more than 7.0g/cm3, what the dispersibility for having conductive powder was reduced
May.Additionally, the electrical characteristics and printing characteristic in order to improve conductive powder, can multiple combination use.As conductive powder (C),
It is adapted to use metal dust, wherein, it is more suitable for using argentum powder and/or copper powder.During using above-mentioned argentum powder and/or copper powder, in order to print
The electrical characteristics of the improvement of brush or conductive pattern improve, outside each composition, can further add from Al, Zn, Pb, Bi,
The metal powder of more than a kind selected in Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cr.Now, in order to maintain electric conductivity, relatively
Below 100 parts of the total weight parts of conductive powder (C), addition preferably 10.0 weight portions of metal powder.
Relative to 100 parts of the total weight parts of conductive powder (C) and inorganic bond (D), resin binder (A) and resin glue
The total weight parts of mixture (B) are less than more than 1.0 8.0, preferably less than more than 2.0 6.0.Resin binder (A) and resin-bonding
Agent (B) if total weight parts less than 1.0, as the binding agent for making conductive powder mutually bond binder resin bonding force compared with
It is weak, thus the possibility that printing when having an intaglio plate lithographic printing is reduced.On the other hand, resin binder (A) and resin binder
(B) when total weight parts are more than 8.0 parts, the packed density for having conductive powder is reduced, and printed patterns are fuzzy, electric conductivity is reduced can
Energy.
Used as inorganic bond (D), preferred particle shape after burning till, burns till conductive powder and holding electrode shape
Simultaneously, it can be ensured that the metal oxide glass powder of the close property of electrode and printed thing is adapted to use.The glass dust for using it is soft
Change o'clock is in the range of 350～600 DEG C.If the softening point of glass dust is too low, when electrocondution slurry is burnt till, the viscosity mistake of glass
It is low, the glass of surplus can be remained on sensitive surface electrode-semiconductor substrate interface, as a result, glass has significantly hinder both
The possibility of contact.On the other hand, if the softening point of glass dust is too high, when electrocondution slurry is burnt till, the viscosity of glass is too low.By
This, has antireflection film fully to remove, and the engagement of sensitive surface electrode and semiconductor substrate is insufficient, and both adhesive strengths
Significantly reduced possibility.As such glass dust, and specifically, it is preferable to from containing lead oxide, pyrex, boron oxide, oxygen
Change in the glass of metal-oxide such as aluminum, silicon oxide, Zinc Oxide, bismuth oxide and select one kind or two or more glass dust.With regard to glass
The mean diameter (D50) of glass powder, based on it is identical with conductive powder the reasons why, preferably less than more than 0.1 μm 10 μm.
【Embodiment】
Hereinafter, show that embodiment illustrates the present invention, but the present invention and be not limited by the example.
Embodiment 1
First, after following composition being sufficiently stirred for, mixed, kneaded with three-roller, make electrocondution slurry.
Additionally, as ethyl cellulose, using trade name エ ト セ Le (etoseru) STD10 (ethoxies of Dow Chemical
The content ratio of base：48～50%, weight average molecular weight Mw：75000).Additionally, as polyvinyl butyral resin, using hydrops
Learn trade name エ ス レ ッ Network (esurekku) BL-1 (weight average molecular weight Mw of Industrial Co., Ltd：19000).As argentum powder,
The use of mean diameter (D50) it is 0.8 μm, tap density is 5.3g/cm3Sphere.Further, as glass dust, use
3.0 μm of mean diameter, softening point is 470 DEG C of flint glass.Acetate of butyl carbitol uses An Tian KCCs
Product.
As printed thing, there are the Si bases of SiNx antireflection films using 15 × 15cm, 200 μm of thickness, formation texture, masking
Plate.On the substrate, by using following intaglio plate and the intaglio plate lithographic plate print of the organosilicon printing blanket as middle transfer body
Brush method, prints above-mentioned electrocondution slurry.Print speed printing speed is set to, and is 40mm/ from intaglio plate to the transfer speed of organosilicon printing blanket
Second, it is the 40mm/ seconds from organosilicon printing blanket to the transfer speed of Si substrates.After printing, the dry of organic solvent is carried out at 120 DEG C
It is dry, form electrode pattern.Using following intaglio plate：On copper surfaces with 50 μm of the spaced etch width of 2mm, the straight line of 15 μm of depth
Strip, implements thereon chromium plating.Organosilicon printing blanket is public using Co., Ltd. Jinyang that spring hardness (JIS A hardness) is 45 °
Department's system " (trade name) シ Le Block ラ Application (shiruburann) ".
In intaglio plate lithographic processes among the various embodiments described above, the formation process of the conductive pattern of comparative example, mesh
Inspection look into printed patterns from intaglio plate to the acceptance of organosilicon printing blanket, printed patterns from organosilicon printing blanket to substrate
Transferability, according to following benchmark evaluation.
(acceptance)
○：During all, the acceptance of conductive pattern is carried out with not breaking.Acceptance is good.
△：A part for the conductive pattern received on organosilicon printing blanket produces broken string or attenuates.Acceptance is slightly bad.
×：Conductive pattern does not receive completely on organosilicon printing blanket.Acceptance is bad.
(transferability)
◎：During all, the transfer of conductive pattern is carried out completely.Transferability is good.
○：Conductive pattern it is a part of non-transfer, or sometimes visible conductive pattern residues on a small quantity organosilicon printing blanket.Transferability
It is good reluctantly.
△：Conductive pattern it is more than half non-transfer, conductive pattern is more to residue in organosilicon printing blanket.Transferability is slightly bad.
×：Conductive pattern is all non-transfer.Transferability is bad.
Embodiment 2～17, comparative example 1～6
By ethyl cellulose and polyvinyl butyral resin, argentum powder and glass dust and solvent, according to the Weight-average molecular shown in table 1
Amount, combined amount (weight portion) mixing, in addition, make electrocondution slurry same as Example 1ly, form conductive pattern.
Result above is as shown in table 1.
【Table 1】
2 are compared by the weight ratio of table, ethyl cellulose and polyvinyl butyral resin:8, the less comparison in ethyl cellulose side
In example 5,6, deteriorate from intaglio plate to the transferability of organosilicon printing blanket, conversely, the weight of ethyl cellulose and polyvinyl butyral resin
Amount ratio compares 8:2, in the less comparative example 2,3 in polyvinyl butyral resin side, from organosilicon printing blanket to the transferability of Si substrates
Deteriorate, cannot all obtain good transferability.Relative to 100 parts of the total weight parts of argentum powder and glass dust, by ethyl cellulose and
Polyvinyl butyral resin compares 2 with weight:8～8:It is equal to the transferability of the conductive pattern of substrate in 2 embodiment 1～17
Well.
【Industrial applicability】
As above, electrocondution slurry according to the present invention, easily carries out microelectrode printing to the substrate used in solaode,
Accordingly, the high efficiency of solaode can be obtained, thus is expected very helpful in industrial circle.
Claims (11)
1. a kind of conductive paste composition, it is characterised in that be at least containing resin binder A and the tree for being respectively different resins
Fat binding agent B, and the conductive paste composition of conductive powder C, inorganic bond D and organic solvent E, resin binder A contains
There is ethyl cellulose, resin binder B contains polyvinyl butyral resin, also, resin binder A and resin binder B
Weight ratio be 2:8～8:2.
2. conductive paste composition according to claim 1, it is characterised in that weight average molecular weight Mw of resin binder A
(A) it is less than more than 1 10 with ratio Mw (the A)/Mw (B) of weight average molecular weight Mw (B) of resin binder B.
3. the conductive paste composition recorded according to claim 1 or 2, it is characterised in that the weight average molecular weight of resin binder B
For 10000～60000.
4. the conductive paste composition recorded according to any one of claims 1 to 3, it is characterised in that the weight of resin binder A
Average molecular weight is 10000～500000.
5. the conductive paste composition recorded according to any one of Claims 1 to 4, it is characterised in that the boiling point of organic solvent E
Less than 300 DEG C more than 200 DEG C, and solubility parameter SP value is less than more than 8 11.
6. the conductive paste composition recorded according to any one of Claims 1 to 5, it is characterised in that conductive powder C is average
Particle diameter D50 is less than more than 0.05 μm 10.0 μm, and tap density is 2.0g/cm3Above 7.0g/cm3Following silver-colored and/or copper.
7. the conductive paste composition recorded according to any one of claim 1～6, it is characterised in that relative to conductive powder C
With 100 parts of the total weight parts of inorganic bond D, the total weight parts of resin binder A and resin binder B be more than 1.0 8.0 with
Under.
8. the conductive paste composition recorded according to any one of claim 1～7, it is characterised in that inorganic bond D is flat
Particle diameter D50 is more than 0.1 μm～less than 10.0 μm of inorganic particulate, and softening point is less than more than 350 DEG C 600 DEG C.
9. conductive paste composition according to claim 6, it is characterised in that further, relative to conductive powder C's
100 parts of total weight parts, containing less than 10 parts from Al, Zn, Pb, Bi, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe and Cr structure
Into group in select at least one more than metal powder.
10. the conductive paste composition recorded according to any one of claim 1～9, it is characterised in that in intaglio plate lithographic plate
The operation of electrode is formed in printing.
11. conductive paste compositions recorded according to any one of claim 1～10, it is characterised in that for forming the sun
Can battery cell electrode.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-141174 | 2014-07-09 | ||
| JP2014141174 | 2014-07-09 | ||
| PCT/JP2015/068985 WO2016006513A1 (en) | 2014-07-09 | 2015-07-01 | Electro-conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106575538A true CN106575538A (en) | 2017-04-19 |
Family
ID=55064149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580037113.1A Pending CN106575538A (en) | 2014-07-09 | 2015-07-01 | Electro-conductive paste |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6079888B2 (en) |
| CN (1) | CN106575538A (en) |
| TW (1) | TW201609908A (en) |
| WO (1) | WO2016006513A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463500A (en) * | 2016-01-12 | 2018-08-28 | 诺利塔克股份有限公司 | Conductive composition |
| CN110097998A (en) * | 2018-01-31 | 2019-08-06 | 上海宝银电子材料有限公司 | A kind of transfer printing process conductive silver paste for touch screens and preparation method thereof |
| CN111987175A (en) * | 2020-09-01 | 2020-11-24 | 深圳纳弘熠岦光学科技有限公司 | Transfer printing method of solar cell grid line and solar cell |
| CN114921196A (en) * | 2018-11-13 | 2022-08-19 | 苏州赛伍应用技术股份有限公司 | Transfer printing glue and transfer printing film for gravure printing process of silver paste of photovoltaic cell piece |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107828351B (en) * | 2016-09-15 | 2021-07-27 | E·I·内穆尔杜邦公司 | Conductive paste for bonding |
| JP2021150930A (en) | 2020-03-23 | 2021-09-27 | キオクシア株式会社 | Equalizer control device, receiving device, and control method of receiving device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6079888B2 (en) | 2017-02-15 |
| WO2016006513A1 (en) | 2016-01-14 |
| TW201609908A (en) | 2016-03-16 |
| JPWO2016006513A1 (en) | 2017-04-27 |
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